FAIRCHILD FAB2200UCX

FAB2200
Audio Subsystem with Stereo Class-G Headphone
Amplifier and 1.2W Mono Class-D Speaker Amplifier
Features
Description





The FAB2200 combines a capacitor-free stereo
headphone amplifier with a monolithic class-D
speaker amplifier.
Single Supply: 2.8V – 5.25V
Pop and Click Suppression
Differential or Single-Ended Audio Inputs
Rejects TDMA Noise from GSM Handsets
Filterless Fully Differential Class-D Speaker
Amplifier
 Programmable Edge-Rate Control and Spread
The filterless class-D amplifier can be connected
directly to a speaker without external filters.
 1.2W into 8Ω at 4.2V, THD+N < 10%
 970mW into 8Ω at 4.2V, THD+N < 1%
 90% Efficiency
 Automatic Gain Control Limits Distortion and
The programmable Automatic Gain Control (AGC)
limits maximum speaker output levels to protect
speakers without introducing distortion. It can also
dynamically limit clipping as the battery voltage falls.
Spectrum Minimize EMI
Protects Speakers at All Battery Voltages
 Noise Gate Improves Audio Quality






An integrated charge pump generates multiple supply
rails for a ground-centered class-G headphone
output. The charge pump is regulated for high Power
Supply Rejection Ratio (PSRR).
Headphone Amplifier
 Power-Saving Class-G Operation
 Audio Taper I2C Volume Control
 Capacitor-Free Outputs
 Integrated Regulated Charge Pump
 SGND Pin Eliminates Ground-Loop Noise
 Noise Gate Improves Audio Quality
The noise gate can automatically mute the speaker or
headphone amplifiers to reduce noise when input
signals are low.
Applications



Cellular Handsets
Notebook Computers
Tablet PCs
DPST Analog Bypass Switch
I2C Control
Low-Power Shutdown Mode
Current Limit and Thermal Protection
25-Bump, 0.4mm Pitch WLCSP Package
Ordering Information
Part Number
Operating Temperature Range
Package
Packing Method
FAB2200UCX
-40 to +85°C
25-Bump, 0.4mm Pitch, Wafer-Level
Chip-Scale Package (WLCSP)
3000 Units on
Tape & Reel
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
June 2011
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Typical Application Circuit
Figure 1. Typical Application Circuit
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
2
Figure 2. Top-View (Bump-Side Down)
Pin Definitions
WLCSP
Name
Description
C1
VBATT
Power supply for speaker amplifier
Type
Power
B2
PGND
Charge pump ground
Power
C2
PGND
Power ground
Power
C3
AGND
Analog ground
Power
B1
VREG
Charge pump regulator – do not connect to an external power supply
Power
A3
CPVDD
Charge pump output – positive power supply for headphone amplifier
Power
A4
CPVSS
Charge pump output – negative mirror of CPVDD
Power
A1
CFP
Charge pump flying capacitor positive terminal
Power
A2
CFN
Charge pump flying capacitor negative terminal
Power
D5
IN1
Line level audio input
Input
E5
IN2
Line level audio input
Input
D4
IN3
Line level audio input
Input
E4
IN4
Line level audio input
Input
B5
HPL
Left headphone output
Output
Right headphone output
Output
A5
HPR
C5
SGND
Sense ground – connect to AGND close to shield terminal of headphone jack
E1
SPKRP
Positive speaker output
Output
D1
SPKRN
Negative speaker output
Output
D3
BYPIN1
Analog bypass switch input
Input
E3
BYPIN2
Analog bypass switch input
Input
Input
D2
BYPOUT1 Analog bypass switch output
Output
E2
BYPOUT2 Analog bypass switch output
Output
C4
B4
B3
SDB
SCL
SDA
Shutdown control
Input
2
Input
2
Bi-directional
I C clock input
I C data I/O
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
3
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Pin Configuration
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The Absolute Maximum Ratings are stress ratings only. All voltages are referenced to GND.
Symbol
Parameter
VBATT
Min.
Voltage on VBATT Pin
VIN
Voltage on IN1, IN2, IN3, IN4, HPL, HPR Pins
VSGND
Voltage on SGND Pin
Max.
Unit
-0.3
6.0
V
CPVSS-0.3
CPVDD+0.3
V
-0.3
0.3
V
VS
Voltage on SDA, SCL, SDB Pins
-0.3
VBATT+0.3
V
VSP
Voltage on SPKRP, SPKRN Pins
-0.3
VBATT+0.3
V
VBYP
Voltage on BYPIN1, BYPIN2, BYPOUT1, BYPOUT2 Pins
-0.3
VBATT+0.3
V
Duration of SPKRP, SPKRN Short Circuit to GND or VBATT
Continuous
Duration of Short Circuit Between SPKRP and SPKRN
Continuous
Duration of HPL, HPR Short Circuit to GND
Continuous
Reliability Information
Symbol
TJ
TSTG
Parameter
Min.
Typ.
Junction Temperature
Storage Temperature Range
-65
TL
Peak Reflow Temperature
θJA
Thermal Resistance, JEDEC Standard, Multilayer Test
Boards, Still Air
Max.
Unit
+150
°C
+150
°C
+300
°C
60
°C/W
TSD
Thermal Shutdown Threshold
+150
°C
THYS
Thermal Shutdown Hysteresis
+35
°C
ESD Protection
Symbol
Parameter
Condition
HBM
Human Body Model (HBM)
JESD22-A114-B Level 2,
EC61340-3-1: 2002 Level 2,
ESD-STM5.1-2001 Level 2,
MIL-STD-883E 3015.7 Level 2
CDM
Charged Device Model (CDM)
JESD22-C101-C Level III,
IEC61340-3-3 Level C4,
ESD-STM5.3.1-1999 Level C4
Min.
Unit
3
kV
2
kV
Notes:
1. Device-use-level ESD tests are conducted at the connector pins.
2. External ESD suppressor ASIP protects the amplifier outputs. Suppressor is between amplifier and connector;
15Ω serial resistance + 5nF capacitor and Zener diodes (14V breakdown voltage) connected to the ground. In
addition, there is a ferrite bead in series between the suppressor and the connector.
3. The air discharge test can be ignored if the contact discharge test range is increased to the same voltages as air
discharge (contact discharge is more stable and repeatable test than air discharge).
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
4
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Absolute Maximum Ratings
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
TA
VBATT
Parameter
Min.
Max.
Unit
Operating Temperature Range
-40
+85
°C
Supply Voltage Range
2.80
5.25
V
Electrical Characteristics
Unless otherwise noted: HPA uses stereo single-ended inputs, SPA uses differential input, unused inputs AC are
grounded, fIN = 1KHz, AGC off, PGAINxx = 0dB, HPxVOL = 0dB, PRESENTGAIN = 6dB, ERC = 1, SSMT = 000,
SHDNB = 1, SDB = 1.8V, SDA and SCL pull-up voltage = 1.8V, ZSPK = 8Ω+68µH, RHP = 32Ω, speaker amplifier and
headphone amplifier on. Typical values are at VBATT = 3.7V, TA = 25°C. Minimum and maximum values are at VBATT =
2.8V to 5.25V, TA = -40°C to 85°C.
Symbol
IDD
Parameter
Quiescent Supply Current
(ZSPK = Open)
ISD
Shutdown Current
tON
Turn-On Time
RIN
Input Resistance
Conditions
Min.
Typ.
