Ordering number : ENA1122 LC876D16A LC876D08A CMOS IC ROM 16K/8K byte, RAM 1024 byte on-chip 8-bit 1-chip Microcontroller Overview The SANYO LC876D16A/LC876D08A is 8-bit microcomputer with the following on-chip functional blocks: • CPU: operable at a minimum bus cycle time of 100ns • 16K/8K-byte ROM • On-chip RAM: 1024 byte • VFD automatic display controller/driver • 16-bit timer/counter (can be divided into two 8-bit timers) • Two 8-bit timer with prescaler • Timer for use as date/time clock • Day-Minute-Second Counter (DMSC) • System clock divider function • Synchronous serial I/O port (with automatic block transmit/receive function) • Asynchronous/synchronous serial I/O port • Remote control receive function • 8-channel×8-bit AD converter • 15-source 10-vectored interrupt system All of the above functions are fabricated on a single chip. Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment (home appliances, AV equipment, communication device, office equipment, industrial equipment etc.). The products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. If you should intend to use our products for applications outside the standard applications of our customer who is considering such use and/or outside the scope of our intended standard applications, please consult with us prior to the intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer' s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer' s products or equipment. Ver.1.00 52108HKIM 20080215-S00003 No.A1122-1/19 LC876D16A/08A Features Read-Only Memory (Mask ROM) • 16384 × 8 bits (LC876D16A) • 8192 × 8 bits (LC876D08A) Random Access Memory (RAM) • 1024 × 9 bits Minimum Bus Cycle Time • 100ns (10MHz) VDD=3.0 to 5.5V Note: The bus cycle time indicates ROM read time. Minimum Instruction Cycle Time (tCYC) • 300ns (10MHz) VDD=3.0 to 5.5V Ports • Input/output ports Data direction programmable for each bit individually: 10 (P1n, P7n) Data direction programmable in nibble units: 8 (P0n) (When N-channel open drain output is selected, data can be input in bit units.) • VFD output ports Large current outputs for digits: 9 (S0/T0 to S8/T8) Large current outputs for digits/segments: 7 (S9/T9 to S15/T15) Digit/segment outputs: 8 (S16 to S23) Segment outputs: 30 (S24 to S53) • Oscillator pins: 2 (CF1/XT1, CF2/XT2) • Reset pin: 1 (RES) • Power supply: 4 (VSS1, VDD1 to VDD3) • VFD power supply: 1 (VP) VFD Automatic Display Controller • Programmable segment/digit output pattern Output can be switched between digit/segment waveform output (pins 9 to 23 can be used for output of digit waveforms). parallel-drive available for large current VFD. • 16-step dimmer function available Timers • Timer 0: 16-bit timer/counter with capture register Mode 0: 2 channel 8-bit timer with programmable 8-bit prescaler and 8-bit capture register Mode 1: 8-bit timer with 8-bit programmable prescaler and 8-bit capture register + 8-bit counter with 8-bit capture register Mode 2: 16-bit timer with 8-bit programmable prescaler and 16-bit capture register Mode 3: 16-bit counter with 16-bit capture register • Timer 4: 8-bit timer with 6-bit prescaler • Timer 5: 8-bit timer with 6-bit prescaler • Base Timer 1) The clock signal can be selected from any of the following. Sub-clock (32.768kHz crystal oscillator), system clock, and prescaler output from timer 0 2) Interrupts can be selected to occur at one of five different times. • Day and time counter 1) Using with a base timer, it can be used as 65000 day + minute + second counter. No.A1122-2/19 LC876D16A/08A SIO • SIO 0: 8-bit synchronous serial interface 1) LSB first/MSB first function available 2) Internal 8-bit baud-rate generator (maximum transmit clock period 4/3 tCYC) 3) Consecutive automatic data communication (1 to 256 bits (communication available for each bit) (stop and reopening available for each byte) • SIO 1: 8-bit asynchronous/synchronous serial interface Mode 0: Synchronous 8-bit serial IO (2-wire or 3-wire, transmit clock 2 to 512 tCYC) Mode 1: Asynchronous serial IO (half duplex, 8 data bits, 1 stop bit, baud rate 8 to 2048 tCYC) Mode 2: Bus mode 1 (start bit, 8 data bits, transmit clock 2 to 512 tCYC) Mode 3: Bus mode 2 (start detection, 8 data bits, stop detection) AD Converter: 8 bits × 8 channels Remote Control Receiver Circuit (sharing pins with P70/INT0/RMIN) • Noise rejection function (Units of noise rejection filter: about 120μs, when selecting a 32.768kHz crystal oscillator as a clock.) • Supporting reception formats with a guide-pulse of half-clock/clock/none. • Determines a end of reception by detecting a no-signal periods (No carrier). (Supports same reception format with a different bit length.) • X’tal HOLD mode release function Watchdog Timer • The watching timer period is set using an external RC. • Watchdog timer can produce interrupt, system reset. Clock Output Function 1) Able to output selected oscillation clock 1/1, 1/2, 1/4, 1/8, 1/16, 1/32, 1/64 as system clock. 2) Able to output oscillation clock of sub clock. System Clock Divider Function • Able to reduce current consumption Available minimum instruction cycle time: 300ns, 600ns, 1.2μs, 2.4μs, 4.8μs, 9.6μs, 19.2μs, 38.4μs, 76.8μs. (Using 10MHz main clock) Interrupts: 15 sources, 10 vectored interrupts • Three priority (low, high and highest) multiple interrupts are supported. During interrupt handling, an equal or lower priority interrupt request is refused. • If interrupt requests to two or more vector addresses occur at once, the higher priority interrupt takes precedence. In the case of equal priority levels, the vector with the lowest address takes precedence. No. Vector Selectable Level Interrupt Signal 1 00003H X or L INT0 2 0000BH X or L INT1 3 00013H H or L INT2/T0L/remote control receiver 4 0001BH H or L INT3/Base timer 0/1 5 00023H H or L T0H 6 0002BH H or L 7 00033H H or L SIO0 8 0003BH H or L SIO1 9 00043H H or L ADC 10 0004BH H or L Port0/T4/T5 • Priority Level: X>H>L • For equal priority levels, vector with lowest address takes precedence. Subroutine Stack Levels: 512 levels Maximum (Stack is located in RAM.) No.A1122-3/19 LC876D16A/08A Multiplication and Division • 16 bits × 8 bits (5 tCYC execution time) • 24 bits × 16 bits (12 tCYC execution time) • 16 bits ÷ 8 bits (8 tCYC execution time) • 24 bits ÷ 16 bits (12 tCYC execution time) Oscillation Circuits • On-chip RC oscillation circuit for system clock use. • On-chip CF oscillation circuit* for system clock use. (Rf built in) • On-chip Crystal oscillation circuit* low speed system clock use. (Rf built in) • Frequency variable RC oscillation circuit (internal) for system clock. 1) Adjustable in ±4% (typ) step from a selected center frequency. 2) Measures oscillation clock using a input signal from XT1 as a reference. * The CF oscillation terminal and the crystal oscillation terminal cannot be used at the same time because of commonness. Standby Function • HALT mode HALT mode is used to reduce power consumption. Program execution is stopped. Peripheral circuits still operate but VFD display and some serial transfer operations stop. 1) Oscillation circuits are not stopped automatically. 2) Release occurs on system reset or by interrupt. • HOLD mode HOLD mode is used to reduce power consumption. Both program execution and peripheral circuits are stopped. 