ONSEMI MMVL109T1G

MMVL109T1
Preferred Device
Silicon Epicap Diodes
Designed for general frequency control and tuning applications;
providing solid−state reliability in replacement of mechanical tuning
methods.
Features
•
•
•
•
High Q with Guaranteed Minimum Values at VHF Frequencies
Controlled and Uniform Tuning Ratio
Surface Mount Package
Pb−Free Package is Available
http://onsemi.com
26−32 pF VOLTAGE VARIABLE
CAPACITANCE DIODES
1
CATHODE
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
VR
30
Vdc
Peak Forward Current
IF
200
mAdc
Symbol
Max
Unit
200
1.57
mW
mW/°C
2
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board
TA = 25°C (Note 1)
Derate above 25°C
2
ANODE
1
PLASTIC
SOD−323
CASE 477
STYLE 1
PD
Thermal Resistance, Junction−to−Ambient
RqJA
635
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−55 to +150
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−5 Minimum Pad
MARKING DIAGRAM
4A M G
G
4A = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping †
MMVL109T1
SOD−323 3000 / Tape & Reel
MMVL109T1G
SOD−323 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 1
1
Publication Order Number:
MMVL109T1/D
MMVL109T1
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted.)
Characteristic
Reverse Breakdown Voltage (IR = 10 mAdc)
Symbol
Min
Typ
Max
Unit
V(BR)R
30
−
−
Vdc
IR
−
−
0.1
mAdc
TCC
−
300
−
ppm/°C
Reverse Voltage Leakage Current (VR = 25 Vdc)
Diode Capacitance Temperature Coefficient
(VR = 3.0 Vdc, f = 1.0 MHz)
Device
MMVL109T1
Ct, Diode Capacitance
VR = 3.0 Vdc, f = 1.0 MHz
pF
Q, Figure of Merit
VR = 3.0 Vdc
f = 50 MHz
CR, Capacitance Ratio
C3/C25
f = 1.0 MHz (Note 2)
Min
Nom
Max
Min
Min
Max
26
29
32
200
5.0
6.5
2. CR is the ratio of Ct measured at 3 Vdc divided by Ct measured at 25 Vdc.
40
1000
32
Q, FIGURE OF MERIT
CT , CAPACITANCE − pF
36
28
24
20
16
12
VR = 3 Vdc
TA = 25°C
100
f = 1.0 MHz
TA = 25°C
8
4
1
3
10
30
10
100
1000
Figure 1. DIODE CAPACITANCE
Figure 2. FIGURE OF MERIT
VR = 20 Vdc
2.0
1.0
0.6
0.2
0.1
0.06
−40
100
f, FREQUENCY (MHz)
100
60
20
10
6.0
0.02
0.01
0.006
0.002
0.001
−60
10
VR, REVERSE VOLTAGE (VOLTS)
C t , DIODE CAPACITANCE (NORMALIZED)
I R , REVERSE CURRENT (nA)
0
−20
0
+20
+40
+60
1.04
1.03
1.02
1.01
1.00
0.99
0.98
0.97
0.96
−75
+80 +100 +120 +140
VR = 3.0 Vdc
f = 1.0 MHz
Ct [ Cc + Cj
−50
−25
0
+25
+50
+75
TA, AMBIENT TEMPERATURE
TA, AMBIENT TEMPERATURE
Figure 3. LEAKAGE CURRENT
Figure 4. DIODE CAPACITANCE
http://onsemi.com
2
+100
+125
MMVL109T1
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
HE
D
b
1
2
E
MILLIMETERS
DIM MIN
NOM MAX
A
0.80
0.90
1.00
A1 0.00
0.05
0.10
A3
0.15 REF
b
0.25
0.32
0.4
C 0.089
0.12 0.177
D
1.60
1.70
1.80
E
1.15
1.25
1.35
L
0.08
HE
2.30
2.50
2.70
A3
A
C
NOTE 3
L
NOTE 5
A1
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
MIN
0.031
0.000
STYLE 1:
PIN 1. CATHODE
2. ANODE
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: [email protected]
http://onsemi.com
3
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MMVL109T1/D