FAIRCHILD FQD16N25CTM_12

QFET
FQD16N25C
250V N-Channel MOSFET
tm
Features
Description
•
•
•
•
•
•
•
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary, planar
stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the avalanche
and commutation mode. These devices are well suited for high
efficiency switching DC/DC converters, switch mode power
supplies, DC-AC converters for uninterrupted power supplies
and motor controls.
16A, 250V, RDS(on) = 0.27Ω @VGS = 10 V
Low gate charge ( typical 41 nC)
Low Crss ( typical 68 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
RoHS compliant
D
D
G
G
D-PAK
S
FQD Series
S
Absolute Maximum Ratings
Symbol
Parameter
FQD16N25C
Units
VDSS
Drain-Source Voltage
250
V
ID
Drain Current
- Continuous (TC = 25°C)
16
A
10.1
A
IDM
Drain Current
- Pulsed
64
A
- Continuous (TC = 100°C)
(Note 1)
± 30
V
432
mJ
VGSS
Gate-Source Voltage
EAS
Single Pulsed Avalanche Energy
(Note 2)
IAR
Avalanche Current
(Note 1)
16
A
EAR
Repetitive Avalanche Energy
(Note 1)
160
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
PD
Power Dissipation (TC = 25°C)
TJ, TSTG
Operating and Storage Temperature Range
TL
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
- Derate above 25°C
5.5
V/ns
160
W
1.28
W/°C
-55 to +150
°C
300
°C
Thermal Characteristics
Symbol
Parameter
FQD16N25C
Units
RθJC
Thermal Resistance, Junction-to-Case
0.78
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
110
°C/W
©2012 Fairchild Semiconductor Corporation
FQD16N25C Rev. C0
1
www.fairchildsemi.com
FQD16N25C 250V N-Channel MOSFET
September 2012
®
Device Marking
Device
FQD16N25C
FQD16N25CTM
D-PAK
380mm
16mm
2,500
FQD16N25C
FQD16N25CTF
D-PAK
380mm
16mm
2,000
Electrical Characteristics
Symbol
Package
Reel Size
Tape Width
Quantity
TC = 25°C unless otherwise noted
Parameter
Test Conditions
Min
Typ
Max Units
250
--
--
V
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0 V, ID = 250 μA
ΔBVDSS/
ΔTJ
Breakdown Voltage Temperature Coefficient
ID = 250 μA, Referenced to 25°C
--
0.31
--
V/°C
IDSS
Zero Gate Voltage Drain Current
VDS = 250 V, VGS = 0 V
--
--
10
μA
VDS = 200 V, TC = 125°C
--
--
100
μA
IGSSF
Gate-Body Leakage Current, Forward
VGS = 30 V, VDS = 0 V
--
--
100
nA
IGSSR
Gate-Body Leakage Current, Reverse
VGS = -30 V, VDS = 0 V
--
--
-100
nA
2.0
--
4.0
V
--
0.22
0.27
Ω
--
10.5
--
S
--
830
1080
pF
--
170
220
pF
--
68
89
pF
--
15
40
ns
--
130
270
ns
--
135
280
ns
--
105
220
ns
--
41
53.5
nC
--
5.6
--
nC
--
22.7
--
nC
--
--
16
A
On Characteristics
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250 μA
RDS(on)
Static Drain-Source On-Resistance
VGS = 10 V, ID = 8A
gFS
Forward Transconductance
VDS = 40 V, ID =8 A
(Note 4)
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 25 V, VGS = 0 V,
f = 1.0 MHz
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
VDD = 125 V, ID = 16A,
RG = 25 Ω
(Note 4, 5)
VDS = 200 V, ID = 16A,
VGS = 10 V
(Note 4, 5)
Gate-Drain Charge
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
ISM
Maximum Pulsed Drain-Source Diode Forward Current
--
--
64
A
VSD
Drain-Source Diode Forward Voltage
VGS = 0 V, IS = 16 A
--
--
1.5
V
trr
Reverse Recovery Time
260
--
ns
Reverse Recovery Charge
VGS = 0 V, IS = 16 A,
dIF / dt = 100 A/μs
--
Qrr
--
2.47
--
μC
(Note 4)
NOTES:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 2.7mH, IAS = 16A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 16A, di/dt ≤300A/μs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test : Pulse width ≤ 300μs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