1) The CF, RC, X’tal and frequency variable RC oscillators automatically stop operation. 2) Release occurs on any of the following conditions. (1) input to the reset pin goes “Low” (2) a specified level is input to at least one of INT0, INT1, INT2 (3) an interrupt condition arises at port 0 • X’tal HOLD mode. X’tal HOLD mode is used to reduce power consumption. Program execution is stopped. All peripheral circuits except the base-timer are stopped. 1) The CF, RC, frequency variable RC oscillation circuits stop automatically. 2) Crystal oscillator is maintained in its state at HOLD mode inception. 3) Release occurs on any of the following conditions. (1) input to the reset pin goes “Low” (2) Setting at least one of the INT0, INT1 and INT2 pins to the specified level (3) Having an interrupt source established at port 0 (4) Having an interrupt source established in the base timer circuit (5) Having an interrupt source established in the remote control receiver circuit Package Form • QFP80(14×14): Lead-free type Development Tools • On-chip debugger: TCB87- type-B + LC87F6D64A No.A1122-4/19 LC876D16A/08A Package Dimensions unit : mm (typ) 3255 17.2 0.8 14.0 60 41 40 80 21 14.0 17.2 61 1 0.65 0.25 20 0.15 (2.7) 0.1 3.0max (0.83) SANYO : QFP80(14X14) 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 S37 S36 S35 S34 S33 S32 S31 S30 S29 S28 S27 S26 S25 S24 S23 S22 S21 S20 S19 S18 Pin Assignment LC876D16A/08A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 P13/SO1 P14/SI1/SB1 P15/SCK1 P16/INT2/T0IN P17/INT3/T0IN RES VSS1 CF1/XT1 CF2/XT2 VDD1 P00/AN0 P01/AN1 P02/AN2 P03/AN3 P04/AN4 P05/AN5 P06/AN6 P07/AN7 P70/INT0/T0LCP/RMIN P71 INT1/T0HCP S38 S39 VDD3 S40 S41 S42 S43 S44 S45 S46 S47 S48 S49 S50 S51 S52 S53 P10/SO0 P11/SI0/SB0 P12/SCK0 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 S17 S16 VDD2 VP1 S15/T15 S14/T14 S13/T13 S12/T12 S11/T11 S10/T10 S9/T9 S8/T8 S7/T7 S6/T6 S5/T5 S4/T4 S3/T3 S2/T2 S1/T1 S0/T0 Top view SANYO: QFP80(14×14) “Lead-free Type” No.A1122-5/19 LC876D16A/08A System Block Diagram Interrupt control IR CF X’tal VMRC ROM Clock generator Standby control PLA PC RC SIO0 Bus interface ACC SIO1 Port 0 B register Port 1 C register Timer 0 ADC ALU Base timer Remote control receiver circuit VFD Controller DMSC PSW Timer 4 INT0 to 3 Noise Rejection Filter RAR Timer 5 RAM Stack pointer Watchdog timer No.A1122-6/19 LC876D16A/08A Pin Description Pin name I/O Function Option VSS1 - • Power supply (-) No VDD1 VDD2 - • Power supply (+) No - • VFD Power supply (-) No I/O • 8bit input/output port Yes VDD3 VP PORT0 • Data direction programmable in nibble units P00 to P07 • Use of pull-up resistor can be specified in nibble units • Input for HOLD release • Input for port 0 interrupt • Other functions P04: clock output (system clock/can selected from sub clock) AD input port: AN0 to AN7 PORT1 I/O • 8bit input/output port Yes • Data direction programmable for each bit P10 to P17 • Use of pull-up resistor can be specified for each bit • Other pin functions P10: SIO0 data output P11: SIO0 data input/bus input/output P12: SIO0 clock input/output P13: SIO1 data output P14: SIO1 data input/bus input/output P15: SIO1 clock input/output P16: INT2 P17: INT3/Buzzer output The following types of interrupt detection are possible: Rising Falling INT2 enable enable INT3 enable enable PORT7 • 2bit input/output port P70 to P71 • Data direction can be specified for each bit Rising/ H level L level enable disable disable enable disable disable Falling No • Use of pull-up resistor can be specified for each bit • Other functions P70: INT0 input/HOLD release input/Timer 0L capture input/ output for watchdog timer/Remote control receiver input P71: INT1 input/HOLD release input/Timer 0H capture input The following types of interrupt detection are possible: Rising Falling INT0 enable enable INT1 enable enable Rising/ H level L level disable enable enable disable enable enable Falling S0/T0 to S8/T8 O • Large current output for VFD display controller digit (can be used for segment) No S9/T9 to S15/T15 O • Large current output for VFD display controller segment/digit No S16 to S53 O • Output for VFD display controller segment No RES I Reset terminal No CF1/XT1 I <ceramic oscillator selected> No • Input terminal for ceramic oscillator < crystal oscillator selected> • Input for 32.768kHz crystal oscillation When not in use, connect to VDD1. CF2/XT2 O <ceramic oscillator selected> No • Output terminal for ceramic oscillator < crystal oscillator selected> • Output for 32.768kHz crystal oscillation When not in use, set to oscillation mode and leave open circuit. No.A1122-7/19 LC876D16A/08A Port Output Types Output configuration and pull-up/pull-down resistor options are shown in the following table. Input/output is possible even when port is set to output mode. Terminal Option Selected in Units of P00 to P07 each bit (Note 1) P10 to P17 each bit Options Pull-up Resistor Pull-down Resistor CMOS Programmable - 2 Nch-open drain Programmable - 1 CMOS Programmable - 2 Nch-open drain Programmable - 1 Output Format P70 - None Nch-open drain Programmable - P71 - None CMOS Programmable - S0/T0 to S15/T15 - None High voltage Pch-open drain - Fixed S16 to S53 Note 1: Programmable pull-up resisters of Port 0 can be attached in nibble units (P00 to P03, P04 to P07). * Note: Connect as follows to reduce noise on VDD and increase the back-up time. VSS1 must be connected together and grounded. LSI VDD1 Power supply Back-up capacitors VDD2 VFD powers VDD3 VSS1 No.A1122-8/19 LC876D16A/08A Absolute Maximum Ratings at Ta = 25°C, VSS1 = 0V Parameter Symbol Pin/Remarks Specification Conditions VDD[V] Supply voltage VDD max VDD1, VDD2, VDD3 Input voltage VI(1) CF1/XT1, RES VI(2) VP Output voltage VO(1) VDD1=VDD2=VDD3 S0/T0 to S15/T15 S16 to S53 Input/Output VO(2) CF2/XT2 VIO(1) Ports 0, 1, 7 IOPH(1) Ports 0, 1 voltage Peak output current Average VDD+0.3 VDD+0.3 VDD-45 VDD+0.3 -0.3 VDD+0.3 -0.3 VDD+0.3 -5 S0/T0 to S15/T15 Current at each pin -30 IOPH(4) S16 to S53 Current at each pin -15 IOMH(1) Ports 0, 1 • CMOS output selected -7.5 IOMH(2) Port 71 Current at each pin -3 IOMH(3) S0/T0 to S15/T15 Current at each pin -15 IOMH(4) S16 to S53 Current at each pin -10 Total output ΣIOAH(1) Port 0 Total of all pins -30 current ΣIOAH(2) Port 1 Total of all pins -30 ΣIOAH(3) Ports 0, 1 Total of all pins -30 ΣIOAH(4) Port 71 Total of all pins -5 ΣIOAH(5) S0/T0 to S15/T15 Total of all pins -60 ΣIOAH(6) S16 to S33 Total of all pins -60 S0/T0 to S15/T15 Total of all pins mA -60 ΣIOAH(8) S34 to S39 Total of all pins -60 ΣIOAH(9) S40 to S47 Total of all pins -60 ΣIOAH(10) S48 to S53 Total of all pins -60 ΣIOAH(11) S34 to S53 Total of all pins -60 Peak output IOPL(1) Ports 0, 1 Current at each pin 20 current IOPL(2) Port 7 Current at each pin 10 Average IOPML(1) Ports 0, 1 Current at each pin 15 output current IOML(2) Port 7 Current at each pin 7.5 Total output ΣIOAL(1) Port 0 Total of all pins 50 current ΣIOAL(2) Port 1 Total of all pins 50 ΣIOAL(3) Port 7 Total of all pins 20 ΣIOAL(4) Ports 0, 1, 7 Total of all pins 80 Pd max QFP80(14×14) Ta=-40 to +85°C Maximum power mW dissipation Operating Topr -40 temperature +85 range Storage temperature V -10 IOPH(3) S16 to S33 unit +6.5 -0.3 Current at each pin • Current at each pin max VDD-45 Port 71 ΣIOAH(7) Low level output current typ -0.3 IOPH(2) output