STMICROELECTRONICS STG3P2M10N60B

STG3P2M10N60B
1-Phase bridge rectifier + 3 phase inverter
IGBT - SEMITOP®2 module
PRELIMINARY DATA
General features
Type
VCES
STG3P2M10N60B
600V
VCE(sat)(Max)
@ IC=7A,
IC@80°C
Ts=25°C
< 2.5V
10A
■
N-channel very fast PowerMESH™ IGBT
■
Lower on-voltage drop (Vcesat)
■
Lower CRES / CIES ratio (no cross-conduction
susceptbility)
■
Very soft ultra fast recovery antiparallel diode
■
High frequency operation up to 70 KHz
■
New generation products with tighter
parameter distribution
■
Compact design
■
Semitop®2 is a trademark of semikron
SEMITOP®2
Internal schematic diagram
Description
Using the latest high voltage technology based on
a patented strip layout, STMicroelectronics has
designed an advanced family of IGBTs, the
PowerMESH™ IGBT, with outstanding
performances.
Applications
■
High frequency motor controls
■
Motor drivers
Order codes
Sales type
Marking
Package
Packaging
STG3P2M10N60B
G3P2M10N60B
SEMITOP®2
SEMIBOX
May 2006
Rev1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
1/12
www.st.com
12
Contents
STG3P2M10N60B
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Typical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2/12
................................................ 8
STG3P2M10N60B
1
Electrical ratings
Electrical ratings
Table 1.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
VCES
Collector-emitter voltage (VGS = 0)
600
V
IC(1)
Collector current (continuous) at Ts = 25°C
19
A
IC(1)
Collector current (continuous) at Ts = 80°C
10
A
VGE
Gate-emitter Voltage
±20
V
ICM(2)
TP<1ms; Ts=25°C
38
A
ICM
TP<1ms; Ts=80°C
20
A
Diode RMS forward current at Ts = 25°C
19
A
PTOT
Total dissipation at Ts = 25°C
56
W
VISO
Insulation withstand voltage A.C.
(t=1min/sec; Ts=25°C)
2500/3000
V
Tstg
Storage temperature
– 40 to 125
°C
Operating junction temperature
– 40 to 150
°C
Value
Unit
2.2
K/W
IF
Tj
1. Calculated value
2. Pulse width limited by max. junction temperature
Table 2.
Symbol
Rth(j-s)
Thermal resistance
Parameter
Thermal resistance junction-sink(1) Max.
1. Resistance value with conductive grease applied and maximum mounting torque equal to 2Nm
3/12
Electrical characteristics
2
STG3P2M10N60B
Electrical characteristics
(TS=25°C unless otherwise specified)
Table 3.
Static
Symbol
Parameter
VBR(CES)
Collector-emitter
breakdown voltage
Test condictions
IC= 1mA, VGE= 0
Collector cut-off current
(VGE = 0)
IGES
Gate-Emitter Leakage
Current (VCE = 0)
VGE= ±20V , VCE= 0
VGE(th)
Gate Threshold Voltage
VCE= VGE, IC= 250µA
VCE(sat)
Collector-emitter saturation VGE= 15V, IC= 7A
voltage
VGE= 15V, IC= 7A, Tc= 125°C
Symbol
gfs (1)
Cies
Coes
Cres
Qg
Qge
Qgc
Max.
600
Unit
V
10
1
µA
mA
±100
nA
5.75
V
1.85
1.7
2.5
V
V
Typ.
Max.
Unit
VCE=Max rating,TS= 125°C
3.75
Dynamic
Parameter
Forward transconductance
Input capacitance
Output capacitance
Reverse transfer
capacitance
Total gate charge
Gate-emitter charge
Gate-collector charge
Test condictions
VCE = 15V, IC= 7A
VCE = 25V, f = 1MHz,
VGE = 0
VCE = 390V, IC = 5A,
VGE = 15V, (see Figure 8)
1. Pulsed: pulse duration=300µs, duty cycle 1.5%
4/12
Typ.
VCE= Max rating,TS= 25°C
ICES
Table 4.
Min.
Min.
4.30
S
720
81
17
pF
pF
pF
35
7
16
48
nC
nC
nC
STG3P2M10N60B
Table 5.
Symbol
td(on)
tr
(di/dt)on
td(on)
tr
(di/dt)on
tr(Voff)
td(off)
tf
tr(Voff)
td(off)
tf
Table 6.
