BTA/BTB24, BTA25, BTA26 and T25 Series ® 25A TRIACS SNUBBERLESS™ & STANDARD MAIN FEATURES: A2 Symbol Value Unit IT(RMS) 25 A VDRM/VRRM 600 and 800 V IGT (Q1) 35 to 50 A2 G A1 A1 A2 G mA IT(RMS) ITSM I ²t dI/dt RMS on-state current (full sine wave) Non repetitive surge peak on-state current (full cycle, Tj initial = 25°C) I²t Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns PG(AV) Tstg Tj Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range September 2002 - Ed: 6A TO-220AB (BTB24) A1 A2 G D2PAK (T25G) A1 A2 G A1 A2 Value D²PAK TO-220AB RD91 TOP3 Ins. TO-220AB Ins. F = 60 Hz F = 50 Hz G TOP3 Insulated (BTA26) RD91 (BTA25) Parameter VDSM/VRSM Non repetitive surge peak off-state voltage IGM A2 TO-220AB Insulated (BTA24) DESCRIPTION Available either in through-hole of surface and T25 mount packages, the BTA/BTB24-25-26 triac series is suitable for general purpose AC power switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, water heaters, induction motor starting circuits...or for phase control operation in high power motor speed controllers, soft start circuits...The snubberless versions (BTA/BTB...W and T25 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500V RMS) complying with UL standards (File ref.: E81734). ABSOLUTE MAXIMUM RATINGS Symbol A1 A2 G A Tc = 100°C Tc = 90°C Tc = 75°C t = 16.7 ms t = 20 ms tp = 10 ms Unit 25 260 250 A 340 A² s F = 120 Hz Tj = 125°C 50 A/µs tp = 10 ms Tj = 25°C VDRM/VRRM V tp = 20 µs Tj = 125°C 4 A Tj = 125°C 1 W - 40 to + 150 - 40 to + 125 °C + 100 1/9 BTA/BTB24, BTA25, BTA26 and T25 Series ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified) ■ SNUBBERLESS™ (3 Quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W Symbol IGT (1) VGT Test Conditions Quadrant RL = 33 Ω VD = 12 V VGD VD = VDRM IH (2) IT = 500 mA IL IG = 1.2 IGT RL = 3.3 kΩ Tj = 125°C T25 ■ CW BW 35 35 50 mA MAX. I - II - III MAX. 1.3 V I - II - III MIN. 0.2 V I - III VD = 67 % VDRM gate open Tj = 125°C (dI/dt)c (2) Without snubber Unit T2535 I - II - III MAX. 50 50 75 mA MAX. 70 70 80 mA 80 80 100 MIN. 500 500 1000 V/µs MIN. 13 13 22 A/ms II dV/dt (2) BTA/BTB Tj = 125°C STANDARD (4 Quadrants): BTB24...B, BTA25...B, BTA26...B Symbol Test Conditions IGT (1) VD = 12 V Quadrant RL = 33 Ω Value Unit I - II - III IV MAX. 50 100 mA VGT ALL MAX. 1.3 V VGD VD = VDRM ALL MIN. 0.2 V IH (2) IT = 500 mA MAX. 80 mA IL IG = 1.2 IGT 70 mA RL = 3.3 kΩ Tj = 125°C I - III - IV MAX. II dV/dt (2) VD = 67 % VDRM gate open Tj = 125°C (dV/dt)c (2) (dI/dt)c = 13.3 A/ms Tj = 125°C 160 MIN. 500 V/µs MIN. 10 V/µs STATIC CHARACTERISTICS Symbol Test Conditions VTM (2) ITM = 35 A Vto (2) tp = 380 µs Unit Tj = 25°C MAX. 1.55 V Threshold voltage Tj = 125°C MAX. 0.85 V Rd (2) Dynamic resistance Tj = 125°C MAX. 16 mΩ IDRM VDRM = VRRM Tj = 25°C 5 µA 3 mA IRRM Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1 2/9 Value Tj = 125°C MAX. BTA/BTB24, BTA25, BTA26 and T25 Series THERMAL RESISTANCES Symbol Rth(j-c) Parameter Value Junction to case (AC) Junction to ambient Rth(j-a) D²PAK