SANYO LC895125W

Ordering number : EN*5241
CMOS LSI
LC895125Q, 895125W
CD-ROM Driver with On-Chip SCSI Interface and
Subcode Functions
Preliminary
Functions
Package Dimensions
CD-ROM ECC function, subcode read function, SCSI
interface
unit: mm
3182-QIP128E
Features
[LC895125Q]
• On-chip SCSI interface (with built-in SCAM selection
register)
• Supports 8× playback - Using ×16 80-ns DRAMs
• Supports 4× playback - Using ×16 80-ns DRAMs or ×8
70-ns DRAMs
• Transfer rates: 10 MB/s (synchronous), 5 MB/s
(asynchronous) using ×16 80-ns DRAMs*1
• Transfer rates: 8.467 MB/s (synchronous), 4.2336 MB/s
(asynchronous) using ×8 70-ns DRAMs*2
• Supports the connection of up to 32 Mb of buffer RAM
(using DRAM)
• The user can freely set the CD main channel, C2 flag,
and other areas in buffer RAM.
• Batch transfer function (transfers the CD main channel
and C2 flag data in a single operation)
• Multi-block transfer function (automatically transfers
multiple blocks in a single operation)
• High-speed transfer mode supports a 10-MB/s
(synchronous) transfer rate using ×8 80-ns DRAMs
• Subcode ECC function
Note: 1. For speeds up to 8× speed, use a SCSI master
clock frequency of 20 MHz.
Note: 2. For speeds up to 4× speed, use a SCSI master
clock frequency of 16.9344 MHz.
SANYO: QIP128E
unit: mm
3214-SQFP144
[LC895125W]
Specifications
SANYO: SQFP144
Absolute Maximum Ratings at VSS = 0 V
Parameter
Maximum supply voltage
Symbol
Conditions
Ratings
Unit
VDD max
Ta = 25°C
–0.3 to +7.0
V
I/O voltages
VI, VO
Ta = 25°C
–0.3 to VDD + 0.3
V
Allowable power dissipation
Pd max
Ta ≤ 70°C
450
mW
Operating temperature
Topr
–30 to +70
°C
Storage temperature
Tstg
–55 to +125
°C
260
°C
Soldering heat resistance (pins only)
10 seconds
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-0005 JAPAN
22896HA (OT) No. 5241-1/11
LC895125Q, 895125W
Allowable Operating Ranges at Ta = –30 to +70°C, VSS = 0 V
min
typ
max
Supply voltage
Parameter
Symbol
VDD
Conditions
4.5
5.0
5.5
Unit
V
Input voltage range
VIN
0
VDD
V
max
Unit
0.8
V
0.6
V
0.8
V
DC Characteristics at VSS = 0 V, VDD = 4.5 to 5.5 V, Ta = –30 to +70°C
Parameter
Symbol
Applicable Pins* (See below)
min
typ
Input high level voltage
VIH1
Input low level voltage
VIL1
Input high level voltage
VIH2
Input low level voltage
VIL2
Input high level voltage
VIH3
Input low level voltage
VIL3
Output high level voltage
VOH1
IOH1 = –2 mA: All output pins except (2), (3),
and XTALCK, IO0 to IO15, and D0 to D7
Output low level voltage
VOL1
IOL1 = 2 mA: All output pins except (2), (3),
and XTALCK, IO0 to IO15, and D0 to D7
0.4
V
Output low level voltage
VOL2
IOL2 = 2 mA: INT1, INT0, and ZSWAIT
(open-drain outputs with pull-up resistors) (2)
0.4
V
Output low level voltage
VOL3
IOL3 = 48 mA: DB0, to DB7, DBP, BSY, I/O, MSG,
