FAIRCHILD FCA36N60NF

SupreMOS
FCA36N60NF
TM
tm
N-Channel MOSFET, FRFET
600V, 36A, 95mΩ
Features
Description
• RDS(on) = 80mΩ ( Typ.)@ VGS = 10V, ID = 18A
The SupreMOS MOSFET, Fairchild’s next generation of high
voltage super-junction MOSFETs, employs a deep trench filling
process that differentiates it from preceding multi-epi based technologies. By utilizing this advanced technology and precise process control, SupreMOS provides world class Rsp, superior
switching performance and ruggedness.
This SupreMOS MOSFET fits the industry’s AC-DC SMPS
requirements for PFC, server/telecom power, FPD TV power,
ATX power, and industrial power applications.
• Ultra Low Gate Charge ( Typ. Qg = 86nC)
• Low Effective Output Capacitance
• 100% Avalanche Tested
• RoHS Compliant
D
G
TO-3PN
G DS
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*
Symbol
VDSS
Drain to Source Voltage
Parameter
VGSS
Gate to Source Voltage
ID
Drain Current
IDM
Drain Current
EAS
Single Pulsed Avalanche Energy
IAR
Avalanche Current
EAR
Repetitive Avalanche Energy
dv/dt
Units
V
±30
V
Continuous (TC = 25oC)
34.9
Continuous (TC = 100oC)
22
Pulsed
Peak Diode Recovery dv/dt
A
(Note 1)
104.7
A
(Note 2)
1800
mJ
(Note 3)
MOSFET dv/dt Ruggedness
12
A
3.12
mJ
50
100
V/ns
(TC = 25oC)
312
W
Derate above 25oC
2.6
W/oC
PD
Power Dissipation
TJ, TSTG
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
TL
FCA36N60NF
600
-55 to +150
o
C
300
o
C
*Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
Parameter
FCA36N60NF
RθJC
Thermal Resistance, Junction to Case
0.40
RθCS
Thermal Resistance, Case to Heat Sink (Typical)
0.24
RθJA
Thermal Resistance, Junction to Ambient
©2011 Fairchild Semiconductor Corporation
FCA36N60NF Rev. A
Units
o
C/W
40
1
www.fairchildsemi.com
FCA36N60NF N-Channel MOSFET, FRFET
February 2011
Device Marking
FCA36N60NF
Device
FCA36N60NF
Package
TO-3PN
Reel Size
-
Tape Width
-
Quantity
30
Electrical Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
600
-
-
V
ID = 1mA, Referenced to 25 C
-
0.60
-
V/oC
VDS = 480V, VGS = 0V
-
-
10
-
-
100
μA
VGS = ±30V, VDS = 0V
-
-
±100
Off Characteristics
BVDSS
ΔBVDSS
ΔTJ
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate to Body Leakage Current
ID = 1mA, VGS = 0V,TJ = 25oC
o
TJ = 125oC
nA
On Characteristics
VGS(th)
RDS(on)
Gate Threshold Voltage
VGS = VDS, ID = 250μA
3.0
3.7
5.0
V
Static Drain to Source On Resistance
VGS = 10V, ID = 18A
-
80
95
mΩ
gFS
Forward Transconductance
VDS = 20V, ID = 18A
-
39
-
S
VDS = 100V, VGS = 0V
f = 1MHz
-
3191
4245
pF
-
145
195
pF
pF
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
-
5
8
Coss
Output Capacitance
VDS = 380V, VGS = 0V, f = 1MHz
-
81
-
pF
Cosseff.
Effective Output Capacitance
VDS = 0V to 480V, VGS = 0V
-
338
-
pF
Qg(tot)
Total Gate Charge at 10V
86
112
nC
Gate to Source Gate Charge
VDS = 380V, ID = 18A,
VGS = 10V
-
Qgs
-
16
-
nC
Qgd
Gate to Drain “Miller” Charge
-
36
-
nC
ESR
Equivalent Series Resistance (G-S)
-
1.2
-
Ω
-
27
64
ns
-
17
44
ns
-
92
194
ns
-
4
18
ns
(Note 4)
Drain Open, f=1MHz
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
VDD = 380V, ID = 18A
RG = 4.7Ω
(Note 4)
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain to Source Diode Forward Current
-
-
36
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
-
-
108
A
VSD
Drain to Source Diode Forward Voltage
VGS = 0V, ISD = 18A
-
-
1.2
V
trr
Reverse Recovery Time
-
166
-
ns
Qrr
Reverse Recovery Charge
VGS = 0V, ISD = 18A
dIF/dt = 100A/μs
-
1.3
-
μC
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. IAS = 12A, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 36A, di/dt ≤ 1200A/μs, VDD ≤ 380V, Starting TJ = 25°C
4. Essentially Independent of Operating Temperature Typical Characteristics
FCA36N60NF Rev. A
2
www.fairchildsemi.com
FCA36N60NF N-Channel MOSFET, FRFET
Package Marking and Ordering Information TC = 25oC unless otherwise noted
Figure 1. On-Region Characteristics
200
200
VGS = 15.0 V
10.0 V
8.0 V
7.0 V
6.0 V
5.0 V
100
ID, Drain Current[A]
100
ID, Drain Current[A]
Figure 2. Transfer Characteristics
*Notes:
1. 250μs Pulse Test
10
o
2. TC = 25 C
10
o
o
25 C
150 C
o
-55 C
1
1
0.1
*Notes:
1. VDS = 20V
2. 250μs Pulse Test
1
VDS, Drain-Source Voltage[V]
10
0.2
20
2
