Order this document by MTP3055V/D SEMICONDUCTOR TECHNICAL DATA Motorola Preferred Device N–Channel Enhancement–Mode Silicon Gate TMOS POWER FET 12 AMPERES 60 VOLTS RDS(on) = 0.15 OHM TMOS V is a new technology designed to achieve an on–resistance area product about one–half that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. Just as with our TMOS E–FET designs, TMOS V is designed to withstand high energy in the avalanche and commutation modes. Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients. TM New Features of TMOS V • On–resistance Area Product about One–half that of Standard MOSFETs with New Low Voltage, Low RDS(on) Technology • Faster Switching than E–FET Predecessors Features Common to TMOS V and TMOS E–FETS • Avalanche Energy Specified • IDSS and VDS(on) Specified at Elevated Temperature • Static Parameters are the Same for both TMOS V and TMOS E–FET D G CASE 221A–06, Style 5 TO–220AB S MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Symbol Value Unit Drain–Source Voltage VDSS 60 Vdc Drain–Gate Voltage (RGS = 1.0 MΩ) VDGR 60 Vdc Gate–Source Voltage — Continuous Gate–Source Voltage — Non–Repetitive (tp ≤ 10 ms) VGS VGSM ± 20 ± 25 Vdc Vpk Drain Current — Continuous @ 25°C Drain Current — Continuous @ 100°C Drain Current — Single Pulse (tp ≤ 10 µs) ID ID IDM 12 7.3 37 Adc Total Power Dissipation @ 25°C Derate above 25°C PD 48 0.32 Watts W/°C TJ, Tstg – 55 to 175 °C Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C (VDD = 25 Vdc, VGS = 10 Vdc, IL = 12 Apk, L = 1.0 mH, RG = 25 Ω) EAS 72 mJ Thermal Resistance — Junction to Case Thermal Resistance — Junction to Ambient RθJC RθJA 3.13 62.5 °C/W TL 260 °C Rating Operating and Storage Temperature Range Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds Apk Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. E–FET, Designer’s and TMOS V are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Preferred devices are Motorola recommended choices for future use and best overall value. REV 2 TMOS Motorola Motorola, Inc. 1996 Power MOSFET Transistor Device Data 1 MTP3055V ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Symbol Characteristic Min Typ Max Unit 60 — — 65 — — Vdc mV/°C — — — — 10 100 — — 100 nAdc 2.0 — 2.7 5.4 4.0 — Vdc mV/°C — 0.10 0.15 Ohm — — 1.3 — 2.2 1.9 gFS 4.0 5.0 — mhos Ciss — 410 500 pF Coss — 130 180 Crss — 25 50 td(on) — 7.0 10 tr — 34 60 td(off) — 17 30 tf — 18 50 QT — 12.2 17 Q1 — 3.2 — Q2 — 5.2 — Q3 — 5.5 — — — 1.0 0.91 1.6 — trr — 56 — ta — 40 — tb — 16 — QRR — 0.128 — — 3.5 4.5 — — 7.5 — OFF CHARACTERISTICS Drain–Source Breakdown Voltage (VGS = 0 Vdc, ID = 250 µAdc) Temperature Coefficient (Positive) V(BR)DSS Zero Gate Voltage Drain Current (VDS = 60 Vdc, VGS = 0 Vdc) (VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150°C) IDSS Gate–Body Leakage Current (VGS = ± 20 Vdc, VDS = 0) IGSS µAdc ON CHARACTERISTICS (1) Gate Threshold Voltage (VDS = VGS, ID = 250 µAdc) Temperature Coefficient (Negative) VGS(th) Static Drain–Source On–Resistance (VGS = 10 Vdc, ID = 6.0 Adc) RDS(on) Drain–Source On–Voltage (VGS = 10 Vdc) (ID = 12 Adc) (ID = 6.0 Adc, TJ = 150°C) VDS(on) Forward Transconductance (VDS = 7.0 Vdc, ID = 6.0 Adc) Vdc DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance (VDS = 25 Vdc, VGS = 0 Vdc, f = 1.0 MHz) Reverse Transfer Capacitance SWITCHING CHARACTERISTICS (2) Turn–On Delay Time Rise Time Turn–Off Delay Time (VDD = 30 Vdc, ID = 12 Adc, VGS = 10 Vdc, RG = 9.1 Ω) Fall Time Gate Charge (See Figure 8) (VDS = 48 Vdc, ID = 12 Adc, VGS = 10 Vdc) ns nC SOURCE–DRAIN DIODE CHARACTERISTICS Forward On–Voltage (1) (IS = 12 Adc, VGS = 0 Vdc) (IS = 12 Adc, VGS = 0 Vdc, TJ = 150°C) Reverse Recovery Time (See Figure 15) (IS = 12 Adc, VGS = 0 Vdc, dIS/dt = 100 A/µs) Reverse Recovery Stored Charge VSD Vdc ns µC INTERNAL PACKAGE INDUCTANCE Internal Drain Inductance (Measured from contact screw on tab to center of die) (Measured from the drain lead 0.25″ from package to center of die) LD Internal Source Inductance (Measured from the source lead 0.25″ from package to source bond pad) LS nH nH (1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%. (2) Switching characteristics are independent of operating junction temperature. 