STMICROELECTRONICS STPS1L30MF

STPS1L30MF
Low drop power Schottky rectifier in flat package
Main product characteristics
IF(AV)
1A
VRRM
30 V
Tj (max)
150° C
VF (max)
0.39 V
A
K
STmite flat
(DO222-AA)
Features and benefits
Description
■
Very low profile package: 0.85 mm
■
Backward compatible with standard STmite
footprint
■
Very small conduction losses
■
Negligible switching losses
■
Extremely fast switching
■
Low forward voltage drop for higher efficiency
and extended battery life
■
Low thermal resistance
■
Avalanche capability specified
Single Schottky rectifier suited for switch mode
power supplies and high frequency DC to DC
converters.
Packaged in STmite flat, this device is intended
for use in very low voltage, high frequency
inverters, free wheeling and polarity protection
applications. Due to the very small size of the
package this device fits battery powered
equipment (cellular, notebook, PDA’s, printers) as
well as chargers and PCMCIA cards.
Order Code
Part number
Marking
STPS1L30MF
F1L3
Table 1.
Absolute ratings (limiting values)
Symbol
Value
Unit
VRRM
Repetitive peak reverse voltage
30
V
IF(RMS)
RMS forward voltage
2
A
IF(AV)
Average forward current
Tc = 140° C δ = 0.5
1
A
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
50
A
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25° C
1200
W
-65 to + 150
°C
150
°C
10000
V/µs
Storage temperature range
Tstg
Tj
Maximum operating junction
dV/dt
1.
Parameter
dPtot
--------------dTj
<
temperature(1)
Critical rate of rise of reverse voltage (rated VR, Tj = 25° C)
1
-------------------------Rth ( j – a )
August 2006
condition to avoid thermal runaway for a diode on its own heatsink
Rev 1
1/7
www.st.com
Characteristics
1
STPS1L30MF
Characteristics
Table 2.
Thermal resistance
Symbol
Rth(j-c)
Rth(j-a)
(1)
Parameter
Value
Unit
Junction to case
20
°C/W
Junction to ambient
250
°C/W
1. Mounted with minimum recommended pad size, PC board FR4
Table 3.
Symbol
Static electrical characteristics
Parameter
Tests conditions
Tj = 25° C
Tj = 85° C
IR (1)
Reverse leakage current
Tj = 25° C
Tj = 85° C
Tj = 25° C
Tj = 85° C
Tj = 25° C
Tj = 85° C
Tj = 25° C
VF (1)
Forward voltage drop
Tj = 85° C
Tj = 25° C
Tj = 85° C
Tj = 25° C
Tj = 85° C
VR = VRRM
VR = 20 V
VR = 10 V
IF = 1 A
IF = 2 A
Min.
Typ
Max.
0.13
0.39
5.25
16.5
0.05
0.24
3.5
10.5
0.03
0.15
2.4
7
0.33
0.39
0.28
0.34
0.39
0.45
0.36
0.42
0.45
0.53
0.43
0.51
0.50
0.60
0.50
0.60
Unit
mA
V
IF = 3 A
IF = 4 A
1. Pulse test: = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.26 x IF(AV) + 0.08 IF2(RMS)
2/7
STPS1L30MF
Figure 1.
Characteristics
Conduction losses versus average Figure 2.
current
IF(AV)(A)
PF(AV)(W)
0.50
δ = 0.05
0.45
Average forward current versus
ambient temperature (δ = 0.5)
δ = 0.1
1.1
δ = 0.2
Rth(j-a)=Rth(j-c)
δ = 0.5
1.0
0.9
0.40
δ=1
0.35
0.8
0.7
0.30
Rth(j-a)=270°C/W
0.6
0.25
0.5
0.20
0.4
0.15
0.3
T
0.10
0.2
0.05
IF(AV)(A)
δ=tp/T
0.00
0.0
0.1
0.2
Figure 3.
