STMICROELECTRONICS STPS20150CR

STPS20150CT/CG/CR/CFP
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
A1
IF(AV)
2 x 10 A
VRRM
150 V
Tj
175°C
VF (max)
0.75 V
K
A2
K
K
FEATURES AND BENEFITS
■
■
■
■
A2
HIGH JUNCTION TEMPERATURE CAPABILITY
GOOD TRADE OFF BETWEEN LEAKAGE
CURRENT AND FORWARD VOLTAGE DROP
LOW LEAKAGE CURRENT
AVALANCHE CAPABILITY SPECIFIED
K
A1
A1
A2
I2PAK
STPS20150CR
D2PAK
STPS20150CG
DESCRIPTION
Dual center tap schottky rectifier designed for
high frequency Switched Mode Power
Supplies.
A2
A2
K
K
A1
TO-220AB
STPS20150CT
TO-220FPAB
STPS20150CFP
A1
ABSOLUTE RATINGS (limiting values, per diode)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
150
V
IF(RMS)
RMS forward current
30
A
A
IF(AV)
Average forward current
δ = 0.5
TO-220AB
D2PAK / I2PAK
Tc = 155°C
Per diode
10
TO-220FPAB
Tc = 135°C
Per device
20
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
180
A
PARM
Repetitive peak avalanche power
tp = 1µs
6700
W
- 65 to + 175
°C
175
°C
10000
V/µs
Tstg
Tj
dV/dt
Storage temperature range
Maximum operating junction temperature
Critical rate of rise of reverse voltage
July 2003 - Ed: 6D
Tj = 25°C
1/7
STPS20150CT/CG/CR/CFP
THERMAL RESISTANCES
Symbol
Rth(j-c)
Parameter
Junction to case
2
2
2
2
2
2
TO-220AB / D PAK / I PAK
Per diode
TO-220FPAB
Unit
2.2
°C/W
4.5
TO-220AB / D PAK / I PAK
Total
1.3
TO-220FPAB
Rth(c)
Value
3.5
TO-220AB / D PAK / I PAK
Coupling
0.3
TO-220FPAB
2.5
When the diodes 1 and 2 are used simultaneously :
∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol
Parameter
IR *
Reverse leakage current
Tests conditions
Tj = 25°C
Min.
Typ.
VR = VRRM
Tj = 125°C
VF **
Pulse test :
Forward voltage drop
Tj = 25°C
IF = 10 A
Tj = 125°C
IF = 10 A
Tj = 25°C
IF = 20 A
Tj = 125°C
IF = 20 A
* tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.64 x IF(AV) + 0.011 IF2(RMS)
2/7
0.69
Max.
Unit
5.0
µA
5.0
mA
0.92
V
0.75
1
0.79
0.86
STPS20150CT/CG/CR/CFP
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
Fig. 2: Average forward current versus ambient
temperature (δ = 0.5, per diode).
IF(AV)(A)
PF(AV)(W)
12
10
δ = 0.05
9
δ = 0.1
δ = 0.2
Rth(j-a)=Rth(j-c) (TO-220AB, I2PAK and D2PAK)
11
δ = 0.5
10
8
9
7
δ=1
Rth(j-a)=Rth(j-c) (TO-220FPAB)
8
6
7
5
6
4
5
Rth(j-a)=15°C/W
4
3
T
T
3
2
2
1
IF(AV)(A)
δ=tp/T
0
0
1
2
3
4
5
6
7
8
9
tp
10
11
δ=tp/T
1
12
0
Fig. 3: Normalized avalanche power derating versus pulse duration.
25
Tamb(°C)
50
75
100
125
150
175
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
tp
0
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
1
0
10
100
0
1000
Fig. 5-1: Non repetitive surge peak forward current versus overload duration (maximum values,
per diode). TO-220AB, I²PAK and D²PAK
25
50
75
100
125
150
Fig. 5-2: Non repetitive surge peak forward current versus overload duration (maximum values,
per diode). TO-220FPAB
IM(A)
IM(A)
150
100
2
2
TO-220AB, I PAK and D PAK
TO-220FPAB
90
125
80
70
100
TC=50°C
75
TC=50°C
50
TC=75°C
50
40
TC=75°C
30
TC=125°C
IM
25
t
20
10
t(s)
δ=0.5
0
1.E-03
60
TC=125°C
IM
t
t(s)
δ=0.5
0
1.E-02
1.E-01
1.E+00
1.E-03
1.E-02
1.E-01
1.E+00
3/7
STPS20150CT/CG/CR/CFP
Fig. 6-1: Relative variation of thermal impedance
junction to case versus pulse duration. TO-220AB,
I²PAK and D²PAK
Fig. 6-2: Relative variation of thermal impedance
junction to case versus pulse duration.