SEL, RST, REQ, C/D (3)
0.4
V
Input leakage current
Pull-up resistance
IL
RUP
All input pins other than (1), (3), and XTALCK
RESET, IO0 to IO15, D0 to D7, RD, CS, WR, WFCK,
SBSO, SCOR (1)
Input pins (3), ACK, and ATN
VI = VSS, VDD: All input pins
IO0 to IO15, D0 to D7, INT0, INT1, ZSWAIT
2.2
V
2.5
V
2.0
V
2.4
V
–25
40
+25
µA
160
kΩ
typ
max
Unit
1.60
2.00
80
SCSI Pin Input Characteristics
Parameter
Input threshold voltage
Hysteresis width
Symbol
Vt + t1
Vt – t1
∆Vtt1
Conditions
VDD = 4.5 to 5.5 V
VDD = 5.0 V
min
V
0.80
1.11
V
0.41
0.49
V
Sample Recommended Oscillator Circuit
R1 = 120 kΩ
R2 = 47 Ω
C1 = 30 pF
Crystal oscillator frequencies: XTALCK0 = 16.9344 MHZ and XTALCK1 = 20 MHz
or:
R1 = 3.3 kΩ
R2 = None
C1 = 5 pF
Crystal oscillator frequency: XTALCK0 = 33.8688 MHz
If third harmonic overtones appear when using a 33.8688 MHz frequency with the
recommended circuit example, consult with the manufacturer of the crystal
element, since detailed values of the circuit constants will be influenced by the
printed circuit board.
No. 5241-2/11
LC895125Q, 895125W
Block Diagram
Note: 1. WFCK, SBSO, SCOR
2. BCK, SDATA, LRCK, C2PO
3. DB0 to DB7, DBP, BSY, MSG, SEL, RST, REQ, I/O, C/D
4. ACK, ATN
5. ZRD, ZWR, SUA0 to SUA6, ZCS, CSCTRL
6. D0 to D7
7. IO0 to IO15
8. RA0 to RA16, ZRAS0, ZRAS1, ZCAS0, ZCAS1, ZOE, ZUWE, ZLWE
Note: IO8 to IO15 and RA9 to RA16 are the same pins.
No. 5241-3/11
LC895125Q, 895125W
Pin Functions (LC895125Q)
Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin
Pin No.
Symbol
Type
1
VDD
P
2
VSS0
P
3
RA5
O
4
RA6
O
5
RA7
O
6
RA8
O
7
RA9 (IO15)
B
8
RA10 (IO14)
B
Function
Address outputs for the buffer RAM
Address outputs for the buffer RAM or data I/O pins
The pin circuits include pull-up resistors.
9
VSS0
P
10
RA11 (IO13)
B
11
RA12 (IO12)
B
12
RA13 (IO11)
B
13
RA14 (IO10)
B
14
RA15 (IO9)
B
15
RA16 (IO8)
B
16
IO7
B
17
VSS0
P
18
IO6
B
19
IO5
B
20
IO4
B
21
IO3
B
22
IO2
B
23
IO1
B
24
IO0
B
25
VSS0
P
26
TEST0
I
27
TEST1
I
28
TEST2
I
29
TEST3
I
30
TEST4
I
31
ZRESET
I
32
VDD
P
33
VSS0
P
34
CSCTRL
I
Selects active-high or active-low for the microcontroller CS logic.
35
XTALCK0
I
Crystal oscillator input
36
XTAL0
O
Crystal oscillator output
37
VSS0
P
38
D0
B
39
D1
B
40
D2
B
41
D3
B
42
D4
B
43
D5
B
44
D6
B
45
D7
B
46
VSS0
P
47
ZSWAIT
O
WAIT signal output to the microcontroller
48
ZINT0
O
Interrupt request output to the microcontroller (ECC side. Set with a register.)
49
VDD
P
ZINT1
O
50
Address outputs for the buffer RAM or data I/O pins
The pin circuits include pull-up resistors.
Buffer RAM data I/O. The pin circuit includes a pull-up resistor.
Buffer RAM data I/O.
The pin circuits include pull-up resistors.
Test pins. These pins must be connected to VSS0.
LSI reset. The LSI is reset on a 0 input.
