STMICROELECTRONICS STR911FAW47

STR91xFAx3x STR91xFAx4x
ARM966E-S™ 16/32-Bit Flash MCU with Ethernet, USB, CAN,
AC motor control, 4 timers, ADC, RTC, DMA
Features
■
■
16/32-bit 96 MHz ARM9E based MCU
– ARM966E-S RISC core: Harvard architecture, 5-stage pipeline, Tightly-Coupled
Memories (SRAM and Flash)
– STR91xFA implementation of core adds
high-speed burst Flash memory interface,
instruction prefetch queue, branch cache
– Up to 96 MIPS directly from Flash memory
– Single-cycle DSP instructions supported
– Binary compatible with ARM7 code
Dual burst Flash memories, 32-bits wide
– 256 KB/512 KB/1 MB/2 MB Main Flash
– 32 KB/128 KB Secondary Flash
– Sequential Burst operation up to 96 MHz
– 100 K min erase cycles, 20 yr min retention
LQFP80 12 x12mm
LQFP128 14 x 14mm
LFBGA144 10 x 10 x 1.7
–
–
–
–
CAN interface (2.0B Active)
3 16550-style UARTs with IrDA protocol
2 Fast I2C™, 400 kHz
2 channels for SPI™, SSI™, or Microwire™
■
External Memory Interface (EMI)
– 8- or 16-bit data, up to 24-bit addressing
– Static Async modes for LQFP128
– Additional burst synchronous modes for
LFBGA144
■
SRAM, 32-bits wide
– 96K bytes, optional battery backup
■
9 programmable DMA channels
■
Up to 80 I/O pins (muxed with interfaces)
■
Clock, reset, and supply management
– Internal oscillator operating with external
4-25 MHz crystal
– Internal PLL up to 96 MHz
– Real-time clock provides calendar
functions, tamper, and wake-up functions
– Reset Supervisor monitors supply voltage,
watchdog, wake-up unit, external reset
– Brown-out monitor
– Run, Idle, and Sleep Mode as low as 50 uA
■
16-bit standard timers (TIM)
– 4 timers each with 2 input capture, 2 output
compare, PWM and pulse count modes
■
3-Phase induction motor controller (IMC)
■
JTAG interface with boundary scan
■
Embedded trace module (ARM ETM9)
■
Vectored interrupt controller (VIC)
– 32 IRQ vectors, 30 interrupt pins
– Branch cache minimizes interrupt latency
■
8-channel, 10-bit A/D converter (ADC)
– 0 to 3.6 V range, 0.7 usec conversion
■
10 Communication interfaces
– 10/100 Ethernet MAC with DMA and MII
– USB Full-speed (12 Mbps) slave device
May 2008
Table 1.
Device summary
Reference
Part number
STR91xFAx32
STR910FAM32, STR910FAW32,
STR910FAZ32, STR912FAW32
STR91xFAx42
STR911FAM42, STR911FAW42,
STR912FAW42, STR912FAZ42
STR91xFAx44
STR911FAM44 STR911FAW44
STR912FAW44, STR912FAZ44
STR91xFAx46
STR911FAM46, STR911FAW46,
STR912FAW46, STR912FAZ46
STR91xFAx47
STR911FAM47, STR911FAW47,
STR912FAW47, STR912FAZ47
Rev 3
1/101
www.st.com
1
Contents
STR91xFAx3x, STR91xFAx4x
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3
Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1
System-in-a-Package (SiP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.2
Package choice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.3
ARM966E-S CPU core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4
Burst Flash memory interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5
3.4.1
Pre-Fetch Queue (PFQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4.2
Branch Cache (BC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.4.3
Management of literals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
SRAM (64K or 96K Bytes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.5.1
Arbitration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.5.2
Battery backup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.6
DMA data movement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.7
Non-volatile memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.8
3.7.1
Primary Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.7.2
Secondary Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
One-time-programmable (OTP) memory . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.8.1
3.9
3.10
2/101
Product ID and revision level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Vectored interrupt controller (VIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.9.1
FIQ handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.9.2
IRQ handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.9.3
Interrupt sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Clock control unit (CCU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.10.1
Master clock sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.10.2
Reference clock (RCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.10.3
AHB clock (HCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.10.4
APB clock (PCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.10.5
Flash memory interface clock (FMICLK) . . . . . . . . . . . . . . . . . . . . . . . . 21
3.10.6
Baud rate clock (BRCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.10.7
External memory interface bus clock (BCLK) . . . . . . . . . . . . . . . . . . . . 22
STR91xFAx3x, STR91xFAx4x
Contents
3.10.8
USB interface clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.10.9
Ethernet MAC clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.10.10 External RTC calibration clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.10.11 Operation example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.11
3.12
3.13
Flexible power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.11.1
Run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.11.2
Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.11.3
Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Voltage supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.12.1
Independent A/D converter supply and reference voltage . . . . . . . . . . . 24
3.12.2
Battery supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
System supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.13.1
Supply voltage brownout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.13.2
Supply voltage dropout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.13.3
Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.13.4
External RESET_INn pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.13.5
Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.13.6
JTAG debug command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.13.7
Tamper detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.14
Real-time clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.15
JTAG interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.15.1
In-system-programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.15.2
Boundary scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.15.3
CPU debug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.15.4
JTAG security bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.16
Embedded trace module (ARM ETM9, v. r2p2) . . . . . . . . . . . . . . . . . . . . 29
3.17
Ethernet MAC interface with DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.18
USB 2.0 slave device interface with DMA . . . . . . . . . . . . . . . . . . . . . . . . 30
3.18.1
Packet buffer interface (PBI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.18.2
DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.18.3
Suspend mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.19
CAN 2.0B interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.20
UART interfaces with DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.20.1
DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.21
I2C interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3.22
SSP interfaces (SPI, SSI, and Microwire) with DMA . . . . . . . . . . . . . . . . 33
3/101
Contents
STR91xFAx3x, STR91xFAx4x
3.22.1
DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.23
General purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.24
A/D converter (ADC) with DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.24.1
3.25
DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Standard timers (TIM) with DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.25.1
DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3.26
Three-phase induction motor controller (IMC) . . . . . . . . . . . . . . . . . . . . . 36
3.27
External memory interface (EMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4
Related documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
5.1
LFBGA144 ball connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
5.2
Default pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
5.2.1
6
Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.1
Buffered and non-buffered writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.2
System (AHB) and peripheral (APB) buses . . . . . . . . . . . . . . . . . . . . . . . 53
6.3
SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.4
Two independent Flash memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6.5
7
6.4.1
Default configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6.4.2
Optional configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
STR91xFA memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.1
Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.1.1
Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.1.2
Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.1.3
Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.1.4
Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.1.5
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7.3
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
7.3.1
7.4
4/101
General notes on pin usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 60
RESET_INn and power-on-reset characteristics . . . . . . . . . . . . . . . . . . . 61
STR91xFAx3x, STR91xFAx4x
7.5
LVD electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
7.5.1
7.6
7.8
7.9
Typical power consumption for frequencies below 10 MHz . . . . . . . . . . 64
Clock and timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
7.7.1
Main oscillator electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 66
7.7.2
X1_CPU external clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
7.7.3
RTC oscillator electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 67
7.7.4
PLL electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
7.8.1
SRAM characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
7.8.2
Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
7.9.1
Functional EMS (electro magnetic susceptibility) . . . . . . . . . . . . . . . . . 71
7.9.2
Electro magnetic interference (EMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
7.9.3
Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . . 72
7.9.4
Electro-static discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
7.9.5
Static latch-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
7.9.6
Designing hardened software to avoid noise problems . . . . . . . . . . . . . 72
7.9.7
Electrical sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
7.10
I/O characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
7.11
External memory bus timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
7.12
7.13
8
LVD delay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
7.6.1
7.7
Contents
7.11.1
Asynchronous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
7.11.2
Synchronous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Communication interface electrical characteristics . . . . . . . . . . . . . . . . . 83
7.12.1
10/100 Ethernet MAC electrical characteristics . . . . . . . . . . . . . . . . . . . 83
7.12.2
USB electrical interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 85
7.12.3
CAN interface electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 85
7.12.4
I2C electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
7.12.5
SPI electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
ADC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Device marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
8.1
STR91xFAx32 / STR91xFAx42 / STR91xFAx44 . . . . . . . . . . . . . . . . . . . 92
8.2
STR91xFAx46 / STR91xFAx47 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
5/101
Contents
9
STR91xFAx3x, STR91xFAx4x
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
9.1
Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
9.2
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
10
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
6/101
STR91xFAx3x, STR91xFAx4x
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Table 47.
Table 48.
Table 49.
Table 50.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Sectoring of primary Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Sectoring of secondary Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Product ID and revision level values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
VIC IRQ Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
STR91x LFBGA144 Ball Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Device pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
RESET_INn and power-on-reset characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
LVD electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Supply current characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Typical current consumption at 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Internal clock frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Main oscillator electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
RTC oscillator electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
RTC crystal electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
PLL electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
SRAM and hardware registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Flash memory program/erase characteristics (Flash size £ 512 KB) . . . . . . . . . . . . . . . . . 69
Flash memory program/erase characteristics (Flash size = 1 MB / 2 MB) . . . . . . . . . . . . . 69
Flash memory endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
EMS data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
EMI data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
ESD data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Static latch-up data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
I/O characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
EMI bus clock period . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
EMI read operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Mux write times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Mux read times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Page mode read times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Sync burst write times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Sync burst read times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
MII_RX_CLK and MII_TX_CLK timing table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
MDC timing table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Ethernet MII management timing table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Ethernet MII transmit timing table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Ethernet MII receive timing table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
I2C electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
SPI electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
General ADC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
ADC conversion time (silicon Rev G) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
ADC conversion time (silicon Rev H and higher) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
7/101
List of tables
Table 51.
