STMICROELECTRONICS SMA6F12AVCL

SMA6F
High junction temperature Transil™
Features
■
Halogen-free package
■
Peak pulse power:
– 600 W (10/1000 µs)
– 4 kW (8/20 µs)
■
Stand off voltage: 5, 12 or 13 V
■
Unidirectional type
■
Low clamping voltage versus standard series
■
Low leakage current, 0.2 µA at 25 °C
■
Operating Tj max: 175 °C
■
JEDEC registered package outline
A
K
Unidirectional
SMAflat
Complies with the following standards
■
IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■
MIL STD 883G-Method 3015-7: class3B
– 25 kV (human body model)
Description
The SMA6F Transil series has been designed to
protect sensitive equipment against electro-static
discharges according to IEC 61000-4-2, MIL STD
883 Method 3015, and electrical over stress such
as IEC 61000-4-4 and 5. They are generally for
surges below 600 W 10/1000 µs.
This planar technology makes it compatible with
high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time. Their low clamping voltages provides a
better safety margin to protect sensitive circuits
with extended life time expectancy.
Packaged in SMAflat non exposed pad, this
minimizes PCB space consumption (footprint in
accordance with IPC 7531 standard).
September 2008
TM: Transil is a trademark of STMicroelectronics
Rev 1
1/9
www.st.com
9
Characteristics
SMA6F
1
Characteristics
Table 1.
Absolute ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
600
W
Peak pulse power dissipation (1)
Tj initial = Tamb
Power dissipation on infinite heatsink
Tlead = 55 °C
6
W
IFSM
Non repetitive surge peak forward current for
unidirectional types
tp = 10 ms
Tj initial = Tamb
60
A
Tstg
Storage temperature range
-65 to +175
°C
Tj
Operating junction temperature range
-55 to +175
°C
TL
Maximum lead temperature for soldering during 10 s
260
°C
Value
Unit
20
°C/W
PPP
P
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2.
Thermal resistance
Symbol
Rth (j-l)
Table 3.
Symbol
Parameter
Junction to leads
Electrical characteristics - definitions (Tamb = 25 °C)
Parameter
VRM
Stand-off voltage
VBR
Breakdown voltage
VCL
Clamping voltage
IRM
Leakage current @ VRM
IPP
Peak pulse current
αT
Voltage temperature coefficient
VF
Forward voltage drop
RD
Dynamic resistance
2/9
I
IF
VF
VCL VBR VRM
IRM
IR
IPP
V
SMA6F
Characteristics
Table 4.
Electrical characteristics - values (Tamb = 25 °C)
VBR @IR(1)
IRM [email protected]
Type
25 °C 85 °C
µA (Max)
min
V
typ max
V
VCL @IPP
RD(2)
VCL @IPP RD(2)
10/1000 µs 10/1000 µs 8/20 µs 8/20 µs
αT(3)
max
max
mA
max
V
A
Ω
V
A
Ω
10-4/°C
SMA6F5.0A
10
50
5.0 6.40 6.74 7.07 10
9.2
68
0.029
13.4 298
0.021
5.7
SMA6F12AVCL
0.2
1
12 13.2 13.7 14.3
1
18.5
31
0.135
22.9 157
0.055
7.8
SMA6F13A
0.2
1
13 14.4 15.2 15.9
1
20.4
29
0.154
23.9 147
0.054
8.3
1. Pulse test: tp <50ms.
2. To calculate maximum clamping voltage at other surge currents, use the following formula
VCLmax = RD x IPP + VBRmax
3. To calculate VBR versus junction temperature, use the following formula:
VBR @ Tj = VBR @ 25 °C x (1 + αT x (Tj - 25))
Figure 1.
Definition of Ipp pulse
%IPP
Repetitive peak pulse current
tr = rise time (µs)
tp = pulse duration time (µs)
100
50
0
tr
Figure 2.
t
tp
Relative peak power dissipation
versus initial junction temperature
Figure 3.
