uClamp0524P Low Voltage TVS for ESD Protection PROTECTION PRODUCTS - MicroClampTM Description Features The µClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD, lightning, and other voltage-induced transient events. Each device will protect up to four lines operating at 5 volts. TM Transient protection for data lines to The µClampTM0524P is a solid-state device designed specifically for transient suppression. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDAs. It features large cross-sectional area junctions for conducting high transient currents. It offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. Mechanical Characteristics The µClampTM0524P may be used to meet the immunity requirements of IEC 61000-4-2, level 4 (±15kV air, ±8kV contact discharge). The “flow-thru” design of the device results in enhanced ESD performance due to reduced board trace inductance. The result is lower clamping voltage and a higher level of protection when compared to conventional TVS devices. Circuit Diagram 8 2 SLP2116P8 package RoHS/WEEE Compliant Nominal Dimensions: 2.1 x 1.6 x 0.58 mm Lead Pitch: 0.5mm Lead Finish: NiPd Marking: Orientation Mark and Marking Code Packaging: Tape and Reel per EIA 481 Applications The µClamp0524P is in an 8-pin, RoHS/WEEE compliant, SLP2116P8 package. It measures 2.1 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and notebook computers. 1 IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Small package for use in portable electronics Protects four I/O lines Working voltage: 5V Flow thru design for easy layout Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology Cellular Handsets & Accessories Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Package 7 3 6 4 2.10 5 1 2 1.60 0.50 BSC 0.58 GND Device Schematic Revision 1/25/2006 8 Pin SLP package (Bottom Side View) 2.1 x 1.6 x 0.58mm (Nominal) 1 www.semtech.com uClamp0524P PROTECTION PRODUCTS Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Ppk 240 Watts Maximum Peak Pulse Current (tp = 8/20µs) Ipp 16 Amps ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VPP +/- 20 +/- 15 kV Operating Temperature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temperature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C Forward Voltage VF IF = 10mA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 9.8 V Clamp ing Voltage VC IPP = 16A, tp = 8/20µs 12.5 V Junction Cap acitance Cj VR = 0V, f = 1MHz 160 pF 2006 Semtech Corp. 2 6 V 5 0.80 µA V www.semtech.com uClamp0524P PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 100 % of Rated Power or I PP Peak Pulse Power - PPP (kW) 90 1 0.1 80 70 60 50 40 30 20 10 0 0 0.01 0.1 1 10 100 25 50 75 100 125 150 Ambient Temperature - TA (oC) 1000 Pulse Duration - tp (µs) Clamping Voltage vs. Peak Pulse Current Forward Voltage vs. Forward Current 4.5 12 4 Forward Voltage - VF (V) Clamping Voltage -VC (V) 10 8 6 4 Waveform Parameters: tr = 8µs td = 20µs 2 3.5 3 2.5 2 1.5 Waveform Parameters: tr = 8µs td = 20µs 1 0.5 0 0 0 2 4 6 8 10 Peak Pulse Current - IPP (A) 12 14 16 18 0 4 8 12 16 Forward Current - IF (A) ESD Clamping (8kV Contact per IEC 61000-4-2) Junction Capacitance vs. Reverse Voltage 1 f = 1 MHz 0.9 CJ(VR) / CJ(VR=0) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2006 Semtech Corp. 2 3 Reverse Voltage - VR (V) 4 5 3 www.semtech.com uClamp0524P PROTECTION PRODUCTS Applications Information Figure 1 - Circuit Diagram Device Connection Options The µClamp0524P is designed to protect four lines. It will present a high impedance to the protected line up to 5 volts. The device is unidirectional and may be used on lines where the signal polarity is above ground. 1 Flow Thru Layout The µClamp0524P is designed for ease of PCB layout by allowing the traces to enter one side of the device and exit the other side. Figure 2 shows the recommended way to design the PCB board traces in order to use the flow through layout. The solid line represents the PCB trace. Note that the PCB traces enter at the input pin and exit from the opposite pin. (pin 1 to pin 8, pin 2 to pin 7, pin 3 to pin 6, pin 4 to pin 5). For example, line 1 enters at pin 1 and exits at Pin 8. The bottom tab is connected to ground. This connection should be made directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. 