Table 52.
8/101
STR91xFAx3x, STR91xFAx4x
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
STR91xFAx3x, STR91xFAx4x
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
STR91xFA block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Clock control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
JTAG chaining inside the STR91xFA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
EMI 16-bit multiplexed connection example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
EMI 8-bit multiplexed connection example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
EMI 8-bit non-multiplexed connection example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
STR91xFAM 80-pin package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
STR91xFAW 128-pin package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
STR91xFA memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
LVD reset delay case 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
LVD reset delay case 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
LVD reset delay case 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Sleep mode current vs temperature with LVD on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Typical application with an external clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Non-mux write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Non-mux bus read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Mux write diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Mux read diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Page mode read diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Sync burst write diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Sync burst read diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
MII_RX_CLK and MII_TX_CLK timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
MDC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Ethernet MII management timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Ethernet MII transmit timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Ethernet MII receive timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
SPI slave timing diagram with CPHA=0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
SPI slave timing diagram with CPHA=1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
SPI master timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
ADC conversion characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Device marking for revision G LQFP80 and LQFP128 packages. . . . . . . . . . . . . . . . . . . . 92
Device marking for revision G LFBGA144 packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Device marking for revision H LQFP80 and LQFP128 packages. . . . . . . . . . . . . . . . . . . . 92
Device marking for revision H LFBGA144 packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Device marking for revision A LQFP80 and LQFP128 packages . . . . . . . . . . . . . . . . . . . . 93
Device marking for revision A LFBGA144 packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
80-Pin low profile quad flat package (LQFP80) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
128-Pin low profile quad flat package (LQFP128) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
144-ball low profile fine pitch ball grid array package (LFBGA144) . . . . . . . . . . . . . . . . . . 96
Recommended PCB Design rules (0.80/0.75mm pitch BGA). . . . . . . . . . . . . . . . . . . . . . . 96
9/101
Description
1
STR91xFAx3x, STR91xFAx4x
Description
STR91xFA is a series of ARM-powered microcontrollers which combines a 16/32-bit
ARM966E-S RISC processor core, dual-bank Flash memory, large SRAM for data or code,
and a rich peripheral set to form an ideal embedded controller for a wide variety of
applications such as point-of-sale terminals, industrial automation, security and
surveillance, vending machines, communication gateways, serial protocol conversion, and
medical equipment. The ARM966E-S core can perform single-cycle DSP instructions, good
for speech processing, audio algorithms, and low-end imaging.
This datasheet provides STR91xFA ordering information, functional overview, mechanical
information, and electrical device characteristics.
For complete information on STR91xFA memory, registers, and peripherals, please refer to
the STR91xFA Reference Manual.
For information on programming the STR91xFA Flash memory please refer to the STR9
Flash Programming Reference Manual
For information on the ARM966E-S core, please refer to the ARM966E-S Rev. 2 Technical
Reference Manual.
10/101
STR91xFAx3x, STR91xFAx4x
2
Device summary
Device summary
Table 2.
Device summary
Part Number
Flash KB
RAM KB
Major Peripherals
Package
STR910FAM32
256+32
64
CAN, 40 I/Os
LQFP80,
12x12 mm
STR910FAW32
256+32
64
CAN, EMI, 80 I/Os
LQFP128,
14x14 mm
STR910FAZ32
256+32
64
CAN, EMI, 80 I/Os
LFBGA144
10 x 10 x 1.7
STR911FAM42
256+32
96
USB, CAN, 40 I/Os
LQFP80,
12x12mm
USB, CAN, 40 I/Os
LQFP80,
12x12mm
USB, CAN, EMI, 80 I/Os
LQFP128,
14x14mm
USB, CAN, EMI, 80 I/Os
LQFP128,
14x14mm
Ethernet, USB, CAN, EMI, 80
I/Os
LQFP128
Ethernet, USB, CAN, EMI, 80
I/Os
LQFP128
Ethernet, USB, CAN, EMI, 80
I/Os
LQFP128
Ethernet, USB, CAN, EMI, 80
I/Os
LFBGA144
10 x 10 x 1.7
Ethernet, USB, CAN, EMI, 80
I/Os
LFBGA144
10 x 10 x 1.7
STR911FAM44
512+32
96
STR911FAM46
1024+128
96
STR911FAM47
2048+128
96
STR911FAW42
256+32
96
STR911FAW44
512+32
96
STR911FAW46
1024+128
96
STR911FAW47
2048+128
96
STR912FAW32
256+32
64
STR912FAW42
256+32
96
STR912FAW44
512+32
96
STR912FAW46
1024+128
96
STR912FAW47
2048+128
96
STR912FAZ42
256+32
96
STR912FAZ44
512+32
96
STR912FAZ46
1024+128
96
STR912FAZ47
2048+128
96
11/101
Functional overview
3
Functional overview
3.1
System-in-a-Package (SiP)
STR91xFAx3x, STR91xFAx4x
The STR91xFA is a SiP device, comprised of two stacked die. One die is the ARM966E-S
CPU with peripheral interfaces and analog functions, and the other die is the burst Flash.