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.1
tp
Tamb(°C)
0.0
1.1
1.2
1.3
Normalized avalanche power
derating versus pulse duration
0
25
Figure 4.
PARM(tp)
PARM(1µs)
50
75
100
125
150
Normalized avalanche power
derating versus junction
temperature
PARM(tp)
PARM(25°C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
Figure 5.
0
10
1
100
25
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values)
Figure 6.
50
75
100
125
150
Relative variation of thermal
impedance junction to case versus
pulse duration
Zth(j-c)/Rth(j-c)
IM(A)
22
1.0
20
0.9
18
0.8
16
0.7
14
0.6
12
TC=25°C
δ = 0.5
0.5
10
TC=75°C
8
TC=125°C
4
0.4
0.3
6
IM
2
t
0.1
t(s)
δ=0.5
0
1.E-03
0.2
δ = 0.2
T
δ = 0.1
tp(s)
Single pulse
δ=tp/T
0.0
1.E-02
1.E-01
1.E+00
1.E-04
1.E-03
1.E-02
tp
1.E-01
3/7
Characteristics
Figure 7.
STPS1L30MF
Reverse leakage currrent versus
reverse voltage applied (typical
values)
Figure 8.
IR(mA)
Reverse leakage currrent versus
junction temperature (typical
values)
IR(mA)
1.E+03
1.E+03
VR=30V
Tj=150°C
1.E+02
1.E+02
Tj=125°C
Tj=100°C
1.E+01
1.E+01
Tj=75°C
1.E+00
1.E+00
Tj=50°C
Tj=25°C
1.E-01
1.E-01
Tj(°C)
VR(V)
1.E-02
1.E-02
0
2
Figure 9.
4
6
8
10
12
14
16
18
20
22
24
26
28
0
30
Junction capacitance versus
reverse voltage applied (typical
values)
25
50
75
100
125
150
Figure 10. Forward voltage drop versus
forward current
IFM(A)
C(pF)
2.0
1000
F=1MHz
VOSC=30mVRMS
Tj=25°C
1.8
Tj=85°C
(maximum values)
1.6
1.4
Tj=85°C
(typical values)
1.2
1.0
100
0.8
0.6
Tj=25°C
(maximum values)
0.4
0.2
VR(V)
10
1
10
100
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu=35 µm, typical values)
Rth(j-a)(°C/W)
250
200
150
100
50
S(mm²)
0
0
4/7
VFM(V)
0.0
20
40
60
80
100
120
140
160
180
200
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
STPS1L30MF
2
Package information
Package information
Table 4.
STmite flat dimensions
Dimensions
Ref.
L
E1
D
L1
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.80
0.85
0.95
0.031 0.033 0.037
b
0.40
0.55
0.65
0.016 0.022 0.026
b2
0.70
0.85
1.00
0.027 0.033 0.039
c
0.10
0.15
0.25
0.004 0.006 0.009
D
1.75
1.90
2.05
0.069 0.075 0.081
E
3.60
3.80
3.90
0.142 0.150 0.154
E1
2.80
2.95
3.10
0.110 0.116 0.122
L
0.50
0.55
0.80
0.020 0.022 0.031
L1
2.10
2.40
2.60
0.083 0.094 0.102
L2
0.45
0.60
0.75
0.018 0.024 0.030
L3
0.20
0.35
0.50
0.008 0.014 0.020
L2
b
b2
L3
E
Millimeters
c
A
Figure 12. STmite flat recommended footprint (all dimensions in mm)
0.85 0.63
2.00
0.65
0.65
0.95
1.95
4.13
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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Ordering information
3
4
6/7
STPS1L30MF
Ordering information
Part number
Marking
Package
Weight
Base qty
Delivery mode
STPS1L30MF
F1L3
STmite flat
16 mg
12000
Tape and reel
Revision history
Date
Revision
21-Aug-2006
1
Changes
First issue.
STPS1L30MF
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