MOTOROLA Freescale Semiconductor, Inc. Order this document by MRF5S19090L/D SEMICONDUCTOR TECHNICAL DATA MRF5S19090LR3 and MRF5S19090LSR3 replaced by MRF5S19090HR3 and MRF5S19090HSR3. “H” suffix indicates lower thermal resistance package. The RF MOSFET Line MRF5S19090LR3 RF Power Field Effect Transistors MRF5S19090LSR3 Designed for PCN and PCS base station applications with frequencies up to 1.9 to 2.0 GHz. Suitable for TDMA, CDMA and multicarrier amplifier applications. • Typical 2 - Carrier N - CDMA Performance for VDD = 28 Volts, IDQ = 850 mA, f1 = 1958.75 MHz, f2 = 1961.25 MHz IS - 95 CDMA (Pilot, Sync, Paging, Traffic Codes 8 Through 13) 1.2288 MHz Channel Bandwidth Carrier. Adjacent Channels Measured over a 30 kHz Bandwidth at f1 - 885 kHz and f2 +885 kHz. Distortion Products Measured over 1.2288 MHz Bandwidth at f1 - 2.5 MHz and f2 +2.5 MHz. Peak/Avg. = 9.8 dB @ 0.01% Probability on CCDF. Output Power — 18 Watts Avg. Power Gain — 14.5 dB Efficiency — 25.8% ACPR — - 51 dB IM3 — - 37 dBc • Internally Matched, Controlled Q, for Ease of Use • High Gain, High Efficiency and High Linearity • Integrated ESD Protection • Designed for Maximum Gain and Insertion Phase Flatness • Capable of Handling 10:1 VSWR, @ 28 Vdc, 1960 MHz, 90 Watts CW Output Power • Excellent Thermal Stability • Characterized with Series Equivalent Large - Signal Impedance Parameters • Qualified Up to a Maximum of 32 VDD Operation • Low Gold Plating Thickness on Leads. L Suffix Indicates 40µ″ Nominal. • In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel. 1990 MHz, 18 W AVG., 2 x N - CDMA, 28 V LATERAL N - CHANNEL RF POWER MOSFETs CASE 465- 06, STYLE 1 NI - 780 MRF5S19090LR3 CASE 465A - 06, STYLE 1 NI - 780S MRF5S19090LSR3 MAXIMUM RATINGS Rating Symbol Value Unit Drain - Source Voltage VDSS 65 Vdc Gate - Source Voltage VGS - 0.5, +15 Vdc Total Device Dissipation @ TC = 25°C Derate above 25°C PD 261 1.49 Watts W/°C Storage Temperature Range Tstg - 65 to +200 °C Operating Junction Temperature TJ 200 °C Symbol Value (1,2) Unit THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction to Case Case Temperature 80°C, 90 W CW Case Temperature 80°C, 18 W CW RθJC 0.67 0.75 °C/W (1) MTTF calculator available at http://www.motorola.com/semiconductors/rf . Select Tools/Software/Application Software/Calculators to access the MTTF calculators by product. (2) Refer to AN1955/D, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.motorola.com/semiconductors/rf . Select Documentation/Application Notes - AN1955. NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed. REV 1 MOTOROLA RF DEVICE DATA Motorola, Inc. 2004 MRF5S19090LR3 MRF5S19090LSR3 1 For ForMore MoreInformation InformationOn OnThis ThisProduct, Product, Go Goto: to:www.freescale.com www.freescale.com ARCHIVE INFORMATION ARCHIVE INFORMATION Freescale Semiconductor, Inc. N - Channel Enhancement - Mode Lateral MOSFETs Freescale Semiconductor, Inc. ESD