VISHAY V3P6

New Product
V3P6
Vishay General Semiconductor
Surface Mount Trench MOS Barrier Schottky Rectifier
FEATURES
TMBS®
eSMP® Series
• Low profile package
• Ideal for automated placement
• Trench MOS Schottky technology
• Low power losses, high efficiency
• Low forward voltage drop
• Meets MSL level 1, per J-STD-020, LF maximum peak of
260 °C
• Not recommended for PCB bottom side wave mounting
DO-220AA (SMP)
• Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
• Halogen-free according to IEC 61249-2-21 definition
PRIMARY CHARACTERISTICS
MECHANICAL DATA
IF(AV)
3.0 A
VRRM
60 V
IFSM
60 A
VF at IF = 3.0 A
0.48 V
TJ max.
150 °C
Case: DO-220AA (SMP)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS compliant, and
commercial grade
Terminals: Matte tin plated leads, solderable
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 1A whisker test
per
Polarity: Color band denotes the cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
V3P6
UNIT
V36
Maximum repetitive peak reverse voltage
Maximum DC forward current
VRRM
60
IF (1)
3.0
(2)
2.4
IFSM
60
A
dV/dt
10 000
V/μs
TJ, TSTG
- 55 to + 150
°C
IF
Peak forward surge current 10 ms single half sine-wave
superimposed on rated load
Voltage rate of change (rated VR)
Operating junction and storage temperature range
V
A
Notes
(1) Mounted on 8 mm x 8 mm pad areas, 1 oz. FR4 PCB
(2) Free air, mounted on recommended copper pad area
Document Number: 89344
Revision: 18-Oct-10
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
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New Product
V3P6
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
IF = 3.0 A
Instantaneous forward voltage
VR = 60 V
Reverse current
Typical junction capacitance
TA = 25 °C
TA = 125 °C
TA = 25 °C
TA = 125 °C
SYMBOL
VF (1)
TYP.
MAX.
0.53
0.63
0.48
0.59
-
900
μA
4
15
mA
250
-
pF
V
IR (2)
4.0 V, 1 MHz
UNIT
CJ
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width ≤ 40 ms
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Typical thermal resistance
V3P6
RθJA
(1)
125
RθJM
(2)
15
UNIT
°C/W
Notes
(1) Free air, mounted on recommended PCB, 1 oz. pad area; thermal resistance R
θJA - junction to ambient
(2) Units mounted on PCB with specific copper pad areas; R
θJM - junction to mount
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
V3P6-M3/84A
0.024
84A
3000
7" diameter plastic tape and reel
V3P6-M3/85A
0.024
85A
10 000
13" diameter plastic tape and reel
RATINGS AND CHARACTERISTICS CURVES
(TA = 25 °C unless otherwise noted)
2.4
3.0
2.0
Average Power Loss (W)
Average Forward Rectified Current (A)
3.5
2.5
2.0
1.5
1.0
D = 0.5
D = 0.8
D = 0.3
D = 0.1
1.6
D = 1.0
1.2
T
0.8
0.4
TM Measured at Terminal
0.5
D = 0.2
0
D = tp/T
tp
0
0
25
50
75
100
125
150
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
TM - Mount Temperature (°C)
Average Forward Current (A)
Fig. 1 - Maximum Forward Current Derating Curve
Fig. 2 - Forward Power Loss Characteristics
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 89344
Revision: 18-Oct-10
New Product
V3P6
Vishay General Semiconductor
1000
TA = 150 °C
10
TA = 125 °C
1
TA = 100 °C
100
TA = 25 °C
0.1
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
10
0.1
1
10
100
Instantaneous Forward Voltage (V)
Reverse Voltage (V)
Fig. 3 - Typical Instantaneous Forward Characteristics
Fig. 5 - Typical Junction Capacitance
100
1000
10
Transient Thermal Impedance (°C/W)
Instantaneous Reverse Current (mA)
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
Junction Capacitance (pF)
Instantaneous Forward Current (A)
100
TA = 150 °C
TA = 125 °C
1
TA = 100 °C
0.1
0.01
TA = 25 °C
0.001
20
40
60
80
Junction to Ambient
100
10
1
0.01
100
0.1
1
10
100
Percent of Rated Peak Reverse Voltage (%)
t - Pulse Duration (s)
Fig. 4 - Typical Reverse Characteristics
Fig. 6 - Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
DO-220AA (SMP)
0.012 (0.30) REF.
Cathode Band
0.053 (1.35)
0.041 (1.05)
0.086 (2.18)
0.074 (1.88)
0.142 (3.61)
0.126 (3.19)
0.036 (0.91)
0.024 (0.61)
0.032 (0.80)
0.016 (0.40)
0.103 (2.60)
0.087 (2.20)
0.158 (4.00)
0.146 (3.70)
0.105
(2.67)
0.013 (0.35)
0.004 (0.10)
0.045 (1.15)
0.033 (0.85)
0.012 (0.30) 0.018 (0.45)
0.000 (0.00) 0.006 (0.15)
Document Number: 89344
Revision: 18-Oct-10
0.025 0.030
(0.635) (0.762)
0.100
(2.54)
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
0.050
(1.27)
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Vishay
Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
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product with the properties described in the product specification is suitable for use in a particular application. Parameters
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including but not limited to the warranty expressed therein.
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Document Number: 91000
Revision: 11-Mar-11
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