ESDAxxxP6 ASD Transil™ array for ESD protection Main applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: ■ Computers ■ Printers ■ Communication systems and cellular phones ■ Video equipment These devices are particularly adapted to the protection of symmetrical signals. SOT-666IP (Internal pad) ESDA6V1P6 ESDA6V1-5P6 Order codes Features ■ 4 / 5 Unidirectional (ESDA6V1P6 / ESDA6V1-5P6) and Bidirectional (ESDA14V2BP6) Transil functions ■ Breakdown voltage: VBR = 6.1 V min. and 14.2 V min. ■ Low leakage current: < 500 nA (ESDA6V1P6 / ESDA6V1-5P6) < 1 µA (ESDA14V2BP6) ■ SOT-666 ESDA14V2BP6 Part Number Marking ESDA6V1P6 B ESDA6V1-5P6 C ESDA14V2BP6 A Figure 1. ESDA6V1P6 functional diagram I/O1 Very small PCB area < 2.6 mm2 I/O4 GND GND I/O2 I/O3 Description The ESDAxxxP6 are monolithic arrays designed to protect up to 5 lines against ESD transients. Figure 2. These devices are ideal for situations where both reduced line capacitance and board space saving are required. ESDA6V1-5P6 functional diagram I/O1 I/O5 GND I/O4 I/O2 I/O3 Benefits ■ High ESD protection level ■ High integration ■ Suitable for high density boards Figure 3. I/O1 Complies with the following standards: IEC61000-4-2 level 4: ESDA14V2BP6 functional diagram I/O4 GND GND I/O2 I/O3 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883E-Method 3015-7: class3 TM: Transil is a trademark of STMicroelectronics 25 kV (Human Body Model) June 2006 Rev 2 1/8 www.st.com 8 Characteristics 1 ESDAxxxP6 Characteristics Table 1. Absolute Maximum Ratings (Tamb = 25° C) Symbol PPP Tj Tstg Parameter Peak pulse power (8/20 µs) (1) Tj initial = Tamb Value ESDA6V1P6 / ESDA6V1-5P6 150 ESDA14V2BP6 50 Unit W Junction temperature Storage temperature range TL Maximum lead temperature for soldering during 10 s at 5 mm for case Top Operating temperature range 150 °C -55 to +150 °C 260 °C -40 to +150 °C 1. for a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Electrical Characteristics (Tamb = 25° C) Symbol Parameter Unidirectional I IF VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop C Capacitance Rd Dynamic resistance VF VCL VBR VRM IRM Slope: 1/Rd V IPP Bidirectional I VCL VBR IRM Slope: 1/Rd IRM VBR @ VRM @ IR Part Numbers min. VRM max. V IPP Rd αT C max. typ. typ. max. @ 0V V V mA µA V Ω 10-4/°C pF 6.1 7.2 1 0.5 3 1.5 4 70 1 12 14.2 18 1 1.5 5.8 25 0.1 3 ESDA6V1P6 ESDA6V1-5P6 ESDA14V2BP6 2/8 ESDAxxxP6 Characteristics Figure 4. Peak power dissipation versus initial junction temperature Figure 5. Peak pulse power versus exponential pulse duration (Tj initial = 25° C) PPP(W) PPP[Tj initial] / PPP[Tj initial=25°C] 1.1 1000 Tj initial = 25°C 1.0 0.9 ESDA6V1P6 & ESDA6V1-5P6 0.8 0.7 0.6 100 0.5 ESDA14V2BP6 0.4 0.3 0.2 Tj initial (°C) 0.1 tp(µs) 10 0.0 0 25 Figure 6. 50 75 100 125 150 1 175 Clamping voltage versus peak pulse current (Tj initial = 25° C, rectangular waveform, tp = 2.5 µs) IPP(A) 10 Figure 7. 100 Junction capacitance versus reverse applied voltage (typical values) C(pF) 100.0 80 F=1MHz VOSC=30mVRMS Tj=25°C 70 ESDA6V1P6 & ESDA6V1-5P6 60 ESDA6V1P6 & ESDA6V1-5P6 10.0 50 ESDA14V2BP6 40 30 1.0 ESDA14V2BP6 20 tP=2.5µs Tj initial =25°C VCL(V) 10 VR(V) 0 0.1 0 Figure 8. 10 20 30 40 50 60 70 Relative variation of leakage current versus junction temperature (typical values) 0 1 2 Figure 9. 3 4 5 6 7 8 9 10 11 12 13 14 Peak forward voltage drop versus peak forward current (typical values) IFM(A) IR[Tj] / IR[Tj=25°C] 1.E+00 1.E+04 ESDA6V1P6 & ESDA6V1-5P6 ESDA14V2BP6 VR =12V 1.E+03 1.E-01 Tj =125°C 1.E+02 Tj =25°C 1.E-02 1.E+01 Tj(°C) ESDA6V1P6 & ESDA6V1-5P6 VR =3V VFM(V) 1.E+00 1.E-03 25 50 75 100 125 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 3/8 Ordering information scheme ESDAxxxP6 Figure 10. ESD response @ VPP = 15 kV air discharge (ESDA6V1-5P6) 2 Ordering information scheme ESDA 6V1 - x B Px ESD Array Breakdown Voltage 6V1 = 6.1 Volts min. 14V2 = 14.2 Volts min. Number of lines protected (optional) 5 = 5 lines Type Blank = Unidirectional B = Bidirectional Packages P6 = SOT-666 for ESDA14V2BP6 and SOT-666IP for ESDA6V1P6 and ESDA6V1-5P6 4/8 ESDAxxxP6 3 Package information Package information Table 3. SOT-666 Dimensions Dimensions b1 Ref. Millimeters Inches L1 Min. L3 Typ. Max. Min. Typ. Max. A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 b D E1 0.27 0.34 0.007 0.011 0.013 A L2 E A3 e 0.50 0.020 L1 0.19 0.007 L2 0.10 0.30 0.004 0.012 e L3 0.10 0.004 Figure 11. SOT-666 Footprint (dimensions in mm) 0.50 0.62 2.60 0.99 0.30 5/8 Package information ESDAxxxP6 Table 4. SOT-666IP Dimensions Dimensions Ref. b1 L1 Millimeters Min. Typ. Max. Inches Min. Typ. Max. L4 L3 b D E1 A L2 E A3 A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 0.34 0.007 0.011 0.013 e 0.50 0.020 L1 0.19 0.007 L2 e 0.27 0.10 0.30 0.004 0.012 L3 0.10 0.004 L4 0.60 0.024 Figure 12. SOT-666IP Footprint (dimensions in mm) 0.50 0.30 0.99 0.21 0.62 2.60 1.40 0.20 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 ESDAxxxP6 4 Ordering information Ordering information Part Number Marking ESDA6V1P6 B ESDA6V1-5P6 C ESDA14V2BP6 A Package Weight Base qty Delivery mode 2.9 mg 3000 Tape and reel SOT-666IP 5 SOT-666 Revision history Date Revision Changes 07-Feb-2006 1 ESDA6V1P6, ESDA6V1-5P6 and ESDA14V2BP6: datasheets merged. ECOPACK statement added. Some curves combined. 26-Jun-2006 2 Reformatted to current standards. Modified package information to show both SOT-666 and SOT-666IP. 7/8 ESDAxxxP6 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8