PROTECTION CHARACTERISTICS Test Conditions Class Human Body Model 1 (Minimum) Machine Model M3 (Minimum) Charge Device Model C7 (Minimum) ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Zero Gate Voltage Drain Leakage Current (VDS = 65 Vdc, VGS = 0 Vdc) IDSS — — 10 µAdc Zero Gate Voltage Drain Leakage Current (VDS = 28 Vdc, VGS = 0 Vdc) IDSS — — 1 µAdc Gate - Source Leakage Current (VGS = 5 Vdc, VDS = 0 Vdc) IGSS — — 1 µAdc Gate Threshold Voltage (VDS = 10 Vdc, ID = 200 µAdc) VGS(th) 2.5 2.7 3.5 Vdc Gate Quiescent Voltage (VDS = 28 Vdc, ID = 850 mAdc) VGS(Q) — 3.7 — Vdc Drain - Source On - Voltage (VGS = 10 Vdc, ID = 2 Adc) VDS(on) — 0.26 — Vdc Forward Transconductance (VDS = 10 Vdc, ID = 2 Adc) gfs — 5 — S Crss — 1.7 — pF ON CHARACTERISTICS (DC) DYNAMIC CHARACTERISTICS Reverse Transfer Capacitance (1) (VDS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc) FUNCTIONAL TESTS (In Motorola Test Fixture, 50 ohm system) 2 - Carrier N - CDMA, 1.2288 MHz Channel Bandwidth Carriers. ACPR measured in 30 kHz Bandwidth and IM3 measured in 1.2288 MHz Bandwidth. Peak/Avg. Ratio = 9.8 dB @ 0.01% Probability on CCDF. Common - Source Amplifier Power Gain (VDD = 28 Vdc, Pout = 18 W Avg., IDQ = 850 mA, f1 = 1930 MHz, f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 =1990 MHz) Gps 13.5 14.5 — dB Drain Efficiency (VDD = 28 Vdc, Pout = 18 W Avg., IDQ = 850 mA, f1 = 1930 MHz, f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 =1990 MHz) η 24 25.8 — % IM3 — - 37 - 35 dBc ACPR — - 51 - 48 dBc IRL — - 14.5 -9 dB Third Order Intermodulation Distortion (VDD = 28 Vdc, Pout = 18 W Avg., IDQ = 850 mA, f1 = 1930 MHz, f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 =1990 MHz); IM3 measured over 1.2288 MHz bandwidth at f1 - 2.5 MHz and f2 = +2.5 MHz) Adjacent Channel Power Ratio (VDD = 28 Vdc, Pout = 18 W Avg., IDQ = 850 mA, f1 = 1930 MHz, f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 =1990 MHz); ACPR measured over 30 kHz bandwidth at f1 - 885 kHz and f2 +885 kHz) Input Return Loss (VDD = 28 Vdc, Pout = 18 W Avg., IDQ = 850 mA, f1 = 1930 MHz, f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 =1990 MHz) (1) Part is internally matched both on input and output. MRF5S19090LR3 MRF5S19090LSR3 For More Information On This Product, 2 Go to: www.freescale.com MOTOROLA RF DEVICE DATA ARCHIVE INFORMATION Freescale Semiconductor, Inc. ARCHIVE INFORMATION OFF CHARACTERISTICS Freescale Semiconductor, Inc. B1 VGG W1 + R1 C3 R2 C4 C5 + + R3 C8 C7 C13 C11 + C9 C12 VDD + C10 R4 C6 Z9 Z6 Z1 Z2 Z3 Z4 Z5 Z6 Z7 Z2 Z3 C15 C14 0.140″ 0.450″ 0.140″ 0.525″ 0.636″ 0.340″ 0.320″ Z4 Z5 Z8 Z10 Z11 Z12 Z7 Z13 RF OUTPUT C2 C1 x 0.080″ Microstrip x 0.080″ Microstrip x 0.080″ Microstrip x 0.080″ Microstrip x 0.141″ Microstrip x 0.050″ Microstrip x 1.401″ Microstrip Z8 Z9 Z10 Z11 Z12 Z13 PCB 0.091″ x 1.133″ Microstrip 0.542″ x 0.071″ Microstrip 0.450″ x 1.133″ Microstrip 0.640″ x 0.141″ Microstrip 