STPS3150/U ® POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 3A VRRM 150 V Tj (max) 175°C VF (max) 0.66 V FEATURES AND BENEFITS ■ ■ ■ NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP FOR HIGHER EFFICIENCY AND EXTENDED BATTERY LIFE LOW THERMAL RESISTANCE DO-201AD STPS3150 DESCRIPTION 150V Power Schottky rectifier are suited for switch Mode Power Supplies on up to 24V rails and high frequency converters. Packaged in SMB and Axial, this device is intended for use in consumer & computer applications like TV, STB, PC and DVD where low drop forward voltage in required to reduce power dissipation. SMB STPS3150U ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 150 V IF(RMS) RMS forward current 15 A 3 A SMB 100 A DO-201AD 150 IF(AV) Average forward current TL = 130°C δ = 0.5 SMB TL = 140°C δ = 0.5 DO-201AD IFSM Tstg Tj dV/dt * : Surge non repetitive forward current Half wave, single phase, 50Hz Storage temperature range Maximum junction temperature * Critical rate of rise of reverse voltage (rated VR, Tj = 25°C) - 65 to + 150 °C 175 °C 10000 V/µs dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) April 2003 - Ed: 1A 1/5 STPS3150/U THERMAL RESISTANCES Symbol Rth(j-l) Parameter Junction to leads Lead length = 10 mm Value 20 15 DO-1201AD SMB Unit °C/W STATIC ELECTRICAL CHARACTERISTICS Symbol Parameter Tests conditions IR * Reverse leakage current Tj = 25°C Min. VR = 150V Tj = 125°C VF * Forward voltage drop Tj = 25°C IF = 3 A Tj = 125°C Tj = 25°C IF = 6 A Tj = 125°C Typ. Max. Unit 0.4 2.0 µA 0.6 2.0 mA 0.78 0.82 V 0.63 0.67 0.85 0.89 0.70 0.75 Pulse test : * tp = 380 µs, δ < 2% To evaluate the maximum conduction losses use the following equation: P = 0.59 x IF(AV) + 0.023 x IF2(RMS) Fig. 1: Conduction losses versus average current. Fig. 2: Average forward current versus ambient temperature (δ = 0.5). PF(AV)(W) IF(AV)(A) 2.4 δ = 0.2 δ = 0.1 2.2 3.5 δ = 0.5 Rth(j-a)=Rth(j-I) DO-201AD 3.0 δ = 0.05 2.0 1.8 2.5 δ=1 1.6 1.4 SMB 2.0 1.2 1.5 1.0 Rth(j-a)=75°C/W 0.8 1.0 0.6 T T 0.4 0.5 IF(AV)(A) 0.2 δ=tp/T 0.0 0.0 0.5 1.0 1.5 2.0 2.5 δ=tp/T tp 0.0 3.0 0 3.5 Fig. 3-1: Non repetitive surge peak forward current versus overload duration (maximum values) (SMB). Tamb(°C) tp 25 50 75 100 125 150 175 Fig. 3-2: Non repetitive surge peak forward current versus overload duration (maximum values) (DO-201AD). IM(A) IM(A) 14 12 11 DO-201AD SMB 12 10 9 Ta=25°C 10 8 Ta=25°C 7 Ta=75°C 5 4 Ta=125°C 3 2 1 2/5 6 Ta=125°C 4 IM IM 2 t t t(s) δ=0.5 t(s) δ=0.5 0 0 1.E-03 8 Ta=75°C 6 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 STPS3150/U Fig. 4-1: Relative variation of thermal impedance junction to ambient versus pulse duration (SMB). Fig. 4-2: Relative variation of thermal impedance junction to ambient versus pulse duration (DO-201AD). Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 DO-201AD SMB 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 δ = 0.5 0.5 0.5 0.4 0.4 0.3 δ = 0.2 0.2 δ = 0.1 δ = 0.5 0.3 T δ = 0.2 0.2 0.1 δ=tp/T tp(s) Single pulse T δ = 0.1 0.1 tp δ=tp/T tp(s) Single pulse 0.0 tp 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Fig. 6: Junction capacitance versus reverse voltage applied (typical values). IR(µA) C(nF) 1.E+04 1000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1.E+03 Tj=125°C 1.E+02 Tj=100°C 1.E+01 100 Tj=75°C Tj=50°C 1.E+00 Tj=25°C 1.E-01 VR(V) VR(V) 1.E-02 10 0 25 50 75 100 125 150 Fig. 7: Forward voltage drop versus forward current. 1 10 100 1000 Fig. 8: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, Cu: 35µm) (SMB). Rth(j-a)(°C/W) IFM(A) 110 100 Tj=125°C (maximum values) 100 SMB 90 Tj=125°C (typical values) 80 Tj=25°C (maximum values) 70 60 10 50 40 30 20 10 VFM(V) 1 S(cm²) 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 3/5 STPS3150/U Fig. 9: Thermal resistance versus lead length (DO-201AD). Rth(°C/W) 90 DO-201AD 80 Rth(j-a) 70 60 50 40 30 Rth(j-I) 20 10 Lleads(mm) 0 5 10 15 20 25 PACKAGE MECHANICAL DATA SMB DIMENSIONS E1 REF. D E A1 A2 C L b FOOT PRINT DIMENSIONS (in millimeters) 2.3 1.52 4/5 2.75 1.52 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 STPS3150/U PACKAGE MECHANICAL DATA DO-201AD plastic B note 1 A E B E ØD ØC note 1 ØD note 2 DIMENSIONS REF. Millimeters Min. Max. Min. NOTES Max. 0.374 1 - The lead diameter ∅ D is not controlled over zone E 5.30 0.209 D 1.30 0.051 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15 mm) E 1.25 0.049 A B 9.50 25.40 C ■ Inches 1.000 Ordering type Marking Package Weight Base qty Delivery mode STPS3150 STPS3150 DO-201AD 1.12 g 600 Ammopack STPS3150RL STPS3150 DO-201AD 1.12 g 1900 Tape & Reel STPS3150U G315 SMB 0.107 g 2500 Tape & Reel Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. 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