ONSEMI 2N4264

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SEMICONDUCTOR TECHNICAL DATA
NPN Silicon
COLLECTOR
3
2
BASE
1
EMITTER
1
2
3
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector – Emitter Voltage
VCEO
15
Vdc
Collector – Base Voltage
VCBO
30
Vdc
Emitter – Base Voltage
VEBO
6.0
Vdc
Collector Current — Continuous
IC
200
mAdc
Total Device Dissipation @ TA = 25°C
Derate above 25°C
PD
350
2.8
mW
mW/°C
Total Device Dissipation @ TC = 25°C
Derate above 25°C
PD
1.0
8.0
Watts
mW/°C
TJ, Tstg
– 55 to +150
°C
Symbol
Max
Unit
Thermal Resistance, Junction to Ambient
RqJA
357
°C/W
Thermal Resistance, Junction to Case
RqJC
125
°C/W
Operating and Storage Junction
Temperature Range
CASE 29–04, STYLE 1
TO–92 (TO–226AA)
THERMAL CHARACTERISTICS
Characteristic
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Max
15
—
30
—
6.0
—
—
—
0.1
10
—
100
Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)
V(BR)CEO
Collector – Base Breakdown Voltage
(IC = 10 mAdc, IE = 0)
V(BR)CBO
Emitter – Base Breakdown Voltage
(IE = 10 mAdc, IC = 0)
V(BR)EBO
Base Cutoff Current
(VCE = 12 Vdc, VEB(off) = 0.25 Vdc)
(VCE = 12 Vdc, VEB(off) = 0.25 Vdc, TA = 100°C)
IBEV
Collector Cutoff Current
(VCE = 12 Vdc, VEB(off) = 0.25 Vdc)
ICEX
Vdc
Vdc
Vdc
µAdc
nAdc
REV 2
Motorola Small–Signal Transistors, FETs and Diodes Device Data
 Motorola, Inc. 1997
1
2N4264
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Continued)
Characteristic
Symbol
Min
Max
Unit
25
40
20
40
30
20
—
160
—
—
—
—
—
—
0.22
0.35
0.65
0.75
0.8
0.95
fT
300
—
MHz
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
Cibo
—
8.0
pF
Output Capacitance
(VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz, IE = 0)
Cobo
—
4.0
pF
( CC = 10 Vdc,, VEB(off) = 2.0 Vdc,,
(V
IC = 100 mAdc, IB1 = 10 mAdc) (Fig. 1, Test Condition C)
td
—
8.0
ns
tr
—
15
ns
VCC = 10 Vdc, (IC = 10 mAdc, for ts)
(IC = 100 mA for tf)
(IB1 = –10 mA) (IB2 = 10 mA) (Fig. 1, Test Condition C)
ts
—
20
ns
tf
—
15
ns
Turn–On Time
(VCC = 3.0 Vdc, VEB(off) = 1.5 Vdc,
IC = 10 mAdc, IB1 = 3.0 mAdc) (Fig. 1, Test Condition A)
ton
—
25
ns
Turn–Off Time
(VCC = 3.0 Vdc, IC = 10 mAdc,
IB1 = 3.0 mAdc, IB2 = 1.5 mAdc) (Fig. 1, Test Condition A)
toff
—
35
ns
Storage Time
(VCC = 10 Vdc, IC = 10 mA,
IB1 = IB2 = 10 mAdc) (Fig. 1, Test Condition B)
ts
—
20
ns
Total Control Charge
(VCC = 3.0 Vdc, IC = 10 mAdc, IB = mAdc)
(Fig. 3, Test Condition A)
QT
—
80
pC
ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc, TA = – 55°C)
(IC = 30 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)(1)
(IC = 200 mAdc, VCE = 1.0 Vdc)(1)
hFE
—
Collector – Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 100 mAdc, IB = 10 mAdc)(1)
VCE(sat)
Base – Emitter Saturation Voltage
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 100 mAdc, IB = 10 mAdc)(1)
VBE(sat)
Vdc
Vdc
SMALL– SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product
(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz)
SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%.
Figure 1. Switching Time Equivalent Test Circuit
Test
Condition IC
2
VCC
RS
mA
V
Ω
A
10
3
B
10
C
100
RC CS(max) VBE(off)
Ω
pF
V
3300 270
4
–1.5
10
560 960
4
—
10
560
12
–2.0
96
V1
V2
V3
V
V
V
10.55 –4.15 10.70
—
–4.65 6.55
6.35 –4.65 6.55
V1
ton
t1
V3
0
V2
0
VEB(off)
< 2 ns
toff
t1
VCC
RC
RB
CS
< 2 ns
PULSE WIDTH (t1) = 300 ns DUTY CYCLE = 2%
Motorola Small–Signal Transistors, FETs and Diodes Device Data
2N4264
CURRENT GAIN CHARACTERISTICS
100
2N4264
VCE = 1 V
h FE, DC CURRENT GAIN
70
TJ = 125°C
50
25°C
–15°C
30
– 55°C
20
10
1.0
2.0
3.0
5.0
7.0
10
20
IC, COLLECTOR CURRENT (mA)
30
50
70
100
200
Figure 2. Minimum Current Gain
270 Ω
t1
3V
8 pF
+10 V
∆V
0
C < COPT
CS < 4 pF
C
<1 ns 9.2 kΩ
PULSE WIDTH (t1) = 5 µs
DUTY CYCLE = 2%
C=0
COPT
TIME
Figure 3. QT Test Circuit
Figure 4. Turn–Off Waveform
NOTE 1
When a transistor is held in a conductive state by a base current, IB,
a charge, QS, is developed or “stored” in the transistor. QS may be
written: QS = Q1 + QV + QX.