Microcontroller data signals
Interrupt request output to the microcontroller (SCSI side. Set with a register.)
Note: 1.
2.
3.
4.
NC pins must be left open. Do not connect any signal to these pins.
Pin names that start with Z are negative-logic signals.
VSS0 is the logic system ground and VSS1 is the SCSI interface ground.
Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any
other measures necessary to prevent undershoot in the DRAM related circuits.
5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied.
Continued on next page.
No. 5241-4/11
LC895125Q, 895125W
Continued from preceding page.
Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin
Pin No.
Symbol
Type
51
ZRD
I
Microcontroller data read signal input
52
ZWR
I
Microcontroller data write signal input
53
ZCS
I
Register chip select signal from the microcontroller
54
SUA0
I
55
SUA1
I
56
SUA2
I
57
SUA3
I
58
SUA4
I
59
SUA5
I
60
SUA6
I
61
VSS0
P
62
X1EN
I
Selection pin that must be set to 1 when XTALCK1 is used.
63
XTALCK1
I
SCSI block oscillator circuit input. Selected by X1EN.
64
XTAL1
O
SCSI block oscillator circuit output.
65
VDD
P
66
VSS1
P
67
DB0
B
68
DB1
B
69
VSS1
P
70
DB2
B
71
DB3
B
72
VDD
P
73
VSS1
P
74
DB4
B
75
DB5
B
76
VSS1
P
77
DB6
B
78
DB7
B
P
79
VSS1
80
DBP
B
81
VSS1
P
82
ATN
B
83
VDD
P
84
BSY
B
85
ACK
B
86
VSS1
P
87
RST
B
88
MSG
B
89
VDD
P
90
SEL
B
91
C/D
B
92
VSS1
P
93
REQ
B
94
I/O
B
95
VSS1
P
96
VDD
P
97
VSS0
98
Function
Microcontroller register selection signals
SCSI connection
SCSI connection
SCSI connection
SCSI connection
SCSI connection
SCSI connection
SCSI connection
SCSI connection
SCSI connection
SCSI connection
P
NC
99
VSS0
P
100
VSS0
P
Note: 1.
2.
3.
4.
NC pins must be left open. Do not connect any signal to these pins.
Pin names that start with Z are negative-logic signals.
VSS0 is the logic system ground and VSS1 is the SCSI interface ground.
Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any
other measures necessary to prevent undershoot in the DRAM related circuits.
5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied.
Continued on next page.
No. 5241-5/11
LC895125Q, 895125W
Continued from preceding page.
Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin
Pin No.
Symbol
Type
101
VSS0
P
102
Function
NC
103
NC
104
C2PO
105
SDATA
I
I
106
BCK
I
107
LRCK
I
108
MCK
O
109
VSS0
P
O
110
EXCK
111
WFCK
I
112
SBSO
I
113
VDD
P
114
SCOR
I
115
VSS0
P
CD DSP interface
Outputs the XTALCK0 frequency, or that frequency divided by 2.
Subcode I/O
Subcode I/O
116
ZRAS0
O
Buffer RAM RAS signal output pin 0 (Normally, pin 0 is used)
117
ZRAS1
O
Buffer RAM RAS signal output pin 1
118
ZCAS0
O
Buffer RAM CAS signal output pin 0 (Normally, pin 0 is used)
119
ZCAS1
O
Buffer RAM CAS signal output pin 1
120
ZOE
O
Buffer RAM output enable
121
ZUWE
O
Buffer RAM upper write enable
122
ZLWE
O
Buffer RAM lower write enable
123
VSS0
P
124
RA0
O
125
RA1
O
126
RA2
O
127
RA3
O
128
RA4
O
Buffer RAM address signal outputs
Note: 1.
2.
3.
4.
NC pins must be left open. Do not connect any signal to these pins.
Pin names that start with Z are negative-logic signals.
VSS0 is the logic system ground and VSS1 is the SCSI interface ground.
Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any
other measures necessary to prevent undershoot in the DRAM related circuits.
