STPS140A/U ® POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 1A VRRM 40 V VF (max) 0.5 V FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNTED DEVICE SMA STPS140A SMB STPS140U DESCRIPTION Single chip Schottky rectifier suited for Switchmode Power Supplies and high frequency DC to DC converters. Packaged in SMA and SMB(*), this device is intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. (*) in accordance with DO214AAand DO21AC JEDEC ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 40 V IF(RMS) RMS forward current 7 A 1 A IF(AV) Average forward current δ = 0.5 SMA TL = 130°C SMB TL = 135°C IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 60 A IRRM Repetitive peak reverse current tp = 2 µs F = 1kHz 1 A IRSM Non repetitive peak reverse current tp = 100µs square 1 A Tstg Storage temperature range - 65 to + 150 °C Tj dV/dt Maximum junction temperature Critical rate of rise of reverse voltage July 1998 - Ed: 6B 150 10000 V/µs 1/6 STPS140A/U THERMAL RESISTANCES Symbol Parameter Junction to lead Rth (j-l) Value Unit SMA 30 °C/W SMB 25 STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions Tests Conditions IR * Reverse leakage current Tj = 25°C Min. Forward voltage drop Pulse test : Max. Unit 12 µA 2 mA 0.55 V VR = 40V Tj = 100°C VF ** Typ. 0.25 Tj = 25°C IF = 1 A Tj = 125°C IF = 1 A Tj = 25°C IF = 2 A Tj = 125°C IF = 2 A 0.43 0.5 0.65 0.53 0.6 * tp = 5 ms, δ < 2 % ** tp = 380 µs, δ < 2% To evaluate the maximum conduction losses use the following equation : P = 0.4 x IF(AV) + 0.10 x IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. Fig. 2: Average forward current versus ambient temperature (δ=0.5). IF(av)(A) PF(av)(W) 0.7 δ = 0.1 0.6 1.2 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-l) 1.0 δ = 0.05 0.5 SMA Rth(j-a)=100°C/W S(Cu)=1.5cm² 0.8 δ=1 0.4 SMB Rth(j-a)=80°C/W S(Cu)=1.5cm² 0.6 0.3 0.1 0.0 0.0 2/6 0.4 T 0.2 δ=tp/T IF(av) (A) 0.2 0.4 0.6 0.8 1.0 T 0.2 tp δ=tp/T 1.2 0.0 0 25 Tamb(°C) tp 50 75 100 125 150 STPS140A/U Fig. 3-1: Non repetivesurge peak forward current versus overload duration (maximum values) (SMB). Fig. 3-2: Non repetivesurge peak forward current versus overload duration (maximum values) (SMA). IM(A) IM(A) 8 8 7 7 6 6 Ta=25°C 5 Ta=25°C 5 4 4 Ta=50°C 2 Ta=50°C 3 3 1 2 Ta=100°C IM t(s) δ=0.5 0 1E-3 1E-2 1E-1 1E+0 Ta=100°C IM 1 t t t(s) δ=0.5 0 1E-3 1E-2 1E-1 1E+0 Fig. 4-1: Relative variation of thermal impedance junction to ambient versus pulse duration (SMB). Fig. 4-2: Relative variation of thermal impedance junction to ambient versus pulse duration (SMA). Zth(j-a)/Rth(j-a) 1.0 Printed circuit board: SCu=1.5cm (e=35µm) 0.9 0.8 0.7 0.6 δ = 0.5 0.5 0.4 0.3 δ = 0.2 0.2 δ = 0.1 0.1 tp(s) Single pulse 0.0 1E+0 1E-2 1E-1 1E+1 Zth(j-a)/Rth(j-a) 1.0 Printed circuit board: SCu=1.5cm (e=35µm) 0.9 0.8 0.7 0.6 δ = 0.5 0.5 0.4 0.3 δ = 0.2 0.2 δ = 0.1 tp(s) 0.1 Single pulse 0.0 1E-2 1E-1 1E+0 2 2 T δ=tp/T tp 1E+3 1E+2 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). T δ=tp/T 1E+1 tp 1E+2 Fig. 6: Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1E+3 200 Tj=125°C F=1MHz Tj=25°C 1E+2 100 Tj=75°C 1E+1 50 1E+0 Tj=25°C 20 1E-1 VR(V) VR(V) 1E-2 0 5 10 15 20 10 25 30 35 40 1 2 5 10 20 50 3/6 STPS140A/U Fig. 7: Forward voltage drop versus forward current (maximum values). Fig. 8-1: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35µm)(SMB). IFM(A) Rth(j-a) (°C/W) 1E+1 120 Tj=125°C P=1.5W 100 1E+0 80 60 1E-1 40 20 S(Cu) (cm²) VFM(V) 1E-2 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Fig. 8-2: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35µm)(SMA). Rth(j-a) (°C/W) 140 P=1.5W 120 100 80 60 40 20 0 4/6 S(Cu) (cm²) 0 1 2 3 4 5 0 0 1 2 3 4 5 STPS140A/U PACKAGE MECHANICAL DATA SMA DIMENSIONS REF. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.70 0.075 0.106 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 E A1 A2 C L b FOOT PRINT (in millimeters) Marking: S140 1.65 1.45 2.40 1.45 5/6 STPS140A/U PACKAGE MECHANICAL DATA SMB Plastic DIMENSIONS REF. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 E A1 A2 C L b Marking: G14 FOOT PRINT (in millimeters) 2.3 1.52 2.75 1.52 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. 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