SEMIKRON SKM200GB176DH10

SKM 200GB176D H10
Absolute Maximum Ratings
Symbol Conditions
IGBT
"
"78
:< *,
SEMITRANSTM 3
Trench IGBT Modules
1% *6(, 3
4 =)7#"=> ? "A
"A78
1% *6(, 3
4 "A-8
4( B +B < 4%( 3
"A-8
4( B +B < 4%( 3
Target Data
Characteristics
Symbol Conditions
IGBT
Typical Applications
# $ %&% '
&%( #
) *! +,
Remarks
# - . /0'
12 $
4&((
1 ( *46(,
9((
; 1(
' @( +++ / 4%( *41%,
#
#
3
@(((
14( *4@(,
9((
#
#
44((
#
14( *4@(,
9((
#
#
44((
#
Freewheeling diode
SKM 200GB176D H10
Units
# 4 +
1% *6(, 3
4 ! "
Values
Inverse diode
"A
"A78
Features
1% 3 $
:*
,
"*=,
: " #
: ( - < 1% *, 3
< 1% *, 3
: 4% < 1% *41%, 3
*,
" 4%( # : 4% F
$ $
: ( 1% 4 8E
7G/G
+ '
1% *41%, 3
$*,
$*,
41(( " 4%( #
7: 7: % D < 41% 3
: ; 4% 1% 3 $
min.
%1
typ.
max.
Units
%6
(4
4 *(C,
& *4(,
@
(9
41 *44,
69 *41,
#
D
1 *1@,
1@% *1C,
1(
A
A
A
419
49
4
*,
(9% *(%,
D
9 (
@%
& (
4@(
C9 *%6,
H
Inverse diode
A *=,
"778
I
"A 4%( #B : ( B < 1% *41%,
3
< 1% *41%, 3
< 1% *41%, 3
"A 4%( #B < 41% * , 3
$0$ 9&(( #0J
: ( 4
4 %
4&
44
9&
4C%
%1
49
1&
D
#
J
94
H
Thermal characteristics
7
*<',
7
*<',N
":K
" N$
(41
(1%
L0M
L0M
7
*',
$
((96
L0M
%
%
>
>
91%
Mechanical data
8
8
O 8
8
9
1%
GB
1
15-12-2005 SCT
© by SEMIKRON
SKM 200GB176D H10
Fig. 1 Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2 Rated current vs. temperature IC = f (TC)
Fig. 3 Typ. turn-on /-off energy = f (IC)
Fig. 4 Typ. turn-on /-off energy = f (RG)
Fig. 5 Typ. transfer characteristic
Fig. 6 Typ. gate charge characteristic
2
15-12-2005 SCT
© by SEMIKRON
SKM 200GB176D H10
Fig. 7 Typ. switching times vs. IC
Fig. 8 Typ. switching times vs. gate resistor RG
Fig. 9 Transient thermal impedance of IGBT
Fig. 10 Transient thermal impedance of FWD
Zthp(j-c) = f (tp); D = tp/tc = tp*f
Zthp(j-c) = f (tp); D = tp/tc = tp*f
Fig. 11 CAL diode forward characteristic
Fig. 12 Typ. CAL diode peak reverse recovery current
3
15-12-2005 SCT
© by SEMIKRON
SKM 200GB176D H10
Fig. 13 Typ. CAL diode recovered charge
UL Recognized
File no. E 63 532
Dimensions in mm
:K
N %
N %
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX.
This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee
expressed or implied is made regarding delivery, performance or suitability.
4
15-12-2005 SCT
© by SEMIKRON