MICROCHIP TC1262

TC1262
500mA Fixed Output CMOS LDO
2
TC1262
1
3
3-Pin SOT-223
Tab is GND
Front View
Device Selection Table
TC1262
Part Number
Package
Junction
Temp. Range
TC1262-xxVDB
3-Pin SOT-223
-40°C to +125°C
TC1262-xxVAB
3-Pin TO-220
-40°C to +125°C
TC1262-xxVEB
3-Pin DDPAK
-40°C to +125°C
NOTE: xx indicates output voltages.
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
3
VOUT
2
GND
1
VIN
2
3
GND
1
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
Tab is GND
TC1262
VIN
•
•
•
•
•
•
•
Front View
Tab is GND
VOUT
Applications
3-Pin DDPAK
3-Pin TO-220
VIN
Very Low Dropout Voltage
500mA Output Current
High Output Voltage Accuracy
Standard or Custom Output Voltages
Over Current and Over Temperature Protection
GND
•
•
•
•
•
Package Type
VOUT
Features
General Description
The TC1262 is a fixed output, high accuracy (typically
±0.5%) CMOS low dropout regulator. Designed specifically for battery-operated systems, the TC1262’s
CMOS construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80µA at full load (20 to 60 times lower than
in bipolar regulators).
TC1262 key features include ultra low noise operation,
very low dropout voltage (typically 350mV at full load),
and fast response to step changes in load.
The TC1262 incorporates both over temperature and
over current protection. The TC1262 is stable with an
output capacitor of only 1µF and has a maximum
output current of 500mA. It is available in 3-Pin
SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages.
Typical Application
VIN
VIN
VOUT
TC1262
VOUT
+
C1
1µF
GND
 2002 Microchip Technology Inc.
DS21373B-page 1
TC1262
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V
Operating Temperature Range...... -40°C < TJ < 125°C
Storage Temperature.......................... -65°C to +150°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1262 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 100µA, CL = 3.3µF, TA = 25°C, unless otherwise noted. Boldface type
specifications apply for junction temperatures of -40°C to +125°C.
Min
Typ
Max
Units
VIN
Symbol
Input Operating Voltage
Parameter
2.7
—
6.0
V
500
—
IOUTMAX
Maximum Output Current
VOUT
Output Voltage
∆VOUT/∆T
VOUT Temperature Coefficient
—
∆VOUT/∆VIN
Line Regulation
—
∆VOUT/VOUT
Load Regulation
—
VIN-VOUT
Dropout Voltage
—
—
—
Test Conditions
Note 7
—
mA
—
VR + 2.5%
V
40
—
ppm/°C
.003
0.35
%/V
0.002
0.01
%/mA
20
60
200
350
30
130
390
650
mV
IL = 100µA
IL = 100mA
IL = 300mA
IL = 500mA (Note 4)
—
VR ±0.5%
VR – 2.5%
—
Note 1
Note 2
(VR + 1V) ≤ VIN ≤ 6V
IL = 0.1mA to IOUTMAX (Note 3)
IDD
Supply Current
—
80
130
µA
IL = 0
PSRR
Power Supply Rejection Ratio
—
64
—
dB
FRE ≤ 1kHz
IOUTSC
Output Short Circuit Current
—
1200
—
mA
VOUT = 0V
∆VOUT/∆PD
Thermal Regulation
—
0.04
—
V/W
Note 5
eN
Output Noise
—
260
—
nV/√Hz
Note
1:
2:
3:
4:
5:
6:
7:
IL = IOUTMAX, FRE = 10kHz
VR is the regulator output voltage setting.
TC VOUT = (VOUT MAX – VOUT MIN) x 10 6
VOUT x ∆T
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θ JA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX.
DS21373B-page 2
 2002 Microchip Technology Inc.
TC1262
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(3-Pin SOT-223)
(3-Pin TO-220)
(3-Pin DDPAK)
3.0
Symbol
Description
1
VIN
2
GND
Ground terminal.
3
VOUT
Regulated voltage output.
Unregulated supply input.
DETAILED DESCRIPTION
3.1
The TC1262 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1262’s supply current does
not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to ILOADMAX load current range (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 3-1 shows a typical application circuit.
