STMICROELECTRONICS STPS3150U

STPS3150
Power Schottky rectifier
Main product characteristics
A
A
IF(AV)
3A
VRRM
150 V
Tj (max)
175° C
VF (max)
0.67 V
K
K
DO-201AD
STPS3150
SMB
STPS3150U
A
Features and benefits
■
Negligible switching losses
■
Low forward voltage drop for higher efficiency
and extented battery life
■
Low thermal resistance
K
SMB flat
STPS3150UF
Order Codes
Description
150 V Power Schottky rectifier are suited for
switch mode power supplies on up to 24 V rails
and high frequency converters.
Packaged in Axial, SMB, and low-profile SMB, this
device is intended for use in consumer and
computer applications like TV, STB, PC and DVD
where low drop forward voltage is required to
reduce power dissipation.
Table 1.
STPS3150U
G315
STPS3150
STPS3150
STPS3150RL
STPS3150
STPS3150UF
FG315
Parameter
Repetitive peak reverse voltage
SMB
IF(AV)
Marking
Absolute Ratings (limiting values)
Symbol
VRRM
Part Number
Average forward current
Surge non repetitive forward current
DO-201AD
TL = 140° C δ = 0.5
SMB flat
TL = 150° C δ = 0.5
Tstg
Storage temperature range
DO-201AD
Operating junction
Tj
1.
<
1
-------------------------Rth ( j – a )
February 2007
150
V
3
A
100
tp = 10 ms sinusoidal
SMB flat
dPtot
--------------dTj
Unit
TL = 130° C δ = 0.5
SMB
IFSM
Value
temperature(1)
150
A
100
-65 to + 175
°C
175
°C
condition to avoid thermal runaway for a diode on its own heatsink
Rev 4
1/10
www.st.com
10
Characteristics
STPS3150
1
Characteristics
Table 2.
Thermal resistance
Symbol
Rth(j-l)
Parameter
Value
Junction to lead
Lead length = 10 mm
Table 3.
Parameter
SMB
20
DO-201AD
15
Tests conditions
Tj = 25° C
Reverse leakage current
Tj = 125° C
Tj = 25° C
VF (2)
10
° C/W
Static electrical characteristics
Symbol
IR (1)
SMB flat
Unit
Tj = 125° C
Forward voltage drop
Tj = 25° C
Tj = 125° C
Min.
VR = VRRM
IF = 3 A
Typ
Max.
Unit
0.4
2.0
µA
0.6
2.0
mA
0.78
0.82
0.63
0.67
0.85
0.89
0.70
0.75
V
IF = 6 A
1. tp = 5 ms, δ < 2%
2. tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.59 x IF(AV) + 0.023 IF2(RMS)
Figure 1.
Average forward power
dissipation versus average
forward current
Figure 2.
PF(AV)(W)
IF(AV)(A)
2.4
δ = 0.2
δ = 0.1
2.2
3.5
δ = 0.5
Rth(j-a)=Rth(j-I)
DO-201AD
3.0
δ = 0.05
2.0
Average forward current versus
ambient temperature (δ = 0.5)
(DO-201AD / SMB)
1.8
2.5
δ=1
1.6
1.4
SMB
2.0
1.2
1.5
1.0
Rth(j-a)=75°C/W
0.8
1.0
0.6
T
T
0.4
0.5
IF(AV)(A)
0.2
δ=tp/T
0.0
0.0
2/10
0.5
1.0
1.5
2.0
2.5
3.0
δ=tp/T
tp
0.0
3.5
0
25
Tamb(°C)
tp
50
75
100
125
150
175
STPS3150
Characteristics
Figure 3.
Average forward current versus
ambient temperature (δ = 0.5)
(SMB flat)
Figure 4.
IF(AV)(A)
Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
IM(A)
3.5
12
Rth(j-a)=Rth(j-l)
11
3.0
SMB
10
9
2.5
8
Ta=25°C
7
2.0
6
SMB flat
1.5
Ta=75°C
5
4
Rth(j-a)=40°C/W
. SCU=2.5 cm2
1.0
Ta=125°C
3
T
IM
2
0.5
δ=tp/T
0.0
0
25
Figure 5.
t
1
Tamb(°C)
tp
t(s)
δ=0.5
0
50
75
100
125
150
175
Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-201AD)
1.E-03
1.E-02
Figure 6.
1.E-01
1.E+00
Non repetitive surge peak forward
current versus overload duration
(maximum values)
IM(A)
IM(A)
50
14
SMB flat
DO-201AD
45
12
40
Ta=25°C
10
35
30
8
TL=25°C
Ta=75°C
25
TL=75°C
6
20
Ta=125°C
4
15
TL=125°C
10
IM
IM
2
t
t
5
t(s)
δ=0.5
0
t(s)
δ=0.5
0
1.E-03
Figure 7.
