TN1215-600B ® STANDARD SCR FEATURES ITRMS = 12 A VDRM / VRRM = 600 V IGT < 15 mA ITSM = 110 A A DESCRIPTION A The TN1215-600B SCR uses a high performance TOPGLASS PNPN technology. This part is intended for general purpose applications using surface mount technology and requiring high surge capability (power tools, crowbar protection, voltage regulation, etc...). G K DPAK ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VDRM VRRM Repetitive peak off-state voltage Tj = 125°C 600 V IT(RMS) RMS on-state current (180° conduction angle) Tc= 105°C 12 A IT(AV) Average on-state current (180° conduction angle) Tc= 105°C 8 A ITSM Non repetitive surge peak on-state current (Tj initial = 25°C) tp = 8.3 ms 115 A tp = 10 ms 110 tp = 10ms 60 A2s I2t I2t Value for fusing dI/dt Critical rate of rise of on-state current dIG /dt = 1 A/µs. IG = 20 mA 50 A/µs Tstg Tj Storage junction temperature range Operating junction temperature range - 40 to + 150 - 40 to + 125 °C 260 °C T Maximum temperature for soldering during 10s september 1998 - Ed: 1A 1/5 TN1215-600B THERMAL RESISTANCES Symbol Parameter Value Unit Rth(j-a) Junction to ambient (S=0.5cm2) 70 °C/W Rth(j-c) Junction to case for D.C 1.5 °C/W Type Value Unit MIN 2 mA MAX 15 Tj= 25°C MAX 1.5 V GATE CHARACTERISTICS PG (AV)= 1W PGM = 10 W (tp = 20 µs) IGM = 4 A (tp = 20 µs) VRGM = 5 V ELECTRICAL CHARACTERISTICS Symbol Test Conditions VD = 12V (DC) RL= 33Ω IGT Tj= 25°C VGT VD = 12V (DC) RL= 33Ω VGD VD = VDRM RL = 3.3kΩ Tj= 125°C MIN 0.2 V IT= 100mA Tj= 25°C MAX 40 mA IH Gate open VTM ITM= 24A tp= 380µs Tj= 25°C MAX 1.6 V IDRM VD = VDRM Tj= 25°C MAX 10 µA IRRM VR = VRRM Tj = 125°C MAX 2 mA dV/dt Linear slope up to VD=67%VDRM Gate open Tj= 125°C MIN 200 V/µs ORDERING INFORMATION TN 12 15 - 600 B (-TR) Tape & Reel STANDARD SCR SENSITIVITY CURRENT 2/5 PACKAGES : B: DPAK VDRM / VRRM TN1215-600B Fig. 1: Maximum average power dissipation versus average on-state current . Fig. 2 : Correlation between maximum average power dissipation and maximum allowable temperatures (T amb and T case) for different thermal resistances. P(W) P(W) 14 12 α α 10 α 105 110 8 6 4 115 Rth=70°C/W 4 360° Rth=37°C/W 120 2 2 IT(av)(A) 0 2 4 α 6 8 10 0 125 0 20 60 80 Tamb(°C) 100 120 140 Fig. 4: Average and D.C. on-state current versus ambient temperature (Printed circuit board FR4, SCu=0.5cm2). IT(av)(A) IT(av)(A) 14 D.C. 12 10 α 8 6 4 2 Tcase(°C) 0 40 12 Fig. 3: Average and D.C. on-state current versus case temperature. 0 Rth=0°C/W 10 6 0 α 12 α 8 Tcase (°C) 14 α 25 50 75 100 125 Fig. 5: Relative variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout). 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 D.C. α Tamb(°C) 0 25 50 75 100 125 Fig. 6: Relative variation of gate trigger current and holding current versus junction temperature Igt,IH[Tj]/Ig,IH[Tj=25°C] K=[Zth(j-a)/Rth(j-a)] 2.5 1.00 2.0 Igt 1.5 0.10 1.0 IH 0.5 tp(s) 0.01 1E-2 1E-1 1E+0 Tj(°C) 1E+1 1E+2 5E+2 0.0 -40 -20 0 20 40 60 80 100 120 140 3/5 TN1215-600B Fig 7: Non repetitive surge peak on-state current versus number of cycles. 120 Fig 8: Non repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and corresponding value of I2t. ITSM(A),I²t(A²s) ITSM(A) 500 Tj initial=25°C F=50Hz 100 Tj initial=25°C ITSM 80 100 I²t 60 40 20 tp(ms) Number of cycles 0 1 10 100 1000 Fig 9: On-state characteristics (maximum values). 100.0 10 1 2 5 10 Fig 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm). ITM(A) Rth(j-a) (°C/W) 100 Tj max.: Vto=0.85V Rt=30mΩ Tj=Tj max. 80 10.0 60 Tj=25°C 40 1.0 20 S(Cu) (cm²) VTM(V) 0.1 0.0 4/5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 0 2 4 6 8 10 12 14 16 18 20 TN1215-600B PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. Millimeters Min. Typ. Max A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 B 0.03 0.64 0.23 0.001 0.90 0.025 0.009 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 Min. Typ. Max. E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 L2 FOOT PRINT DIMENSIONS (in millimeters) Inches 0.80 L4 0.60 V2 0° 0.031 1.00 0.023 8° 0° 0.039 8° WEIGHT : 0.30g MARKING 6.7 6.7 TYPE MARKING TN1215-600B TN 1215 6 6.7 3 1.6 1.6 2.3 2.3 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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