Headphone Amplifiers Enabled,
Speaker Amplifier Disabled,
DIFFIN43=1
3.5
Headphone Amplifiers Disabled,
Speaker Amplifier Enabled,
DIFFIN21=1
4.7
Headphone and Speaker Amplifiers
Enabled
6.2
SHDNB = 0, SDB = 1.8V
2.2
SHDNB = 1, SDB = GND
2.2
Time from Shutdown to Full Speaker
and Headphone Operation, ZCD and
Ramps Disabled
1.25
PGAINxx = 0dB
21.0
PGAINxx = 12dB
8.5
Maximum Input Signal Swing PGAINxx = 0dB
(VBATT = 2.8V to 5.25V,
PGAINxx = 12dB
Single-Ended Input)
Max.
Unit
mA
µA
ms
KΩ
2.300
Vpk-pk
0.575
Analog Bypass Switch
RON
THD
IOFF
On Resistance
IBYPOUTx = 20mA,
BYPx = 0V and
VBATT, BYPEN = 1
Total Harmonic Distortion
VDIF = 2VPP, VCM=
VBATT/2, f = 1kHz,
BYPEN = 1,
Load = 8
Off Isolation
TA = 25°C
1
Series
Resistance is
10Ω per
Switch
0.05
No Series
Resistors
0.10
BYPEN = 0, 10KHz 1VRMS Sine
Wave Applied Across BYPOUT1 and
BYPOUT2, BYPIN1 and BYPIN2 to
GND = 50Ω
Ω
0.25
%
94
dB
Continued on the following page…
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
5
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Recommended Operating Conditions
Unless otherwise noted: HPA uses stereo single-ended inputs, SPA uses differential input, unused inputs AC are
grounded, fIN = 1KHz, AGC off, PGAINxx = 0dB, HPxVOL = 0dB, PRESENTGAIN = 6dB, ERC = 1, SSMT = 000,
SHDNB = 1, SDB = 1.8V, SDA and SCL pull-up voltage = 1.8V, ZSPK = 8Ω+68µH, RHP = 32Ω, speaker amplifier and
headphone amplifier on. Typical values are at VBATT = 3.7V, TA = 25°C. Minimum and maximum values are at VBATT =
2.80V to 5.25V, TA = -40°C to 85°C.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
Speaker Amplifier
VOS
KCP
PSRR
POUT
Output Offset Voltage
Click-and-Pop Level
Power-Supply Rejection
Ratio
Output Power
PRESENTGAIN = Mute
±0.5
PRESENTGAIN = 6dB
±2.5
Peak Voltage,
Into Shutdown
A-Weighted,
32 Samples per Second,
PRESENTGAIN = Mute, Out of Shutdown
Inputs AC Grounded
-70
Inputs AC Grounded
THD+N
Total Harmonic
Distortion Plus Noise
Output Frequency
IOUT
f = 1kHz,
100mVPP Ripple
75
THD+N < 10%, ERC Disabled,
SSMT = 100, VBATT = 3.7V
930
THD+N < 10%, ERC Enabled, SSMT = 000,
VBATT = 3.7V
945
930
VBATT = 3.7V
DIFFINxx = 0
(Single-Ended)
90
%
97
dB
DIFFINxx = 0
(Single-Ended)
97
DIFFINxx = 1
(Differential)
97
32
Spread Spectrum, SSMT = 000
330
Fixed Frequency, SSMT = 100
330
Mute Attenuation
0.075
97
A-Weighted, Headphone Amps Off,
DIFFINxx = 0, Inputs AC Grounded
POUT = 720mW, f = 1kHz
mW
975
0.030
DIFFINxx = 1
(Differential)
dB
750
POUT = 350mW
Output Current Limit
Efficiency
77
1200
Signal-to-Noise Ratio
Output Noise
f = 217Hz,
100mVPP Ripple
THD+N < 10%, ERC Disabled, SSMT =
100, VBATT = 4.2V
A-Weighted, POUT =
720mW, Headphone
Amplifiers On
Vn
74
970
A-Weighted, POUT =
720mW, Headphone
Amplifiers Off
SNR
VBATT = 2.8V to
5.25V
VBATT = 4.2V
dBV
-70
THD+N < 1%, ERC Disabled, SSMT = 100,
VBATT = 4.2V
THD+N < 1%, ERC
Enabled, SSMT = 000
mV
µVRMS
KHz
1.3
A
90
%
100
dB
Continued on the following page…
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
6
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Electrical Characteristics (Continued)
Unless otherwise noted: HPA uses stereo single-ended inputs, SPA uses differential input, unused inputs AC are
grounded, fIN = 1KHz, AGC off, PGAINxx = 0dB, HPxVOL = 0dB, PRESENTGAIN = 6dB, ERC = 1, SSMT = 000,
SHDNB = 1, SDB = 1.8V, SDA and SCL pull-up voltage = 1.8V, ZSPK = 8Ω+68µH, RHP = 32Ω, speaker amplifier and
headphone amplifier on. Typical values are at VBATT = 3.7V, TA = 25°C. Minimum and maximum values are at VBATT =
2.80V to 5.25V, TA = -40°C to 85°C.
Symbol
Parameter
Conditions
Min.
Typ. Max.
Unit
Headphone Amplifiers
IVBATT
VOS
KCP
PSRR
POUT = 2x50µW
into 32Ω
IN1 and IN2 On,
P
= 2x250µW
Supply Current
IN3 and IN4 Off, DIFFIN43=1, OUT
into 32Ω
Speaker Amplifier Off
POUT = 2x500µW
into 32Ω
Output Offset Voltage
HPxVOL = Mute
Peak Voltage, A-Weighted,
Into Shutdown
32 Samples per Second,
Click-and-Pop Level
HPxVOL = Mute,
Out of Shutdown
Inputs AC Grounded
VBATT = 2.8V to
5.25V
f = 217Hz,
Power-Supply Rejection
VRIPPLE =
Inputs AC Grounded
Ratio
200mVPP
f = 1KHz, VRIPPLE
= 200mVPP
4.4
6.8
±0.15
POUT
RHP = 32
HPxVOL = 4dB
Output Power
dBV
-70
95
95
THD+N
Total Harmonic
Distortion Plus Noise
CL
XTALK
fP
AV
Signal-to-Noise Ratio
Output Noise
Capacitive Drive
Crosstalk
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
27
31
mW
41
0.010 0.075
RHP = 16, POUT = 10mW
0.020
DIFFINxx = 0
(Single-Ended)
DIFFINxx = 1
(Differential)
DIFFINxx = 0
A-Weighted, POUT = 32mW,
(Single-Ended)
Speaker Amplifier On
DIFFINxx = 1
HPxVOL = 4dB
(Differential)
A-Weighted, Speaker Amplifier Off, DIFFINxx = 0
95
%
100
100
dB
100
103
6.5
100
-85
µVRMS
pF
dB
1.3
MHz
Across All Gain Stages
±0.4
dB
HPL to HPR, HPxVOL = 0dB
±0.3
%
±1
%
100
dB
HPL to HPR, HPR to HPL, PO = 15mW
Charge-Pump Frequency
Headphone Gain
Accuracy
Channel-to-Channel
Gain Tracking
Channel-to-Channel
Gain Tracking
Mute Attenuation
39
RHP = 32, POUT = 20mW
A-Weighted, POUT = 32mW,
Speaker Amplifier Off
HPxVOL = 4dB
SNR
dB
95
RHP = 32
HPxVOL = 6dB
THD+N < 10%
mV
-70
RHP = 16
THD+N < 1%
mA
5.8
HPL to HPR Across Entire Pre-Amplifier and
Volume Range
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7
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Electrical Characteristics (Continued)
Unless otherwise noted, VBATT = 2.80V to 5.25V and TA = -40°C to 85°C.
Symbol
Parameter
Conditions
Fast Mode (400kHz)
Min.
Max.
