STMICROELECTRONICS BUZ80A

BUZ80A

N - CHANNEL 800V - 2.5Ω - 3.8A - TO-220
FAST POWER MOS TRANSISTOR
TYPE
BUZ80A
■
■
■
■
■
■
■
V DSS
R DS(on)
ID
800 V
<3Ω
3.8 A
TYPICAL RDS(on) = 2.5 Ω
± 30V GATE TO SOURCE VOLTAGE RATING
100% AVALANCHE TESTED
REPETITIVE AVALANCHE DATA AT 100oC
LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
REDUCED THRESHOLD VOLTAGE SPREAD
3
1
2
TO-220
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SWITCH MODE POWER SUPPLIES (SMPS)
■ DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Un it
BUZ80A
V DS
V DGR
V GS
Drain-source Voltage (V GS = 0)
800
V
Drain- gate Voltage (R GS = 20 kΩ)
800
V
G ate-source Voltage
± 20
V
o
ID
Drain Current (continuous) at Tc = 25 C
3.8
A
ID
Drain Current (continuous) at Tc = 100 oC
2.3
A
I DM (•)
P tot
V ISO
Ts tg
Tj
15
A
T otal Dissipation at Tc = 25 o C
Drain Current (pulsed)
100
W
Derating Factor
0.8
W /o C
Insulation W ithstand Voltage (DC)

Storage Temperature
Max. Operating Junction Temperature
V
-65 to 150
o
C
150
o
C
(•) Pulse width limited by safe operating area
November 1998
1/9
BUZ80A
THERMAL DATA
TO-220
R thj -case
Thermal Resistance Junction-case
Max
1.25
o
C/W
R thj -amb
R thc-sink
Tl
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
Typ
Maximum Lead Temperature For Soldering Purpose
62.5
0.5
300
o
C/W
C/W
o
C
o
AVALANCHE CHARACTERISTICS
Symbo l
Max Valu e
Unit
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
Parameter
3.8
A
E AS
Single Pulse Avalanche Energy
(starting Tj = 25 o C, I D = IAR , VDD = 50 V)
200
mJ
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbo l
V (BR)DSS
I DSS
IGSS
Parameter
Drain-source
Breakdown Voltage
Test Con ditions
I D = 250 µA
T yp.
Max.
800
V GS = 0
V DS = Max Rating
Zero G ate Voltage
Drain Current (V GS = 0) V DS = Max Rating x 0.8
Gate-body Leakage
Current (VDS = 0)
Min.
Unit
V
o
Tc = 100 C
V GS = ± 20 V
250
1000
µA
µA
± 100
nA
ON (∗)
Symbo l
Parameter
Test Con ditions
ID = 250 µA
V GS(th)
Gate Threshold
Voltage
R DS(on)
Static Drain-source O n V GS = 10V ID = 1.7 A
Resistance
V GS = 10V ID = 1.7 A
I D(o n)
V DS = V GS
Min.
T yp.
Max.
Unit
2
3
4
V
2.5
3
6
Ω
Ω
Tc = 100o C
3.8
On State Drain Current V DS > ID(o n) x R DS(on )ma x
V GS = 10 V
A
DYNAMIC
Symbo l
g f s (∗)
C iss
C os s
C rss
2/9
Parameter
Test Con ditions
Forward
Transconductance
V DS > ID(o n) x R DS(on )ma x
Input Capacitance
Output Capacitance
Reverse T ransfer
Capacitance
V DS = 25 V
f = 1 MHz
Min.
I D = 1.7A
V GS = 0
T yp.
Max.
1
Unit
S
1100
150
35
pF
pF
pF

BUZ80A
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbo l
t d(on)
tr
(di/dt) on
Qg
Q gs
Q gd
T yp.
Max.
Unit
Turn-on Time
Rise Time
Parameter
V DD = 30 V ID = 2.3 A
V GS = 10 V
R G = 50 Ω
(see test circuit, figure 3)
Test Con ditions
65
150
90
200
ns
ns
Turn-on Current Slope
V DD = 600 V ID = 3.8 A
V GS = 10 V
R G = 50 Ω
(see test circuit, figure 5)
80
110
A/µs
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 400 V
55
8
26
70
nC
nC
nC
T yp.
Max.
Unit
110
140
150
145
190
200
ns
ns
ns
T yp.
Max.
Unit
3.8
15
A
A
2
V
ID = 5 A
Min.
V GS = 10 V
SWITCHING OFF
Symbo l
tr (Voff)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Con ditions
Min.
V DD = 600 V ID = 3.8 A
R G = 50 Ω V GS = 10 V
(see test circuit, figure 5)
SOURCE DRAIN DIODE
Symbo l
Parameter
Test Con ditions
ISD
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
V SD (∗)
Forward On Voltage
I SD = 4 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 4 A di/dt = 100 A/µs
o
T j = 150 C
V DD = 100 V
(see test circuit, figure 5)
t rr
Q rr
I RRM
Min.
V GS = 0
500
ns
4.3
µC
17
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Safe Operating Area

Thermal Impedance
3/9
BUZ80A
Derating Curve
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
4/9

BUZ80A
Capacitance Variations
Normalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs Temperature
Turn-on Current Slope
Turn-off Drain-source Voltage Slope
Cross-over Time

5/9
BUZ80A
Switching Safe Operating Area
Accidental Overload Area
Source-drain Diode Forward Characteristics
6/9

BUZ80A
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times

7/9
BUZ80A
TO-220 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
D1
0.107
1.27
0.050
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.067
F2
1.14
1.70
0.044
0.067
G
4.95
5.15
0.194
0.203
G1
2.4
2.7
0.094
0.106
H2
10.0
10.40
0.393
0.409
14.0
0.511
L2
16.4
L4
0.645
13.0
0.551
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.2
6.6
0.244
0.260
L9
3.5
3.93
0.137
0.154
DIA.
3.75
3.85
0.147
0.151
D1
C
D
A
E
L5
H2
G
G1
F1
L2
F2
F
Dia.
L5
L9
L7
L6
8/9
L4
P011C

BUZ80A
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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 1998 STMicroelectronics – Printed in Italy – All Rights Reserved
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
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