ONSEMI 2N5655

2N5655, 2N5657
Plastic NPN Silicon
High−Voltage Power
Transistor
These devices are designed for use in line−operated equipment such
as audio output amplifiers; low−current, high−voltage converters; and
AC line relays.
0.5 AMPERE
POWER TRANSISTORS
NPN SILICON
250−350 VOLTS, 20 WATTS
Features
• Excellent DC Current Gain −
•
•
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hFE = 30−250 @ IC = 100 mAdc
Current−Gain − Bandwidth Product −
fT = 10 MHz (Min) @ IC = 50 mAdc
Pb−Free Packages are Available*
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MAXIMUM RATINGS (Note 1)
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Symbol
2N5655
2N5657
Unit
VCEO
250
350
Vdc
VCB
275
375
Vdc
VEB
6.0
Vdc
IC
0.5
1.0
Adc
Base Current
IB
1.0
Adc
Total Device Dissipation @ TC = 25°C
Derate above 25°C
PD
20
0.16
W
W/°C
TJ, Tstg
– 65 to + 150
°C/W
Symbol
Max
Unit
qJC
6.25
°C/W
Collector Current −
Continuous
Peak
Operating and Storage Junction
Temperature Range
TO−225AA
CASE 77−09
STYLE 1
MARKING DIAGRAM
YWW
2
N565xG
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
Junction−to−Case
Y
WW
2N565x
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Indicates JEDEC registered data.
G
= Year
= Work Week
= Device Code
x = 5 or 7
= Pb−Free Package
ORDERING INFORMATION
Device
2N5655
2N5655G
2N5657
2N5657G
Package
Shipping
TO−225
500 Units / Bulk
TO−225
(Pb−Free)
500 Units / Bulk
TO−225
500 Units / Bulk
TO−225
(Pb−Free)
500 Units / Bulk
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 9
1
Publication Order Number:
2N5655/D
2N5655, 2N5657
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ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted) (Note 2)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage
(IC = 100 mAdc (inductive), L = 50 mH)
2N5655
2N5657
VCEO(sus)
250
350
−
−
Vdc
Collector−Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)
2N5655
2N5657
V(BR)CEO
250
350
−
−
Vdc
Collector Cutoff Current
(VCE = 150 Vdc, IB = 0)
(VCE = 250 Vdc, IB = 0)
2N5655
2N5657
−
−
0.1
0.1
Collector Cutoff Current
(VCE = 250 Vdc, VEB(off) = 1.5 Vdc)
(VCE = 350 Vdc, VEB(off) = 1.5 Vdc)
(VCE = 150 Vdc, VEB(off) = 1.5 Vdc, TC = 100_C)
(VCE = 250 Vdc, VEB(off) = 1.5 Vdc, TC = 100_C)
2N5655
2N5657
2N5655
2N5657
−
−
−
−
0.1
0.1
1.0
1.0
Collector Cutoff Current
(VCB = 275 Vdc, IE = 0)
(VCB = 375 Vdc, IE = 0)
2N5655
2N5657
−
−
10
10
−
10
25
30
15
5.0
−
250
−
−
−
−
−
1.0
2.5
10
VBE
−
1.0
Vdc
fT
10
−
MHz
Output Capacitance (VCB = 10 Vdc, IE = 0, f = 100 kHz)
Cob
−
25
pF
Small−Signal Current Gain (IC = 100 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
hfe
20
−
−
ICEO
mAdc
ICEX
mAdc
mAdc
ICBO
Emitter Cutoff Current (VEB = 6.0 Vdc, IC = 0)
IEBO
mAdc
ON CHARACTERISTICS
DC Current Gain (Note 3)
(IC = 50 mAdc, VCE = 10 Vdc)
(IC = 100 mAdc, VCE = 10 Vdc)
(IC = 250 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)
hFE
Collector−Emitter Saturation Voltage (Note 3)
(IC = 100 mAdc, IB = 10 mAdc)
(IC = 250 mAdc, IB = 25 mAdc)
(IC = 500 mAdc, IB = 100 mAdc)
−
VCE(sat)
Base−Emitter Voltage (IC = 100 mAdc, VCE = 10 Vdc) (Note 3)
Vdc
DYNAMIC CHARACTERISTICS
Current−Gain − Bandwidth Product (IC = 50 mAdc, VCE = 10 Vdc, f = 10 MHz) (Note 4)
Indicates JEDEC registered data for 2N5655 Series.
Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
fT is defined as the frequency at which |hfe| extrapolates to unity.
40
PD, POWER DISSIPATION (WATTS)
2.
3.
4.
30
50 mH
X
20
200
TO SCOPE
Hg RELAY
+
10
25
50 V
Y
300
0
+
6.0 V
50
75
100
TC, CASE TEMPERATURE (°C)
125
−
1.0
150
Figure 1. Power Derating
Figure 2. Sustaining Voltage Test Circuit
Safe Area Limits are indicated by Figures 3 and 4. Both limits are applicable and must be observed.
http://onsemi.com
2
2N5655, 2N5657
1.0
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate I C − V CE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 3 is based on T J(pk) = 150_C; TC is
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided T J(pk)
v 150_C. At high case temperatures, thermal limitations
will reduce the power that can be handled to values less than
the limitations imposed by second breakdown.
IC, COLLECTOR CURRENT (AMP)
10 ms
0.5
500 ms
TJ = 150°C
0.2
1.0 ms
dc
Second Breakdown Limit
Thermal Limit @ TC = 25°C
Bonding Wire Limit
Curves apply below rated VCEO
2N5655
0.1
0.05
0.02
0.01
2N5657
20
30 40
60
100
200 300 400
VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
600
Figure 3. Active−Region Safe Operating Area
300
100
70
VCE = 10 V
VCE = 2.0 V
TJ = +150°C
+100°C
50
+ 25°C
30
20
10
1.0
−55 °C
2.0
3.0
5.0
7.0
10
20
30
50
IC, COLLECTOR CURRENT (mA)
70
100
Figure 4. Current Gain
1.0
0.8
V, VOLTAGE (VOLTS)
hFE , DC CURRENT GAIN
200
VBE(sat) @ IC/IB = 10
VBE @ VCE = 10 V
0.6
0.4
VCE(sat) @ IC/IB = 10
0.2
TJ = + 25°C
IC/IB = 5.0
0
10
20
30
50
100
200 300
IC, COLLECTOR CURRENT (mA)
Figure 5. “On” Voltages
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3
500
200
300
500
2N5655, 2N5657
300
TJ = + 25°C
200
C, CAPACITANCE (pF)
Cib
100
70
50
30
20
10
0.1
Cob
0.2
0.5
1.0 2.0
5.0
10 20
VR, REVERSE VOLTAGE (VOLTS)
50
100
Figure 6. Capacitance
10
IC/IB = 10
VCC = 300 V, VBE(off) = 2.0 V
(2N5657, only)
VCC = 100 V, VBE(off) = 0 V
tr
5.0
2.0
t, TIME (s)
μ
1.0
0.5
0.2
td
0.1
0.05
0.02
0.01
1.0
2.0
5.0
10
20
50
100
IC, COLLECTOR CURRENT (mA)
200
500
Figure 7. Turn−On Time
10
IC/IB = 10
t, TIME (s)
μ
5.0
ts
2.0
tf
1.0
VCC = 100 V
0.5
VCC = 300 V
(Type 2N5657, only)
0.2
0.1
1.0
2.0
5.0
10
20
50
100
IC, COLLECTOR CURRENT (mA)
Figure 8. Turn−Off Time
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4
200
500
2N5655, 2N5657
PACKAGE DIMENSIONS
TO−225
CASE 77−09
ISSUE Z
−B−
U
F
Q
−A−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 077−01 THRU −08 OBSOLETE, NEW STANDARD
077−09.
C
M
1 2 3
H
DIM
A
B
C
D
F
G
H
J
K
M
Q
R
S
U
V
K
J
V
G
S
R
0.25 (0.010)
A
M
M
B
M
D 2 PL
0.25 (0.010)
M
A
M
B
M
INCHES
MIN
MAX
0.425
0.435
0.295
0.305
0.095
0.105
0.020
0.026
0.115
0.130
0.094 BSC
0.050
0.095
0.015
0.025
0.575
0.655
5_ TYP
0.148
0.158
0.045
0.065
0.025
0.035
0.145
0.155
0.040
−−−
MILLIMETERS
MIN
MAX
10.80
11.04
7.50
7.74
2.42
2.66
0.51
0.66
2.93
3.30
2.39 BSC
1.27
2.41
0.39
0.63
14.61
16.63
5 _ TYP
3.76
4.01
1.15
1.65
0.64
0.88
3.69
3.93
1.02
−−−
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. BASE
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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5
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2N5655/D