Unit
0.6
V
VIL
Low-Level Input Voltage
VBATT 2.80V to 5.25V
-0.3
VIH
High-Level Input Voltage
VBATT 2.80V to 5.25V
1.3
VOL
Low-level Output Voltage
at 3mA Sink Current
(Open-Drain or Open-Collector)
0
0.4
V
IIH
High-Level Input Current
Each I/O Pin, Input Voltage = VBATT
-1
1
µA
IIL
Low-Level Input Current
Each I/O Pin, Input Voltage = 0V
-1
1
µA
V
I2C AC Electrical Characteristics
Unless otherwise noted, VBATT = 2.80V to 5.25V and TA = -40°C to 85°C.
Symbol
fSCL
tHD;STA
Fast Mode
Parameter
SCL Clock Frequency
Min.
Max.
Unit
0
400
kHz
Hold Time (Repeated) START Condition
0.6
µs
tLOW
LOW Period of SCL Clock
1.3
µs
tHIGH
HIGH Period of SCL Clock
0.6
µs
tSU;STA
Set-up Time for Repeated START Condition
0.6
tHD;DAT
Data Hold Time
tSU;DAT
tr
tf
tSU;STO
0
(4)
Data Set-up Time
µs
0.9
100
(5)
Rise Time of SDA and SCL Signals
(5)
Fall Time of SDA and SCL Signals
µs
ns
20+0.1Cb
300
20+0.1Cb
300
ns
ns
Set-up Time for STOP Condition
0.6
µs
tBUF
Bus Free Time between STOP and START Conditions
1.3
µs
tSP
Pulse Width of Spikes that Must Be Suppressed by the Input Filter
0
50
ns
Notes:
4. A fast-mode I2C-Bus® device can be used in a standard-mode system, but the requirement tSU;DAT ≥250ns must
then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If
such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line
2
tr_max + tSU;DAT = 1000 + 250 = 1250ns (according to the standard-mode I C bus specification) before the SCL line
is released.
5. Cb equals the total capacitance of one bus line in pf. If mixed with high-speed mode devices, faster fall times are
allowed according to the I2C specification.
Figure 3. Definition of Timing for Full-Speed Mode Devices on the I2C-Bus®
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
8
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
I2C DC Electrical Characteristics
System
8.0
ZSPKR = 8ohm+68uH
RHP = 32ohm
SPKR Path Gain = 12dB
HP Path Gain = 0dB
7.0
SPA+HPA
SPA
6.5
HPA
Supply Current (mA)
7.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
3.0
3.5
4.0
Supply Voltage (V)
4.5
5.0
5.5
Figure 4. Quiescent Supply Current
vs. Supply Voltage
Figure 5. Hardware and Software Shutdown Current
vs. Supply Voltage
THD+N (%)
Speaker Amplifier
Figure 6. THD+N vs. Output Power
Figure 7. THD+N vs. Frequency
Figure 8. Efficiency vs. Output Power
Figure 9. Efficiency vs. Output Power
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
9
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Typical Performance Characteristics
0
PSRR (dB)
-20
VBATT = 3.7V
ZSPKR = 8ohm+68µH
VRIPPLE = 100mVPP
Inputs AC Grounded
-40
-60
-80
-100
10
Figure 10. Output Power vs. Supply Voltage
100
1K
Frequency (Hz)
10K
100K
Figure 11. PSRR vs. Frequency
Figure 12. Output vs. Frequency
Headphone Amplifier
Figure 13. THD+N vs. Output Power
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
Figure 14. THD+N vs. Output Power
www.fairchildsemi.com
10
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Typical Performance Characteristics
THD+N (%)
THD+N (%)
Figure 16. THD+N vs. Frequency
PSRR (dB)
Figure 15. THD+N vs. Frequency
Figure 17. Power Dissipation vs. Total Output Power
Figure 18. PSRR vs. Frequency
Figure 19. Crosstalk vs. Frequency
Figure 20. Output vs. Frequency
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
11
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Typical Performance Characteristics
Shutdown Mode
Signal Path
When SHDNB bit is set to 0 or the SDB pin is grounded,
the FAB2200 enters low-power Shutdown Mode.
The input channels have a pre-amplifier stage that can
be set from 0dB to 21dB of gain. The headphone
amplifiers have separate volume controls that range
from -53dB to 6dB. The speaker amplifier has a volume
control that ranges from -25dB to 6dB. In addition, the
speaker amplifier has a fixed gain of 6dB.
2
While SHDNB=0 and SDB is HIGH, I C communication
2
is available. I C values are preserved. Values are not
reset on exiting Shutdown Mode.
If the SDB pin is grounded, I2C communication is
unavailable. I2C values are not preserved. Values are
reset to default values after SDB goes HIGH.
A variety of combinations of these signals can be routed
to the headphone amplifiers or the speaker amplifier
(see Table 1). For example, to connect the left
headphone amplifier channel to IN3 and IN1, set the
SELHPL3 and SELHPL1 bits to 1. SELHPL4 and
SELHPL2 should be set to 0.
Inputs During Shutdown
To achieve low supply current during shutdown, all
inputs must be at DC levels (except the BYPASS pins).
Audio inputs must be AC grounded. VBATT must be
within recommended operating conditions. I2C pins must
be grounded or pulled HIGH with no toggling. If AC is
presented to the inputs during shutdown, standby
current may increase slightly, but there are no other
negative effects.
The DIFFIN43 and DIFFIN21 bits configure the inputs
as differential pairs. When configured as differential, the
even-numbered selection bit should be 1 and the oddnumbered selection bit should be 0. For example, if
channels 4 and 3 are a differential pair that should be
connected to the speaker amplifier, DIFFIN43 and
SELSPA4 should be set to 1. SELSPA3, SELSPA2, and
SELSPA1 should be set to 0.
Thermal Shutdown
If the junction temperature of the device exceeds the
thermal shutdown threshold (see Electrical Characteristics
table), the device protects itself by shutting down. The
device remains shut down until the junction temperature
falls below the thermal shutdown hysteresis.
Amplifier channels that have no inputs selected should
be muted (HPxVOL = 00000 or STARTGAIN = 000000).
If an amplifier channel has no input selection bits set to
1, the amplifier channel is turned off. When the speaker
amplifier is turned off, the SPKRP and SPKRN outputs
stop switching.
2
The I C port remains functional and the OVRTEMP bit is
set to O. This bit remains set until it is read. If the device
is still in thermal shutdown when the bit is read, it
remains set to 1. Otherwise, the bit is cleared to 0.
Unused audio input pins must be AC grounded.
An integrated Dual-Pole Single-Throw (DPST) analog
bypass switch can be used to route system audio
signals. For example, baseband audio can be routed to
the speaker by connecting the BYPOUTx pins to the
SPKRx pins. Baseband audio outputs would then be
connected to the BYPINx pins through optional external
resistors if the baseband device expects a higher
impedance than the existing speaker.
Over-Current Shutdown
If the output current limit of either amplifier is exceeded
(see the Electrical Characteristics table), the amplifier in
question shuts down for approximately one second.
After one second, the amplifier is re-enabled. If the
amplifier output current exceeds the limit again, the
cycle repeats.
During current-limit shutdown, the I2C port remains
functional. If the current-limit shutdown was caused by
the speaker amplifier, the OVRCURSP bit is set to 1. This
bit remains set until it is read. If the speaker amplifier is
still in current-limit shutdown when the bit is read, it
remains set to 1. Otherwise, the bit is cleared to 0.
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
Gain for the headphone amplifier signal path is defined
by PGAINxx + HPxVOL.
Gain for the speaker amplifier signal path is defined by
PGAINxx + PRESENTGAIN + 6dB.
Internal signal amplitude should not exceed 2.3VPP.
