EMIF02-MIC01F2 2-line IPAD™, EMI filter including ESD protection Features ■ 2-line symetrical low-pass filter ■ Lead-free package ■ High-density capacitor ■ High-efficiency EMI filtering ■ Very small PCB footprint: 1.42 mm x 1.92 mm ■ Very thin package: 0.65 mm ■ High-efficiency ESD suppression (IEC 61000-4-2 level 4) ■ Flip Chip 11 bumps Figure 1. Pin configuration (bump side view) High reliability offered by monolithic integration Complies with the standards: ■ 3 4 2 1 IEC61000-4-2 Level 4 on inputs and outputs – 15 kV (air discharge) – 8 kV (contact discharge) A B C Application ■ Mobile phones (differential microphone filtering and ESD protection). Figure 2. Schematic GND A4 Description GND Meas GND C5 The EMIF02-MIC01F2 is a highly integrated device designed to suppress EMI / RFI noise for microphone line filtering. GND GND Vcc A2 C3 C1 B4 The EMIF02-MIC01F2 Flip Chip packaging means the package size is equal to the die size. This is why the EMIF02-MIC01F2 is a very small device. R3 R5 R1 B1 R2 to pre-amp C1codec To Mic C4 C2 C4 R4 R6 C2 GND GND GND C6 GND Additionally, the filter includes an ESD protection circuit to prevent damage to the protected device when subjected to ESD surges up to 15 kV. GND GND A3,B2,B3,C3 are ground pins TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 6 1/7 www.st.com 7 Electrical characteristics 1 EMIF02-MIC01F2 Electrical characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value VPP ESD IEC 61000-4-2, input and output pins - air discharge ESD IEC 61000-4-2, in put and output pins - contact discharge 15 8 kV Junction temperature 125 °C Tj Unit Top Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to +150 °C Max Unit 18 V 0.5 µA 1.2 nF Table 2. Electrical characteristics (Tamb = 25 °C) Symbol VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic impedance IPP Peak pulse current Symbol Test condition VBR IR = 1 mA per line IRM VRM = 3 V per line C1, C2, C3 VLINE = 0 V, VOSC = 30 mV, F = 1 MHz C4, C5, C6 2/7 Min Typ 14 0.8 1.0 R1, R2 Tolerance ± 5 % 50 Ω R3, R4 Tolerance ± 5 % 1.00 kΩ R5, R6 Tolerance ± 5 % 2.20 kΩ EMIF02-MIC01F2 Figure 3. Electrical characteristics Filter response Figure 4. dB 10 10 Tj = 25° C 0 dB Tj = 25° C 0 -10 -10 -20 -20 -30 -30 -40 Analog crosstalk -40 Line B4/B1 -50 -50 -60 -60 -70 -70 C1/B4 -80 -80 Line C4/C1 -90 100 k Figure 5. 1.0 M 10.0 M 100 M 1.0 G F (Hz) -90 F (Hz) -100 10.0 G ESD response to IEC 61000-4-2 (+15 kV air discharge) on output (VOUT) -100 100 k Figure 6. 1.0 M 10 M 100 M 1.0 G 10 G ESD response to IEC 61000-4-2 (-15 kV air discharge) on output (VOUT) 10 V/div 10 V/div 20 ns/div 20 ns/div 3/7 Ordering information scheme 2 EMIF02-MIC01F2 Ordering information scheme Figure 7. Ordering information scheme EMIF yy - xx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 (pF) or 2 letters = application 2 digits = version Package F = Flip Chip x = 2: Lead-free, Pitch = 500 µm, Bump = 310 µm 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 8. 4/7 Flip Chip dimensions EMIF02-MIC01F2 Ordering information Figure 9. Footprint Figure 10. Marking Copper pad Diameter: 250 µm recommended, 300 µm max Dot, ST logo E Solder stencil opening: 330 µm x x z y ww xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter Figure 11. Flip Chip tape and reel specification Dot identifying Pin A1 location 3.5 ± 0.1 1.56 ST E User direction of unreeling Ordering information Table 3. Ordering information Order code EMIF02-MIC01F2 Note: xxx yww 4 ± 0.1 All dimensions in mm 4 2.02 ST E xxx yww ST E xxx yww 8 ± 0.3 0.73 ± 0.05 1.75 ± 0.1 Ø 1.5 ± 0.1 4 ± 0.1 Marking Package Weight Base qty Delivery mode GB Flip Chip 3.8 mg 5000 Tape and reel (7”) More packing information is available in the application notes: AN1235: “Flip Chip: package description and recommendations for use” AN 1751: “EMI filters: Recomendations and measurements” 5/7 Revision history 5 Revision history Table 4. 6/7 EMIF02-MIC01F2 Document revision history Date Revision Changes Sep-2004 3 Previous issue. 09-Feb-2006 4 Added ECOPACK statement. Updated graphics to current standards. 06-Oct-2006 5 Reformatted to current standards. Updated characteristic curves, removed Aplac information and updated tape and reel pocket dimensions. 17-Apr-2008 6 Updated ECOPACK statement. Updated Figure 7, Figure 8 and Figure 11. Reformatted to current standards. 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