TN2540-G ® SCR FEATURES HIGH SURGE CAPABILITY HIGH ON-STATE CURRENT HIGH STABILITY AND RELIABILITY A DESCRIPTION A The TN2540 series of Silicon Controlled Rectifiers uses a high performance glass passivated technology. This SCR is designed for power supplies up to 400Hz on resistive or inductive load. G K D2PAK ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit IT(RMS) RMS on-state current (180° conduction angle) Tc= 100°C 25 A IT(AV) Average on-state current (180° conduction angle) Tc= 100°C 16 A ITSM Non repetitive surge peak on-state current tp = 8.3 ms 314 A (Tj initial = 25°C) tp = 10 ms 300 I2t Value for fusing tp = 10ms 450 A2s I2t dI/dt Critical rate of rise of on-state current dIG /dt = 1 A/µs. IG = 100 mA 100 A/µs Tstg Tj Storage junction temperature range Operating junction temperature range - 40 to + 150 - 40 to + 125 °C 260 °C Tl Maximum temperature for soldering during 10s Symbol VDRM VRRM Parameter Repetitive peak off-state voltage Tj = 125°C May 1998 - Ed: 5 TN2540600G 800G 600 800 Unit V 1/5 TN2540-G THERMAL RESISTANCES Symbol Parameter Value Unit Rth(j-a) Junction to ambient (S=1cm2) 45 °C/W Rth(j-c) Junction to case for D.C 1.0 °C/W GATE CHARACTERISTICS PG (AV)= 1W PGM = 10 W (tp = 20 µs) IGM = 4 A (tp = 20 µs) VRGM = 5 V ELECTRICAL CHARACTERISTICS Symbol IGT Test Conditions VD = 12V (DC) RL= 33Ω Value Unit MIN 3 mA MAX 40 Tj= 25°C MAX 1.3 V Tj= 25°C VGT VD = 12V (DC) RL= 33Ω VGD VD = VDRM RL = 3.3kΩ Tj= 125°C MIN 0.2 V IH IT= 200mA Tj= 25°C MAX 50 mA IL IG = 1.2 IGT Tj= 25°C MAX 90 mA VTM ITM= 50A tp= 380µs Tj= 25°C MAX 1.5 V IDRM VD = VDRM Tj= 25°C MAX 5 µA IRRM VR = VRRM Tj= 125°C MAX 4 mA dV/dt VD=67%VDRM Gate open Tj= 125°C MIN 500 V/µs Gate open ORDERING INFORMATION TN Add "-TR" suffix for Tape & Reel shipment 25 40 - 600 CURRENT G PACKAGES : G: D2PAK SCR 2/5 Type SENSITIVITY VOLTAGE TN2540-G Fig. 1: Maximum average power dissipation versus average on-state current . Fig. 2 : Correlation between maximum average power dissipation and maximum allowable temperatures (Tamb and T case) for different thermal resistances heatsink+contact. P(W) P(W) 25 25 D.C. α=180° 15 5 5 110 115 10 15 20 25 0 120 α=180° IT(AV)(A) 5 Rth=0°C/W 15 10 0 Rth=1°C/W 105 α=60° 10 0 Rth=2°C/W 20 α=90° α=30° Rth=3°C/W 100 α=120° 20 Tcase (°C) 0 20 Tamb(°C) 40 60 80 100 120 140 125 Fig. 3: Average and D.C. on-state current versus case temperature. Fig. 4: Relative variation of thermal impedance versus pulse duration. IT(AV)(A) K=[Zth/Rth] 30 1.00 D.C. 25 Zth(j-c) 20 α=180° Zth(j-a) 15 0.10 10 5 0 Tcase(°C) 0 25 50 tp(s) 75 100 125 0.01 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Fig. 5: Relative variation of gate trigger current and holding current versus junction temperature. Fig. 6: Non repetitive surge peak on-state current versus number of cycles. IGT,IH[Tj]/IGT,IH[Tj=25°C] ITSM(A) 2.5 320 2.0 Tj initial=25°C F=50Hz 280 IGT 240 200 1.5 160 1.0 IH 120 80 0.5 40 Tj(°C) 0.0 -40 -20 0 20 40 60 80 100 120 140 0 Number of cycles 1 10 100 1000 3/5 TN2540-G Fig. 7: Non repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and corresponding value of I2t. Fig. 8: On-state characteristics (maximum values). ITSM(A),I²t(A²s) ITM(A) 1000 300 Tj initial=25°C ITSM 100 I²t 500 Tj=Tj max. Tj max.: Vto=0.77V Rt=14mΩ 10 Tj=25°C 200 tp(ms) 100 1 VTM(V) 2 5 10 Fig. 9: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm). 1 0 1 2 3 4 5 Fig. 10: Typical reflow soldering heat profile, either for mounting on FR4 or metal-backed boards. Rth(j-a) (°C/W) T (°C) 80 250 245°C 70 215°C 200 60 50 150 Epoxy FR4 board 40 100 30 20 10 0 Metal-backed board 50 S(Cu) (cm²) 0 4/5 4 8 12 16 20 24 t (s) 28 32 36 40 0 0 40 80 120 160 200 240 280 320 360 TN2540-G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A Millimeters Inches Min. Typ. Max. Min. Typ. Max. E C2 L2 D L L3 A1 B2 R C B G A2 2.0 MIN. FLAT ZONE V2 A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 B 0.03 0.70 0.23 0.001 0.93 0.027 0.009 0.037 B2 1.25 C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 1.40 0.048 0.055 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 R V2 0.40 0° 0.016 8° 0° 8° FOOT PRINT DIMENSIONS (in millimeters) 16.90 MARKING: TN2540 x00G 10.30 5.08 1.30 3.70 8.90 Information furnished is believed to be accurate and reliable. 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