The two die are connected to each other by a custom high-speed 32-bit burst memory
interface and a serial JTAG test/programming interface.
3.2
Package choice
STR91xFA devices are available in 128-pin (14 x 14 mm) and 80-pin (12 x 12 mm) LQFP
and LFBGA144 (10 x 10 mm) packages. Refer to Table 2: Device summary on page 11 for a
list of available peripherals for each of the package choices.
3.3
ARM966E-S CPU core
The ARM966E-S core inherently has separate instruction and data memory interfaces
(Harvard architecture), allowing the CPU to simultaneously fetch an instruction, and read or
write a data item through two Tightly-Coupled Memory (TCM) interfaces as shown in
Figure 1. The result is streamlined CPU Load and Store operations and a significant
reduction in cycle count per instruction. In addition to this, a 5-stage pipeline is used to
increase the amount of operational parallelism, giving the most performance out of each
clock cycle.
Ten DSP-enhanced instruction extensions are supported by this core, including single-cycle
execution of 32x16 Multiply-Accumulate, saturating addition/subtraction, and count leadingzeros.
The ARM966E-S core is binary compatible with 32-bit ARM7 code and 16-bit Thumb® code.
3.4
Burst Flash memory interface
A Burst Flash memory interface (Figure 1) has been integrated into the Instruction TCM
(I-TCM) path of the ARM966E-S core. Also in this path is an 8-instruction Pre-Fetch Queue
(PFQ) and a 15-entry Branch Cache (BC), enabling the ARM966E-S core to perform up to
96 MIPS while executing code directly from Flash memory. This architecture provides high
performance levels without a costly instruction SRAM, instruction cache, or external
SDRAM. Eliminating the instruction cache also means interrupt latency is reduced and code
execution becomes more deterministic.
3.4.1
Pre-Fetch Queue (PFQ)
As the CPU core accesses sequential instructions through the I-TCM, the PFQ always looks
ahead and will pre-fetch instructions, taking advantage any idle bus cycles due to variable
length instructions. The PFQ will fetch 32-bits at a time from the Burst Flash memory at a
rate of up to 96 MHz.
12/101
STR91xFAx3x, STR91xFAx4x
3.4.2
Functional overview
Branch Cache (BC)
When instruction addresses are not sequential, such as a program branch situation, the
PFQ would have to flush and reload which would cause the CPU to stall if no BC were
present. Before reloading, the PFQ checks the BC to see if it contains the desired target
branch address. The BC contains up to fifteen of the most recently taken branch addresses
and the first eight instructions associated with each of these branches. This check is
extremely fast, checking all fifteen BC entries simultaneously for a branch address match
(cache hit). If there is a hit, the BC rapidly supplies the instruction and reduces the CPU
stall. This gives the PFQ time to start pre-fetching again while the CPU consumes these
eight instructions from the BC. The advantage here is that program loops (very common
with embedded control applications) run very fast if the address of the loops are contained
in the BC.
In addition, there is a 16th branch cache entry that is dedicated to the Vectored Interrupt
Controller (VIC) to further reduce interrupt latency by eliminating the stall latency typically
imposed by fetching the instruction that reads the interrupt vector address from the VIC.
3.4.3
Management of literals
Typical ARM architecture and compilers do not place literals (data constants) sequentially in
Flash memory with the instructions that use them, but instead the literals are placed at some
other address which looks like a program branch from the PFQ’s point of view. The
STR91xFA implementation of the ARM966E-S core has special circuitry to prevent flushing
the PFQ when literals are encountered in program flow to keep performance at a maximum.
13/101
Functional overview
STR91xFAx3x, STR91xFAx4x
Figure 1.
