SANYO FTD2017R

FTD2017R
Ordering number : ENA0472
SANYO Semiconductors
DATA SHEET
N-Channel Silicon MOSFET
FTD2017R
General-Purpose Switching Device
Applications
Features
•
•
•
•
•
Low ON-resistance.
2.5V drive.
Mount height 1.1mm.
Composite type, facilitating high-density mounting.
Drain common specifications.
Specifications
Absolute Maximum Ratings at Ta=25°C
Parameter
Symbol
Conditions
Ratings
Unit
Drain-to-Source Voltage
VDSS
20
Gate-to-Source Voltage
VGSS
±12
V
6
A
Drain Current (DC)
ID
Drain Current (Pulse)
V
IDP
PD
PW≤10µs, duty cycle≤1%
40
A
Mounted on a ceramic board (1000mm2✕0.8mm)1unit
1.2
W
PT
Tch
Mounted on a ceramic board (1000mm2✕0.8mm)
Channel Temperature
Storage Temperature
Tstg
Allowable Power Dissipation
Total Dissipation
1.25
W
150
°C
--55 to +150
°C
Electrical Characteristics at Ta=25°C
Parameter
Drain-to-Source Breakdown Voltage
Zero-Gate Voltage Drain Current
Gate-to-Source Leakage Current
Cutoff Voltage
Forward Transfer Admittance
Static Drain-to-Source On-State Resistance
Marking : D2017R
Symbol
V(BR)DSS
IDSS
IGSS
Conditions
ID=1mA, VGS=0V
VDS=20V, VGS=0V
VGS(off)
yfs
VGS= ±8V, VDS=0V
VDS=10V, ID=1mA
VDS=10V, ID=6A
RDS(on)1
RDS(on)2
ID=6A, VGS=4.5V
ID=6A, VGS=4V
RDS(on)3
RDS(on)4
ID=3A, VGS=3.1V
ID=3A, VGS=2.5V
Ratings
min
typ
Unit
max
20
V
±10
µA
µA
1.3
V
1
0.5
6.9
11.5
11
17
23
mΩ
S
12
18
24
mΩ
14
19
30
mΩ
14.4
20
33
mΩ
Continued on next page.
Any and all SANYO Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in
serious physical and/or material damage. Consult with your SANYO Semiconductor representative
nearest you before usingany SANYO Semiconductor products described or contained herein in such
applications.
SANYO Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition
ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor
products described or contained herein.
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
N1506PA TI IM TC-00000296 No. A0472-1/4
FTD2017R
Continued from preceding page.
Parameter
Symbol
Ratings
Conditions
min
typ
max
Unit
Turn-ON Delay Time
td(on)
See specified Test Circuit.
960
ns
Rise Time
tr
td(off)
See specified Test Circuit.
2700
ns
See specified Test Circuit.
5500
ns
tf
See specified Test Circuit.
5400
ns
Turn-OFF Delay Time
Fall Time
Total Gate Charge
Qg
nC
Qgs
VDS=10V, VGS=4.5V, ID=6A
VDS=10V, VGS=4.5V, ID=6A
10
Gate-to-Source Charge
1
nC
Gate-to-Drain “Miller” Charge
Qgd
VDS=10V, VGS=4.5V, ID=6A
4
Diode Forward Voltage
VSD
IS=6A, VGS=0V
Package Dimensions
8
3.0
7
6
1 : Drain
2 : Source1
3 : Source1
4 : Gate1
5 : Gate2
6 : Source2
7 : Source2
8 : Drain
1
4
1.0
1 : Drain
2 : Source1
3 : Source1
4 : Gate1
5 : Gate2
6 : Source2
7 : Source2
8 : Drain
0.05
6.4
4.5
0.5
5
SANYO : TSSOP8
0.25
0.95
V
5
0.125
8
nC
1.2
Electrical Connection
unit : mm (typ)
7006A-005
0.95
0.83
0.425
0.65
Top view
1
2
3
4
Switching Time Test Circuit
VDD=10V
VIN
4.5V
0V
ID=5A
RL=2Ω
VIN
D
VOUT
PW=10µs
D.C.≤1%
G
P.G
Rg
FTD2017R
50Ω
S
Rg=2.4kΩ
No. A0472-2/4
FTD2017R
ID -- VDS
8
6
5
4
3
25°C
2
7
--25°C
Drain Current, ID -- A
3
9
3.1
4
VDS=6V
V
1.5
S=
G
V
V
10V 7 .5 V 4 .5
V
Drain Current, ID -- A
5
ID -- VGS
10
Ta=75
°C
4 .0
2.5V
V
6
2
1
1
0
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
Drain-to-Source Voltage, VDS -- V
0
40
ID=6A
30
3A
25
20
15
10
5
2
4
6
8
10
Gate-to-Source Voltage, VGS -- V
2
12
1V
3A
I D=
25
yfs -- ID
,
3A
I D=
15
, VG
6A
I D=
V
4.0
S=
VG
6A,
I D=
10
5
0
--50
50
100
150
200
IT11788
IS -- VSD
10
VGS=0V
5
°C
25
3
C
5°
--2
=
°C
Tc
75
2
1.0
7
5
3
2
3
2
1.0
7
5
3
2
0.1
2
3
2
5 7 0.1
3
5 7 1.0
2
3
5 7 10
IT11789
Drain Current, ID -- A
0
Gate-to-Source Voltage, VGS -- V
7
tf
3
2
tr
td(on)
1000
0.6
0.8
1.0
1.2
IT11790
VGS -- Qg
VDS=10V
ID=6A
9
5
0.4
10
td(off)
10000
0.2
Diode Forward Voltage, VSD -- V
SW Time -- ID
2
Switching Time, SW Time -- ns
=2.