current High level output current • CMOS output selected • Current at each pin min °C Tstg -55 +125 range No.A1122-9/19 LC876D16A/08A Allowable Operating Conditions at Ta = -40°C to +85°C, VSS1 = 0V Specification Parameter Symbol Pin/Remarks Conditions VDD[V] Operating VDD(1) supply voltage VDD(2) VDD1=VDD2=VDD3 0.300μs≤tCYC≤200μs 0.735μs≤tCYC≤200μs range Hold voltage VHD VDD1 RAM and the register data are kept in HOLD mode. Pull-down VP VP VIH(1) Ports 0, 1 supply voltage Input high Output disable voltage VIH(2) Port 70 Output disable Watchdog timer Input low VIH(3) XT1/CF1, RES VIL(1) Ports 0, 1 voltage 2.5 to 5.5 min typ max unit 3.0 5.5 2.5 5.5 2.0 5.5 -35 VDD 0.3VDD +0.7 VDD 2.5 to 5.5 0.9VDD VDD 2.5 to 5.5 0.75VDD VDD 2.5 to 5.5 VSS 2.5 to 5.5 VSS 2.5 to 5.5 VSS 0.25VDD 3.0 to 5.5 0.300 200 2.5 to 5.5 0.735 200 3.0 to 5.5 0.1 10 V Output disable Port 71 Port 70 0.1VDD +0.4 port input/interrupt VIL(2) Port 70 Output disable Watchdog timer VIL(3) Operation XT1/CF1, RES tCYC cycle time External FEXCF(1) CF1 • CF2 open circuit 0.8VDD -1.0 system clock • system clock divider set to 1/1 frequency • external clock DUTY=50±5% 2.5 to 5.5 0.1 4 • CF2 open circuit 3.0 to 5.5 0.2 20 2.5 to 5.5 0.2 8 • system clock divider set to 1/2 • external clock DUTY=50±5% Oscillation FmCF(1) CF1, CF2 stabilizing MHz • 10MHz ceramic resonator oscillation 3.0 to 5.5 10 2.5 to 5.5 4 • Refer to figure 1 time period (Note 2-1) μs FmCF(2) CF1, CF2 (Note 2-2) • 4MHz ceramic resonator oscillation MHz • Refer to figure 1 FmRC RC oscillation FmVMRC Frequency variable RC oscillation circuit FsX’tal XT1, XT2 2.5 to 5.5 0.3 1.0 2.5 to 5.5 4 2.5 to 5.5 32.768 2.0 32.768kHz crystal resonator oscillation kHz Refer to figure 2 Note 2-1: The oscillation constant is shown in table 1 and table 2. Note 2-2: The CF oscillation terminal and the crystal oscillation terminal cannot be used at the same time because of commonness. No.A1122-10/19 LC876D16A/08A Electrical Characteristics at Ta = -40°C to +85°C, VSS1 = 0V Parameter Symbol Pin/Remarks Specification Conditions VDD[V] Input high current IIH(1) Ports 0, 1, 7 min typ max unit • Output disable • Pull-up resister OFF. • VIN=VDD 2.5 to 5.5 1 (including OFF state leak current of the output Tr.) Input low current IIH(2) RES VIN=VDD 2.5 to 5.5 1 IIH(3) CF1/XT1 VIN=VDD 2.5 to 5.5 1 IIL(1) Ports 0, 1, 7 • Output disable μA • Pull-up resister OFF. • VIN=VSS 2.5 to 5.5 -1 -1 (including OFF state leak current of the output Tr.) IIL(2) RES VIN=VSS 2.5 to 5.5 IIL(3) CF1/XT1 VIN=VSS 2.5 to 5.5 -1 Output high VOH(1) Port 0: CMOS IOH=-1.0mA 4.5 to 5.5 VDD-1 voltage VOH(2) output option IOH=-0.5mA 3.0 to 5.5 VDD-1 IOH=-0.1mA 2.5 to 5.5 VDD-0.5 VOH(3) Ports 1 VOH(4) Port 71 IOH=-0.4mA 2.5 to 5.5 VDD-1 VOH(5) S0/T0 to S15/T15 IOH=-20.0mA 4.5 to 5.5 VDD-1.8 VOH(6) IOH=-10.0mA 3.0 to 5.5 VDD-1.8 VOH(7) • IOH=-1.0mA 2.5 to 5.5 VDD-1 IOH=-5.0mA 4.5 to 5.5 VDD-1.8 VOH(9) IOH=-2.5mA 3.0 to 5.5 VDD-1.8 VOH(10) • IOH=-1.0mA 2.5 to 5.5 VDD-1 • IOH at any single pin is not over 1mA. VOH(8) S16 to S53 • IOH at any single pin is V not over 1mA. Output low VOL(1) voltage Pull-up resistor Output off-leak Ports 0, 1 IOL=10mA 4.5 to 5.5 1.5 VOL(2) IOL=5mA 3.0 to 5.5 1.5 VOL(3) IOL=1.6mA 2.5 to 5.5 0.4 2.5 to 5.5 0.4 VOL(4) Port 7 IOL=1mA Rpu Ports 0, 1, 7 VOH=0.9VDD IOFF(1) current S0/T0 to S15/T15, • Output P-ch Tr. OFF S16 to S53 • VOUT=VSS • Output P-ch Tr. OFF IOFF(2) • VOUT=VDD-40V Pull-down resistor Rpd • S0/T0 to S15/T15 • Output P-ch Tr. OFF • S16 to S53 • VOUT=3V 4.5 to 5.5 15 40 70 2.5 to 4.5 25 70 150 2.5 to 5.5 -1 2.5 to 5.5 -30 5.0 60 kΩ μA 100 200 kΩ • Vp=-30V Hysteresis VHYS(1) Pin capacitance • Ports 