STPS10150CT/CG ® HIGH VOLTAGE POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS A1 IF(AV) 2x5A VRRM 150 V Tj 175°C VF (max) 0.75 V K A2 K FEATURES AND BENEFITS ■ ■ ■ ■ HIGH JUNCTION TEMPERATURE CAPABILITY GOOD TRADE OFF BETWEEN LEAKAGE CURRENT AND FORWARD VOLTAGE DROP LOW LEAKAGE CURRENT AVALANCHE CAPABILITY SPECIFIED A2 K A1 A2 A1 D2PAK STPS10150CG TO-220AB STPS10150CT DESCRIPTION Dual center tap schottky rectifier designed for high frequency Switched Mode Power Supplies. ABSOLUTE RATINGS (limiting values, per diode) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 150 V IF(RMS) RMS forward current 10 A 5 10 A IF(AV) Average forward current TO-220AB δ = 0.5 D2PAK Tc = 155°C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 120 A PARM Repetitive peak avalanche power tp = 1µs 3100 W - 65 to + 175 °C 175 °C 10000 V/µs Tstg Tj dV/dt Storage temperature range Maximum operating junction temperature Critical rate of rise of reverse voltage July 2003 - Ed: 5B per diode per device Tj = 25°C 1/5 STPS10150CT/CG THERMAL RESISTANCES Symbol Rth (j-c) Parameter Junction to case Unit 4 °C/W Per diode 2 Total 2.4 2 Coupling 0.7 TO-220AB / D PAK TO-220AB / D PAK Rth (c) Value 2 TO-220AB / D PAK When the diodes 1 and 2 are used simultaneously : ∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol Parameter IR * Reverse leakage current Tests conditions Tj = 25°C Min. VR = VRRM Tj = 125°C VF ** Pulse test : Forward voltage drop Typ. 0.40 Tj = 25°C IF = 5 A Tj = 125°C IF = 5 A Tj = 25°C IF = 10 A Tj = 125°C IF = 10 A 0.69 Max. Unit 2.0 µA 2.0 mA 0.92 V 0.75 1 0.79 0.85 * tp = 5 ms, δ < 2% ** tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.65 IF(AV) + 0.02 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current (per diode). PF(av)(W) 5.0 δ = 0.2 δ = 0.5 δ = 0.1 4.5 4.0 δ = 0.05 3.5 δ=1 3.0 2.5 2.0 1.5 T 1.0 0.5 IF(av) (A) tp δ=tp/T 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2/5 Fig. 2: Average forward current versus ambient temperature (δ = 0.5, per diode). IF(av)(A) 6 Rth(j-a)=Rth(j-c) 5 4 Rth(j-a)=15°C/W 3 2 T 1 0 δ=tp/T 0 25 Tamb(°C) tp 50 75 100 125 150 175 STPS10150CT/CG Fig. 3: Normalized avalanche power derating versus pulse duration. Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(1µs) 1 1.2 PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 1 0 10 100 0 1000 Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values, per diode). 25 50 75 100 125 150 Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration (per diode). Zth(j-c)/Rth(j-c) IM(A) 1.0 80 70 0.8 60 50 Tc=50°C 0.6 Tc=75°C 0.4 δ = 0.5 40 30 20 δ = 0.2 δ = 0.1 Tc=125°C IM 10 Single pulse t(s) t δ=0.5 0 1E-3 1E-2 T 0.2 1E-1 1E+0 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values, per diode) 0.0 1E-3 tp(s) δ=tp/T 1E-2 tp 1E-1 1E+0 Fig. 8: Junction capacitance versus reverse voltage applied (typical values, per diode). C(pF) IR(µA) 200 1E+5 F=1MHz Tj=25°C Tj=175°C 1E+4 100 Tj=150°C 1E+3 Tj=125°C 1E+2 50 Tj=75°C 1E+1 1E+0 20 Tj=25°C 1E-1 1E-2 VR(V) VR(V) 0 25 50 75 100 125 150 10 1 2 5 10 20 50 100 200 3/5 STPS10150CT/CG Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35µm) (STPS10150CG only). Fig. 9: Forward voltage drop versus forward current (maximum values, per diode). IFM(A) Rth(j-a) (°C/W) 100.0 80 70 Tj=125°C Typical values 60 10.0 Tj=125°C 50 Tj=25°C 40 30 1.0 20 10 VFM(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 S(cm²) 0 2 4 6 8 10 12 14 16 18 PACKAGE MECHANICAL DATA TO-220AB DIMENSIONS REF. A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 L4 M G1 E G Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. 4/5 Inches Min. L2 F Millimeters 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 20 STPS10150CT/CG PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E Min. C2 L2 D L L3 A1 B2 Millimeters R C B G A2 2.0 MIN. FLAT ZONE V2 A A1 A2 B B2 C C2 D E G L L2 L3 R V2 Inches Typ. Max. Min. Typ. Max. 4.30 4.60 0.169 0.181 2.49 2.69 0.098 0.106 0.03 0.23 0.001 0.009 0.70 0.93 0.027 0.037 1.25 1.40 0.049 0.055 0.45 0.60 0.017 0.024 1.21 1.36 0.047 0.054 8.95 9.35 0.352 0.368 10.00 10.28 0.393 0.405 4.88 5.28 0.192 0.208 15.00 15.85 0.590 0.624 1.27 1.40 0.050 0.055 1.40 1.75 0.055 0.069 0.40 0.016 0° 8° 0° 8° FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 5.08 1.30 3.70 8.90 ■ Ordering type Marking Package Weight Base qty Delivery mode STPS10150CT STPS10150CG STPS10150CG-TR STPS10150CT STPS10150CG STPS10150CG TO-220AB D2PAK D2PAK 2.2 g 1.48 g 1.48 g 50 50 1000 Tube Tube Tape & reel EPOXY MEETS UL94, V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. 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