0.316″ x 0.080″ Microstrip 1.209″ x 0.080″ Microstrip Arlon GX - 0300 - 55 - 22, 30 mil, εr = 2.55 Figure 1. MRF5S19090 Test Circuit Schematic Table 1. MRF5S19090 Test Circuit Component Designations and Values Part Description Value, P/N or DWG Manufacturer B1 Short RF Bead 95F786 Newark C1 22 pF Chip Capacitor, B Case 100B220CP 500X ATC C2 10 pF Chip Capacitor, B Case 100B100CP 500X ATC C3, C13 1 µF, 50 V SMT Tantalum Capacitors T494C105(1)050AS Kemet C4, C12 0.1 µF Chip Capacitors, B Case CDR33BX104AKWS Kemet C5, C11 1k pF Chip Capacitors, B Case 100B102JP 500X ATC C6, C7 4.3 pF Chip Capacitors, B Case 100B4R3JP 500X ATC C8 10 µF, 35 V SMT Tantalum Capacitor T494D106(1)035AS Kemet C9, C10 22 µF, 35 V SMT Tantalum Capacitors T494X226(1)035AS Kemet C14 2.7 pF Chip Capacitor, B Case 100B2.7BP 500X ATC C15 0.6 – 4.5 Gigatrim Variable Capacitor 44F3358 Newark R1 1 kW Chip Resistor D5534M07B1K00R Newark R2 560 kW Chip Resistor CR1206 564JT Newark R3, R4 12 W Chip Resistors RM73B2B120JT Garrett Electronics W1 1 turn 14 gauge wire MOTOROLA RF DEVICE DATA MRF5S19090LR3 MRF5S19090LSR3 3 For More Information On This Product, Go to: www.freescale.com ARCHIVE INFORMATION ARCHIVE INFORMATION Freescale Semiconductor, Inc. RF INPUT Z1 DUT Freescale Semiconductor, Inc. C8 C13 C7 R1 R3 B1 W1 C6 C11 C12 R2 C3 C4C5 C14 Freescale Semiconductor, Inc. ARCHIVE INFORMATION C15 C9 CUT OUT AREA C1 VDD R4 C10 C2 MRF5S19090 Rev 02 Figure 2. MRF5S19090 Test Circuit Component Layout MRF5S19090LR3 MRF5S19090LSR3 For More Information On This Product, 4 Go to: www.freescale.com MOTOROLA RF DEVICE DATA ARCHIVE INFORMATION VGG Freescale Semiconductor, Inc. Gps η 30 VDD = 28 Vdc, Pout = 18 W (Avg.), IDQ = 850 mA 2−Carrier N−CDMA, 2.5 MHz Carrier Spacing 1.2288 MHz Channel Bandwidth Peak/Avg. = 9.8 dB @ 0.01% Probability (CCDF) 12 10 IRL 20 −20 IM3 8 −40 −20 −30 −40 −50 f, FREQUENCY (MHz) Figure 3. 2 - Carrier N - CDMA Broadband Performance −15 IDQ = 1300 mA 16 15 1100 mA 850 mA 650 mA 14 13 450 mA VDD = 28 Vdc f1 = 1958.75 MHz, f2 = 1961.25 MHz Two−Tone Measurement, 2.5 MHz Tone Spacing 12 1 10 IM3, THIRD ORDER INTERMODULATION DISTORTION (dBc) 17 G ps , POWER GAIN (dB) VDD = 28 Vdc f1 = 1958.75 MHz, f2 = 1961.25 MHz Two−Tone Measurement, 2.5 MHz Tone Spacing −20 −25 −30 −35 IDQ = 450 mA −40 1100 mA 1300 mA −45 −50 850 mA 650 mA −55 100 1 10 100 Pout, OUTPUT POWER (WATTS) PEP Pout, OUTPUT POWER (WATTS) PEP Figure 4. Two - Tone Power Gain versus Output Power Figure 5. Third Order Intermodulation Distortion versus Output Power −25 56 Ideal 55 −30 Pout , OUTPUT POWER (dBm) ARCHIVE INFORMATION −10 6 −60 1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 2060 2080 IMD, INTERMODULATION DISTORTION (dBc) Freescale Semiconductor, Inc. ACPR 0 IM3 (dBc), ACPR (dBc) G ps , POWER GAIN (dB) 14 3rd Order −35 −40 5th Order −45 7th Order P3dB = 51.21 dBm (132.13 W) 54 53 P1dB = 50.82 dBm (120.78 W) 52 51 Actual 50 49 