0, 1, 7 • RES voltage CP All pins 2.5 to 5.5 0.1VDD V 2.5 to 5.5 10 pF • f=1MHz • All other terminals connected to VSS. • Ta=25°C No.A1122-11/19 LC876D16A/08A Serial I/O Characteristics at Ta = -40°C to +85°C, VSS1 = 0V 1. SIO0 Serial I/O Characteristics (Note 4-1-1) Input clock Parameter Symbol Frequency tSCK(1) Low level tSCKL(1) Pin/ SCK0(P12) Specification Conditions Remarks VDD[V] See Fig. 6. tSCKH(1) 2.5 to 5.5 pulse width tCYC 4 • (Note 4-1-2) Frequency tSCK(2) SCK0(P12) • CMOS output selected 4/3 • See Fig. 6. Output clock Low level tSCKL(2) 1/2 pulse width High level tSCK tSCKH(2) 2.5 to 5.5 pulse width 1/2 • Continuous data tSCKHA(2) transmission/reception mode tSCKH(2) • CMOS output selected +2tCYC • See Fig. 6. Data setup time Serial input unit 1 • Continuous data tSCKHA(1) transmission/reception mode tsDI(1) SB0(P11), SI0(P11) tSCKH(2) +(10/3) tCYC tCYC • Must be specified with respect to rising edge of SIOCLK. 2.5 to 5.5 0.03 2.5 to 5.5 0.03 • See Fig. 6. Data hold time Input clock Output delay thDI(1) tdD0(1) time SO0(P10), SB0(P11) • Continuous data transmission/reception mode 2.5 to 5.5 • (Note 4-1-3) tdD0(2) (1/3)tCYC +0.05 µs • Synchronous 8-bit mode • (Note 4-1-3) tdD0(3) Output clock Serial output max 1 • See Fig. 6. Serial clock typ 2 pulse width High level min 2.5 to 5.5 1tCYC +0.05 (Note 4-1-3) 2.5 to 5.5 (1/3)tCYC +0.05 Note 4-1-1: These specifications are theoretical values. Add margin depending on its use. Note 4-1-2: To use serial-clock-input in continuous trans/rec mode, a time from SI0RUN being set when serial clock is "H" to the first negative edge of the serial clock must be longer than tSCKHA. Note 4-1-3: Must be specified with respect to falling edge of SIOCLK. Must be specified as the time to the beginning of output state change in open drain output mode. See Fig. 6. No.A1122-12/19 LC876D16A/08A 2. SIO1 Serial I/O Characteristics (Note 4-2-1) Input clock Pin/ Symbol Frequency tSCK(3) Low level tSCKL(3) Remarks SCK1(P15) VDD[V] min See Fig. 6. SCK1(P15) • CMOS output selected 1 2 • See Fig. 6. tSCKL(4) 2.5 to 5.5 pulse width High level 1/2 tSCK tSCKH(4) 1/2 pulse width Serial input Data setup time unit 1 tSCK(4) Low level max tCYC tSCKH(3) Frequency typ 2 2.5 to 5.5 pulse width High level Specification Conditions pulse width Output clock Serial clock Parameter SB1(P14), tsDI(2) SI1(P14) • Must be specified with respect to rising edge of 2.5 to 5.5 0.03 2.5 to 5.5 0.03 SIOCLK. Data hold time • See Fig. 6. thDI(2) Output delay time tdD0(4) SO1(P13), Serial output SB1(P14) • Must be specified with μs respect to falling edge of SIOCLK. • Must be specified as the time to the beginning of (1/3)tCYC 2.5 to 5.5 +0.05 output state change in open drain output mode. • See Fig. 6. Note 4-2-1: These specifications are theoretical values. Add margin depending on its use. Pulse Input Conditions at Ta = -40°C to +85°C, VSS1 = 0V Parameter Symbol Pin/Remarks Specification Conditions VDD[V] High/low level tPIH(1) INT0(P70), • Interrupt acceptable pulse width tPIL(1) INT1(P71), • Events to timer 0, 1 can be input. min typ 2.5 to 5.5 1 2.5 to 5.5 2 max unit INT2(P16) tPIH(2) INT3(P17) • Interrupt acceptable tPIL(2) (Noise rejection ratio • Events to timer 0 can be input. set to 1/1.) tPIH(3) INT3(P17) • Interrupt acceptable tPIL(3) (Noise rejection ratio • Events to timer 0 can be input. tCYC 2.5 to 5.5 64 set to 1/32.) tPIH(4) INT3(P17) • Interrupt acceptable tPIL(4) (Noise rejection ratio • Events to timer 0 can be input. 