VGS
7
10
7
5
8
7
6
5
4
3
2
1
7
5
0.1
5V
4.
S=
5V
20
Case Temperature, Tc -- °C
VDS=10V
0.1
7
0.01
2.5
IT11786
3.
S=
, VG
30
IT11787
Source Current, IS -- A
Forward Transfer Admittance, yfs -- S
3
2.0
35
0
--100
0
0
1.5
RDS(on) -- Tc
40
Static Drain-to-Source
On-State Resistance, RDS(on) -- mΩ
45
1.0
Gate-to-Source Voltage, VGS -- V
Ta=25°C
35
0.5
IT11785
RDS(on) -- VGS
50
Static Drain-to-Source
On-State Resistance, RDS(on) -- mΩ
0.40
Tc=75
°C
25°C
--25°C
0
0
2
3
5
7
1.0
2
Drain Current, ID -- A
3
5
7
10
IT11323
0
1
2
3
4
5
6
7
8
Total Gate Charge, Qg -- nC
9
10
IT11791
No. A0472-3/4
FTD2017R
ASO
≤10µs
IDP=40A
10
7
5
3
2
10
ms
0m
s
DC
op
era
tio
Operation in this area
is limited by RDS(on).
0.1
7
5
3
2
10
0
1m µs
s
10
ID=6A
1.0
7
5
3
2
n
Ta=25°C
Single pulse
Mounted on a ceramic board (1000mm2✕0.8mm) 1unit
0.01
0.01
2
3
5 7 0.1
2
3
5 7 1.0
2
3
5 7 10
Drain-to-Source Voltage, VDS -- V
Allowable Power Dissipation(FET1), PD -- W
PD -- Ta
1.4
Allowable Power Dissipation, PD -- W
Drain Current, ID -- A
100
7
5
3
2
Mounted on a ceramic board (1000mm2✕0.8mm)
1.25
1.2
1.0
0.8
To
t
0.6
1u
al
ni
t
di
ss
ip
ati
on
0.4
0.2
0
2 3
IT11852
0
20
40
60
80
100
120
140
Ambient Temperature, Ta -- °C
160
IT11853
PD(FET1) -- PD(FET2)
1.4
1.2
M
ou
nte
1.0
do
na
ce
ram
0.8
ic
bo
ard
0.6
(1
00
0m
m2
✕0
0.4
.8m
m)
0.2
0
0
0.2
0.4
0.6
0.8
1.0
1.2
Allowable Power Dissipation(FET2), PD -- W
1.4
IT11854
Note on usage : Since the FTD2017R is a MOSFET product, please avoid using this device in the vicinity
of highly charged objects.
Specifications of any and all SANYO Semiconductor products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state,
and are not guarantees of the performance, characteristics, and functions of the described products
as mounted in the customer's products or equipment. To verify symptoms and states that cannot be
evaluated in an independent device, the customer should always evaluate and test devices mounted
in the customer's products or equipment.
SANYO Semiconductor Co., Ltd. strives to supply high-quality high-reliability products. However, any
and all semiconductor products fail with some probability. It is possible that these probabilistic failures
could give rise to accidents or events that could endanger human lives, that could give rise to smoke or
fire, or that could cause damage to other property. When designing equipment, adopt safety measures
so that these kinds of accidents or events cannot occur. Such measures include but are not limited to
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or contained herein are controlled under any of applicable local export control laws and regulations, such
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or mechanical, including photocopying and recording, or any information storage or retrieval system,
or otherwise, without the prior written permission of SANYO Semiconductor Co., Ltd.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification"
for the SANYO Semiconductor product that you intend to use.
Information (including circuit diagrams and circuit parameters) herein is for example only; it is not
guaranteed for volume production. SANYO Semiconductor believes information herein is accurate
and reliable, but no guarantees are made or implied regarding its use or any infringements of
intellectual property rights or other rights of third parties.
This catalog provides information as of November, 2006. Specifications and information herein are subject
to change without notice.
PS No. A0472-4/4