5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied.
No. 5241-6/11
LC895125Q, 895125W
Pin Functions (LC895125W)
Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin
Pin No.
Symbol
Type
1
VSS0
P
2
VDD
P
3
VSS0
P
4
RA5
O
5
RA6
O
6
RA7
O
7
RA8
O
8
RA9 (IO15)
B
9
RA10 (IO14)
B
10
VSS0
P
11
RA11 (IO13)
B
12
RA12 (IO12)
B
13
RA13 (IO11)
B
14
RA14 (IO10)
B
15
RA15 (IO9)
B
16
RA16 (IO8)
B
17
IO7
B
18
VDD
P
19
VSS0
20
Function
Buffer RAM address signal outputs
Address outputs for the buffer RAM or data I/O pins
The pin circuits include pull-up resistors.
Address outputs for the buffer RAM or data I/O pins
The pin circuits include pull-up resistors.
Buffer RAM data I/O. The pin circuit includes a pull-up resistor.
P
NC
21
IO6
B
22
IO5
B
23
IO4
B
24
IO3
B
25
IO2
B
26
IO1
B
27
IO0
B
28
VSS0
P
29
TEST0
I
30
TEST1
I
31
TEST2
I
32
TEST3
I
33
TEST4
I
34
ZRESET
I
35
VDD
P
36
VSS0
P
37
VDD
P
38
VSS0
P
39
CSCTRL
I
Selects active-high or active-low for the microcontroller CS logic.
40
XTALCK0
I
Crystal oscillator input
41
XTAL0
O
Crystal oscillator output
42
VSS0
P
43
D0
B
44
D1
B
45
D2
B
46
D3
B
47
D4
B
48
D5
B
49
D6
B
50
D7
B
Buffer RAM data I/O.
The pin circuit includes a pull-up resistor.
Test pins. These pins must be connected to VSS0.
LSI reset. The LSI is reset on a 0 input.
Microcontroller data signals
Note: 1.
2.
3.
4.
NC pins must be left open. Do not connect any signal to these pins.
Pin names that start with Z are negative-logic signals.
VSS0 is the logic system ground and VSS1 is the SCSI interface ground.
Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any
other measures necessary to prevent undershoot in the DRAM related circuits.
5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied.
Continued on next page.
No. 5241-7/11
LC895125Q, 895125W
Continued from preceding page.
Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin
Pin No.
Symbol
Type
51
VSS0
P
Function
52
ZSWAIT
O
WAIT signal output to the microcontroller
53
ZINT0
O
Interrupt request output to the microcontroller (ECC side. Set with a register.)
54
VDD
P
55
VSS0
P
56
ZINT1
O
Interrupt request output to the microcontroller (SCSI side. Set with a register.)
57
ZRD
I
Microcontroller data read signal input
58
NC
59
ZWR
I
Microcontroller data write signal input
60
ZCS
I
Input for the register chip select signal from the microcontroller
61
SUA0
I
62
SUA1
I
63
SUA2
I
64
SUA3
I
65
SUA4
I
66
SUA5
I
67
SUA6
I
68
VSS0
P
69
X1EN
I
Selection pin that must be set to 1 when XTALCK1 is used
70
XTALCK1
I
SCSI block oscillator circuit input. Selected by X1EN.
71
XTAL1
O
SCSI block oscillator circuit output
72
VSS0
P
73
VDD
P
74
VSS1
P
75
DB0
B
76
DB1
B
77
VSS1
P
78
DB2
B
79
DB3
B
80
Microcontroller register selection signals
SCSI connection
SCSI connection
NC
81
VDD
P
82
VSS1
P
83
DB4
B
84
DB5
B
85
VSS1
P
86
DB6
B
87
DB7
B
P
88
VSS1
89
DBP
B
90
VDD
P
91
VSS1
92
SCSI connection
SCSI connection
SCSI connection
P
NC
93
ATN
B
94
VDD
P
95
BSY
B
96
ACK
B
97
VSS1
P
98
RST
B
99
MSG
B
VDD
P
100
SCSI connection
SCSI connection
SCSI connection
Note: 1.