TO-220FPAB
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
1.0
2
2
TO-220AB, I PAK and D PAK
TO-220FPAB
0.9
0.9
0.8
0.8
0.7
0.7
δ = 0.5
0.6
0.6
0.5
0.5
0.4
δ = 0.2
0.3
δ = 0.1
δ = 0.5
0.4
δ = 0.2
0.3
T
0.2
T
δ = 0.1
0.2
Single pulse
0.1
tp(s)
δ=tp/T
0.1
tp
tp(s)
Single pulse
0.0
δ=tp/T
tp
0.0
1.E-03
1.E-02
1.E-01
1.E+00
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode).
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Fig. 8: Junction capacitance versus reverse voltage
applied (typical values, per diode).
C(nF)
IR(µA)
1000
1E+5
F=1MHz
Tj=25°C
Tj=175°C
1E+4
Tj=150°C
1E+3
Tj=125°C
100
1E+2
Tj=100°C
1E+1
1E+0
Tj=25°C
VR(V)
VR(V)
10
1E-1
0
25
50
75
100
125
150
Fig. 8: Forward voltage drop versus forward
current (per diode).
1
2
5
10
20
50
100
200
Fig. 9: Thermal resistance junction to ambient versus
copper surface under tab (Epoxy printed circuit board,
Cu = 35µm) (STPS20150CG only).
Rth(j-a)(°C/W)
IFM(A)
80
100.0
70
Tj=125°C
(typical values)
60
10.0
50
Tj=125°C
40
30
Tj=25°C
1.0
20
10
VFM(V)
S(cm²)
0.1
0.0
4/7
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
0
5
10
15
20
25
30
35
40
STPS20150CT/CG/CR/CFP
PACKAGE MECHANICAL DATA
D2PAK
DIMENSIONS
REF.
E
C2
D
L
L3
A1
B2
R
C
B
G
A2
2.0 MIN.
FLAT ZONE
V2
Inches
Min.
Typ. Max. Min.
Typ. Max.
A
4.30
4.60 0.169
0.181
A1
2.49
2.69 0.098
0.106
A2
0.03
0.23 0.001
0.009
B
0.70
0.93 0.027
0.037
B2
1.25
C
0.45
0.60 0.017
0.024
C2
1.21
1.36 0.047
0.054
D
8.95
9.35 0.352
0.368
E
10.00
10.28 0.393
0.405
G
4.88
5.28 0.192
0.208
L
15.00
15.85 0.590
0.624
L2
1.27
1.40 0.050
0.055
L3
1.40
1.75 0.055
0.069
A
L2
Millimeters
R
V2
1.40
0.049 0.055
0.40
0°
0.016
8°
0°
8°
FOOT PRINT DIMENSIONS (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
5/7
STPS20150CT/CG/CR/CFP
PACKAGE MECHANICAL DATA
TO-220AB
REF.
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
F
M
G1
E
G
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
2.40
2.70
0.094
0.106
10
10.40
0.393
0.409
16.4 typ.
0.645 typ.
13
14
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
PACKAGE MECHANICAL DATA
I2PAK
DIMENSIONS
REF.
A
E
c2
L2
D
L1
A1
b2
L
b1
b
e
6/7
c
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
b
0.70
0.93
0.028
0.037
b1
1.14
1.17
0.044
0.046
b2
1.14
1.17
0.044
0.046
c
0.45
0.60
0.018
0.024
c2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
E
10.0
10.4
0.394
0.409
L
13.1
13.6
0.516
0.535
L1
3.48
3.78
0.137
0.149
L2
1.27
1.40
0.050
0.055
STPS20150CT/CG/CR/CFP
PACKAGE MECHANICAL DATA
TO-220FPAB
REF.
A
B
H
Dia
L6
L2
L7
L3
L5
D
F1
L4
F2
F
E
G1
G
A
B
D
E
F
F1
F2
G
G1
H
L2
L3
L4
L5
L6
L7
Dia.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.4
4.6
0.173
0.181
2.5
2.7
0.098
0.106
2.5
2.75
0.098
0.108
0.45
0.70
0.018
0.027
0.75
1
0.030
0.039
1.15
1.70
0.045
0.067
1.15
1.70
0.045
0.067
4.95
5.20
0.195
0.205
2.4
2.7
0.094
0.106
10
10.4
0.393
0.409
16 Typ.
0.63 Typ.
28.6
30.6
1.126
1.205
9.8
10.6
0.386
0.417
2.9
3.6
0.114
0.142
15.9
16.4
0.626
0.646
9.00
9.30
0.354
0.366
3.00
3.20
0.118
0.126
OTHER INFORMATION
■
Ordering type
Marking
Package
Weight
Base qty
Delivery
mode
STPS20150CT
STPS20150CT
TO-220AB
2.20 g
50
Tube
STPS20150CG
STPS20150CG
D2PAK
1.48 g
50
Tube
STPS20150CG-TR
STPS20150CG
D2PAK
1.48 g
1000
Tape & Reel
1.49 g
50
Tube
2.0 g
50
Tube
2
I PAK
STPS20150CR
STPS20150CR
STPS20150CFP
STPS20150CFP TO-220FPAB
EPOXY MEETS UL94,V0
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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