ESDALC6V1Px ASD (Application Specific Devices) Low capacitance TRANSIL™ arrays for ESD protection Main applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: ■ Computers ■ Printers ■ Communication systems ■ Cellular phone handsets and acessories ■ Wireline and wireless telephone sets ■ Set top boxes SOT663 2 to 4 unidirectional Transil functions ■ Breakdown voltage VBR = 6.1 V min. ■ Low leakage current < 100 nA ■ Low capacitance (7.5 pF @ 3 V) ■ Very small PCB area < 2.6 mm2 SOT666IP Order code Features ■ SOT665 Part number Marking ESDALC6V1P3 A2 ESDALC6V1P5 A1 ESDALC6V1P6 D ESDALC6V1P3 functional diagram Description The ESDALC6V1Px are monolithic suppressors designed to protect components connected to data and transmission lines against ESD. ESDALC6V1P5 functional diagram These devices clamp the voltage just above the logic level supply for positive transients and to a diode drop below ground for negative transients. Benefits ■ High ESD protection level ■ High integration Complies with the following standards: ESDALC6V1P6 functional diagram IEC61000-4-2 level 4: 15 kV(air discharge) 8 kV(contact discharge) MIL STD 883E-Method 3015-7: class3 25 kV HBM (Human Body Model) TM: TRANSIL is a trademark of STMicroelectronics October 2006 Rev 3 1/9 www.st.com 9 Characteristics 1 ESDALC6V1Px Characteristics Table 1. Absolute ratings (Tamb = 25° C) Symbol Parameter VPP(1) PPP Tj Tstg Value Unit ±8 ±15 kV Peak pulse power (8/20 µs)(1) Tj initial = Tamb 30 W Junction temperature 150 °C -55 to +150 °C 260 °C -40 to +150 °C IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge Peak pulse voltage Storage temperature range TL Maximum lead temperature for soldering during 10 s Top Operating temperature range 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Electrical characteristics (Tamb = 25° C) Symbol Parameter I VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop C Capacitance Rd Dynamic resistance IF VF VCL VBR ESDALC6V1P3 ESDALC6V1P5 ESDALC6V1P6 2/9 V IRM Slope: 1/Rd VBR@ IR Part Number VRM IRM @ VRM max. IPP Rd αT C typ. typ. typ.@ 3V min. max. V V mA µA V Ω 10-4/°C pF 6.1 7.2 1 0.1 3 1.5 4.5 7.5 ESDALC6V1Px Figure 1. Characteristics Peak power dissipation versus initial junction temperature Figure 2. PPP[T j initial] / PPP [T j initial=25°C] Peak pulse power versus exponential pulse duration (Tj initial = 25° C) PPP(W) 1.1 1000 1.0 Tj initial = 25°C 0.9 0.8 0.7 0.6 100 0.5 0.4 0.3 0.2 0.1 tp(µs) Tj(°C) 0.0 10 0 25 Figure 3. 50 75 100 125 150 175 1 Clamping voltage versus peak pulse current (typical values, rectangular waveform) 10 Figure 4. IPP(A) 100 Forward voltage drop versus peak forward current (typical values) IFM(A) 1.E+00 100.0 tp = 2.5µs Tj initial = 25°C Tj = 125°C Tj = 25°C 10.0 1.E-01 1.0 1.E-02 VFM(V) VCL(V) 1.E-03 0.1 0 10 Figure 5. 20 30 40 50 60 70 Junction capacitance versus reverse applied voltage (typical values) 0.0 0.2 Figure 6. 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Relative variation of leakage current versus junction temperature (typical values) IR [T j] / IR [T j=25°C] C(pF) 1.E+04 13 VR =3 V F=1MHz VOSC=30mVRMS Tj=25°C 12 11 1.E+03 10 9 8 7 1.E+02 6 5 4 1.E+01 3 2 VR(V) 1 T j(°C) 1.E+00 0 0 1 2 3 4 5 6 25 50 75 100 125 150 3/9 Ordering information scheme Figure 7. ESDALC6V1Px ESD response to IEC 61000-4-2 (air Figure 8. discharge 15 kV positive surge) 10 V per div. 0.00 Analog crosstalk measurement dB -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 F (Hz) -100.00 0.1 µs per division Figure 9. 100.0k 1.0M 10.0M Digital crosstalk test measurement 5 V per div. VG1 β21VG1 0.1 µs per div. 2 Ordering information scheme ESDA ESD Array Low Capacitance Breakdown Voltage (min) 6V1 = 6.1 Volt Package P3 = SOT-663 (SC89-3L) P5 = SOT-665 P6 = SOT-666IP (internal pad) 4/9 LC 6V1 Px 100.0M 1.0G ESDALC6V1Px 3 Package information Package information Table 3. SOT-663 dimensions Dimensions Ref. A D Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.60 0.70 0.80 0.024 0.028 0.031 D 1.40 1.60 1.80 0.055 0.063 0.071 E 0.75 0.85 0.95 0.030 0.033 0.037 HE 1.50 1.60 1.70 0.059 0.063 0.067 b HE alpha E L L2 L e c 2xe 0.39 0.015 L2 0.44 0.47 0.50 0.017 0.018 0.020 c 0.08 0.13 0.18 0.003 0.005 0.007 b 0.22 0.27 0.37 0.009 0.011 0.015 e 0.50 2xe 0.90 α 4° 1.00 0.020 1.10 7° 0.035 0.040 0.043 4° 7° Figure 10. SOT-663 footprint (dimensions in mm) 5/9 Package information ESDALC6V1Px Table 4. SOT-665 dimensions Dimensions Ref. bp D E A Lp He C Millimeters Inches Min. Max. Min. Max. A 0.50 0.60 0.020 0.024 BP 0.17 0.27 0.007 0.011 C 0.08 0.18 0.003 0.007 D 1.50 1.70 0.060 0.067 E 1.10 1.30 0.043 0.051 e 1.00 0.040 e1 0.50 0.020 He 1.50 1.70 0.059 0.067 Lp 0.10 0.30 0.004 0.012 e1 e Figure 11. SOT-665 footprint (dimensions in mm) 6/9 ESDALC6V1Px Package information Table 5. SOT-666IP dimensions Dimensions Ref. b1 L1 Millimeters Min. Typ. Max. Inches Min. Typ. Max. L4 L3 b D E1 A L2 E A3 A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 0.34 0.007 0.011 0.013 e 0.50 0.020 L1 0.19 0.007 L2 e 0.27 0.10 0.30 0.004 0.012 L3 0.10 0.004 L4 0.60 0.024 Figure 12. SOT-666IP footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information 4 5 8/9 ESDALC6V1Px Ordering information Part number Marking Package Weight Base qty Delivery mode ESDALC6V1P3 A2 SOT663 2.9 mg 3000 Tape and reel ESDALC6V1P5 A1 SOT665 2.9 mg 3000 Tape and reel ESDALC6V1P6 D SOT666IP 2.9 mg 3000 Tape and reel Revision history Date Revision Description of changes 16-Aug-2006 1 ESDALC6V1P3, ESDALC6V1P5, and ESDALC6V1P6 merged and reformatted to current standards. 23-Aug-2006 2 Table 1 on page 2: Temperature range upgraded to Tj max = 150° C 11-Oct-2006 3 Added values for VPP in Table 1. ESDALC6V1Px Please Read Carefully: Information in this document is provided solely in connection with ST products. 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