2.5 to 5.5 256 Reset possible 2.5 to 5.5 200 set to 1/128.) tPIL(5) RES μs No.A1122-13/19 LC876D16A/08A AD Converter Characteristics at Ta = -40°C to +85°C, VSS1 = 0V Parameter Symbol Pin/Remarks Specification Conditions VDD[V] Resolution N AN0(P00) to Absolute ET AN7(P07) tCAD (Note 6-1) max bit ±1.5 AD conversion time=32×tCYC 15.62 97.92 (tCYC= (tCYC= 0.488μs) 3.06μs) 4.5 to 5.5 (Note 6-2) 23.52 97.92 (tCYC= (tCYC= 0.735μs) 3.06μs) 18.82 97.92 3.0 to 5.5 AD conversion time=64×tCYC (ADCR2=1) 4.5 to 5.5 (Note 6-2) (tCYC= (tCYC= 0.294μs) 1.53μs) 47.04 97.92 (tCYC= (tCYC= 0.735μs) 1.53μs) VSS VDD 3.0 to 5.5 VAIN 3.0 to 5.5 voltage range Analog port IAINH VAIN=VDD 3.0 to 5.5 input current IAINL VAIN=VSS 3.0 to 5.5 unit 8 3.0 to 5.5 (ADCR2=0) Analog input typ 3.0 to 5.5 precision Conversion time min 1 -1 LSB μs V μA Note 6-1: Absolute precision not including quantizing error (±1/2 LSB). Note 6-2: Conversion time means time from executing AD conversion instruction to loading complete digital value to register. Consumption Current Characteristics at Ta = -40°C to +85°C, VSS1 = 0V Parameter Symbol Pin/ VDD[V] • FmCF=10Hz for ceramic resonator dissipation VDD1 =VDD2 during basic =VDD3 • System clock: 10MHz Current IDDOP(1) oscillation operation • Internal RC oscillation stopped. (Note 7-1) • 1/1 frequency division ratio IDDOP(2) • CF1=15MHz for external clock • System clock: CF1 oscillation • Internal RC oscillation stopped. • 1/2 frequency division ratio IDDOP(3) Specification Conditions Remarks • FmCF=4MHz for ceramic resonator oscillation min typ max 4.5 to 5.5 6.6 20 3.0 to 4.5 5.0 15 4.5 to 5.5 8.5 25 3.0 to 4.5 7.5 22 4.5 to 5.5 2.6 7.8 3.0 to 4.5 1.9 5.7 4.5 to 5.5 0.48 2.0 2.5 to 4.5 0.33 1.5 4.5 to 5.5 42 220 2.5 to 4.5 24 150 unit mA • System clock: 4MHz • Internal RC oscillation stopped. • 1/1 frequency division ratio IDDOP(4) • FmCF=0Hz (No oscillation) • System clock: RC oscillation • Divider set to 1/2 IDDOP(5) • FsX’tal=32.768kHz for crystal oscillation • System clock: 32.768KHz • Internal RC oscillation stopped. • 1/2 frequency division ratio μA Note 7-1: The currents of the output transistors and the pull-up MOS transistors are ignored. Continued on next page. No.A1122-14/19 LC876D16A/08A Continued from preceding page. Parameter Current Symbol IDDHALT(1) Pin/ dissipation VDD1 =VDD2 HALT mode =VDD3 Specification Conditions Remarks VDD[V] min typ max unit HALT mode • FmCF=10MHz for Ceramic resonator 4.5 to 5.5 2.6 8.4 3.0 to 4.5 1.8 5.4 4.5 to 5.5 3.8 11.4 3.0 to 4.5 2.2 6.6 4.5 to 5.5 1.2 3.6 2.5 to 4.5 0.8 2.4 4.5 to 5.5 300 1000 2.5 to 4.5 210 630 4.5 to 5.5 37 95 2.5 to 4.5 20 60 oscillation • System clock: 10MHz (Note 7-1) • Internal RC oscillation stopped. • Divider: 1/1 IDDHALT(2) HALT mode • CF1=15MHz for external clock • System clock: CF1 oscillation mA • Internal RC oscillation stopped. • Divider 1/2 IDDHALT(3) HALT mode • FmCF=4MHz for Ceramic resonator oscillation • System clock: 4MHz • Internal RC oscillation stopped. • Divider: 1/1 IDDHALT(4) HALT mode • FmCF=0Hz (When oscillation stops.) • System clock: RC oscillation • Divider: 1/2 IDDHALT(5) HALT mode • FsX’tal=32.768kHz for crystal oscillation • Internal RC oscillation stopped. • System clock: 32.768kHz • Divider: 1/2 Current IDDHOLD(1) VDD1 • CF1=VDD or open circuit dissipation HOLD mode Current μA HOLD mode (when using external clock) IDDHOLD(2) VDD1 Date/time 0.02 20 2.5 to 4.5 0.01 15 4.5 to 5.5 35 85 2.5 to 4.5 18 55 Date/time clock HOLD mode • CF1=VDD or open circuit dissipation 4.5 to 5.5 (when using external clock) • FsX’tal=32.768kHz for crystal oscillation clock HOLD mode Note 7-1: The currents of the output transistors and the pull-up MOS transistors are ignored. Characteristics of a Sample Main System Clock Oscillation Circuit The characteristics in the table bellow is based on the following conditions: 1. Use the standard evaluation board SANYO has provided. 