STMICROELECTRONICS STPS2H100U

STPS2H100A/U
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
IF(AV)
2A
VRRM
100 V
Tj (max)
175 °C
VF (max)
0.65 V
FEATURES AND BENEFITS
SMA
(JEDEC DO-214AC)
STPS2H100A
NEGLIGIBLE SWITCHING LOSSES
HIGH JUNCTION TEMPERATURE CAPABILITY
LOW LEAKAGE CURRENT
GOOD TRADE OFF BETWEEN LEAKAGE
CURRENT AND FORWARD VOLTAGE DROP
AVALANCHE RATED
SMB
(JEDEC DO-214AA)
STPS2H100U
DESCRIPTION
Schottky rectifier designed for high frequency
miniature Switched Mode Power Supplies such as
adaptators and on board DC/DC converters.
Packaged in SMA or SMB.
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
100
V
IF(RMS)
RMS forward current
10
A
IF(AV)
Average forward current
TL = 130°C δ = 0.5
2
A
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
75
A
IRRM
Repetitive peak reverse current
tp=2 µs F=1kHz square
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
1
A
Tstg
Storage temperature range
- 65 to + 175
°C
175
°C
10000
V/µs
Tj
dV/dt
Maximum operating junction temperature
Critical rate of rise of reverse voltage
November 1998 - Ed: 3A
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STPS2H100A/U
THERMAL RESISTANCES
Symbol
Rth (j-l)
Parameter
Junction to lead
Value
Unit
SMA
30
°C/W
SMB
25
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
IR *
Reverse leakage current
Tests conditions
Tj = 25°C
Min.
Pulse test :
Forward voltage drop
Max.
Unit
1
µA
1
mA
0.79
V
VR = VRRM
Tj = 125°C
VF **
Typ.
0.4
Tj = 25°C
IF = 2 A
Tj = 125°C
IF = 2 A
Tj = 25°C
IF = 4 A
Tj = 125°C
IF = 4 A
0.6
0.65
0.88
0.69
0.74
* tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.56 IF(AV) + 0.045 IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current.
Fig. 2: Average forward current versus ambient
temperature (δ=0.5).
IF(av)(A)
PF(av)(W)
1.8
δ = 0.2
δ = 0.1
δ = 0.5
1.6
δ = 0.05
1.4
1.2
δ=1
1.0
0.8
0.6
T
0.4
0.2
tp
IF(av) (A)
δ=tp/T
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
2/6
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Rth(j-a)=Rth(j-l)
SMA
Rth(j-a)=100°C/W
S(Cu)=1.5cm²
SMB
Rth(j-a)=80°C/W
S(Cu)=1.5cm²
T
δ=tp/T
0
25
Tamb(°C)
tp
50
75
100
125
150
175
STPS2H100A/U
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values)
(SMB).
IM(A)
10
9
8
7
6
5
4
3
IM
2
1
0
1E-3
Fig. 4: Non repetitive surge peak forward current
versus overload duration (maximum values)
(SMA).
IM(A)
8
7
6
Ta=50°C
Ta=50°C
5
4
Ta=100°C
Ta=100°C
3
Ta=150°C
t
1E-2
IM
1
t(s)
δ=0.5
2
1E-1
1E+0
Ta=150°C
t
t(s)
δ=0.5
0
1E-3
1E-2
1E-1
1E+0
Fig. 5: Relative variation of thermal impedance
junction to ambient versus pulse duration (SMB).
Fig. 6: Relative variation of thermal impedance
junction to ambient versus pulse duration (SMA).
Zth(j-a)/Rth(j-a)
1.0
Printed circuit board: S(Cu)=1.5cm² (e=35µm)
0.9
0.8
0.7
0.6 δ = 0.5
0.5
0.4
0.3 δ = 0.2
0.2 δ = 0.1
0.1
tp(s)
Single pulse
0.0
1E-2
1E-1
1E+0
1E+1
Zth(j-a)/Rth(j-a)
1.0
Printed circuit board: S(Cu)=1.5cm² (e=35µm)
0.9
0.8
0.7
0.6 δ = 0.5
0.5
0.4
0.3 δ = 0.2
0.2 δ = 0.1
0.1
tp(s)
Single pulse
0.0
1E-2
1E-1
1E+0
T
δ=tp/T
1E+2
tp
1E+3
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
T
δ=tp/T
tp
1E+1
1E+2
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values).
IR(µA)
C(pF)
1E+0
200
F=1MHz
Tj=25°C
Tj=125°C
1E-1
100
Tj=100°C
1E-2
Tj=75°C
50
1E-3
1E-4
20
VR(V)
Tj=25°C
1E-5
0
10
20
30
40
50
60
70
80
90 100
10
VR(V)
1
2
5
10
20
50
100
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STPS2H100A/U
Fig. 9: Thermal resistance junction to ambient
versus copper surface under each lead
(Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMB).
Fig. 10: Thermal resistance junction to ambient
versus copper surface under each lead
(Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMA).
Rth(j-a) (°C/W)
Rth(j-a) (°C/W)
120
140
100
120
100
80
80
60
60
40
40
20
20
S(Cu) (cm²)
0
0
1
2
3
S(Cu) (cm²)
4
5
Fig. 11: Forward voltage drop versus forward
current .
IFM(A)
1E+1
Tj=125°C
Maximum
values
1E+0
Tj=125°C
Typical
values
Tj=25°C
Maximum
values
1E-1
VFM(V)
1E-2
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
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0
0
1
2
3
4
5
STPS2H100A/U
PACKAGE MECHANICAL DATA
SMA
DIMENSIONS
E1
REF.
D
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.70
0.075
0.106
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.41
0.006
0.016
E
4.80
5.60
0.189
0.220
E1
3.95
4.60
0.156
0.181
D
2.25
2.95
0.089
0.116
L
0.75
1.60
0.030
0.063
E
A1
A2
C
L
b
FOOT PRINT (in millimeters)
1.65
1.45
2.40
1.45
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STPS2H100A/U
PACKAGE MECHANICAL DATA
SMB
DIMENSIONS
E1
REF.
D
E
A1
A2
C
L
b
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.41
0.006
0.016
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
L
0.75
1.60
0.030
0.063
FOOT PRINT (in millimeters)
2.3
1.52
2.75
1.52
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS2H100A
S21
SMA
0.068g
5000
Tape & reel
STPS2H100U
G21
SMB
0.107g
2500
Tape & reel
Band indicates cathode
Epoxy meets UL94,V0
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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