Q1 is the charge required to develop the required collector current.
This charge is primarily a function of alpha cutoff frequency. QV is the
charge required to charge the collector–base feedback capacity. QX is
excess charge resulting from overdrive, i.e., operation in saturation.
The charge required to turn a transistor “on” to the edge of saturation
is the sum of Q1 and QV which is defined as the active region charge,
QA. QA = IB1tr when the transistor is driven by a constant current step
IC
.
(IB1) and IB1 < <
hFE
If IB were suddenly removed, the transistor would continue to
conduct until QS is removed from the active regions through an
external path or through internal recombination. Since the internal
recombination time is long compared to the ultimate capability of a
transistor, a charge, QT, of opposite polarity, equal in magnitude, can
be stored on an external capacitor, C, to neutralize the internal charge
and considerably reduce the turn–off time of the transistor. Figure 3
shows the test circuit and Figure 4 the turn–off waveform. Given QT
from Figure 13, the external C for worst–case turn–off in any circuit is:
C = QT/∆V, where ∆V is defined in Figure 3.
Motorola Small–Signal Transistors, FETs and Diodes Device Data
3
2N4264
“ON” CONDITION CHARACTERISTICS
VCE, MAXIMUM COLLECTOR–EMITTER
VOLTAGE (VOLTS)
1.0
2N4264
TJ = 25°C
0.8
IC = 10 mA
50 mA
200 mA
100 mA
0.6
0.4
0.2
0
0.1
0.2
0.3
0.5
0.7
1.0
2.0
3.0
IB, BASE CURRENT (mA)
5.0
7.0
10
20
30
50
Figure 5. Collector Saturation Region
1.0
IC/IB = 10
TJ = 25°C
θV, TEMPERATURE COEFFICIENTS (mV/°C)
Vsat , SATURATION VOLTAGE (VOLTS)
1.2
MAX VBE(sat)
MIN VBE(sat)
0.8
0.6
MAX VCE(sat)
0.4
0.2
0
1.0
2.0 3.0
50 70 100
5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mA)
Figure 6. Saturation Voltage Limits
4
200
1.0
0.5
qVC for VCE(sat)
(25°C to 125°C)
(– 55°C to 25°C)
0
– 0.5
(25°C to 125°C)
– 1.0
qVB for VBE
(– 55°C to 25°C)
– 1.5
– 2.0
0
40
80
120
160
IC, COLLECTOR CURRENT (mA)
200
Figure 7. Temperature Coefficients
Motorola Small–Signal Transistors, FETs and Diodes Device Data
2N4264
DYNAMIC CHARACTERISTICS
200
200
VCC = 10 V
TJ = 25°C
100
70
70
t r , RISE TIME (ns)
t d, DELAY TIME (ns)
100
IC/IB = 10
TJ = 25°C
TJ = 125°C
td @ VEB(off) = 3 V
50
30
2V
20
0V
10
VCC = 10 V
50
30
20
VCC = 3 V
10
7.0
7.0
5.0
5.0
1.0
2.0
50
5.0
10
20
IC, COLLECTOR CURRENT (mA)
100
200
1.0
50
5.0
10
20
IC, COLLECTOR CURRENT (mA)
2.0
Figure 8. Delay Time
200
IC/IB = 20
30
TJ = 25°C
TJ = 125°C
IC/IB = 10
20
10
ts′
7.0
VCC = 10 V
TJ = 25°C
TJ = 125°C
100
t f , FALL TIME (ns)
t s , STORAGE TIME (ns)
200
Figure 9. Rise Time
50
^ ts – 1/8 tf
70
50
30
IC/IB = 20
20
IC/IB = 10
10
IB1 = IB2
7.0
5.0
5.0
1.0
50
5.0
10
20
IC, COLLECTOR CURRENT (mA)
2.0
100
200
1.0
50
5.0
10
20
IC, COLLECTOR CURRENT (mA)
2.0
Figure 10. Storage Time
100
200
5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
200
Figure 11. Fall Time
10
1000
MAX
TYP
7.0
IC/IB = 10
TJ = 25°C
TJ = 125°C
700
500
Cibo
Q, CHARGE (pC)
CAPACITANCE (pF)
100
5.0
Cobo
3.0
300
200
QT
100
VCC = 3 V
70
50
VCC = 10 V
30
2.0
0.1
0.2
0.5
1.0
2.0
REVERSE BIAS (Vdc)
5.0
10
Figure 12. Junction Capacitance
Motorola Small–Signal Transistors, FETs and Diodes Device Data
20
QA
VCC = 3 V
1.0
2.0 3.0
Figure 13. Maximum Charge Data
5
2N4264
PACKAGE DIMENSIONS
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
B
R
P
L
F
SEATING
PLANE
K
DIM
A
B
C
D
F
G
H
J
K
L
N
P
R
V
D
J
X X
G
H
V
C
1
SECTION X–X
N
N
CASE 029–04
(TO–226AA)
ISSUE AD
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.022
0.016
0.019
0.045
0.055
0.095
0.105
0.015
0.020
0.500
–––
0.250
–––
0.080
0.105
–––
0.100
0.115
–––
0.135
–––
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.41
0.55
0.41
0.48
1.15
1.39
2.42
2.66
0.39
0.50
12.70
–––
6.35
–––
2.04
2.66
–––
2.54
2.93
–––
3.43
–––
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
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6
◊
2N4264/D
Motorola Small–Signal Transistors, FETs and Diodes Device
Data