STR91xFA block diagram
Stacked Burst Flash Memory Die
STR91xA
STR91x
JTAG ISP
VDD
CORE SUPPLY, VDD
GND
CORE GND, VSS
VDDQ
2nd Flash
Main Flash 256K,
512K, 1M or 2M 32K or 128K
Bytes
Bytes
Burst Interface
I/O SUPPLY, VDDQ
GND
I/O GND, VSSQ
BACKUP
SUPPLY
VBATT
64K or 96K
Byte
SRAM
Burst Interface
Pre-Fetch Que
and Branch
Cache
RTC
Arbiter
Data TCM
Interface
Instruction
ARM966E-S
TCM
RISC CPU Core Interface
Control Logic / BIU and Write Buffer
JTAG
JTAG
Debug
and
ETM
ETM
AMBA / AHBA Interface
32.768 kHz
XTAL
Real Time Clock
Wake Up
PLL, Power Management,
and Supervisory Reset
EMI bus*** or
16 GPIO
EMI Ctrl
16
External Memory
Interface (EMI)***,
Muxed Address/Data
Ethernet**
or 16 GPIO
To Ethernet
PHY (MII) **
Dedicated
DMA
* USB not available on STR910
** Ethernet MAC not available on STR910 and STR911
*** EMI not available on LQFP80
**** Only 40 GPIOs on LQFP80
14/101
Request
from
UART,
I2C,
SPI,
Timers,
Ext Req
ADC
Ethernet**
MAC, 10/100
Motor Control,
3-ph Induction
(3) UART w/ IrDA
(2) I2C
32
Programmable DMA
Controller (8 ch.)
USB* Full Speed, 10
Endpoints with FIFOs
USB Bus
AHB
to
APB
(4) 16-bit Timers,
CAPCOM, PWM
(80) GPIO****
48
MUX to 48 GPIO
4 MHz to
25
MHz XTAL
APB
AHB
Programmable Vectored
Programmable
Vectored
Interrupt Controllers
Interrupt Controller
(2) SPI
CAN 2.0B
8 Channel 10-bit
ADC
Watchdog Tmr
AVDD
AVREF*
AVSS
STR91xFAx3x, STR91xFAx4x
3.5
Functional overview
SRAM (64K or 96K Bytes)
A 32-bit wide SRAM resides on the CPU’s Data TCM (D-TCM) interface, providing singlecycle data accesses. As shown in Figure 1, the D-TCM shares SRAM access with the
Advanced High-performance Bus (AHB). Sharing is controlled by simple arbitration logic to
allow the DMA unit on the AHB to also access to the SRAM.
3.5.1
Arbitration
Zero-wait state access occurs for either the D-TCM or the AHB when only one of the two is
requesting SRAM. When both request SRAM simultaneously, access is granted on an
interleaved basis so neither requestor is starved, granting one 32-bit word transfer to each
requestor before relinquishing SRAM to the other. When neither the D-TCM or the AHB are
requesting SRAM, the arbiter leaves access granted to the most recent user (if D-TCM was
last to use SRAM then the D-TCM will not have to arbitrate to get access next time).
The CPU may execute code from SRAM through the AHB. There are no wait states as long
as the D-TCM is not contending for SRAM access and the AHB is not sharing bandwidth
with peripheral traffic. The ARM966E-S CPU core has a small pre-fetch queue built into this
instruction path through the AHB to look ahead and fetch instructions during idle bus cycles.
3.5.2
Battery backup
When a battery is connected to the designated battery backup pin (VBATT), SRAM contents
are automatically preserved when the operating voltage on the main digital supplies (VDD
and VDDQ are lost or sag below the LVD threshold. Automatic switchover to SRAM can be
disabled by firmware if it is desired that the battery will power only the RTC and not the
SRAM during standby.
3.6
DMA data movement
DMA channels on the Advanced High-performance Bus (AHB) take full advantage of the
separate data path provided by the Harvard architecture, moving data rapidly and largely
independent of the instruction path. There are two DMA units, one is dedicated to move data
between the Ethernet interface and SRAM, the other DMA unit has eight programmable
channels with 14 request signals to service other peripherals and interfaces (USB, SSP,
ADC, UART, Timers, EMI, and external request pins). Both single word and burst DMA
transfers are supported. Memory-to-memory transfers are supported in addition to memoryperipheral transfers. DMA access to SRAM is shared with D-TCM accesses, and arbitration
is described in Section 3.5.1. Efficient DMA transfers are managed by firmware using linked
list descriptor tables. Of the 16 DMA request signals, two are assigned to external inputs.
The DMA unit can move data between external devices and resources inside the STR91xFA
through the EMI bus.
3.7
Non-volatile memories
There are two independent 32-bit wide Burst Flash memories enabling true read-while-write
operation. The Flash memories are single-voltage erase/program with 20 year minimum
data retention and 100K minimum erase cycles. The primary Flash memory is much larger
than the secondary Flash.