2 7 3 6 4 5 GND Figure 2 - PCB Trace Layout In 1 In 2 In 3 In 4 Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. 2006 Semtech Corp. 8 4 Out 1 Out 2 Out 3 Out 4 www.semtech.com uClamp0524P PROTECTION PRODUCTS Applications Information Board Layout Comparison to MLVs Figure 3 - Layout Example Traditionally, single line devices such as MLVs have been a favorite solution for ESD protection in portable applications mainly due to their small size. Single-line solutions, are easy for designers to “sprinkle” around the board wherever ESD protection is needed. However, although each MLV takes up a small area on its own, when used as a multiple-line solution on board, PCB designers must consider that the total board space that each device takes up includes not only the package itself, but also the courtyard, or the “keep-out” area of the land pattern and the connecting traces. Using 0402 MLV in a 8-line connector protection as an example, although each 0402 MLV takes up about 0.5mm2, the total land pattern and courtyard area needed to reflow the MLVs accurately is about 31.2 mm2. Furthermore, because each MLV is spaced out from its neighboring MLVs, the signal traces used to connect from the connector pins to the each MLV are also spread out, and therefore, add to the total board area used. 18 1 The µClamp0524P presents a more compact solution. Each µClamp0524P integrates 4 TVS in a single, lowprofile SLP package. Using the same example of an 8line connector application, only two µClamp0524Ps are required to protect all 8 lines. While each µclamp0524P uses about 3.36mm2 in board area, the total area required for two devices to protect 8 lines, including the package area and the “keep out” area, is only 17.6mm2. Comparing to the 31.2 mm2 in area that 8 MLVs need, two µClamp0524Ps provide a board savings of approximately 77%! Furthermore, since each µClamp0524P offers flow-through design, the signal traces can be routed directly to the devices from the connector pins without taking extra board space. 2006 Semtech Corp. Layout using 2 each uClamp0524P requires less than 18mm2 of board space. 5 www.semtech.com uClamp0524P PROTECTION PRODUCTS Applications Information - Spice Model uClamp0524P Spice Model Table 1 - uClamp0524P Spice Parameters 2006 Semtech Corp. Parameter Unit D1 (T VS) IS Amp 2.53e-12 BV Volt 7.08 VJ Volt 0.71 RS Ohm 0.129 IB V Amp 1.0E-3 CJO Farad 140e-12 TT sec 2.541E-9 M -- 0.385 N -- 1.1 EG eV 1.11 6 www.semtech.com uClamp0524P PROTECTION PRODUCTS Outline Drawing - SLP2116P8 A B D DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX E PIN 1 INDICATOR (LASER MARK) A SEATING PLANE aaa C A2 A1 C D1 A A1 A2 b D D1 E E1 e L N aaa bbb .020 .023 .026 - .001 .002 (.006) .007 .010 .012 .079 .083 .087 .061 .067 .071 .059 .063 .067 .010 .016 .020 .020 BSC .011 .013 .015 6 .003 .004 0.50 0.58 0.65 0.00 .003 0.05 (0.15) 0.20 0.25 0.30 2.00 2.10 2.20 1.55 1.70 1.80 1.50 1.60 1.70 0.25 0.40 0.50 0.50 BSC 0.28 0.33 0.38 6 0.08 0.10 1 2 LxN E/2 E1 N bxN bbb e C A B D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP2116P8 P X DIMENSIONS Z F G (C) Y DIM B C F G P X Y Z INCHES .071 .060 .018 .035 .020 .012 .025 .085 MILLIMETERS 1.80 1.52 0.45 0.89 0.50 0.30 0.63 2.15 B NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2006 Semtech Corp. 7 www.semtech.com uClamp0524P PROTECTION PRODUCTS Marking Ordering Information 0524P PIN 1 INDICATOR Part Number Working Voltage Device Marking Qty per Reel Reel Size uClamp0524P.TCT 5V 0524P 3,000 7 Inch MicroClamp, uClamp and µClamp are marks of Semtech Corporation Tape and Reel Specification Device Orientation in Tape A0 1.96 +/-0.05 mm B0 K0 2.31 +/-0.05 mm 0.74 +/-0.05 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.8 mm ±0.05 (.031) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2006 Semtech Corp. 8 www.semtech.com