48 VDD = 28 Vdc, IDQ = 850 mA Pulsed CW, 8 µsec(on), 1 msec(off) Center Frequency = 1960 MHz 47 −50 VDD = 28 Vdc, Pout = 90 W (PEP), IDQ = 850 mA Two−Tone Measurements, Center Frequency = 1960 MHz −55 0.1 1 10 46 45 31 32 33 34 35 36 37 38 39 40 41 TWO−TONE SPACING (MHz) Pin, INPUT POWER (dBm) Figure 6. Intermodulation Distortion Products versus Tone Spacing Figure 7. Pulse CW Output Power versus Input Power MOTOROLA RF DEVICE DATA 42 MRF5S19090LR3 MRF5S19090LSR3 5 For More Information On This Product, Go to: www.freescale.com ARCHIVE INFORMATION 40 η, DRAIN EFFICIENCY (%) 16 IRL, INPUT RETURN LOSS (dB) TYPICAL CHARACTERISTICS Freescale Semiconductor, Inc. 40 −25 VDD = 28 Vdc, IDQ = 850 mA f1 = 1958.75 MHz, f2 = 1961.25 MHz 2 x N−CDMA, 2.5 MHz @ 1.2288 MHz Bandwidth Peak/Avg. = 9.8 dB @ 0.01% Probability (CCDF) 35 30 −30 η 25 −35 −40 IM3 20 −45 Gps 15 −50 η 10 −55 ACPR 5 −60 −65 1 10 Figure 8. 2 - Carrier N - CDMA ACPR, IM3, Power Gain and Drain Efficiency versus Output Power 0 109 −10 MTBF FACTOR (HOURS x AMPS2 ) 1.2288 MHz Channel BW −20 −IM3 @ 1.2288 MHz Integrated BW −30 +IM3 @ 1.2288 MHz Integrated BW −40 −50 −60 −70 −ACPR @ 30 kHz Integrated BW +ACPR @ 30 kHz Integrated BW −80 108 107 106 100 −90 120 140 160 180 200 220 TJ, JUNCTION TEMPERATURE (°C) −100 −7.5 −6 −4.5 −3 −1.5 0 1.5 3 4.5 f, FREQUENCY (MHz) Figure 9. 2 - Carrier N - CDMA Spectrum 6 7.5 This above graph displays calculated MTBF in hours x ampere2 drain current. Life tests at elevated temperatures have correlated to better than ±10% of the theoretical prediction for metal failure. Divide MTBF factor by ID2 for MTBF in a particular application. Figure 10. MTBF Factor versus Junction Temperature MRF5S19090LR3 MRF5S19090LSR3 For More Information On This Product, 6 Go to: www.freescale.com MOTOROLA RF DEVICE DATA ARCHIVE INFORMATION 0 Pout, OUTPUT POWER (WATTS) AVG. (dB) Freescale Semiconductor, Inc. ARCHIVE INFORMATION IM3 IM3 (dBc), ACPR (dBc) η, DRAIN EFFICIENCY (%), G ps , POWER GAIN (dB) TYPICAL CHARACTERISTICS Freescale Semiconductor, Inc. f = 1990 MHz Zo = 10 Ω Zload* f = 1930 MHz f = 1990 MHz ARCHIVE INFORMATION Freescale Semiconductor, Inc. ARCHIVE INFORMATION Zsource f = 1930 MHz VDD = 28 V, IDQ = 850 mA, Pout = 18 W Avg. f MHz Zsource Ω Zload Ω 1930 2.98 - j5.12 2.07 - j1.31 1960 3.36 - j4.65 2.02 - j1.18 1990 4.06 - j4.64 1.93 - j1.01 Zsource = Test circuit impedance as measured from gate to ground. Zload = Test circuit impedance as measured from drain to ground. Output Matching Network Device Under Test Input Matching Network Z source Z load Figure 11. Series Equivalent Input and Output Impedance MOTOROLA RF DEVICE DATA MRF5S19090LR3 MRF5S19090LSR3 7 For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. ARCHIVE INFORMATION Freescale Semiconductor, Inc. ARCHIVE INFORMATION NOTES MRF5S19090LR3 MRF5S19090LSR3 For More Information On This Product, 8 Go to: www.freescale.com MOTOROLA RF DEVICE