Extra caution should be taken when mixing signals. For
example, if IN1 is mixed with IN3, the maximum peak to
peak amplitude of IN1 plus the maximum peak to peak
amplitude of IN3 should not exceed 2.3VPP.
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12
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Functional Description
DIFFIN43
DIFFIN21
SELxxx4
SELxxx3
SELxxx2
SELxxx1
xxx Amplifier Input
X
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
X
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
xxx Amplifier Channel Off
IN1
IN2
IN2 + IN1
IN3
IN3 + IN1
IN3 + IN2
IN3 + IN2 + IN1
IN4
IN4 + IN1
IN4 + IN2
IN4 + IN2 + IN1
IN4 + IN3
IN4 + IN3 + IN1
IN4 + IN3 + IN2
IN4 + IN3 + IN2 + IN1
xxx Amplifier Channel Off
Not Supported
IN2 - IN1
Not Supported
IN3
Not Supported
IN3 + (IN2 - IN1)
Not Supported
IN4
Not Supported
IN4 + (IN2 - IN1)
Not Supported
IN4 + IN3
Not Supported
IN4 + IN3 + (IN2 - IN1)
Not Supported
xxx Amplifier Channel Off
IN1
IN2
IN2 + IN1
Not Supported
Not Supported
Not Supported
Not Supported
IN4 - IN3
(IN4 - IN3) + IN1
(IN4 - IN3) + IN2
(IN4 - IN3) + IN2 + IN1
Not Supported
Not Supported
Not Supported
Not Supported
xxx Amplifier Channel Off
Not Supported
IN2 - IN1
Not Supported
Not Supported
Not Supported
Not Supported
Not Supported
IN4 - IN3
Not Supported
(IN4 - IN3) + (IN2 - IN1)
Not Supported
Not Supported
Not Supported
Not Supported
Not Supported
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
13
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Table 1. Input Channel Selection
The FAB2200 includes a regulated charge pump that
derives CPVDD and CPVSS (the headphone amplifier
power supplies) from VBATT. When the headphone
output amplitude is low, the CPVDD is 1.3V and CPVSS is
-1.3V. When needed, CPVDD and CPVSS dynamically
increase to 1.8V and -1.8V, respectively, to allow for
higher output amplitudes. The combination of an
efficient regulated charge pump and class-G operation
allows low headphone amplifier power dissipation,
resulting in longer battery run time.
Table 2.
Headphone Amplifier Output
Impedance, HIZx=1
Output Impedance (Ω)
Frequency (KHz)
11800
40
760
6000
470
13000
Headphone Volume Control Ramp and
Zero-Crossing Detection
The negative CPVSS rail allows the headphone amplifier
output to be centered at 0V and eliminates the need for
output DC blocking capacitors.
The HPRAMP, HPRAMPSPEED, and HPZCD bits
control the headphone amplifiers’ volume controls when
HPxVOL is changed.
The FAB2200 headphone outputs can be placed in
High-Impedance Mode by setting the HIZx bits to 1 (see
Table 2). This can be useful if the system’s headphone
jack is shared with other devices. For proper high-
Table 3. Headphone Volume Change Behavior
HPRAMP HPZCD
0
Behavior When HPxVOL Changes
0
Volume changes immediately.
0
1
For each channel, wait until a zero crossing occurs in the input before changing volume. If a
zero crossing does not occur within HPRAMPSPEED, volume is forced to the new setting.
1
0
Volume is ramped to the new setting at a rate of HPRAMPSPEED per step.
1
Volume is changed by one step when a zero crossing occurs. If a zero crossing does not
occur within HPRAMPSPEED, a step is forced. Only the first zero crossing within
HPRAMPSPEED triggers a volume change – volume does not change again until the next
HPRAMPSPEED.
1
Table 4. Headphone Volume Change Timing
HPRAMPSPEED[1:0]
Ramp and ZCD Time Between Steps (ms)
00
0.25
01
2.00
10
16.00
11
128.00
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
14
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
impedance operation, the device must not be in
Shutdown Mode. Voltages on HPL and HPR must not
exceed ±1.8V.
Class-G Headphone Amplifier with
Capacitor Free Outputs
The headphone noise gate automatically mutes the
headphone amplifier when its input amplitudes are low
to reduce noise during inactivity. This function is not
recommended for music playback, but is effective for
speech. The amplitude is measured after input preamplifiers and before the headphone amplifier volume
controls. The headphone noise gate threshold level is
set by the HPNGTHRESH register. The amplitudes of
both channels must be less than the noise gate
threshold for a time determined by the HPNGTIME
register. When the noise gate mutes the amplifier, the
HPNGTRIP bit is set to 1.
HPNGTIME [2:0]
Time (ms)
101
320
110
640
111
Reserved
Certain combinations of HPRAMP, HPZCD, HPNGZRA,
and HPNGZRR are valid as shown in Table 8.
Combinations not listed may produce unpredictable
results (X = don’t care).
Table 8. Valid Headphone Amplifier Ramp /
Zero Crossing / Noise Gate Combinations
If either channel’s input amplitude goes above the
headphone noise gate threshold, both amplifiers are unmuted and the HPNGTRIP bit is set to 0. The amplifiers
are returned to the former HPxVOL values.
If either channel is in High-Impedance Mode (HIZx=1),
all inputs to that headphone should be deselected
(SELHPxx=0) so the noise gate ignores the HIZ channel.
HPRAMP
HPZCD
HPNGZRA HPNGZRR
0
0
X
X
X
X
1
1
1
X
1
0
Class-D Speaker Amplifier
If the HPNGZRA bit is set to 0, the headphone noise
gate attack (mute) function occurs immediately rather
than waiting for zero-crossing detection or ramping. If
the HPNGZRA bit is set to 1, the headphone noise gate
attack function obeys headphone zero-crossing
detection and ramp settings.
The class-D amplifier achieves greater than 90% efficiency.
If the HPNGZRR bit is set to 0, the headphone noise
gate release (un-mute) function occurs immediately
rather than waiting for zero-crossing detection or
ramping. If the HPNGZRR bit is set to 1, the headphone
noise gate release (un-mute) function obeys headphone
zero crossing detection and ramp settings.
Programmable Automatic Gain Control
(AGC)
Table 5. Headphone Noise Gate Threshold
Voltage
AGC works by comparing the threshold voltage against
a proposed output amplitude (the signal’s amplitude
after all gain stages, before the PWM modulator). If the
threshold is exceeded, gain is dynamically reduced until
the output voltage level no longer exceeds the threshold
or the minimum gain setting. When the output voltage
level no longer exceeds the threshold, gain is slowly
increased until either the output voltage level exceeds
the threshold again or the starting gain is reached.
HPNGTHRESH
[2:0]
Noise Gate Threshold (mVpk)
000
Headphone Noise Gate Disabled
001
2.8
010
5.7
011
11.3
100
22.6
101
45.3
110
90.5
111
181.0
Table 7.
Programmable spread spectrum and edge rate control
minimize electromagnetic interference (EMI). Rise and fall
times are limited to 20ns per transition at all power levels.
The speaker amplifier’s AGC can be used to limit output
amplitude and reduce clipping as supply voltage varies.
The AGC allows high-volume settings while minimizing
distortion and protecting the speaker element.
AGC settings should not be changed while the speaker
amplifier is on. Before making changes to THMAX,
THVBATT, AGCATTACK, AGCRELEASE, or AGCMIN;
the speaker amplifier should be turned off by clearing all
SELSPAn bits to 0 or clearing SHDNB to 0.
AGC Threshold
The AGC threshold can be thought of as a target for the
maximum output amplitude. It is defined by the THMAX
and THVBATT registers.
