STPS160A/U ® POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 1A VRRM 60 V Tj (max) 150°C VF (max) 0.57 V FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNTED DEVICE SMA (JEDEC DO-214AC) STPS160A SMB (JEDEC DO-214AA) STPS160U DESCRIPTION Single chip Schottky rectifier suited for Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMA or SMB, this device is intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) RMS forward current 10 A IF(AV) Average forward current TLead = 130°C δ = 0.5 1 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 75 A IRRM Repetitive peak reverse current tp = 2 µs square F = 1kHz 1 A IRSM Non repetitive peak reverse current tp = 100µs square 1 A Tstg Storage temperature range - 65 to + 150 °C Tj dV/dt * : Maximum junction temperature * Critical rate of rise of reverse voltage 150 10000 V/µs dPtot 1 < thermal runaway condition for a diode on its own heatsink Rth(j−a) dTj July 1999 - Ed: 5A 1/6 STPS160A/U THERMAL RESISTANCES Symbol Rth (j-l) Parameter Junction to lead Value Unit SMA 30 °C/W SMB 23 STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions Tests Conditions IR * Reverse leakage current Tj = 25°C Min. Forward voltage drop Max. Unit 4 µA 4 mA 0.67 V VR = 60V Tj = 125°C VF * Typ. 1.1 Tj = 25°C IF = 1 A Tj = 125°C IF = 1 A Tj = 25°C IF = 2 A Tj = 125°C IF = 2 A 0.49 0.57 0.8 0.58 0.65 * tp = 380 µs, δ < 2% Pulse test : To evaluate the maximum conduction losses use the following equation : P = 0.49 x IF(AV) + 0.08 x IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. Fig. 2: Average forward current versus ambient temperature (δ=0.5). IF(av)(A) PF(av)(W) 0.7 δ = 0.1 0.6 δ = 0.2 1.2 δ = 0.5 Rth(j-a)=Rth(j-l) 1.0 δ = 0.05 δ=1 0.5 SMA Rth(j-a)=100°C/W S(Cu)=1.5cm² 0.8 0.4 0.6 0.3 0.2 0.0 0.0 2/6 0.4 T 0.1 δ=tp/T IF(av) (A) 0.2 0.4 0.6 0.8 1.0 SMB Rth(j-a)=80°C/W S(Cu)=1.5cm² T 0.2 tp 1.2 0.0 δ=tp/T 0 Tamb(°C) tp 25 50 75 100 125 150 STPS160A/U Fig. 3-1: Non repetive surge peak forward current versus overload duration (maximum values) (SMB). Fig. 3-2: Non repetive surge peak forward current versus overload duration (maximum values) (SMA). IM(A) IM(A) 8 8 7 7 6 6 Ta=25°C 5 4 Ta=50°C 3 2 5 Ta=25°C 4 Ta=50°C 3 2 Ta=100°C IM 1 t(s) δ=0.5 0 1E-3 1E-2 IM 1 t 1E-1 1E+0 Ta=100°C t t(s) δ=0.5 0 1E-3 1E-2 1E-1 1E+0 Fig. 4-1: Relative variation of thermal impedance junction to ambient versus pulse duration (SMB). Fig. 4-2: Relative variation of thermal impedance junction to ambient versus pulse duration (SMA). Zth(j-a)/Rth(j-a) 1.0 0.9 Printed circuit board: S(Cu)=1.5cm² (e=35µm) 0.8 0.7 0.6 δ=0.5 0.5 0.4 0.3 δ=0.2 0.2 δ=0.1 0.1 tp(s) Single pulse 0.0 1E-2 1E-1 1E+0 1E+1 Zth(j-a)/Rth(j-a) 1.0 0.9 Printed circuit board: S(Cu)=1.5cm² (e=35µm) 0.8 0.7 0.6 δ=0.5 0.5 0.4 0.3 δ=0.2 0.2 δ=0.1 0.1 tp(s) Single pulse 0.0 1E-2 1E-1 1E+0 T δ=tp/T 1E+2 tp 1E+3 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). IR(µA) T δ=tp/T tp 1E+1 1E+2 Fig. 6: Junction capacitance versus reverse voltage applied (typical values) C(pF) 1E+3 200 F=1MHz Tj=25°C Tj=100°C 100 1E+2 Tj=75°C 50 1E+1 1E+0 1E-1 20 Tj=25°C VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 60 VR(V) 10 1 2 5 10 20 50 100 3/6 STPS160A/U Fig. 7: Forward voltage drop versus forward current (maximum values). Fig. 8-1: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35µm)(SMB). IFM(A) Rth(j-a) (°C/W) 1E+1 100 Tj=125°C 80 1E+0 60 Tj=25°C 40 1E-1 20 S(Cu) (cm²) VFM(V) 1E-2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 Fig. 8-2: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35µm)(SMA). Rth(j-a) (°C/W) 140 120 100 80 60 40 20 0 4/6 S(Cu) (cm²) 0 1 2 3 4 5 0 0 1 2 3 4 5 STPS160A/U PACKAGE MECHANICAL DATA SMA DIMENSIONS REF. E1 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.70 0.075 0.106 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 D E A1 A2 C L b FOOT PRINT DIMENSIONS ( in millimeters) 1.65 1.45 2.40 1.45 5/6 STPS160A/U PACKAGE MECHANICAL DATA SMB DIMENSIONS E1 REF. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 D E A1 A2 C L b FOOT PRINT DIMENSIONS ( in millimeters) 2.3 1.52 Ordering type 2.75 1.52 Marking STPS160A GA6 STPS160U E16 Band indicates cathode Epoxy meets UL94,V0 Package Weight Base qty Delivery mode SMA SMB 0.068 g. 0.107 g. 5000 2500 Tape & reel Tape & reel Information furnished is believed to be accurate and reliable. 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