TO-220AB 0.8 RD91 (Insulated) TOP3 Insulated 1.1 TO-220AB Insulated 1.7 D²PAK 45 TOP3 Insulated 50 S = 1 cm² TO-220AB TO-220AB Insulated Unit °C/W °C/W 60 S: Copper surface under tab PRODUCT SELECTOR Voltage (xxx) Part Number Sensitivity Type Package X 50 mA Standard TO-220AB X X 50 mA Snubberless TO-220AB BTA/BTB24-xxxCW X X 35 mA Snubberless TO-220AB BTA25-xxxB X X 50 mA Standard RD-91 BTA25-xxxBW X X 50 mA Snubberless RD-91 BTA25-xxxCW X X 35 mA Snubberless RD-91 BTA26-xxxB X X 50 mA Standard TOP3 Ins. BTA26-xxxBW X X 50 mA Snubberless TOP3 Ins. BTA26-xxxCW X X 35 mA Snubberless TOP3 Ins. T2535-xxxG X X 35 mA Snubberless D²PAK 600 V 800 V BTB24-xxxB X BTA/BTB24-xxxBW BTB: Non insulated TO-220AB package ORDERING INFORMATION BT A 24 - 600 BW (RG) TRIAC SERIES INSULATION: A: insulated B: non insulated VOLTAGE: 600: 600V 800: 800V SENSITIVITY & TYPE B: 50mA STANDARD BW: 50mA SNUBBERLESS CW: 35mA SNUBBERLESS PACKING MODE Blank: Bulk RG: Tube CURRENT: 24: 25A in TO-220AB 25: 25A in Rd91 26: 25A in TOP3 3/9 BTA/BTB24, BTA25, BTA26 and T25 Series T 25 35 - 600 G (-TR) TRIAC SERIES PACKAGE: G: D2PAK CURRENT: 25A VOLTAGE: 600: 600V 800: 800V PACKING MODE: Blank: Tube -TR: Tape & Reel SENSITIVITY: 35: 35mA OTHER INFORMATION Part Number Marking Weight Base quantity Packing mode BTA/BTB24-xxxyz BTA/BTB24xxxyz 2.3 g 250 Bulk BTA/BTB24-xxxyzRG BTA/BTB24-xxxyz 2.3 g 50 Tube BTA25-xxxyz BTA25xxxyz 20 g 25 Bulk BTA26-xxxyz BTA26xxxyz 4.5 g 120 Bulk T2535-xxxG T2535xxxG 1.5 g 50 Tube T2535-xxxG-TR T2535xxxG 1.5 g 1000 Tape & reel Note: xxx= voltage, y = sensitivity, z = type 4/9 BTA/BTB24, BTA25, BTA26 and T25 Series Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle). Fig. 2-1: RMS on-state current versus case temperature (full cycle). P (W) IT(RMS) (A) 30 30 25 25 20 20 15 15 10 10 BTB/T25 BTA24 5 0 5 IT(RMS) (A) 0 5 10 15 BTA25/26 20 25 Fig. 2-2: D²PAK RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35 µm), full cycle. 0 Tc(°C) 0 25 50 75 100 125 Fig. 3: Relative variation of thermal impedance versus pulse duration. IT(RMS) (A) K=[Zth/Rth] 4.0 1E+0 2 D PAK (S=1cm2) 3.5 Zth(j-c) 3.0 1E-1 2.5 Zth(j-a) BTA/BTB24/T25 2.0 1.5 1E-2 Zth(j-a) BTA26 1.0 0.5 0.0 tp (s) Tamb(°C) 0 25 Fig. 4: values). 50 75 100 125 On-state characteristics (maximum 1E-3 1E-3 1E-1 1E+0 1E+1 1E+2 5E+2 Fig. 5: Surge peak on-state current versus number of cycles. ITM (A) ITSM (A) 300 100 1E-2 300 250 Tj max t=20ms One cycle Non repetitive Tj initial=25°C 200 150 10 Repetitive Tc=75°C Tj=25°C 100 Tj max. Vto = 0.85 V Rd = 16 mΩ VTM (V) 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 50 Number of cycles 4.5 0 1 10 100 1000 5/9 BTA/BTB24, BTA25, BTA26 and T25 Series Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10ms, and corresponding value of I²t. Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values). IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25°C] ITSM (A), I²t (A²s) 2.5 3000 Tj initial=25°C 1000 2.0 dI/dt limitation: 50A/µs IGT 1.5 IH & IL ITSM 1.0 0.5 I²t Tj(°C) tp (ms) 100 0.01 0.10 1.00 10.00 Fig. 8: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values). 