2 Motorola TMOS Power MOSFET Transistor Device Data MTP3055V TYPICAL ELECTRICAL CHARACTERISTICS VGS = 10 V 9V TJ = 25°C I D , DRAIN CURRENT (AMPS) 20 24 8V I D , DRAIN CURRENT (AMPS) 24 7V 16 12 6V 8 5V VDS ≥ 10 V TJ = – 55°C 20 25°C 100°C 16 12 8 4 4 4V 0 1 2 3 4 2 5 6 7 9 8 Figure 1. On–Region Characteristics Figure 2. Transfer Characteristics 0.25 0.20 TJ = 100°C 0.15 25°C 0.10 – 55°C 0.05 0 4 8 12 16 ID, DRAIN CURRENT (AMPS) 20 24 10 0.15 TJ = 25°C 0.14 0.13 0.12 VGS = 10 V 0.11 0.10 15 V 0.09 0.08 0 Figure 3. On–Resistance versus Drain Current and Temperature 4 8 12 16 ID, DRAIN CURRENT (AMPS) 20 24 Figure 4. On–Resistance versus Drain Current and Gate Voltage 1.6 100 VGS = 0 V VGS = 10 V ID = 6 A I DSS , LEAKAGE (nA) RDS(on) , DRAIN–TO–SOURCE RESISTANCE (NORMALIZED) 4 VGS, GATE–TO–SOURCE VOLTAGE (VOLTS) VGS = 10 V 1.4 3 VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS) 0.30 0 0 5 R DS(on) , DRAIN–TO–SOURCE RESISTANCE (OHMS) R DS(on) , DRAIN–TO–SOURCE RESISTANCE (OHMS) 0 1.2 1.0 10 TJ = 125°C 0.8 0.6 – 50 – 25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) 150 175 Figure 5. On–Resistance Variation with Temperature Motorola TMOS Power MOSFET Transistor Device Data 1 0 10 30 40 20 50 VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS) 60 Figure 6. Drain–To–Source Leakage Current versus Voltage 3 MTP3055V POWER MOSFET SWITCHING Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (∆t) are determined by how fast the FET input capacitance can be charged by current from the generator. The capacitance (Ciss) is read from the capacitance curve at a voltage corresponding to the off–state condition when calculating td(on) and is read at a voltage corresponding to the on–state when calculating td(off). The published capacitance data is difficult to use for calculating rise and fall because drain–gate capacitance varies greatly with applied voltage. Accordingly, gate charge data is used. In most cases, a satisfactory estimate of average input current (IG(AV)) can be made from a rudimentary analysis of the drive circuit so that At high switching speeds, parasitic circuit elements complicate the analysis. The inductance of the MOSFET source lead, inside the package and in the circuit wiring which is common to both the drain and gate current paths, produces a voltage at the source which reduces the gate drive current. The voltage is determined by Ldi/dt, but since di/dt is a function of drain current, the mathematical solution is complex. The MOSFET output capacitance also complicates the mathematics. And finally, MOSFETs have finite internal gate resistance which effectively adds to the resistance of the driving source, but the internal resistance is difficult to measure and, consequently, is not specified. The resistive switching time variation versus gate resistance (Figure 9) shows how typical switching performance is affected by the parasitic circuit elements. If the parasitics were not present, the slope of the curves would maintain a value of unity regardless of the switching speed. The circuit used to obtain the data is constructed to minimize common inductance in the drain and gate circuit loops and is believed readily achievable with board mounted components. Most power electronic loads are inductive; the data in the figure is taken with a resistive load, which approximates an optimally snubbed inductive load. Power MOSFETs may be safely operated into an inductive load; however, snubbing reduces switching losses. t = Q/IG(AV) During the rise and fall time interval when switching a resistive load, VGS remains virtually constant at a level known as the plateau voltage, VSGP. Therefore, rise and fall times may be approximated by the following: tr = Q2 x RG/(VGG – VGSP) tf = Q2 x RG/VGSP where VGG = the gate drive voltage, which varies from zero to VGG RG = the gate drive resistance and Q2 and VGSP are read from the gate charge curve. During the turn–on and turn–off delay times, gate current is not constant. The simplest calculation uses appropriate values from the capacitance curves in a standard equation for voltage change in an RC network. The equations are: td(on) = RG Ciss In [VGG/(VGG – VGSP)] td(off) = RG Ciss In (VGG/VGSP) 1200 VDS = 0 V C, CAPACITANCE (pF) 1000 VGS = 0 V TJ = 25°C Ciss 800 600 Crss Ciss 400 Coss 200 Crss 0 10 5 5 0 VGS 10 15 20 25 VDS GATE–TO–SOURCE OR DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 