DATA Freescale Semiconductor, Inc. ARCHIVE INFORMATION ARCHIVE INFORMATION Freescale Semiconductor, Inc. NOTES MOTOROLA RF DEVICE DATA MRF5S19090LR3 MRF5S19090LSR3 9 For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. ARCHIVE INFORMATION Freescale Semiconductor, Inc. ARCHIVE INFORMATION NOTES MRF5S19090LR3 MRF5S19090LSR3 For More Information On This Product, 10 Go to: www.freescale.com MOTOROLA RF DEVICE DATA Freescale Semiconductor, Inc. PACKAGE DIMENSIONS G Q bbb 2X 1 M T A M B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M−1994. 2. CONTROLLING DIMENSION: INCH. 3. DELETED 4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY FROM PACKAGE BODY. M 3 B K 2 (FLANGE) D bbb M T A M B M M bbb ARCHIVE INFORMATION Freescale Semiconductor, Inc. R (INSULATOR) N M T A M B M ccc M T A S (LID) ccc H (LID) B M M T A M B M aaa M T A M (INSULATOR) B M M C F E A T A SEATING PLANE (FLANGE) CASE 465 - 06 ISSUE F NI - 780 MRF5S19090LR3 4X Z (LID) K 2X 2 B D bbb M T A M B M N R (LID) ccc M M T A M B M M B M ccc M T A M aaa M T A M S (INSULATOR) bbb M T A (LID) B M (INSULATOR) B M E A A (FLANGE) MOTOROLA RF DEVICE DATA DIM A B C D E F H K M N R S U Z aaa bbb ccc INCHES MIN MAX 0.805 0.815 0.380 0.390 0.125 0.170 0.495 0.505 0.035 0.045 0.003 0.006 0.057 0.067 0.170 0.210 0.774 0.786 0.772 0.788 0.365 0.375 0.365 0.375 −−− 0.040 −−− 0.030 0.005 REF 0.010 REF 0.015 REF MILLIMETERS MIN MAX 20.45 20.70 9.65 9.91 3.18 4.32 12.57 12.83 0.89 1.14 0.08 0.15 1.45 1.70 4.32 5.33 19.61 20.02 19.61 20.02 9.27 9.53 9.27 9.52 −−− 1.02 −−− 0.76 0.127 REF 0.254 REF 0.381 REF STYLE 1: PIN 1. DRAIN 2. GATE 5. SOURCE H C 3 MILLIMETERS MIN MAX 33.91 34.16 9.65 9.91 3.18 4.32 12.57 12.83 0.89 1.14 0.08 0.15 27.94 BSC 1.45 1.70 4.32 5.33 19.66 19.96 19.60 20.00 3.00 3.51 9.27 9.53 9.27 9.52 0.127 REF 0.254 REF 0.381 REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M−1994. 2. CONTROLLING DIMENSION: INCH. 3. DELETED 4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY FROM PACKAGE BODY. 1 (FLANGE) INCHES MIN MAX 1.335 1.345 0.380 0.390 0.125 0.170 0.495 0.505 0.035 0.045 0.003 0.006 1.100 BSC 0.057 0.067 0.170 0.210 0.774 0.786 0.772 0.788 .118 .138 0.365 0.375 0.365 0.375 0.005 REF 0.010 REF 0.015 REF STYLE 1: PIN 1. DRAIN 2. GATE 3. SOURCE 4X U (FLANGE) B DIM A B C D E F G H K M N Q R S aaa bbb ccc F T SEATING PLANE CASE 465A - 06 ISSUE F NI - 780S MRF5S19090LSR3 MRF5S19090LR3 MRF5S19090LSR3 11 For More Information On This Product, Go to: www.freescale.com ARCHIVE INFORMATION B Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. 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Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong 852-26668334 HOME PAGE: http://motorola.com/semiconductors MRF5S19090LR3 MRF5S19090LSR3 MOTOROLA RF DEVICE DATA More Information On This Product, For For More Information On This Product, 12 Go to: www.freescale.com ◊ Go to: www.freescale.com MRF5S19090L/D