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
+
+
VIN
C1
1µF
TC1262
Battery
–
VOUT
+
VOUT
C2
1µF
Output Capacitor
A 1µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance greater than 0.1Ω and less than 5Ω, and a
resonant frequency above 1MHz. A 1µF capacitor
should be connected from VIN to GND if there is more
than 10 inches of wire between the regulator and the
AC filter capacitor, or if a battery is used as the power
source. Aluminum electrolytic or tantalum capacitor
types can be used. (Since many aluminum electrolytic
capacitors freeze at approximately -30°C, solid
tantalums are recommended for applications operating
below -25°C.) When operating from sources other than
batteries, supply-noise rejection and transient
response can be improved by increasing the value of
the input and output capacitors and employing passive
filtering techniques.
GND
 2002 Microchip Technology Inc.
DS21373B-page 3
TC1262
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
Where:
PD =
VINMAX =
VOUTMIN =
ILOADMAX =
Worst case actual power dissipation
Maximum voltage on VIN
Minimum regulator output voltage
Maximum output (load) current
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(θJA).
Table 4-1 and Table 4-2 show various values of θJA for
the TC1262 packages.
THERMAL RESISTANCE
GUIDELINES FOR TC1262 IN
SOT-223 PACKAGE
Board
Area
2500 sq mm 2500 sq mm 2500 sq mm
Thermal
Resistance
(θJA)
45°C/W
1000 sq mm 2500 sq mm 2500 sq mm
45°C/W
225 sq mm
2500 sq mm 2500 sq mm
53°C/W
100 sq mm
2500 sq mm 2500 sq mm
59°C/W
1000 sq mm 1000 sq mm 1000 sq mm
52°C/W
1000 sq mm
55°C/W
0 sq mm
Board
Area
Thermal
Resistance
(θJA)
2500 sq mm 2500 sq mm 2500 sq mm
25°C/W
1000 sq mm 2500 sq mm 2500 sq mm
27°C/W
125 sq mm
35°C/W
2500 sq mm 2500 sq mm
*Tab of device attached to topside copper
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
VINMAX
= 3.3V ± 10%
VOUTMIN = 2.7V ± 0.5%
ILOADMAX = 275mA
TJMAX
= 125°C
TAMAX
= 95°C
θJA
= 59°C/W (SOT-223)
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
= 260mW
Where all terms are previously defined.
Copper
Area
(Backside)
Copper
Area
(Backside)
= [(3.3 x 1.1) – (2.7 x .995)]275 x 10–3
PDMAX = (TJMAX – TAMAX)
θJA
Copper
Area
(Topside)*
Copper
Area
(Topside)*
THERMAL RESISTANCE
GUIDELINES FOR TC1262 IN
3-PIN DDPAK/TO-220
PACKAGE
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
EQUATION 4-2:
TABLE 4-1:
TABLE 4-2:
1000 sq mm
Maximum allowable power dissipation:
PDMAX = (TJMAX – TAMAX)
θJA
= (125 – 95)
59
= 508mW
In this example, the TC1262 dissipates a maximum of
260mW; below the allowable limit of 508mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN, is found by sustituting the maximum allowable
power dissipation of 508mW into Equation 4-1, from
which VINMAX = 4.6V.
*Tab of device attached to topside copper
DS21373B-page 4
 2002 Microchip Technology Inc.
TC1262
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Line Regulation vs. Temperature
Output Noise vs. Frequency
0.020
RLOAD = 50µΩ
COUT = 1µF
0.018
0.0090
0.016
0.014
NOISE (µV/√Hz)
LINE REGULATION (%)
Load Regulation vs. Temperature
0.0100
10.0
LOAD REGULATION (%/mA)
5.0
0.012
0.010
0.008
0.006
1.0
0.1
0.004
0.002
0.000
-40°C
0.0
0°C
25°C
70°C
85°C
125°C
0.01
0.01
TEMPERATURE (°C)
1
100
1000
0.0070
0.0060
0.0050
0.0040
IDD vs. Temperature
1mA to 500mA
2.5V
0.0030
0.0020
1mA to 500mA
5V
0.0010
0.0100
-40°C
0°C
5V
45
30
85°C
0.40
DROPOUT VOLTAGE (V)
2.5V
75
DROPOUT VOLTAGE (V)
105
60
70°C
25°C
0.30
125°C
125°C
0°C
0.20
-40°C
0.10
0.40
85°C
0.30
70°C
25°C
0.20
0°C
0.10
-40°C
15
0
-40°C
0.00
0°C
25°C
70°C
85°C 125°C
0.00
0
100
TEMPERATURE (°C)
2.5V VOUT vs. Temperature
IL = 0.1mA
2.50
VOUT (V)
2.30
IL = 300mA
A
IL = 500mA
A
5.20
5.10
5.00
4.90
4.80
4.70
4.60
4.40
4.30
1.70
4.20
4.10
4.00
-40°C
0°C
25°C
70°C
85°C
TEMPERATURE (°C)