7. Capacitance Variation 4 Motorola TMOS Power MOSFET Transistor Device Data 60 QT 10 50 Q1 8 VGS Q2 40 6 30 4 20 2 ID = 12 A 10 TJ = 25°C Q3 0 0 1 3 2 VDS 5 4 6 7 8 9 10 11 12 0 13 1000 t, TIME (ns) 12 VDS , DRAIN–TO–SOURCE VOLTAGE (VOLTS) VGS, GATE–TO–SOURCE VOLTAGE (VOLTS) MTP3055V VDD = 30 V ID = 12 A VGS = 10 V TJ = 25°C 100 tr td(off) tf 10 td(on) 1 1 10 QT, TOTAL CHARGE (nC) RG, GATE RESISTANCE (OHMS) Figure 8. Gate–To–Source and Drain–To–Source Voltage versus Total Charge Figure 9. Resistive Switching Time Variation versus Gate Resistance 100 DRAIN–TO–SOURCE DIODE CHARACTERISTICS 12 dIS/dt = 100 A/µs VDD = 25 V TJ = 25°C 0.12 10 I S , SOURCE CURRENT (AMPS) QRR , STORED CHARGE (µ C) 0.13 0.11 0.10 0.09 0.08 0 2 4 6 8 10 12 VGS = 0 V TJ = 25°C 8 6 4 2 0 0.50 0.55 0.60 IS, SOURCE CURRENT (AMPS) 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.0 VSD, SOURCE–TO–DRAIN VOLTAGE (VOLTS) Figure 10. Stored Charge Figure 11. Diode Forward Voltage versus Current SAFE OPERATING AREA The Forward Biased Safe Operating Area curves define the maximum simultaneous drain–to–source voltage and drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and a case temperature (TC) of 25°C. Peak repetitive pulsed power limits are determined by using the thermal response data in conjunction with the procedures discussed in AN569, “Transient Thermal Resistance–General Data and Its Use.” Switching between the off–state and the on–state may traverse any load line provided neither rated peak current (IDM) nor rated voltage (VDSS) is exceeded and the transition time (tr,tf) do not exceed 10 µs. In addition the total power averaged over a complete switching cycle must not exceed (TJ(MAX) – TC)/(RθJC). A Power MOSFET designated E–FET can be safely used in switching circuits with unclamped inductive loads. For reli- Motorola TMOS Power MOSFET Transistor Device Data able operation, the stored energy from circuit inductance dissipated in the transistor while in avalanche must be less than the rated limit and adjusted for operating conditions differing from those specified. Although industry practice is to rate in terms of energy, avalanche energy capability is not a constant. The energy rating decreases non–linearly with an increase of peak current in avalanche and peak junction temperature. Although many E–FETs can withstand the stress of drain– to–source avalanche at currents up to rated pulsed current (IDM), the energy rating is specified at rated continuous current (ID), in accordance with industry custom. The energy rating must be derated for temperature as shown in the accompanying graph (Figure 13). Maximum energy at currents below rated continuous ID can safely be assumed to equal the values indicated. 5 MTP3055V SAFE OPERATING AREA 75 VGS = 20 V SINGLE PULSE TC = 25°C 10 µs 10 100 µs 1 ms 1.0 10 ms dc RDS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.1 0.1 50 25 0 10 1.0 ID = 12 A EAS, SINGLE PULSE DRAIN–TO–SOURCE AVALANCHE ENERGY (mJ) I D , DRAIN CURRENT (AMPS) 100 100 25 50 75 100 125 150 175 VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS) TJ, STARTING JUNCTION TEMPERATURE (°C) Figure 12. Maximum Rated Forward Biased Safe Operating Area Figure 13. Maximum Avalanche Energy versus Starting Junction Temperature r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 1.0 D = 0.5 0.2 0.1 0.1 0.05 P(pk) 0.02 0.01 SINGLE PULSE t1 t2 DUTY CYCLE, D = t1/t2 0.01 1.0E–05 1.0E–04 1.0E–03 1.0E–02 t, TIME (s) 1.0E–01 RθJC(t) = r(t) RθJC D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) – TC = P(pk) RθJC(t) 1.0E+00 1.0E+01 Figure 14. Thermal Response di/dt IS trr ta tb TIME 0.25 IS tp IS Figure 15. Diode Reverse Recovery Waveform 6 Motorola TMOS Power MOSFET Transistor Device Data MTP3055V PACKAGE DIMENSIONS –T– B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. SEATING PLANE C F T S 4 A Q 1 2 3 STYLE 5: PIN 1. 2. 3. 4. U H K Z L R V J G D N GATE DRAIN SOURCE DRAIN DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 ––– ––– 0.080 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 ––– ––– 2.04 CASE 221A–06 ISSUE Y Motorola TMOS Power MOSFET Transistor Device Data 7 MTP3055V Motorola reserves the right to make changes without further notice to any products herein. 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