Headphone Noise Gate Timing
HPNGTIME [2:0]
Time (ms)
000
10
001
20
010
40
011
80
100
160
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
THMAX defines the maximum threshold value
regardless of VBATT supply voltage. This is useful for
protecting speakers from high amplitudes. Table 9
shows the THMAX threshold settings as well as the
corresponding maximum RMS power (assuming a 1KHz
sine wave into an 8 load).
www.fairchildsemi.com
15
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Programmable Headphone Amplifier
Noise Gate
THMAX
[3:0]
THMAX Threshold
Maximum
Output
Threshold
(Vpk)
0000
Maximum Power with
Sine Wave and 8
Load (mW)
THMAX Threshold Disabled
THMAX
[3:0]
Maximum
Output
Threshold
(Vpk)
Maximum Power
with Sine Wave and
8 Load (mW)
1000
3.6
810.0
0001
2.2
302.5
1001
3.8
902.5
0010
2.4
360.0
1010
4.0
1000.0
0011
2.6
422.5
1011
4.2
1102.5
0100
2.8
490.0
1100
4.4
1210.0
0101
3.0
562.5
1101
4.6
1322.5
0110
3.2
640.0
1110
4.8
1440.0
0111
3.4
722.5
1111
5.0
1562.5
THVBATT limits the amount of clipping allowed by the
AGC. As VBATT falls, the maximum output amplitude
falls. THVBATT defines the threshold as a fraction of the
VBATT supply voltage. When the fraction is less than 1,
the AGC attempts to adjust gain to prevent clipping. For
values greater than 1, some clipping is allowed before
the AGC reduces gain (see Table 10).
Table 10. THVBATT Threshold
THVBATT [4:0]
0000
VBATT Fraction
(V/V)
THD with 1KHz
Sine Wave (%)
THVBATT [4:0]
(VBATT=3.7V,
8 Load)
THVBATT Threshold Disabled
VBATT Fraction
(V/V)
THD with 1KHz
Sine Wave (%)
(VBATT=3.7V,
8 Load)
1000
1.25
13.0
0001
0.90
1.0
1001
1.30
14.4
0010
0.95
3.0
1010
1.35
15.6
0011
1.00
4.9
1011
1.40
16.7
0100
1.05
6.7
1100
1.45
17.7
0101
1.10
8.5
1101
1.50
18.7
0110
1.15
10.0
1110
1.55
19.6
0111
1.20
11.6
1111
1.60
20.5
Ultimately, the AGC threshold is whichever voltage is
lower between THVBATT and THMAX. For example, if
THMAX = 0111, THVBATT = 0001, and VBATT = 4.2V,
the AGC threshold is 3.4V as defined by THMAX. If
VBATT falls to 3.6V, the AGC threshold falls to 3.24V as
defined by THVBATT (see Figure 21). If THVBATT and
THMAX are both set to 0, the AGC is disabled.
5.0
V
TH
BA
TT
4.0
A G C T h re sho ld
3 .5
AG
2 .5
C
r
Th
es
ho
ld
2.0
2 .5
33.0
V B A T T = 4 .2V
3.0
V B A T T = 3 .6V
A G C Thre s hold (V )
4 .5
3 .5
4
4.0
TH M A X
4 .5
5
5.0
5 .5
V BATT (V )
Figure 21. AGC Threshold, THMAX = 0111,
THVBATT = 0001
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
16
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Table 9.
Table 11.
Speaker Gain Values
Gain Register [5:0]
Gain (dB)
Gain Register [5:0]
Gain (dB)
000000
Mute
100000
-9.5
000001
-25.0
100001
-9.0
000010
-24.5
100010
-8.5
000011
-24.0
100011
-8.0
000100
-23.5
100100
-7.5
000101
-23.0
100101
-7.0
000110
-22.5
100110
-6.5
000111
-22.0
100111
-6.0
001000
-21.5
101000
-5.5
001001
-21.0
101001
-5.0
001010
-20.5
101010
-4.5
001011
-20.0
101011
-4.0
001100
-19.5
101100
-3.5
001101
-19.0
101101
-3.0
001110
-18.5
101110
-2.5
001111
-18.0
101111
-2.0
010000
-17.5
110000
-1.5
010001
-17.0
110001
-1.0
010010
-16.5
110010
-0.5
010011
-16.0
110011
0
010100
-15.5
110100
0.5
010101
-15.0
110101
1.0
010110
-14.5
110110
1.5
010111
-14.0
110111
2.0
011000
-13.5
111000
2.5
011001
-13.0
111001
3.0
011010
-12.5
111010
3.5
011011
-12.0
111011
4.0
011100
-11.5
111100
4.5
011101
-11.0
111101
5.0
011110
-10.5
111110
5.5
011111
-10.0
111111
6.0
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
17
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Starting Gain
Starting gain is the amount of speaker gain applied when the AGC is not active. It can also be thought of as
maximum gain when the AGC is active. Starting gain is controlled by the STARTGAIN register (see Table 11).



The minimum gain is determined by the AGCMIN
register. The rate of gain reduction is determined by the
AGCATTACK register.
AGC Release
When the output signal is below the AGC threshold,
gain is stepped up by 1dB. The rate of gain increase is
determined by the AGCRELEASE registers. Gain is
increased until it reaches the starting gain or an AGC
attack is triggered again.
The amplitude is above the AGC threshold, AND
Present gain is above the minimum gain point, AND
Attack speed is not exceeded.
Table 12.
AGC Attack Speed
AGCATTACK [2:0] AGC Attack Speed (µs/Step) AGCATTACK [2:0] AGC Attack Speed (µs/Step)
000
12.5
100
200
001
25.0
101
400
010
50.0
110
800
011
100.0
111
1600
Table 13.
AGC Release Speed
AGCRELEASE [2:0]
AGC Release Speed
(ms/Step)
AGCRELEASE [2:0]
AGC Release Speed
(ms/Step)
000
12.5
100
200
001
25.0
101
400
010
50.0
110
800
011
100.0
111
1600
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
18
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
AGC Attack
AGC attack occurs when the AGC determines that, after
applying present gain, the output signal amplitude would
be too high and gain should be stepped down by 1dB.
The AGC checks an approximation of the amplitude of
the output signal that includes present gain, but
excludes clipping that may occur in the final output
stage. All of the following conditions must be true to
trigger an AGC attack:
Set starting gain
I2C registers
and reset the timers.
yes
no
Is the
output amplitude
above the AGC
threshold?
Can
gain be lowered
by a step while staying
above minimum
gain?
Is the
present gain setting
below the starting
gain?
yes
no
no
no
yes
Has enough
time (attack speed)
passed since the last
gain change?
Has enough
time (decay speed)
passed since the last
gain change?
yes
no
yes
Reduce gain by
1 step and reset
timers.
Increase gain by
1 step and reset
the timers.
Figure 22. AGC Flow Chart
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
19
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Start
The speaker noise gate automatically mutes the speaker
amplifier when its input amplitude is low to reduce noise
during inactivity. This function is not recommended for
music playback, but is effective for speech. The amplitude
is measured after input pre-amplifiers, but before the
speaker amplifier’s volume control. The speaker noise
gate’s threshold level is set by the SPNGTHRESH
register. The amplitude must be less than the speaker
noise gate threshold for a time determined by the
SPNGTIME register. When the speaker noise gate mutes
the speaker amplifier, the SPNGTRIP bit is set to 1.
If the input amplitude goes above the speaker noise
gate threshold, the speaker amplifier is un-muted and
the SPNGTRIP bit is set to 0. If the AGC is not enabled,
the speaker amplifier is returned to its former
PRESENTGAIN value. If the AGC is enabled,
AGCRELEASE
speed
determines
the
new
PRESENTGAIN value.