2.
3.
4.
NC pins must be left open. Do not connect any signal to these pins.
Pin names that start with Z are negative-logic signals.
VSS0 is the logic system ground and VSS1 is the SCSI interface ground.
Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any
other measures necessary to prevent undershoot in the DRAM related circuits.
5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied.
Continued on next page.
No. 5241-8/11
LC895125Q, 895125W
Continued from preceding page.
Type: I: Input pin, O: Output pin, B: Bidirectional pin, P: Power supply pin, NC: No connection pin
Pin No.
Symbol
Type
101
SEL
B
102
C/D
B
103
VSS1
P
104
REQ
B
105
I/O
B
106
VSS1
P
107
VDD
P
108
VSS0
P
109
VDD
P
110
VSS0
111
Function
SCSI connection
SCSI connection
P
NC
112
VSS0
P
113
VSS0
P
114
VSS0
115
P
NC
116
NC
117
C2PO
118
SDATA
I
I
119
BCK
I
120
LRCK
I
121
MCK
O
122
VSS0
P
O
123
EXCK
124
WFCK
I
125
SBSO
I
126
VDD
P
127
VSS0
P
128
SCOR
I
129
VSS0
P
130
CD DSP interface
Outputs the XTALCK0 frequency, or that frequency divided by 2.
Subcode I/O
Subcode I/O
NC
131
ZRAS0
O
Buffer RAM RAS signal output pin 0 (Normally, pin 0 is used)
132
ZRAS1
O
Buffer RAM RAS signal output pin 1
133
ZCAS0
O
Buffer RAM CAS signal output pin 0 (Normally, pin 0 is used)
134
ZCAS1
O
Buffer RAM CAS signal output pin 1
135
ZOE
O
Buffer RAM output enable
136
ZUWE
O
Buffer RAM upper write enable
137
ZLWE
O
Buffer RAM lower write enable
138
VSS0
P
139
RA0
O
140
RA1
O
141
RA2
O
142
RA3
O
143
RA4
O
144
VDD
P
Buffer RAM address signal outputs
Note: 1.
2.
3.
4.
NC pins must be left open. Do not connect any signal to these pins.
Pin names that start with Z are negative-logic signals.
VSS0 is the logic system ground and VSS1 is the SCSI interface ground.
Applications that use DRAM must insert resistors in the CAS and RAS lines, connect capacitors between these lines and ground, and take any
other measures necessary to prevent undershoot in the DRAM related circuits.
5. Since these circuits include buffers that sink 48 mA, adequate noise prevention measures must be applied.
No. 5241-9/11
LC895125Q, 895125W
Pin Functions
1. SCSI Pins
• BSY, ACK, MSG, SEL, REQ, ATN, I/O, C/D (input and output)
SCSI bus control pins.
• DB0 to DB7, DBPB (input and output)
These are the SCSI data bus pins.
2. Microcontroller Interface Pins
• ZCS (input)
Microcontroller chip select line
• CSCTRL (input)
Microcontroller chip select logic selection signal
High - ZCS is an active low signal.
Low - ZCS is an active high signal.
• ZRD, ZWR, SUA0 to SUA6 (input)
Microcontroller interface control signal
The SUA0 to SUA6 pins are used for addressing.
• ZSWAIT (output)
When the microcontroller accesses RAM, it must wait if this pin is low.
This is a built-in pull-up resistor open-drain output.
• D7 to D0 (input and output)
Microcontroller data bus. Pull-up resistors are built in.
• ZINT0, ZINT1 (output)
Interrupt request output to the microcontroller. A SCSI-side interrupt can be output from ZINT1 by setting the C
register (bit 7 in R11).
This is a built-in pull-up resistor open-drain output.
3. Buffer RAM Pins
• IO0 to IO15 (input and output)
Buffer RAM data bus. Pull-up resistors are built in. The IO8 to IO15 pins have shared functions as the RA9 to
RA16 pins.
