SEMICONDUCTOR TECHNICAL DATA The MC10E/100E157 contains four 2:1 multiplexers with differential outputs. The output data are controlled by the individual Select (SEL) inputs. The individual select control makes the devices well suited for random logic designs. • • • • • Individual Select Controls QUAD 2:1 MULTIPLEXER 550ps Max. D to Output 800ps Max. SEL to Output Extended 100E VEE Range of – 4.2V to – 5.46V Internal 75kΩ Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View) SEL3 NC D3a D3b VCCO Q3 Q3 25 24 23 22 20 19 21 D2b 26 18 Q2 D2a 27 17 Q2 SEL2 28 16 VCC VEE 1 15 Q1 SEL1 2 14 Q1 D1a 3 13 Q0 FN SUFFIX PLASTIC PACKAGE CASE 776-02 LOGIC DIAGRAM D0a MUX D0b D1b 4 12 Q0 5 6 7 8 9 10 11 SEL0 SEL0 D0a D0b NC NC NC VCCO D1a * All VCC and VCCO pins are tied together on the die. 1 Q0 0 1 MUX D1b Q0 Q1 Q1 0 SEL1 D2a 1 PIN NAMES MUX Pin D0a – D3a D0b – D3b SEL0 – SEL3 Q0 – Q3 Q0 – Q3 Function Input Data a Input Data b Select Inputs True Outputs Inverted Outputs D2b Q2 0 SEL2 D3a 1 MUX TRUTH TABLE D3b SEL Data H L a b SEL3 12/93 Motorola, Inc. 1996 Q2 2–1 REV 2 Q3 Q3 0 MC10E157 MC100E157 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol IIH IEE Characteristic min typ 25°C max min typ 85°C max min typ max Unit Condition µA Input HIGH Current D SEL 200 150 Power Supply Current 10E 100E 200 150 200 150 mA 32 32 38 38 32 32 38 38 32 37 38 44 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic tPLH tPHL Propagation Delay to Output D SEL tSKEW Within-Device Skew tr tf Rise/Fall Times 20 - 80% 25°C 85°C min typ max min typ max min typ max 220 425 380 600 550 800 220 425 380 600 550 800 220 425 380 600 550 800 Unit Condition ps 70 70 70 ps 1 ps 275 400 650 275 400 650 275 400 650 1. Within-device skew is defined as identical transitions on similar paths through a device. MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E157 MC100E157 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E157 MC100E157 Motorola reserves the right to make changes without further notice to any products herein. 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