15/101
Functional overview
STR91xFAx3x, STR91xFAx4x
Both Flash memories are blank when devices are shipped from ST. The CPU can boot only
from Flash memory (configurable selection of which Flash bank).
Flash memories are programmed half-word (16 bits) at a time, but are erased by sector or
by full array.
3.7.1
Primary Flash memory
Using the STR91xFA device configuration software tool and 3rd party Integrated Developer
Environments, it is possible to specify that the primary Flash memory is the default memory
from which the CPU boots at reset, or otherwise specify that the secondary Flash memory is
the default boot memory. This choice of boot memory is non-volatile and stored in a location
that can be programmed and changed only by JTAG In-System Programming. See
Section 6: Memory mapping, for more detail.
The primary Flash memory has equal length 64K byte sectors. See Table 3 for number of
sectors per device type.
Table 3.
Sectoring of primary Flash memory
Size of Primary Flash
256 KBytes
512 KBytes
1 MByte
2 MBytes
Number of sectors
4
8
16
32
Size of each sector
3.7.2
64 Kbytes
64 Kbytes
Secondary Flash memory
The smaller of the two Flash memories can be used to implement a bootloader, capable of
storing code to perform robust In-Application Programming (IAP) of the primary Flash
memory. The CPU executes code from the secondary Flash, while updating code in the
primary Flash memory. New code for the primary Flash memory can be downloaded over
any of the interfaces on the STR91xFA (USB, Ethernet, CAN, UART, etc.)
Additionally, the Secondary Flash memory may also be used to store small data sets by
emulating EEPROM through firmware, eliminating the need for external EEPROM
memories. This raises the data security level because passcodes and other sensitive
information can be securely locked inside the STR91xFA device.
The secondary Flash memory is sectored as shown in Table 4 according to device type.
Both the primary Flash memory and the secondary Flash memory can be programmed with
code and/or data using the JTAG In-System Programming (ISP) channel, totally
independent of the CPU. This is excellent for iterative code development and for
manufacturing.
Table 4.
16/101
Sectoring of secondary Flash memory
Size of Secondary Flash
32 KBytes
128 KBytes
Number of sectors
4
8
Size of each sector
8 Kbytes
16 Kbytes
STR91xFAx3x, STR91xFAx4x
3.8
Functional overview
One-time-programmable (OTP) memory
There are 32 bytes of OTP memory ideally suited for serial numbers, security keys, factory
calibration constants, or other permanent data constants. These OTP data bytes can be
programmed only one time through either the JTAG interface or by the CPU, and these
bytes can never be altered afterwards. As an option, a “lock bit” can be set by the JTAG
interface or the CPU which will block any further writing to the this OTP area. The “lock bit”
itself is also OTP. If the OTP array is unlocked, it is always possible to go back and write to
an OTP byte location that has not been previously written, but it is never possible to change
an OTP byte location if any one bit of that particular byte has been written before. The last
two OTP bytes (bytes 31 and 30) are reserved for the STR91xFA product ID and revision
level.
3.8.1
Product ID and revision level
OTP bytes 31 and 30 are programmed at ST factory before shipment and may be read by
firmware to determine the STR91xFA product type and silicon revision so it can optionally
take action based on the silicon on which it is running. In Rev H devices and 1MB/2MB Rev
A devices, byte 31 contains the the major family identifier of "9" (for STR9) in the high-nibble
location and the minor family identifier in the low nibble location, which can be used to
determine the size of Primary flash memory. In all devices, byte 30 contains the silicon
revision level indicator. See Table 5 for values related to the revisions of STR9 production
devices and size of Primary Flash memory. See Section 8 for details of external
identification of silicon revisions.
Table 5.
Product ID and revision level values
Production salestype
Silicon revision
Size of Primary Flash
OTP byte 31
OTP byte 30
STR91xFAxxxxx
Rev G
256K or 512K
91h
20h
STR91xFAxxxxx
Rev H
256K
90h
21h
STR91xFAxxxxx
Rev H
512K
91h
21h
STR91xFAx46xx
Rev A
1024K
92h
21h
STR91xFAx47xx
Rev A
2048K
93h
21h
3.9
Vectored interrupt controller (VIC)
Interrupt management in the STR91xFA is implemented from daisy-chaining two standard
ARM VIC units. This combined VIC has 32 prioritized interrupt request channels and
generates two interrupt output signals to the CPU. The output signals are FIQ and IRQ, with
FIQ having higher priority.
3.9.1
FIQ handling
FIQ (Fast Interrupt reQuest) is the only non-vectored interrupt and the CPU can execute an
Interrupt Service Routine (ISR) directly without having to determine/prioritize the interrupt
source, minimizing ISR latency. Typically only one interrupt source is assigned to FIQ. An
FIQ interrupt has its own set of banked registers to minimize the time to make a context
switch. Any of the 32 interrupt request input signals coming into the VIC can be assigned to
FIQ.