2. Use the peripheral parts with indicated value externally. 3. The peripheral parts value is a recommended value of oscillator manufacturer. Table 1. Main system clock oscillation circuit characteristics using ceramic resonator Circuit Parameters Frequency 4MHz 10MHz Manufacturer MURATA MURATA Oscillator C1 C2 Rd1 Rf1 Operating Oscillation Supply Sstabilizing Time Voltage Range typ max [ms] [ms] [pF] [pF] [Ω] [Ω] [V] CSTCR4M00G53-R0 15 15 2.2k Open 2.2 to 5.5 2.2 to 5.5 CSTLS4M00G53-B0 15 15 2.2k Open CSTCE10M0G52-R0 10 10 1k Open 2.8 to 5.5 CSTLS10M0G53095-B0 15 15 1k Open 2.9 to 5.5 Notes The oscillation stabilizing time is a period until the oscillation becomes stable after VDD becomes higher than minimum operating voltage. (Refer to Figure 4) No.A1122-15/19 LC876D16A/08A Characteristics of a Sample Subsystem Clock Oscillator Circuit The characteristics in the table bellow is based on the following conditions: 1. Use the standard evaluation board SANYO has provided. 2. Use the peripheral parts with indicated value externally. 3. The peripheral parts value is a recommended value of oscillator manufacturer Table 2 Subsystem clock oscillation circuit characteristics using crystal oscillator Circuit Parameters Frequency Manufacturer Oscillator Operating Oscillation Supply Voltage Stabilizing Time C3 C4 Rd2 Rf2 Range typ max [pF] [pF] [Ω] [Ω] [V] [s] [s] Notes The oscillation stabilizing time is a period until the oscillation becomes stable after executing the instruction which starts the sub-clock oscillation or after releasing the HOLD mode. (Refer to Figure 4) Notes: Since the circuit pattern affects the oscillation frequency, place the oscillation-related parts as close to the oscillation pins as possible with the shortest possible pattern length. CF1 XT1 CF2 Rf1 C1 Rf2 Rd1 C2 XT2 C3 CF Rd2 C4 X’tal Figure 1 Ceramic Oscillation Circuit Figure 2 Crystal Oscillation Circuit 0.5VDD Figure 3 AC Timing Measurement Point No.A1122-16/19 LC876D16A/08A VDD VDD limit Power supply 0V Reset time RES Internal RC oscillation tmsCF CF1, CF2 tmsX’tal XT1, XT2 Operating mode Unfixed Reset Instruction execution Reset Time and Oscillation Stabilization Time HOLD reset signal Without HOLD reset signal HOLD reset signal VALID Internal RC oscillation tmsCF CF1,CF2 tmsX’tal XT1, XT2 Operating mode HOLD HALT HOLD Reset Signal and Oscillation Stabilization Time Figure 4 Oscillation Stabilization Time No.A1122-17/19 LC876D16A/08A VDD Note: Set CRES, RRES values such that reset time exceeds 200μs. RRES RES CRES Figure 5 Reset Circuit SIOCLK: DATAIN: DI0 DI1 DI2 DI3 DI4 DI5 DI6 DI7 DI8 DATAOUT: DO0 DO1 DO2 DO3 DO4 DO5 DO6 DO7 DO8 Data RAM transmission period (only SIO0) tSCK tSCKL tSCKH SIOCLK: tsDI thDI DATAIN: tdDO DATAOUT: Data RAM transmission period (only SIO0) tSCKL tSCKHA SIOCLK: tsDI thDI DATAIN: tdDO DATAOUT: Figure 6 Serial I/O Waveform tPIL tPIH Figure 7 Pulse Input Timing Signal Waveform No.A1122-18/19 LC876D16A/08A SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein. SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of SANYO Semiconductor Co.,Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the SANYO Semiconductor Co.,Ltd. product that you intend to use. Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. Upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's intellectual property rights which has resulted from the use of the technical information and products mentioned above. This catalog provides information as of February, 2008. Specifications and information herein are subject to change without notice. PS No.A1122-19/19