Freescale Semiconductor, Inc. Order this document by MBC13901PP/D ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Product Preview MBC13901 The RF Building Block Series NPN Silicon Low Noise Transistor RF NPN SILICON TRANSISTOR ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Freescale Semiconductor, Inc... The MBC13901 is a high performance transistor fabricated using Motorola’s 15 GHz fτ bipolar IC process. It is housed in the 4–lead SC–70 (SOT–343) surface mount plastic package resulting in a parasitic effect reduction and RF performance enhancements. The high performance at low power makes the MBC13901 suitable for front–end applications in portable wireless systems such as pagers, cellular and cordless phones. • • • • • fτ = 15 GHz NFmin = 1.2 dB ICMAX = 20 mA VCEO = 5.0 V Low Noise Figure, NFmin = 1.0 dB (Typ) @1.0 GHz, 3.0 V and 3.0 mA SEMICONDUCTOR TECHNICAL DATA Maximum Stable Gain, 22 dB @ 1.0 GHz, 3.0 V and 3.0 mA Output Third Order Intercept, OIP3 = 23 dBm @ 1.0 GHz, 3.0 V and 22 mA Ultra small SOT–343 Surface Mount Package Available Only in Tape and Reel Packaging 1 4 (Scale 4:1) PLASTIC PACKAGE CASE 318M (SOT–343, Tape & Reel Only) ORDERING INFORMATION This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice. Device Package MBC13901 SOT–343 Motorola, Inc. 2000 MOTOROLA WIRELESS SEMICONDUCTOR For More Information On This Product, SOLUTIONS – RF AND IF DEVICE DATA Go to: www.freescale.com Rev 0 1 Freescale Semiconductor, Inc. MBC13901 NOTES ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Freescale Semiconductor, Inc... ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 2 MOTOROLA WIRELESS SEMICONDUCTOR For More Information On This Product, Go to: www.freescale.comSOLUTIONS – RF AND IF DEVICE DATA Freescale Semiconductor, Inc. MBC13901 NOTES ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Freescale Semiconductor, Inc... ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 MOTOROLA WIRELESS SEMICONDUCTOR For More Information On This Product, SOLUTIONS – RF AND IF DEVICE DATA Go to: www.freescale.com 3 Freescale Semiconductor, Inc. MBC13901 OUTLINE DIMENSIONS PLASTIC PACKAGE ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 CASE 318M–01 (SOT–343) ISSUE O 2X 0.15 C 2X e1 D 4 3 A A2 B (B1) e4 E/2 E1/2 PIN 1 IDENTIFIER IN THIS ZONE D E 0.20 C ÉÉ ÉÉ A1 1 B 2 e3 E1 0.10 C 3X 2X 0.15 C b 0.10 M SEATING PLANE e2 A C A–B D 4X B VIEW C q1 B SECTION B–B GAUGE PLANE (SEE NOTE 7) ÉÉÉÉ ÇÇÇ ÉÉÉÉ ÇÇÇ b SEATING PLANE c c1 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Freescale Semiconductor, Inc... 4X 4X q1 q C L b1 (L1) BASE METAL WITH PLATING L2 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15mm PER END. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.15mm PER SIDE. 4. DIMENSIONS D AND E1 ARE DETERMINED AT THE OUTMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF PLASTIC BODY. 5. DATUMS A, B AND D TO BE DETERMINED 0.10mm FROM THE LEAD TIP. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08mm AND 0.15mm FROM THE LEAD TIP. DIM A A1 A2 b b1 B B1 c c1 D E E1 e1 e2 e3 e4 L L1 L2 q q1 MILLIMETERS MIN MAX ––– 1.10 0.00 0.10 0.80 1.00 0.25 0.40 0.25 0.35 0.55 0.70 0.55 0.65 0.10 0.25 0.08 0.20 2.00 BSC 2.10 BSC 1.25 BSC 1.30 BSC 0.65 BSC 1.15 BSC 0.50 BSC 0.26 0.46 0.425 REF 0.15 BSC 0_ 8_ 4_ 10 _ VIEW C Motorola reserves the right to make changes without further notice to any products herein. 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