This means that 16-bit PSRAM cannot be used.
• RA0 to RA16 (output)
Buffer RAM address lines. RA9 to RA16 have shared functions as the IO8 to IO15 pins.
This means that 16-bit PSRAM cannot be used.
• ZRAS0, ZRAS1, (ZCS0), (ZCS1) (output)
Buffer DRAM RAS outputs. Normally, ZRAS0 is used. However, when two 1-MB (64k × 16-bit) DRAM chips
are used, the respective DRAM RAS pins are connected to ZRAS0 and ZRAS1. Connected to the CS pin if
PSRAM is used.
• ZCAS0, ZCAS1 (output)
Buffer DRAM CAS outputs. Normally, ZCAS0 is used. However, when two 1-MB (64k × 16-bit) DRAM chips
are used, the respective DRAM CAS pins are connected to ZCAS0.
• ZOE (output)
Buffer RAM read output signal
• ZUWE, ZLWE (output)
Buffer RAM write output signals. Connected to the corresponding pins on the RAM chip.
Leave ZUWE open if an 8-bit RAM is used.
4. Subcode Interface Pins
• EXCK, WFCK, SBSO, SCOR (input and output)
Subcode interface pins. Connecting a CD DSP using these pins allows the LC895125 to read in subcode data and
transfer it to the host.
No. 5241-10/11
LC895125Q, 895125W
5. CD DSP Data Pins
• BCK, SDATA, LRCK, C2PO (input)
The LC895125 reads in CD-ROM data over these pins connected to a CD DSP.
C2PO is the C2 flag pin.
6. Other Pins
• ZRESET (input)
Reset input to the LC895125. The LC895125 is reset by a low-level input.
This pin must be held low for a period of at least 1 µs when power is first applied.
• XTALCK0, XTAL0
The main clock for the ECC and SCSI blocks. These pins support frequencies from 16.9344 to 25 MHz.
When a double-frequency input is used, these pins accept frequencies up to 38 MHz.
Use a double-frequency input when a ceramic oscillator and DRAM are used.
(This is because the internal clock must have a 50% duty.)
An external clock may input to the XTALCK pin.
The SCSI block main clock can also be provided from XTALCK1 and XTAL1 if so specified by the setting of
X1EN (pin 89).
• XTALCK1, XTAL1
The main clock for the ECC and SCSI blocks. These pins are enabled for oscillator operation by setting X1EN (pin
89). The LC895125 is designed so that the ECC and SCSI blocks can also be operated asynchronously.
This means that precise 10-MB/s synchronous transfers can be achieved by providing a 20-MHz input to
XTALCK1 and XTAL1.
A ceramic oscillator may be used here since only the rising edge of this signal is used.
In applications that do not use these pins, XTALCK1 must be tied to VSS and XTAL1 must be left open.
• X1EN (input)
Set this pin to 1 to us use XTALCK1 and XTAL1 for the SCSI block main clock.
Set this pin to 0 to drive both the ECC and SCSI blocks from XTALCK0 and XTAL0.
• MCK (output)
Outputs either the XTALCK0 frequency or that frequency divided by 2. This pin’s output can also be stopped if
desired.
■ No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace
equipment, nuclear power control systems, vehicles, disaster/crime-prevention equipment and the like, the failure of
which may directly or indirectly cause injury, death or property loss.
■ Anyone purchasing any products described or contained herein for an above-mentioned use shall:
➀ Accept full responsibility and indemnify and defend SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and
distributors and all their officers and employees, jointly and severally, against any and all claims and litigation and all
damages, cost and expenses associated with such use:
➁ Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on
SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors or any of their officers and employees
jointly or severally.
■ Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for
volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied
regarding its use or any infringements of intellectual property rights or other rights of third parties.
This catalog provides information as of February, 1996. Specifications and information herein are subject to
change without notice.
PS No. 5241-11/11