STMICROELECTRONICS STTH112RL

STTH112/A/U
®
HIGH VOLTAGE ULTRAFAST RECTIFIER
MAIN PRODUCT CHARACTERISTICS
IF(AV)
1A
VRRM
1200 V
Tj (max)
175 °C
VF (max)
1.65 V
FEATURES AND BENEFITS
■
■
■
■
■
Low forward voltage drop
High reliability
High surge current capability
Soft switching for reduced EMI disturbances
Planar technology
DO-41
STTH112
DESCRIPTION
The STTH112, which is using ST ultrafast high
voltage planar technology, is specially suited for
free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching
applications.
SMA
STTH112A
SMB
STTH112U
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
1200
V
V(RMS)
RMS voltage
850
V
IF(AV)
Average forward current
1
A
DO-41
20
A
SMA
18
IFSM
Forward surge current
Tl = 85°C
δ =0.5
DO-41
Tl = 115°C
δ =0.5
SMA
Tl = 125°C
δ =0.5
SMB
t = 8.3 ms
SMB
Tstg
Tj
Storage temperature range
Maximum operating junction temperature
January 2003 - Ed: 2
- 50 + 175
°C
+ 175
°C
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STTH112/A/U
THERMAL PARAMETERS
Symbol
Parameter
Rth (j-l)
Junction to lead
L = 10 mm
Junction to ambient
Rth (j-a)
L = 10 mm
Value
Unit
DO-41
45
°C/W
SMA
30
SMB
25
DO-41
110
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
IR
Reverse leakage current
VF
Tests conditions
VR = 1200V
Forward voltage drop
IF = 1 A
Min.
Typ.
Max.
Unit
Tj = 25°C
5
µA
Tj = 125°C
50
Tj = 25°C
1.9
Tj = 125°C
1.17
V
1.65
To evaluate the maximum conduction losses use the following equation :
P = 1.35 x IF(AV) + 0.3 x IF2(RMS)
DYNAMIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Tests conditions
Min.
Typ.
Max.
Unit
trr
Reverse recovery time
IF = 0.5 A
Irr = 0.25 A IR = 1A
Tj = 25°C
75
ns
tfr
Forward recovery time
IF = 1 A
dIF/dt = 50 A/µs
VFR = 1.1 x VFmax
Tj = 25°C
500
ns
30
V
VFP
Forward recovery voltage
Fig. 1: Conduction losses versus average current.
Fig. 2: Forward voltage drop versus forward
current.
IFM(A)
P(W)
2.2
2.0
δ = 0.05
δ = 0.1
100.0
δ = 0.2
δ = 0.5
Tj=125°C
(maximum values)
1.8
1.6
δ=1
1.4
Tj=125°C
(typical values)
10.0
1.2
Tj=25°C
(maximum values)
1.0
0.8
1.0
0.6
T
0.4
IF(AV)(A)
0.2
δ=tp/T
0.0
0.0
2/6
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
VFM(V)
tp
0.1
1.1
1.2
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
STTH112/A/U
Fig. 3-1: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4, Lleads = 10mm) (DO-41).
Fig. 3-2: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4) (SMA).
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
δ = 0.5
0.5
0.5
0.4
0.4
0.3
0.3
δ = 0.2
0.2
T
0.2
δ = 0.1
0.1
δ = 0.5
T
δ = 0.2
δ = 0.1
Single pulse
tp(s)
1.E-01
1.E+00
0.1
δ=tp/T
0.0
1.E+01
tp
tp(s)
Single pulse
δ=tp/T
0.0
1.E+02
1.E-01
1.E+03
1.E+00
1.E+01
tp
1.E+02
1.E+03
Fig. 3-3: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4)(SMB).
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
T
δ = 0.1
0.1
tp(s)
Single pulse
δ=tp/T
0.0
1.E-01
1.E+00
1.E+01
Fig. 4-1: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness: 35µm)
(DO-41, SMB).
tp
1.E+02
1.E+03
Fig. 4-2: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness: 35µm)
(SMA).
Rth(j-a)(°C/W)
Rth(j-a)(°C/W)
140
110
130
100
120
90
110
DO-41
Lleads=10mm
80
100
90
70
80
SMB
60
SMA
70
50
60
40
50
30
40
30
20
20
10
S(cm²)
S(cm²)
10
0
0
0
1
2
3
4
5
6
7
8
9
10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
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STTH112/A/U
PACKAGE MECHANICAL DATA
SMA
DIMENSIONS
REF.
E1
D
E
A1
A2
C
L
b
FOOTPRINT (in millimeters)
1.65
1.45
4/6
2.40
1.45
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.70
0.075
0.106
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.41
0.006
0.016
E
4.80
5.60
0.189
0.220
E1
3.95
4.60
0.156
0.181
D
2.25
2.95
0.089
0.116
L
0.75
1.60
0.030
0.063
STTH112/A/U
PACKAGE MECHANICAL DATA
SMB
DIMENSIONS
REF.
E1
D
E
A1
A2
C
L
b
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.41
0.006
0.016
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
L
0.75
1.60
0.030
0.063
FOOTPRINT (in millimeters)
2.3
1.52
2.75
1.52
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STTH112/A/U
PACKAGE MECHANICAL DATA
DO-41
DIMENSIONS
C
A
C
REF.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.07
5.20
0.160
0.205
B
2.04
2.71
0.080
0.107
C
28
D
0.712
O
/D
O
/D
■
O
/ B
1.102
0.863
0.028
0.034
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
STTH112
STTH112
DO-41
0.34 g
2000
Ammopack
STTH112A
H12
SMA
0.068 g
5000
Tape & reel
STTH112U
U12
SMB
0.11 g
2500
Tape & reel
STTH112RL
STTH112
DO-41
0.34 g
5000
Tape & reel
Epoxy meets UL 94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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