Table 14. Speaker Noise Gate Threshold Voltage
Table 15.
SPNGTHRESH [2:0]
Speaker Noise Gate Threshold (mVpk)
000
Speaker Noise Gate Disabled
001
2.8
010
5.7
011
11.3
100
22.6
101
45.3
110
90.5
111
181.0
Speaker Noise Gate Timing
SPNGTIME [2:0]
Time (ms)
000
10
001
20
010
40
011
80
100
160
101
320
110
640
111
Reserved
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
20
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Programmable Speaker Amplifier Noise Gate
The SPRAMP, SPRAMPSPEED, and SPZCD bits
control the speed at which PRESENTGAIN is changed
when STARTGAIN is changed.
Table 16.
Speaker Gain Change Behavior
SPRAMP
SPZCD
0
0
STARTGAIN changes immediately.
0
1
Wait until a zero crossing occurs in the input before changing STARTGAIN. If a zero
crossing does not occur within SPRAMPSPEED, STARTGAIN is forced to the new setting.
1
0
STARTGAIN is ramped to the new setting at a rate of SPRAMPSPEED per step.
1
STARTGAIN is changed by one step when a zero crossing occurs. If a zero crossing does
not occur within SPRAMPSPEED, a step is forced. Only the first zero crossing within
SPRAMPSPEED triggers a gain change – gain does not change again until the next
SPRAMPSPEED.
1
Behavior When STARTGAIN Is Changed
Table 17. Speaker Gain Change Timing
SPRAMPSPEED[1:0]
Ramp and ZCD Time Between Steps (ms)
00
0.25
01
2.00
10
16.00
11
128.00
SPRAMP, SPRAMPSPEED, and SPZCD have no effect
on AGC and noise gate timing. AGC and noise gate
timing have no effect on speaker amplifier gain ramp
and zero-crossing detection. In the event of a conflict
between these systems, PRESENTGAIN chooses the
lowest gain setting. For example, SPRAMP is enabled
with a slow SPRAMPSPEED and a fast AGCATTACK.
The user changes STARTGAIN from 111111 to 000001.
As the ramp function begins to ramp PRESENTGAIN
down slowly (as defined by SPRAMPSPEED), a loud
sound surpasses the AGC threshold. This forces
PRESENTGAIN to react quickly (as defined by
AGCATTACK). If the sound’s amplitude falls below the
AGC threshold before PRESENTGAIN reaches 000001,
the quick gain reduction halts and the slow gain
reduction resumes.
Valid combinations of SPRAMP, SPZCD, SPNGZRA,
and SPNGZRR are shown in Table 18. Combinations
not listed may produce unpredictable results.
Table 18. Valid Speaker Amplifier Ramp / Zero Crossing / Noise Gate Combinations
SPRAMP
SPZCD
SPNGZRA
SPNGZRR
0
0
X
X
X
X
1
1
1
X
1
0
Note:
6. X = don’t care.
If the SPNGZRA bit is set to 0, the speaker noise gate
attack (mute) function occurs immediately rather than
waiting for zero-crossing detection or ramping. If the
SPNGZRA bit is set to 1, the speaker noise gate attack
function obeys speaker zero crossing detection and
ramp settings.
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
If the SPNGZRR bit is set to 0, the speaker noise gate
release (un-mute) function occurs immediately rather
than waiting for zero-crossing detection or ramping. If
the SPNGZRR bit is set to 1, the speaker noise gate
release (un-mute) function obeys speaker zero-crossing
detection and ramp settings.
www.fairchildsemi.com
21
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Speaker Amplifier Gain Ramp and Zero-Crossing Detection (ZCD)
Writing to and reading from the FAB2200 registers is
2
2
accomplished via the I C interface. The I C protocol
requires that one device on the bus initiates and
controls all read and write operations. This device is
called the “master” device. The master device also
generates the SCL signal, which is the clock signal for
all other devices on the bus, called “slave” devices. The
FAB2200 is a slave device. Both the master and slave
devices can send and receive data on the bus.
Writing to and Reading from the FAB2200
During I2C operations, one data bit is transmitted per
clock cycle. All I2C operations follow a repeating nineclock-cycle pattern that consists of eight bits (one byte)
of transmitted data followed by an acknowledge (ACK)
or not acknowledge (NACK) from the receiving device.
Note that there are no unused clock cycles during any
operation – therefore, there must be no breaks in the
stream of data and ACKs/NACKs during data transfers.
Setting the Pointer
All read and write operations must begin with a START
condition generated by the master device. After the
START condition, the master device must immediately
send a slave address (7 bits), followed by a read/write
bit. If the slave address matches the address of the
FAB2200, the FAB2200 sends an ACK by pulling the
SDA line LOW for one clock cycle.
For all operations, the pointer stored in the command
register must be pointing to the register that is going to
be written to or read from. To change the pointer value
in the Command register, the read/write bit following the
address must be 0. This indicates that the master writes
new information into the Command register.
After the FAB2200 sends an ACK in response to
receiving the address and read/write bit, the master
device must transmit an appropriate 8-bit pointer value,
2
as explained in the I C Registers section. The FAB2200
sends an ACK after receiving the new pointer data.
For most operations, I2C protocol requires the SDA line
to remain stable (unmoving) whenever SCL is HIGH;i.e., transitions on the SDA line can only occur when
SCL is LOW. The exceptions to this rule are when the
master device issues a START or STOP condition. A
slave device cannot issue a START or STOP condition.
The pointer set operation is illustrated in Figure 25 and
Figure 26. Any time a pointer set is performed, it must
be immediately followed by a read or write operation.
The Command register retains the current pointer value
between operations; therefore subsequent read
operations do not require a pointer set cycle. Write
operations always require the pointer be reset.
START Condition: This condition occurs when the SDA
line transitions from HIGH to LOW while SCL is HIGH.
The master device uses this condition to indicate that a
data transfer is about to begin.
STOP Condition: This condition occurs when the SDA
line transitions from LOW to HIGH while SCL is HIGH.
The master device uses this condition to signal the end
of a data transfer.
Reading
Acknowledge and Not Acknowledge: When data is
transferred to the slave device, it sends an acknowledge
(ACK) after receiving every byte of data. The receiving
(slave) device sends an ACK by pulling SDA LOW for
one clock cycle.
If the pointer is already pointing to the desired register,
the master can read from that register by setting the
read/write bit (following the slave address) to 1. After
sending an ACK, FAB2200 begins transmitting data
during the following clock cycle. The master should
respond with a NACK, followed by a STOP condition
(see Figure 23).
When the master device is reading data from the slave
device, the master sends an ACK after receiving every
byte of data. Following the last byte, a master device
sends a “not acknowledge” (NACK) instead of an ACK,
followed by a STOP condition. A NACK is indicated by
leaving SDA HIGH during the clock after the last byte.
The master reads multiple bytes by responding to the
data with an ACK instead of a NACK and continuing to
send SCL pulses, as shown in Figure 24. The FAB2200
increments the pointer by one and sends the data from
the next register. The master indicates the last data byte
by responding with a NACK, followed by a STOP.
Slave Address
To read from a register other than the one currently
indicated by the Command register, a pointer to the
desired register must be set. Immediately following the
pointer set, the master must perform a REPEAT START
condition (see Figure 26), which indicates to the
FAB2200 that a new operation is about to occur. If the
REPEAT START condition does not occur, the
FAB2200 assumes that a write is taking place and the
selected register is overwritten by the upcoming data on
the data bus. After the START condition, the master
must again send the device address and read/write bit.
This time, the read/write bit must be set to 1 to indicate
a read. The rest of the read cycle is the same as
described in the previous paragraphs for reading from a
preset pointer location.