100.0 50 40 30 20 S(cm²) 6/9 20 24 28 100 120 140 Fig. 9: Relative variation of critical rate of decrease of main current versus junction temperature. 1 60 16 80 2 D²PAK 12 60 3 70 8 40 4 Rth(j-a) (°C/W) 4 20 5 80 0 0 6 Fig. 10: D²PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm). 0 -20 (dI/dt)c [Tj] / (dI/dt)c [Tj specified] (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.4 2.2 2.0 1.8 1.6 BW/CW/T2535 1.4 B 1.2 1.0 0.8 0.6 (dV/dt)c (V/µs) 0.4 0.1 1.0 10.0 10 0.0 -40 32 36 40 0 Tj (°C) 0 25 50 75 100 125 BTA/BTB24, BTA25, BTA26 and T25 Series PACKAGE MECHANICAL DATA D²PAK (Plastic) DIMENSIONS REF. A E Min. C2 L2 D L L3 A1 B2 Millimeters R C B G A2 2.0 MIN. FLAT ZONE V2 A A1 A2 B B2 C C2 D E G L L2 L3 R V2 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 Typ. Min. Typ. Max. 4.60 2.69 0.23 0.93 1.40 0.40 0° Max. Inches 0.169 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.048 0.055 0.60 0.017 0.024 1.36 0.047 0.054 9.35 0.352 0.368 10.28 0.393 0.405 5.28 0.192 0.208 15.85 0.590 0.624 1.40 0.050 0.055 1.75 0.055 0.069 0.016 8° 0° 8° FOOTPRINT DIMENSIONS (in millimeters) D²PAK (Plastic) 16.90 10.30 5.08 1.30 3.70 8.90 7/9 BTA/BTB24, BTA25, BTA26 and T25 Series PACKAGE MECHANICAL DATA RD91 (Plastic) DIMENSIONS L2 A2 L1 REF. Millimeters Min. B2 B1 C C2 C1 A1 N2 N1 B F E3 I A A A1 A2 B B1 B2 C C1 C2 E3 F I L1 L2 N1 N2 Max. 40.00 30.30 22.00 27.00 16.50 24.00 14.00 3.50 3.00 0.90 4.50 13.60 3.50 1.90 43° 38° 29.90 13.50 1.95 0.70 4.00 11.20 3.10 1.70 33° 28° Inches Min. Max. 1.575 1.193 0.867 1.063 0.650 0.945 0.551 0.138 0.118 0.035 0.177 0.535 0.138 0.075 43° 38° 1.177 0.531 0.077 0.027 0.157 0.441 0.122 0.067 33° 28° PACKAGE MECHANICAL DATA TOP3 (Plastic) DIMENSIONS REF. Millimeters Min. A B C D E F G H J K L P R 8/9 Typ. 4.4 1.45 14.35 0.5 2.7 15.8 20.4 15.1 5.4 3.4 4.08 1.20 4.60 Inches Max. Min. 4.6 1.55 15.60 0.7 2.9 16.5 21.1 15.5 5.65 3.65 4.17 1.40 0.173 0.057 0.565 0.020 0.106 0.622 0.815 0.594 0.213 0.134 0.161 0.047 Typ. Max. 0.181 0.061 0.614 0.028 0.114 0.650 0.831 0.610 0.222 0.144 0.164 0.055 0.181 BTA/BTB24, BTA25, BTA26 and T25 Series PACKAGE MECHANICAL DATA TO-220AB (Plastic) DIMENSIONS B REF. C Millimeters Inches b2 Min. L F I A l4 c2 a1 l3 l2 a2 b1 M c1 e A a1 a2 B b1 b2 C c1 c2 e F I I4 L l2 l3 M Typ. 15.20 Max. Min. Typ. 15.90 0.598 3.75 Max. 0.625 0.147 13.00 14.00 0.511 0.551 10.00 10.40 0.393 0.409 0.61 0.88 0.024 0.034 1.23 1.32 0.048 0.051 4.40 4.60 0.173 0.181 0.49 0.70 0.019 0.027 2.40 2.72 0.094 0.107 2.40 2.70 0.094 0.106 6.20 6.60 0.244 0.259 3.75 3.85 0.147 0.151 15.80 16.40 16.80 0.622 0.646 0.661 2.65 2.95 0.104 0.116 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 2.60 0.102 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. © The ST logo is a registered trademark of STMicroelectronics © 2002 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Isreal - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 9/9