STMICROELECTRONICS STP120NF04

STP120NF04
N-channel 40V - 0.0047Ω - 120A TO-220
STripFET™ II MOSFET
General features
Type
VDSS
RDS(on)
ID
Pw
STP120NF04
40V
<0.0050Ω
120A
300W
■
Standard threshold drive
■
100% avalanche tested
3
1
Description
This MOSFET is the latest development of
STMicroelectronics unique “Single Feature
Size™” strip-based process. The resulting
transistor shows extremely high packing density
for low on-resistance, rugged avalanche
characteristics and less critical alignment steps
therefore a remarkable manufacturing
reproducibility.
2
TO-220
Internal schematic diagram
Applications
■
Switching application
Order codes
Part number
Marking
Package
Packaging
STP120NF04
P120NF04
TO-220
Tube
October 2006
Rev 2
1/14
www.st.com
14
Contents
STP120NF04
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................ 6
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
STP120NF04
1
Electrical ratings
Electrical ratings
Table 1.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
40
V
VDS
Drain-source voltage (VGS = 0)
VGS
Gate-source voltage
±
20
V
Drain current (continuous) at TC = 25°C
120
A
ID
(1)
ID
Drain current (continuous) at TC = 100°C
120
A
IDM(2)
Drain current (pulsed)
480
A
PTOT
Total dissipation at TC = 25°C
300
W
Derating factor
2
W/°C
dv/dt(3)
Peak diode recovery voltage slope
6
V/ns
EAS(4)
Single pulse avalanche energy
1.2
J
TJ
Tstg
Operating junction temperature
Storage temperature
-55 to 175
°C
0.5
°C/W
see Figure 14. on page 8
°C/W
Thermal resistance junction-ambient
(free air) Max
62.5
°C/W
Maximum lead temperature for soldering
purpose
300
°C
1. Current Limited by Package
2. Pulse width limited by safe operating area
3. ISD ≤120A, di/dt ≤300A/µs, VDD ≤V(BR)DSS, Tj ≤TJMAX.
4. Starting Tj = 25°C, Id = 60A, VDD=30 V
Table 2.
Thermal data
Rthj-case
Thermal resistance junction-case Max
Rthj-pcb
Thermal resistance junction-pcb
Max
Rthj-a
Tl
3/14
Electrical characteristics
2
STP120NF04
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 3.
Symbol
On/off states
Parameter
Test conditions
Drain-source breakdown
voltage
ID = 250 µA, VGS = 0
IDSS
Zero gate voltage drain
current (VGS = 0)
VDS = Max Rating
VDS = Max Rating,
TC = 125 °C
IGSS
Gate body leakage current
(VDS = 0)
VGS = ± 20V
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250µA
RDS(on)
Static drain-source on
resistance
VGS = 10V, ID = 50 A
V(BR)DSS
Table 4.
Symbol
(1)
Typ.
Max.
40
Unit
V
2.8
1
10
µA
µA
±100
nA
4.5
V
0.0047 0.0050
Ω
Dynamic
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Forward transconductance
VDS =15V, ID = 50A
150
S
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS =25V, f=1 MHz, VGS=0
5100
1300
160
pF
pF
pF
td(on)
tr
Turn-on delay time
rise time
VDD = 20 V, ID = 60 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 18)
35
220
ns
ns
td(off)
tf
Turn-off delay time
fall time
VDD = 20 V, ID = 60 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 18)
80
50
ns
ns
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
VDD=32V, ID = 120A
VGS =10V
(see Figure 19)
110
35
35
gfs
1. Pulsed: pulse duration=300µs, duty cycle 1.5%
4/14
Min.
150
nC
nC
nC
STP120NF04
Electrical characteristics
Table 5.
Symbol
Source drain diode
Max
Unit
Source-drain current
120
A
ISDM(1)
Source-drain current (pulsed)
480
A
VSD(2)
Forward on voltage
1.3
V
ISD
trr
Qrr
IRRM
Parameter
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Test conditions
Min
Typ.
ISD=120A, VGS=0
ISD=120A,
di/dt = 100A/µs,
VDD=20V, Tj=150°C
(see Figure 20)
75
185
5
ns
nC
A
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration=300µs, duty cycle 1.5%
5/14
Electrical characteristics
STP120NF04
2.1
Electrical characteristics (curves)
Figure 1.
Safe operating area
Figure 2.
Thermal impedance
Figure 3.
Output characterisics
Figure 4.
Transfer characteristics
Figure 5.
Transconductance
Figure 6.
Static drain-source on resistance
6/14
STP120NF04
Electrical characteristics
Figure 7.
Gate charge vs gate-source voltage Figure 8.
Figure 9.
Normalized gate threshold voltage
vs temperature
Figure 11. Normalized on resistance vs
temperature
Capacitance variation
Figure 10. Normalized BVDSS vs temperature
Figure 12. Source-drain diode forward
characteristics
7/14
Electrical characteristics
STP120NF04
Figure 13. Power derating vs Tc
Figure 14. Thermal resistance Rthj-a vs PCB
copper area
Figure 15. Max id current vs Tc
Figure 16. Max power dissipation vs PCB
copper area
8/14
STP120NF04
Electrical characteristics
Figure 17. Allowable Iav vs time in avalanche
The previous curve gives the safe operating area for unclamped inductive loads, single
pulse or repetitive, under the following conditions:
PD(AVE) =0.5*(1.3*BVDSS *IAV )
EAS(AR) =PD(AVE) *tAV
Where:
IAV is the allowable current in avalanche
PD(AVE) is the average power dissipation in avalanche (single pulse)
tAV is the time in avalanche
To derate above 25 °C, at fixed IAV, the following equation must be applied:
IAV = 2 * (Tjmax - TCASE) / (1.3 * BVDSS * Zth)
Where:
Zth = K * Rth is the value coming from Normalized Thermal Response at fixed pulse width
equal to TAV.
9/14
Test circuit
3
STP120NF04
Test circuit
Figure 18. Switching times test circuit for
resistive load
Figure 19. Gate charge test circuit
Figure 20. Test circuit for inductive load
Figure 21. Unclamped Inductive load test
switching and diode recovery times
circuit
Figure 22. Unclamped inductive waveform
10/14
Figure 23. Switching time waveform
STP120NF04
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
11/14
Package mechanical data
STP120NF04
TO-220 MECHANICAL DATA
DIM.
mm.
MIN.
inch
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
b
0.61
0.88
0.024
0.034
b1
1.15
1.70
0.045
0.066
c
0.49
0.70
0.019
0.027
D
15.25
15.75
0.60
0.620
E
10
10.40
0.393
0.409
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.194
0.202
F
1.23
1.32
0.048
0.052
H1
6.20
6.60
0.244
0.256
J1
2.40
2.72
0.094
0.107
0.551
L
13
14
0.511
L1
3.50
3.93
0.137
L20
16.40
L30
12/14
TYP
0.154
0.645
28.90
1.137
øP
3.75
3.85
0.147
0.151
Q
2.65
2.95
0.104
0.116
STP120NF04
5
Revision history
Revision history
Table 6.
Revision history
Date
Revision
Changes
28-Feb-2005
1
First release.
02-Oct-2006
2
New template, no content change
13/14
STP120NF04
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