Each slave device on the bus has a unique address so
the master can identify which device is sending or
receiving data. The FAB2200 slave address is
1001101X binary where “X” is the read/write bit. Master
write operations are indicated when X=0. Master read
operations are indicated when X=1.
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
22
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
I2C Control
All writes must be preceded by a pointer set, even if the
pointer is already pointing to the desired register.
Immediately following the pointer set, the master must
begin transmitting the data to be written. After
transmitting each byte of data, the master must release
the Serial Data (SDA) line for one clock cycle to allow
As with reading, the master can write multiple bytes by
continuing to send data. The FAB2200 increments the
pointer by 1 and accepts data for the next register. The
master indicates the last data byte by issuing a STOP.
Figure 23. I2C Read
Figure 24. I2C Multiple-Byte Read
2
Figure 25. I C Write
2
Figure 26. I C Write Followed by Read
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
23
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
the FAB2200 to acknowledge receiving the byte. The
write operation should be terminated by a STOP
condition from the master (see Figure 25).
Writing
The I2C slave address is 1001101x, where x=0 for write operations and x=1 for read operations.
Address
B7
0x00
0x01
B6
B5
VERSION
HIZL
HIZR
B4
HPNGTRIP SPNGTRIP
0
BYPEN
0x02
DIFFIN43 DIFFIN21
0x03
SELSPA4 SELSPA3 SELSPA2
SELSPA1
0x04
SELHPL4 SELHPL3 SELHPL2
SELHPL1
0x05
B3
B2
B1
B0
OVRTEMP
OVRCURSP
0
0
0
SHDNB
0
PGAIN43
PGAIN21
HPRAMPSPEED
SELHPR4
SELHPR3
HPZCD
HPRAMP
SELHPR2
SELHPR1
0
0
HPLVOL
0
0x06
0
0
HPRVOL
0
0x07
HPNGZR
A
0x08
ERC
0x09
SPNGZRA
HPNGTHRESH
0
0
HPNGZRR
0
SPRAMPSPEED
SPNGTHRESH
0x0A
HPNGTIME
SPNGZRR
THMAX
SPRAMP
THVBATT
0x0B
0
0x0C
0
0
AGCATTACK
AGCMIN
0x0D
0
0
PRESENTGAIN
0x0E
0
0
STARTGAIN
0x0F
0
0
0
MCSSMT
Bits labeled “0” have no effect if written. When read, the
value is always 0.
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
SPZCD
SPNGTIME
AGCRELEASE
SSMT
Bits and addresses not listed in the register map are for
testing only. These bits should never be written. When
read, they may return any value.
www.fairchildsemi.com
24
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Register Map
Address
B7
B6
B5
0x00
VERSION
default
010
B4
B3
B2
B1
B0
HPNGTRIP SPNGTRIP OVRTEMP OVRCURSP
0
0
0
0
0
0
VERSION (Read only)
Indicates the silicon revision number.
HPNGTRIP (Read only)
1 = Headphone amplifiers are being muted by the noise gate.
0 = Normal operation.
SPNGTRIP (Read only)
1 = Speaker amplifier is being muted by the noise gate.
0 = Normal operation.
OVRTEMP (Read/Clear)
1 = The junction temperature of the device has exceeded the thermal shutdown threshold. (This bit remains set until it
is read.)
0 = Normal operation.
OVRCURSP (Read/Clear)
1 = The output current limit of the speaker amplifier has been exceeded. (This bit remains set until it is read.)
0 = Normal operation.
Address
B7
B6
B5
B4
B3
B2
B1
B0
0x01
HIZL
HIZR
0
BYPEN
0
0
0
SHDNB
default
0
0
0
0
0
0
0
0
HIZx
1 = HPx is muted and output is in High-Impedance Mode (see Table 2).
0 = Normal operation.
BYPEN
1 = DPST analog bypass switch is closed.
0 = DPST analog bypass switch is open.
SHDNB
1 = Normal operation.
0 = Low-power Shutdown Mode.
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
25
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Register Descriptions
B7
B6
B5
0x02
DIFFIN43
DIFFIN21
default
0
0
B4
B3
B2
PGAIN43
0
B1
B0
PGAIN21
0
0
0
0
0
DIFFIN43
1 = IN4 and IN3 are configured as a differential pair.
0 = IN4 and IN3 are independent.
DIFFIN21
1 = IN2 and IN1 are configured as a differential pair.
0 = IN2 and IN1 are independent.
PGAIN43
PGAIN43 sets the pre-amplifier gain for IN4 and IN3.
PGAIN21
PGAIN21 sets the pre-amplifier gain for IN2 and IN1.
PGAINxx [2:0]
Pre-Amplifier Gain (dB)
PGAINxx [2:0]
Pre-Amplifier Gain (dB)
000
0
100
12
001
3
101
15
010
6
110
18
011
9
111
21
Address
0x03
default
0x04
default
B7
B6
B5
B4
B3
SELSPA4 SELSPA3 SELSPA2 SELSPA1
0
0
SELHPL4 SELHPL3
0
0
0
HPRAMPSPEED
0
SELHPL2 SELHPL1
0
B2
B1
B0
HPZCD
HPRAMP
0
0
0
0
SELHPR4
SELHPR3
SELHPR2
SELHPR1
0
0
0
0
0
SELSPAx
1 = Channel INx is added to the speaker amplifier’s input.
0 = Channel INx is disconnected from the speaker amplifier’s input.
If all four SELSPAx bits are 0, the speaker amplifier is turned off and the SPKRP and SPKRN outputs stop switching.
SELHPLx
1 = Channel INx is added to the left headphone amplifier’s input.
0 = Channel INx is disconnected from left headphone amplifier’s input.
If all four SELHPLx bits are 0, the left headphone amplifier is turned off.
SELHPRx
1 = Channel INx is added to the right headphone amplifier’s input.
0 = Channel INx is disconnected from right headphone amplifier’s input.
If all four SELHPRx bits are 0, the right headphone amplifier is turned off.
HPRAMPSPEED
HPRAMPSPEED sets timing for the headphone amplifiers’ ramp function according to Table 4.
HPZCD
1 = Headphone amplifier zero-crossing detection is enabled.
0 = Headphone amplifier zero-crossing detection is disabled.
HPRAMP
1 = Headphone amplifier volume ramping is enabled.
0
= Headphone amplifier volume ramping is disabled.
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
26
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Address
B7
B6
0x05
0
0
default
0
0
0x06
0
0
default
0
0
B5
B4
B3
B2
B1
B0
HPLVOL
0
0
0
0
0
0
0
HPRVOL
0
0
0
0
0
0
0
HPxVOL
HPxVOL sets the gain of the headphone amplifiers according to Table 19.
HPxVOL does not include PGAINxx. Gain for the entire headphone amplifier signal path is defined by PGAINxx +
HPxVOL.
Table 19. Headphone Amplifier Gain Settings
HPxVOL [4:0]
Gain (dB)
HPxVOL [4:0]
Gain (dB)
00000
mute
10000
-9
00001
-53
10001
-8
00010
-49
10010
-7
00011
-45
10011
-6
00100
-41
10100
-5
00101
-37
10101
-4
00110
-33
10110
-3
00111
-29
10111
-2
01000
-25
11000
-1
01001
-23
11001
0
01010
-21
11010
1
01011
-19
11011
2
01100
-17
11100
3
01101
-15
11101
4
01110
-13
11110
5
01111
-11
11111
6
Address
B7
0x07
HPNGZRA
default
0
B6
B5
B4
HPNGTHRESH
0
0
B3
B2
HPNGZRR
0
0
B1
B0
HPNGTIME
0
0
0
HPNGZRA
1 = The headphone noise gate attack function obeys headphone zero-crossing detection and ramp settings.