Symbol
Eon(1)
Eoff(2)
Ets
Eon(1)
Eoff(2)
Ets
Electrical characteristics
Switching on/off
Parameter
Test condictions
Turn-on delay time
Current rise time
Turn-on current slope
VCC = 300V, IC = 7A
Turn-on delay time
Current rise time
Turn-on current slope
VCC = 300V, IC = 7A
Off voltage rise time
Turn-off delay time
Current fall time
VCC = 300V, IC = 7A
Off voltage rise time
Turn-off delay time
Current fall time
VCC = 300V, IC = 7A
Min.
RG= 22Ω, VGE= ±15V
TS= 25°C (see Figure 9)
RG= 22Ω, VGE= ±15V
TS=125°C (see Figure 9)
RG= 22Ω, VGE= ±15V
TS=25°C (see Figure 9)
RG= 22Ω, VGE= ±15V
TS=125°C (see Figure 9)
Typ.
Max.
Unit
18.5
8.5
1060
ns
ns
A/µs
18.5
7
1000
ns
ns
A/µs
27
72
60
ns
ns
ns
56
116
105
ns
ns
ns
Switching energy (inductive load)
Parameter
Turn-on switching losses
Turn-off switching losses
Total switching losses
Turn-on switching losses
Turn-off switching losses
Total switching losses
Test condictions
VCC = 300V, IC = 7A
RG= 22Ω, VGE= ±15V
TS=25°C
(see Figure 9)
VCC = 300V, IC = 7A
RG= 22Ω, VGE= ±15V
TS= 125°C
Min.
Typ.
Max.
Unit
95
115
210
µJ
µJ
µJ
140
215
355
µJ
µJ
µJ
(see Figure 9)
1. Eon is the tun-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in
a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the
same temperature (25°C and 125°C)
2. Turn-off losses include also the tail of the collector current
5/12
Electrical characteristics
Table 7.
Symbol
STG3P2M10N60B
Collector-emitter diode
Parameter
Test condictions
If = 3.5A
Vf
Forward on-voltage
trr
Reverse recovery time
ta
If = 7A ,VR = 40V,
Reverse recovery charge
TS = 25°C, di/dt = 100 A/µs
Reverse recovery current
(see Figure 6)
Softness factor of the diode
Qrr
Irrm
S
If = 3.5A, TS = 125°C
trr
Reverse recovery time
ta
If = 7A ,VR = 40V,
Reverse recovery charge
TS =125°C, di/dt = 100A/µs
Reverse recovery current
(see Figure 6)
Softness factor of the diode
Qrr
Irrm
S
Table 8.
Symbol
Min.
Typ.
Max.
Unit
1.3
1.1
1.9
V
V
37
22
40
2.1
0.68
ns
ns
nC
A
61
34
98
3.2
0.79
ns
ns
nC
A
Bridge rectifier diode
Parameter
Vf
Forward on-voltage
Rth(j-s)
Thermal resistance
junction-sink(1)
Tj
Operating junction
temperature
Test condictions
Min.
If=20A, TS=125°C
Typ. Max.
1.1
-40
1. Resistance value with conductive grease applied and maximum mounting torque equal to 2Nm
6/12
Unit
V
2.15
K/W
150
°C
STG3P2M10N60B
2.1
Electrical characteristics
Typical characteristics (curves)
Figure 1.
Output characteristics at
Ts=25°C
Figure 2.
Output characteristics at
Ts=125°C
Figure 3.
Capacitance variations
Figure 4.
Gate charge vs gate-emitter
voltage
Figure 5.
Total switching losses vs gate Figure 6.
resistance
Total switching losses vs
collector current
7/12
Test circuit
STG3P2M10N60B
3
Test circuit
Figure 7.
Test circuit for inductive load
switching
Figure 8.
Figure 9.
Switching waveform
Figure 10. Diode recovery time waveform
8/12
Gate charge test circuit
STG3P2M10N60B
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
9/12
Package mechanical data
STG3P2M10N60B
SEMITOP®2 mechanical data
Dim
A
A1
A2
A3
øb
øb1
D
D2
E
E1
E2
e
e1
e2
e3
f
L
L1
L2
L3
øP
øP1
øp2
R
10/12
mm
Min
15.30
15.23
Typ
15.50
15.43
10.50
10
1.50
1.60
40.20
40.50
38
27.80
28
19.80
20
25.50
2.90
3
1.50
7.80
8
3.90
4
2.50
3.43
3.50
11.80
12
5.20
4.30
4.40
12
14.50
1
SEMITOP®2 is a trademark of SEMIKRON
Max
15.70
15.63
40.80
28.20
20.20
3.10
8.20
4.10
12.20
4.50
STG3P2M10N60B
5
Revision history
Revision history
Table 9.
Revision history
Date
Revision
15-May-2005
1
Changes
Initial release.
11/12
STG3P2M10N60B
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