PPP[T j initial] / PPP[T j initial=25°C]
Peak pulse power versus
exponential pulse duration
(Tj initial = 25 °C)
PPP(kW)
1.1
100.0
Tj initial = 25 °C
1.0
0.9
0.8
10.0
0.7
0.6
0.5
0.4
1.0
0.3
0.2
Tj initial (°C)
0.1
tp(ms)
0.0
0.1
0
25
50
75
100
125
150
175
200
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
3/9
Characteristics
SMA6F
Figure 4.
1000.0
Clamping voltage versus peak pulse current
(exponential waveform, maximum values)
IPP(A)
Tj initial=25 °C
SMA6F5.0A
SMA6F12AVCL
100.0
SMA6F13A
10.0
1.0
tp = 8/20 µs
tp = 10/1000 µs
VCL(V)
0.1
5
Figure 5.
10
15
20
Junction capacitance versus reverse applied voltage (typical values)
10000
C(pF)
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
SMA6F5.0A
1000
SMA6F12AVCL
SMA6F13A
VR(V)
100
1
4/9
10
100
25
SMA6F
Figure 6.
Characteristics
Peak forward voltage drop versus
peak forward current (typical
values)
Figure 7.
IFM(A)
1.0E+02
1.00
Relative variation of thermal
impedance junction to ambient
versus pulse duration (printed
ciruit board FR4, SCu = 1 cm2)
Zth(j-a)/Rth(j-a)
On recommended pad
layout
1.0E+01
0.10
1.0E+00
Tj =125 °C
Tj =25 °C
0.01
1.0E-01
VFM(V)
tp(S)
1.0E-02
0.0
Figure 8.
0.5
1.0
1.5
2.0
Thermal resistance junction to
ambient versus copper surface
under each lead
(printed circuit board FR4,
copper thickness = 35 µm)
Rth(j-a)(°C/W)
0.00
1.0E-03
Figure 9.
1.E+04
200
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
Leakage current versus junction
temperature (typical values)
IR(nA)
180
160
1.E+03
140
VBR=11.7V
120
1.E+02
100
80
VBR>11.7V
60
1.E+01
40
20
SCU(cm2)
VR=VRM
Tj(°C)
1.E+00
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
25
50
75
100
125
150
175
5/9
Ordering information scheme
2
SMA6F
Ordering information scheme
Figure 10. Ordering information scheme
SM
Surface Mount
Package
A = SMAflat package
Surge rating
6F = 600 W
Stand off voltage
example: 5.0 = 5.0 V
Type
A = Unidirectional
Delivery mode
TR = Tape and reel
6/9
A 6F
xx
A
-
TR
SMA6F
3
Package information
Package information
●
Case: JEDEC DO-221AC molded plastic over Planar junction
●
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
●
Polarity: Band indicates cathode
●
Flammability: Epoxy rated UL94V-0
●
RoHS package
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 5.
SMAflat (non exposed pad) dimensions
Dimensions
Ref.
A
L 2x
L1 2x
E E1
L
L2 2x
b
Inches
Min. Typ. Max.
Min.
A
0.90
1.10
0.035
0.043
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.95
0.088
0.116
E
4.80
5.60
0.189
0.220
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
c
D
Millimeters
Typ.
L1
0.50
0.019
L2
0.50
0.019
Max.
Figure 11. SMAflat footprint dimensions Figure 12. Marking information
5.52
(0.217)
Cathode bar (unidirectional devices only )
1.52
(0.060)
e3
x x x
z y ww
1.20
(0.047)
3.12
(0.123)
e3: ECOPACK ( Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
1.20
(0.047)
millimeters
(inches)
7/9
Ordering information
4
Ordering information
Table 6.
5
Ordering information
Order code
Marking
SMA6F5.0A-TR
SUA
SMA6F12AVCL-TR
SUJ
SMA6F13A-TR
SUG
Package
Weight
SMAflat
0.035 g
Revision history
Table 7.
8/9
SMA6F
Document revision history
Date
Revision
04-Sep-2008
1
Changes
First issue.
Base qty Delivery mode
10000
Tape and reel
SMA6F
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2008 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
9/9