0 = The headphone noise gate attack (mute) function occurs immediately rather than waiting for zero-crossing
detection or ramping.
HPNGTHRESH
HPNGTHRESH sets the threshold voltage for the headphone amplifiers’ noise gate function according to Table 1.
HPNGZRR
1 = The headphone noise gate release (un-mute) function obeys headphone zero-crossing detection and ramp
settings.
0 = The headphone noise gate release (un-mute) function occurs immediately rather than waiting for zero-crossing
detection or ramping.
HPNGTIME
HPNGTIME sets the timing for the headphone amplifiers’ noise gate function according to Table 6.
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
27
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Address
B7
B6
B5
B4
0x08
ERC
0
0
0
default
0
0
0
0
B3
B2
SPRAMPSPEED
0
B1
B0
SPZCD
SPRAMP
0
0
B1
B0
0
ERC
1 = Speaker amplifier edge-rate control is enabled.
0 = Speaker amplifier edge-rate control is disabled.
SPRAMPSPEED
SPRAMPSPEED sets timing for the speaker amplifier’s ramp function according to Table 17.
SPZCD
1 = Speaker amplifier zero-crossing detection is enabled.
0 = Speaker amplifier zero-crossing detection is disabled.
SPRAMP
1 = Speaker amplifier gain ramping is enabled.
0 = Speaker amplifier gain ramping is disabled.
Address
B7
0x09
SPNGZRA
default
0
B6
B5
B4
B3
SPNGTHRESH
0
0
B2
SPNGZRR
0
0
SPNGTIME
0
0
0
SPNGZRA
1 = The speaker noise gate attack function obeys speaker zero-crossing detection and ramp settings.
0 = The speaker noise gate attack (mute) function occurs immediately rather than waiting for zero-crossing detection
or ramping.
SPNGTHRESH
SPNGTHRESH sets the threshold voltage for the speaker amplifier’s noise gate function according to Table 14.
SPNGZRR
1 = The speaker noise gate release (un-mute) function obeys speaker zero-crossing detection and ramp settings.
0 = The speaker noise gate release (un-mute) function occurs immediately rather than waiting for zero-crossing
detection or ramping.
SPNGTIME
SPNGTIME sets the timing for the speaker amplifier’s noise gate function according to Table 15.
Address
B7
B6
0x0A
default
B5
B4
B3
B2
THMAX
0
0
B1
B0
THVBATT
0
0
0
0
0
0
THMAX
THMAX sets the maximum threshold voltage for the speaker amplifier’s AGC according to Table 9.
THVBATT
THVBATT sets the clipping level relative to VBATT for the speaker amplifier’s AGC according to Table 10.
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
28
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Address
B7
0x0B
0
default
0
B6
B5
B4
B3
AGCATTACK
0
B2
0
0
0
B1
B0
AGCRELEASE
0
0
0
0
B2
B1
B0
0
0
0
B1
B0
AGCATTACK
AGCATTACK sets the attack speed for the speaker amplifier’s AGC according to Table 12.
AGCRELEASE
AGCRELEASE sets the release speed for the speaker amplifier’s AGC according to Table 13.
Address
B7
B6
0x0C
0
0
default
0
0
B5
B4
B3
AGCMIN
0
0
0
AGCMIN
AGCMIN sets the minimum gain for the speaker amplifier’s AGC according to Table 11.
Address
B7
B6
0x0D
0
0
B5
B4
B3
B2
PRESENTGAIN
PRESENTGAIN
(Read only)
PRESENTGAIN is the actual gain setting for the speaker amplifier according to Table 11. The target value for
PRESENTGAIN is set by STARTGAIN. However, PRESENTGAIN may be changed automatically by the AGC or the
noise gate.
PRESENTGAIN does not include PGAINxx. Gain for the entire speaker amplifier signal path is defined by PGAINxx +
PRESENTGAIN.
Address
B7
B6
0x0E
0
0
default
0
0
B5
B4
B3
B2
B1
B0
STARTGAIN
0
0
0
0
0
0
B1
B0
STARTGAIN
STARTGAIN is the volume setting for the speaker amplifier according to Table 11.
Address
B7
B6
0x0F
0
0
default
0
0
B5
B4
B3
B2
MCSSMT
1
SSMT
0
0
0
0
0
SSMT
Sets the spread-spectrum modulation of the class-D amplifier. See Table 20 for the amount of modulation. A setting
of 000 results in a ±5.3% modulation in the speaker amplifier’s output frequency. A setting of 100 disables spreadspectrum modulation.
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
29
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Address
Class-D Spread-Spectrum Modulation Trim
SSMT [2:0]
Class-D Spread-Spectrum Modulation Trim (±%)
000
5.3
001
7.0
010
10.6
011
21.2
100
0.0
101
3.0
110
3.6
111
4.2
MCSSMT [5:3]
Sets the spread-spectrum modulation of the master clock. See Table 21 for amount of modulation. Modulating the
master clock does not modulate the class-D output frequency because the triangle wave generator is PLL controlled.
Table 21.
Master Clock Spread-Spectrum Modulation Trim
MCSSMT [2:0]
Master Clock Spread-Spectrum
Modulation Trim (± %)
000
5.3
001
7.0
010
10.6
011
21.2
100
0.0
101
3.0
110
3.6
111
4.2
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
30
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Table 20.
Layout Considerations
Recommended Routing / Layout Rules
General layout and supply bypassing play a major role
in analog performance and thermal characteristics.
Fairchild offers a demonstration board to guide layout
and aid device evaluation (contact Fairchild for details).
Following this layout configuration provides optimum
performance for the device. For the best results, follow
the steps and recommended routing rules listed below.


Do not run analog and digital signals in parallel.

Place the speaker amplifier output as close as
possible to the speaker element to reduce EMI.

Traces should be run on top of the ground plane
at all times.



No trace should run over ground / power splits.

Minimize all trace lengths to reduce series
inductance.
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
Use separate analog and digital power planes to
supply power.
Avoid routing at 90-degree angles.
Place bypass capacitors within 0.1 inches of the
device power pin.
www.fairchildsemi.com
31
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Applications Information
0.03 C
E
2X
F
A
1.60
B
0.40
A1
BALL A1
INDEX AREA
1.60
D
(Ø0.200)
Cu Pad
(Ø0.300)
Solder Mask
0.40
0.03 C
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
2X
TOP VIEW
0.06 C
0.625
0.547
0.05 C
C
D
0.378±0.018
0.208±0.021
E
SEATING PLANE
SIDE VIEWS
NOTES:
1.60
0.005
B. DIMENSIONS ARE IN MILLIMETERS.
Ø0.260±0.02
25X
0.40
1.60
A. NO JEDEC REGISTRATION APPLIES.
C A B
E
D
C
B
0.40
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
(Y) ±0.018
A
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F
1 2 3 4 5
(X) ±0.018
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
BOTTOM VIEW
G. DRAWING FILNAME: MKT-UC025AArev2.
Figure 27. 25-Bump, 0.4mm Pitch, Wafer-Level Chip-Scale Package (WLCSP)
Product
D
E
X
Y
FAB2200UCX
2.06mm
2.38mm
0.39mm
0.23mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent version. Package specifications do not expand Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductors online packaging area for the most recent packaging drawings and tape and reel
specifications http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
32
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
Physical Dimensions
FAB2200 — Audio Subsystem with Stereo Class-G Headphone Amplifier
© 2009 Fairchild Semiconductor Corporation
FAB2200 • Rev. 1.0.1
www.fairchildsemi.com
33