 2002 Microchip Technology Inc.
125°C
500
0
100
200
300
400
ILOAD (mA)
500
IL = 0.1mA
IL
IL
4.50
1.90
1.50
-40°C
200
300
400
ILOAD (mA)
5.0V VOUT vs. Temperature
2.70
VOUT (V)
85°C
LOAD
0.50
125°C
120
90
70°C
2.5V Dropout Voltage vs. ILOAD
0.50
135
2.10
25°C
TEMPERATURE (°C)
FREQUENCY (kHz)
150
IDD (µA)
10
0.0080
0°C
25°C
70°C
85°C
125°C
TEMPERATURE (°C)
DS21373B-page 5
TC1262
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 3-Pin SOT-223 Devices
User Direction of Feed
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
3-Pin SOT-223
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
4000
13 in
Component Taping Orientation for 3-Pin DDPAK Devices
PIN 1
User Direction of Feed
Device
Marking
W
P
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
3-Pin DDPAK
DS21373B-page 6
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
24 mm
16 mm
750
13 in
 2002 Microchip Technology Inc.
TC1262
6.3
Package Dimensions
3-Pin SOT-223
.264 (6.70)
.248 (6.30)
.122 (3.10)
.114 (2.90)
.287 (7.30) .146 (3.70)
.264 (6.70) .130 (3.30)
.041 (1.04)
.033 (0.84)
PIN 1
.091 (2.30) TYP.
.031 (0.80)
.024 (0.60)
.071
(1.80)
MAX.
.013 (0.33)
.009 (0.24)
10° MAX.
.004 (0.10)
.001 (0.02)
.181 (4.60) TYP.
.036 (0.91) MIN.
Dimensions: inches (mm)
3-Pin TO-220
.185 (4.70)
.165 (4.19)
.113 (2.87)
.103 (2.62)
.410 (10.41)
.357 (9.06)
.156 (3.96)
.146 (3.71)
DIA.
.055 (1.40)
.045 (1.14)
.258 (6.55)
.230 (5.84)
.594 (15.09)
.569 (14.45)
3° - 7.5°
5 PLCS.
.244 (6.20)
.234 (5.94)
.560 (14.22)
.518 (13.16)
.055 (1.40)
.045 (1.14)
.020 (0.51)
.012 (0.30)
.037 (0.94)
.027 (0.69)
.105 (2.67)
.095 (2.41)
PIN 1
.115 (2.92)
.095 (2.41)
.205 (5.21)
.195 (4.95)
Dimensions: inches (mm)
 2002 Microchip Technology Inc.
DS21373B-page 7
TC1262
6.3
Package Dimensions (Continued)
3-Pin DDPAK
.183 (4.65)
.170 (4.32)
.410 (10.41)
.385 (9.78)
.067 (1.70)
.045 (1.14)
.055 (1.40)
.045 (1.14)
3° - 7°
(5x)
.370 (9.40)
.330 (8.38)
.605 (15.37)
.549 (13.95)
.010 (0.25)
.000 (0.00)
.051 (1.30)
.049 (1.24)
.026 (0.66)
.014 (0.36)
.110 (2.79)
.068 (1.72)
.037 (0.94)
.026 (0.66)
PIN 1
.100 (2.54) TYP.
8° MAX.
Dimensions: inches (mm)
DS21373B-page 8
 2002 Microchip Technology Inc.
TC1262
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21373B-page 9
TC1262
NOTES:
DS21373B-page 10
 2002 Microchip Technology Inc.
TC1262
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
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KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
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dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
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MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
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Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
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The Company’s quality system processes and
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 2002 Microchip Technology Inc.
DS21373B-page 11
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Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
05/01/02
*DS21373B*
DS21373B-page 12
 2002 Microchip Technology Inc.