17/101
Functional overview
3.9.2
STR91xFAx3x, STR91xFAx4x
IRQ handling
IRQ is a vectored interrupt and is the logical OR of all 32 interrupt request signals coming
into the 32 IRQ channels. Priority of individual vectored interrupt requests is determined by
hardware (IRQ channel Intr 0 is highest priority, IRQ channel Intr 31 is lowest).
However, inside the same VIC (primary or secondary VIC), CPU firmware may re-assign
individual interrupt sources to individual hardware IRQ channels, meaning that firmware can
effectively change interrupt priority levels as needed within the same VIC (from priority 0 to
priority 16).
Note:
VIC0 (primary VIC) interrupts always have higher priority than VIC1 (secondary VIC)
interrupts
When the IRQ signal is activated by an interrupt request, VIC hardware will resolve the IRQ
interrupt priority, then the ISR reads the VIC to determine both the interrupt source and the
vector address to jump to the service code.
The STR91xFA has a feature to reduce ISR response time for IRQ interrupts. Typically, it
requires two memory accesses to read the interrupt vector address from the VIC, but the
STR91xFA reduces this to a single access by adding a 16th entry in the instruction branch
cache, dedicated for interrupts. This 16th cache entry always holds the instruction that reads
the interrupt vector address from the VIC, eliminating one of the memory accesses typically
required in traditional ARM implementations.
3.9.3
Interrupt sources
The 32 interrupt request signals coming into the VIC on 32 IRQ channels are from various
sources; 5 from a wake-up unit and the remaining 27 come from internal sources on the
STR91xFA such as on-chip peripherals, see Table 6. Optionally, firmware may force an
interrupt on any IRQ channel.
One of the 5 interrupt requests generated by the wake-up unit (IRQ25 in Table 6) is derived
from the logical OR of all 32 inputs to the wake-up unit. Any of these 32 inputs may be used
to wake up the CPU and cause an interrupt. These 32 inputs consist of 30 external
interrupts on selected and enabled GPIO pins, plus the RTC interrupt, and the USB Resume
interrupt.
Each of 4 remaining interrupt requests generated by the wake-up unit (IRQ26 in Table 6) are
derived from groupings of 8 interrupt sources. One group is from GPIO pins P3.2 to P3.7
plus the RTC interrupt and the USB Resume interrupt; the next group is from pins P5.0 to
P5.7; the next group is from pins P6.0 to P6.7; and last the group is from pins P7.0 to P7.7.
This allows individual pins to be assigned directly to vectored IRQ interrupts or one pin
assigned directly to the non-vectored FIQ interrupt.
18/101
STR91xFAx3x, STR91xFAx4x
Table 6.
Functional overview
VIC IRQ Channels
IRQ Channel
hardware
priority
VIC input
channel
Logic Block
Interrupt Source
0 (high priority)
VIC0.0
Watchdog
Timeout in WDT mode, Terminal Count in Counter Mode
1
VIC0.1
CPU Firmware
Firmware generated interrupt
2
VIC0.2
CPU Core
Debug Receive Command
3
VIC0.3
CPU Core
Debug Transmit Command
4
VIC0.4
TIM Timer 0
Logic OR of ICI0_0, ICI0_1, OCI0_0, OCI0_1, Timer overflow
5
VIC0.5
TIM Timer 1
Logic OR of ICI1_0, ICI1_1, OCI1_0, OCI1_1, Timer overflow
6
VIC0.6
TIM Timer 2
Logic OR of ICI2_0, ICI2_1, OCI2_0, OCI2_1, Timer overflow
7
VIC0.7
TIM Timer 3
Logic OR of ICI3_0, ICI3_1, OCI3_0, OCI3_1, Timer overflow
8
VIC0.8
USB
Logic OR of high priority USB interrupts
9
VIC0.9
USB
Logic OR of low priority USB interrupts
10
VIC0.10
CCU
Logic OR of all interrupts from Clock Control Unit
11
VIC0.11
Ethernet MAC
Logic OR of Ethernet MAC interrupts via its own dedicated DMA
channel.
