EMIF06-1002F2 6-line IPAD™, EMI filter and ESD protection Features ■ Lead-free package ■ Very low PCB space consumption 1.92 mm x 1.79 mm ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression (IEC 61000-4-2 level 4 on external pins) ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Flip Chip (14 bumps) Complies with the following standards ■ Figure 1. IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) Pin configuration (bump side) 4 3 2 I1 O1 O2 I2 Application This device is designed for EMI filtering in ESD sensitive equipment such as mobile phones. GND O4 I6 The EMIF06-1002F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF06-1002F2 Flip Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV. This device includes 6 EMI filters. I5 Figure 2. External pin C D GND I4 A B O3 I3 Description 1 E F O6 O5 G Basic cell configuration Internal pin TM: IPAD is a trademark of STMicroelectronics. March 2010 Doc ID 14730 Rev 2 1/7 www.st.com 7 Electrical characteristics 1 EMIF06-1002F2 Electrical characteristics Table 1. Absolute maximum ratings(1) Symbol Parameter VPP Value ESD discharge IEC 61000-4-2, level 4 on external pins (I1 to I6) Air discharge Contact discharge 15 8 Air discharge on internal pins (O1 to O6) Contact discharge on internal pins (O1 to O6) 2 2 Unit kV Tj Junction temperature range -30 to 125 °C Tstg Storage temperature range -55 to 150 °C 1. (Tamb = 25 °C) Table 2. Electrical characteristics(1) Symbol Parameters VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic impedance IPP Peak pulse current RI/O Series resistance between input and output Cline Input capacitance per line Symbol IR = 1 mA IRM VRM = 3 V VF FC VR = 3 V DC, F = 1 MHz Cut-off frequency (Zsource = Zload = 50 Ω) 1. (Tamb = 25 °C) 2/7 V IRM IR IPP Min Typ Max 6 RI/O Cline IF VCL VBR VRM Test conditions VBR I Doc ID 14730 Rev 2 Unit V 200 nA 80 100 120 Ω 9.2 11.5 13.8 pF 280 MHz EMIF06-1002F2 Figure 3. Electrical characteristics S21 attenuation measurements Figure 4. dB 0.00 0.00 Analog crosstalk measurements dB - 10.00 - 5.00 - 20.00 - 10.00 - 30.00 - 40.00 - 15.00 - 50.00 - 60.00 - 20.00 - 70.00 - 80.00 - 25.00 - 90.00 - 100.00 - 30.00 - 110.00 - 35.00 - 120.00 F (Hz) F (Hz) - 130.00 - 40.00 - 140.00 100.0k 1.0M 10.0M I1 - O1 I3 - O3 I5 - O5 100.0M 1.0G 100.0k I2 - O2 I4 - O4 I6 - O6 1.0M 10.0M I1 - O2 Figure 5. ESD response to IEC61000-4-2 Figure 6. (+ 15 kV air discharge) on one input (Vin) and one output (Vout) Figure 7. Line capacitance versus applied voltage for filter C(pF) 100.0M 1.0G I1 - O6 ESD response to IEC61000-4-2 (- 15 kV air discharge) on one input (Vin) and one output (Vout) 18 16 F=1MHz Vosc=30mVRMS Tj=25°C 14 12 10 8 6 4 2 VLINE(V) 0 0 1 2 3 Doc ID 14730 Rev 2 4 5 3/7 Ordering information scheme 2 EMIF06-1002F2 Ordering information scheme Figure 8. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) Package F = Flip Chip x = 2: Lead-free, pitch = 500 µm, bump = 315 µm 4/7 Doc ID 14730 Rev 2 yy - xxx z Fx EMIF06-1002F2 3 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 9. Package dimensions 50 0µ m ±1 0 650 µm ± 65 1.92 mm ± 50 µm 500 µm ± 10 315 µm ± 50 1.79 mm ± 50 µm Figure 10. Footprint Figure 11. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 250 µm recommended , 300 µm max x x z y w w Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter Note: E More packing information is available in the application notes: AN1235: "Flip Chip: Package description and recommendations for use" AN1751: “EMI filters: Recommendations and measurements” Doc ID 14730 Rev 2 5/7 Ordering information EMIF06-1002F2 Figure 12. Flip Chip tape and reel specification Dot identifying Pin A1 location 3.5 ± 0.1 STE STE xxz yww xxz yww User direction of unreeling Ordering information Table 3. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF06-1002F2 JC Flip Chip 4.7 mg 5000 Tape and reel 7” Revision history Table 4. 6/7 xxz yww 4 ± 0.1 All dimensions in mm 5 STE 2.02 8 ± 0.3 1.89 0.73 ± 0.05 4 1.75 ± 0.1 Ø 1.5 ± 0.1 4 ± 0.1 Document revision history Date Revision Changes 21-May-2008 1 First issue. 29-Mar-2010 2 Upated Flip Chip tape and reel specification Figure 12. Doc ID 14730 Rev 2 EMIF06-1002F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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