1.E-02
1.E-01
1.E+00
Normalized avalanche power
derating versus pulse duration
1.E-03
Figure 8.
PARM(tp)
PARM(1µs)
1.E-02
1.E-01
1.E+00
Normalized avalanche power
derating versus junction
temperature
PARM(tp)
PARM(25°C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
0.001
0.01
Tj(°C)
tp(µs)
0.1
1
0
10
100
1000
25
50
75
100
125
150
3/10
Characteristics
Figure 9.
STPS3150
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-2001AD)
Zth(j-a)/Rth(j-a)
Zth(j-a)/Rth(j-a)
1.0
1.0
SMB
DO-201AD
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
T
0.2
T
0.2
Single pulse
0.1
δ=tp/T
tp(s)
Single pulse
0.1
tp
0.0
δ=tp/T
tp(s)
tp
0.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 11. Relative variation of thermal
impedance junction to lead
versus pulse duration - SMB flat
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 12. Reverse leakage current versus
reverse voltage applied (typical
values)
Zth(j-l)/Rth(j-l)
IR(µA)
1.0
1.E+04
SMB flat
0.9
Tj=150°C
1.E+03
0.8
Tj=125°C
0.7
1.E+02
Tj=100°C
0.6
1.E+01
0.5
Tj=75°C
0.4
Tj=50°C
1.E+00
0.3
0.2
Tj=25°C
1.E-01
Single pulse
0.1
tp(s)
VR(V)
1.E-02
0.0
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
0
1.E+01
Figure 13. Junction capacitance versus
reverse voltage applied (typical
values)
25
50
75
100
125
150
Figure 14. Forward voltage drop versus
forward current
IFM(A)
C(pF)
100
1000
Tj=125°C
(maximum values)
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=125°C
(typical values)
Tj=25°C
(maximum values)
10
100
VFM(V)
VR(V)
10
1
1
4/10
10
100
1000
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
STPS3150
Characteristics
Figure 16. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm)
(DO-201AD)
Figure 15. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm) (SMB)
Rth(j-a)(°C/W)
Rth(°C/W)
110
90
100
DO-201AD
SMB
80
Rth(j-a)
90
70
80
60
70
60
50
50
40
40
30
Rth(j-I)
30
20
20
10
10
SCu(cm²)
Lleads(mm)
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5
10
15
20
25
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm) (SMB flat)
Rth(j-a)(°C/W)
110
100
90
80
70
60
SMB flat
50
40
30
20
10
SCU(cm²)
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
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Package information
2
STPS3150
Package information
●
Epoxy meets UL94, V0.
Table 4.
SMB dimensions
Dimensions
Ref.
Millimeters
Inches
E1
D
E
A1
A2
C
L
b
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
L
0.75
1.50
0.030
0.059
Figure 18. SMB footprint (dimensions in mm)
1.62
2.60
1.62
2.18
5.84
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STPS3150
Package information
Table 5.
SMB Flat dimensions
Dimensions
Ref.
D
L
L2
E E1
L
L1
b
Inches
Min. Typ. Max.
Min.
A
0.90
1.10
0.035
0.043
b(1)
1.95
2.20
0.077
0.087
(1)
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.200
0.220
E1
4.05
4.60
0.189
0.181
L
0.75
1.50
0.029
0.059
A
c
Millimeters
c
Typ.
L1
0.40
0.016
L2
0.60
0.024
Max.
1. Applies to plated leads
Figure 19. SMB Flat footprint (dimensions in mm)
5.84
2.07
1.20
3.44
1.20
7/10
Package information
Table 6.
STPS3150
DO-201AD Package dimensions
DIMENSIONS
B
B
A
E
Note 1
E
REF.
Note 1
Millimeters
Min.
A
ØD
Max.
Inches
Min.
9.50
Max.
0.374
Note 2
ØC
B
25.40
1.000
C
5.30
0.209
D(1)
1.30
0.051
E
1.25
0.049
Note 2(2)
15
0.59
1. The lead diameter D is not controlled over zone E
2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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STPS3150
3
4
Ordering information
Ordering information
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS3150U
G315
SMB
0.107 g
2500
Tape and reel
STPS3150UF
FG315
SMB flat
0.50 g
5000
Tape and reel
STPS3150
STPS3150
DO-201AD
1.12 g
600
Ammopack
STPS3150RL
STPS3150
DO-201AD
1.12 g
1900
Tape and reel
Revision history
Date
Revision
Description of Changes
May-2003
2A
31-May-2006
3
Reformatted to current standard. Added ECOPACK statement.
Updated SMB footprint in Figure 12. Changed nF to pF in Figure 8.
08-Feb-2007
4
Added SMB flat package.
Last update.
9/10
STPS3150
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