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
4
6
8
VGS, Gate-Source Voltage[V]
10
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
200
150
IS, Reverse Drain Current [A]
RDS(ON) [mΩ],
Drain-Source On-Resistance
100
125
VGS = 10V
100
VGS = 20V
75
10
o
150 C
o
25 C
1
*Notes:
1. VGS = 0V
o
*Notes: TC = 25 C
0.2
0.2
50
0
18
36
54
72
ID, Drain Current [A]
90
108
Figure 5. Capacitance Characteristics
VGS, Gate-Source Voltage [V]
10
10000
Capacitances [pF]
Ciss
1000
Coss
10
1.4
Figure 6. Gate Charge Characteristics
100000
100
2. 250μs Pulse Test
0.4
0.6
0.8
1.0
1.2
VSD, Body Diode Forward Voltage [V]
*Notes:
1. VGS = 0V
2. f = 1MHz
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
1
0.1
FCA36N60NF Rev. A
Crss
1
10
100
VDS, Drain-Source Voltage [V]
8
VDS = 120V
VDS = 300V
6
VDS = 480V
4
2
*Notes: ID = 18A
0
600
0
3
20
40
60
80
Qg, Total Gate Charge [nC]
100
www.fairchildsemi.com
FCA36N60NF N-Channel MOSFET, FRFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
1.1
1.0
0.9
*Notes:
1. VGS = 0V
2. ID = 1mA
0.8
-100
-50
0
50
100
o
TJ, Junction Temperature [ C]
2.5
2.0
1.5
1.0
*Notes:
1. VGS = 10V
2. ID = 18A
0.5
0.0
-100
150
-50
0
50
100
o
TJ, Junction Temperature [ C]
150
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
500
40
10μs
100
100μs
ID, Drain Current [A]
ID, Drain Current [A]
RDS(on), [Normalized]
Drain-Source On-Resistance
BVDSS, [Normalized]
Drain-Source Breakdown Voltage
1.2
1ms
10
10ms
Operation in This Area
is Limited by R DS(on)
1
DC
*Notes:
0.1
o
30
20
10
1. TC = 25 C
o
2. TJ = 150 C
3. Single Pulse
0
25
0.01
1
10
100
VDS, Drain-Source Voltage [V]
1000
50
75
100
125
o
TC, Case Temperature [ C]
150
Figure 11. Transient Thermal Response Curve
Thermal Response [ZθJC]
1
0.5
0.1
0.2
0.1
0.01
t1
0.02
0.01
*Notes:
Single pulse
0.005
-5
10
FCA36N60NF Rev. A
PDM
0.05
t2
o
1. ZθJC(t) = 0.40 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
-4
10
-3
-2
-1
0
10
10
10
10
Rectangular Pulse Duration [sec]
4
1
10
2
10
www.fairchildsemi.com
FCA36N60NF N-Channel MOSFET, FRFET
Typical Performance Characteristics (Continued)
FCA36N60NF N-Channel MOSFET, FRFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FCA36N60NF Rev. A
5
www.fairchildsemi.com
FCA36N60NF N-Channel MOSFET, FRFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
+
VDS
_
I SD
L
Driver
RG
VGS
VGS
( Driver )
Same Type
as DUT
VDD
• dv/dt controlled by RG
• ISD controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
I SD
( DUT )
di/dt
IRM
Body Diode Reverse Current
VDS
( DUT )
Body Diode Recovery dv/dt
VDD
VSD
Body Diode
Forward Voltage Drop
FCA36N60NF Rev. A
6
www.fairchildsemi.com
FCA36N60NF N-Channel MOSFET, FRFET
Mechanical Dimensions
TO-3PN
FCA36N60NF Rev. A
7
www.fairchildsemi.com
tm
tm
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
www.Fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild
Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of
up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and
warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is
committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I51
FCA36N60NF Rev. A
8
www.fairchildsemi.com
FCA36N60NF N-Channel MOSFET, FRFET
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
PowerTrench®
F-PFS™
The Power Franchise®
AccuPower™
FRFET®
PowerXS™
The Right Technology for Your Success™
Auto-SPM™
®
Programmable Active Droop™
Global Power ResourceSM
Build it Now™
Green FPS™
QFET®
CorePLUS™
QS™
Green FPS™ e-Series™
CorePOWER™
TinyBoost™
Quiet Series™
CROSSVOLT™
Gmax™
TinyBuck™
RapidConfigure™
CTL™
GTO™
TinyCalc™
Current Transfer Logic™
IntelliMAX™
™
TinyLogic®
DEUXPEED®
ISOPLANAR™
TINYOPTO™
Dual Cool™
Saving our world, 1mW/W/kW at a time™
MegaBuck™
TinyPower™
EcoSPARK®
SignalWise™
MICROCOUPLER™
TinyPWM™
EfficentMax™
SmartMax™
MicroFET™
TinyWire™
ESBC™
SMART START™
MicroPak™
TriFault Detect™
SPM®
MicroPak2™
®
TRUECURRENT™*
STEALTH™
MillerDrive™
μSerDes™
SuperFET®
MotionMax™
Fairchild®
SuperSOT™-3
Motion-SPM™
Fairchild Semiconductor®
SuperSOT™-6
OptiHiT™
FACT Quiet Series™
UHC®
SuperSOT™-8
OPTOLOGIC®
FACT®
®
Ultra FRFET™
OPTOPLANAR
SupreMOS®
FAST®
®
UniFET™
SyncFET™
FastvCore™
VCX™
Sync-Lock™
FETBench™
VisualMax™
®*
FlashWriter® *
PDP SPM™
XS™
FPS™
Power-SPM™