FQD16N25C Rev. C0
2
www.fairchildsemi.com
FQD16N25C 250V N-Channel MOSFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
VGS
15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
5.0 V
Bottom : 4.5 V
Top :
ID, Drain Current [A]
1
ID, Drain Current [A]
1
10
0
10
10
o
150 C
o
25 C
o
-55 C
0
10
∝ Notes :
1. 250レs Pulse Test
2. TC = 25∩
∝ Notes :
1. VDS = 40V
2. 250レs Pulse Test
-1
10
-1
-1
0
10
10
1
10
10
2
4
6
8
10
VGS, Gate-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperatue
IDR, Reverse Drain Current [A]
RDS(ON) [ヘ ],
Drain-Source On-Resistance
1.5
1.0
VGS = 10V
0.5
VGS = 20V
∝ Note : TJ = 25∩
0.0
1
10
0
10
150∩
∝ Notes :
1. VGS = 0V
2. 250レs Pulse Test
-1
0
10
20
30
40
10
50
0.2
0.4
0.6
Figure 5. Capacitance Characteristics
3000
VGS, Gate-Source Voltage [V]
Capacitance [pF]
Ciss
Coss
Crss
1000
0
-1
10
∝ Notes :
1. VGS = 0 V
2. f = 1 MHz
1.4
1.6
1.8
VDS = 50V
10
VDS = 125V
VDS = 200V
8
6
4
2
∝ Note : ID = 15.6A
0
10
0
1
10
0
10
20
30
40
50
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]
FQD16N25C Rev. C0
1.2
12
2000
1500
1.0
Figure 6. Gate Charge Characteristics
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
2500
0.8
VSD, Source-Drain voltage [V]
ID, Drain Current [A]
500
25∩
3
www.fairchildsemi.com
FQD16N25C 250V N-Channel MOSFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
RDS(ON), (Normalized)
Drain-Source On-Resistance
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
1.2
1.1
1.0
∝ Notes :
1. VGS = 0 V
2. ID = 250 レA
0.9
0.8
-100
-50
0
50
100
150
2.5
2.0
1.5
1.0
∝ Notes :
1. VGS = 10 V
2. ID = 8.9 A
0.5
0.0
-100
200
-50
0
50
100
150
200
o
o
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
20
Operation in This Area
is Limited by R DS(on)
2
15
10 μs
ID, Drain Current [A]
ID, Drain Current [A]
10
100 μs
1ms
1
10
10ms
100ms
DC
0
10
10
5
* Notes :
o
1. TC = 25 C
o
2. TJ = 150 C
3. Single Pulse
0
-1
10
10
0
1
10
10
25
2
50
75
100
125
150
o
TC, Case Temperature [ C]
VDS, Drain-SourceVoltage[V]
Figure 11. Transient Thermal Response Curve
0
10
Z? JC(t), Thermal Response
D=0.5
0.2
-1
10
0.1
0.05
PDM
0.02
0.01
t1
-2
10
single pulse
-5
10
-4
10
-3
10
t2
* Notes :
0
1. Z? JC(t) = 0.78 C/W Max.
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * Z? JC(t)
-2
10
-1
10
0
10
1
10
t1, Square Wave Pulse Duration [sec]
FQD16N25C Rev. C0
4
www.fairchildsemi.com
FQD16N25C 250V N-Channel MOSFET
Typical Performance Characteristics (Continued)
FQD16N25C 250V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FQD16N25C Rev. C0
5
www.fairchildsemi.com
FQD16N25C 250V N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
FQD16N25C Rev. C0
6
www.fairchildsemi.com
FQD16N25C 250V N-Channel MOSFET
Mechanical Dimensions
D-PAK
Dimensions in Millimeters
FQD16N25C Rev. C0
7
www.fairchildsemi.com
tm
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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expected to result in a significant injury of the user.
2.
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Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
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No Identification Needed
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Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I61
FQD16N25C Rev. C0
8
www.fairchildsemi.com
FQD16N25C 250V N-Channel MOSFET
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