12
VIC0.12
DMA
Logic OR of interrupts from each of the 8 individual DMA
channels
13
VIC0.13
CAN
Logic OR of all CAN interface interrupt sources
14
VIC0.14
IMC
Logic OR of 8 Induction Motor Control Unit interrupts
15
VIC0.15
ADC
End of AtoD conversion interrupt
16
VIC1.0
UART0
Logic OR of 5 interrupts from UART channel 0
17
VIC1.1
UART1
Logic OR of 5 interrupts from UART channel 1
18
VIC1.2
UART2
Logic OR of 5 interrupts from UART channel 2
19
VIC1.3
I2C0
Logic OR of transmit, receive, and error interrupts of I2C channel
0
20
VIC1.4
I2C1
Logic OR of transmit, receive, and error interrupts of I2C channel
1
21
VIC1.5
SSP0
Logic OR of all interrupts from SSP channel 0
22
VIC1.6
SSP1
Logic OR of all interrupts from SSP channel 1
23
VIC1.7
BROWNOUT
LVD warning interrupt
24
VIC1.8
RTC
Logic OR of Alarm, Tamper, or Periodic Timer interrupts
25
VIC1.9
Wake-Up (all)
Logic OR of all 32 inputs of Wake-Up unit (30 pins, RTC, and
USB Resume)
26
VIC1.10
Wake-up Group 0
Logic OR of 8 interrupt sources: RTC, USB Resume, pins P3.2 to
P3.7
27
VIC1.11
Wake-up Group 1
Logic OR of 8 interrupts from pins P5.0 to P5.7
28
VIC1.12
Wake-up Group 2
Logic OR of 8 interrupts from pins P6.0 to P6.7
19/101
Functional overview
Table 6.
STR91xFAx3x, STR91xFAx4x
VIC IRQ Channels (continued)
IRQ Channel
hardware
priority
VIC input
channel
Logic Block
Interrupt Source
29
VIC1.13
Wake-up Group 3
Logic OR of 8 interrupts from pins P7.0 to P7.7
30
VIC1.14
USB
USB Bus Resume Wake-up (also input to wake-up unit)
31 (low priority)
VIC1.15
PFQ-BC
Special use of interrupts from Prefetch Queue and Branch Cache
3.10
Clock control unit (CCU)
The CCU generates a master clock of frequency fMSTR. From this master clock the CCU
also generates individually scaled and gated clock sources to each of the following
functional blocks within the STR91xFA.
3.10.1
●
CPU, fCPUCLK
●
Advanced High-performance Bus (AHB), fHCLK
●
Advanced Peripheral Bus (APB), fPCLK
●
Flash Memory Interface (FMI), fFMICLK
●
External Memory Interface (EMI), fBCLK
●
UART Baud Rate Generators, fBAUD
●
USB, fUSB
Master clock sources
The master clock in the CCU (fMSTR) is derived from one of three clock input sources. Under
firmware control, the CPU can switch between the three CCU inputs without introducing any
glitches on the master clock output. Inputs to the CCU are:
●
Main Oscillator (fOSC). The source for the main oscillator input is a 4 to 25 MHz external
crystal connected to STR91xFA pins X1_CPU and X2_CPU, or an external oscillator
device connected to pin X1_CPU.
●
PLL (fPLL). The PLL takes the 4 to 25 MHz oscillator clock as input and generates a
master clock output up to 96 MHz (programmable). By default, at power-up the master
clock is sourced from the main oscillator until the PLL is ready (locked) and then the
CPU may switch to the PLL source under firmware control. The CPU can switch back to
the main oscillator source at any time and turn off the PLL for low-power operation. The
PLL is always turned off in Sleep mode.
●
RTC (fRTC). A 32.768 kHz external crystal can be connected to pins X1_RTC and
X2_RTC, or an external oscillator connected to pin X1_RTC to constantly run the realtime clock unit. This 32.768 kHz clock source can also be used as an input to the CCU
to run the CPU in slow clock mode for reduced power.
As an option, there are a number of peripherals that do not have to receive a clock sourced
from the CCU. The USB interface can receive an external clock on pin P2.7, TIM timers
TIM0/ TIM1 can receive an external clock on pin P2.4, and timers TIM2/TIM3 on pin P2.5.
20/101
STR91xFAx3x, STR91xFAx4x
Figure 2.
Functional overview
Clock control
32.768 kHz
RTCSEL
JRTCLK
MII_PHYCLK
EMI_BCLK
25MHz
1/2
PHYSEL
RCLK
X1_CPU
4-25MHz
X1_CPU
Main
OSC
PLL
fMSTR
fPLL
fOSC
RCLK
DIV
(1,2,4)
(1,2,4,8,16,1024)
X1_RTC
RTC
OSC
X2_RTC
32.768 kHz
HCLK
AHB DIV
APB DIV)
PCLK
(1,2,4,8)
Master CLK
fRTC
FMICLK
1/2
Timer 0 & 1
EXTCLK_T0T1
CPUCLK
External clock
SSPCLK clock to SSP
Timer 2 & 3
EXTCLK_T2T3
USB_CLK48M
3.10.2
External clock
48MHz
1/2
BRCLK baud rate to UART
1/2
USBCLK to USB
Reference clock (RCLK)
The main clock (fMSTR) can be divided to operate at a slower frequency reference clock
(RCLK) for the ARM core and all the peripherals. The RCLK provides the divided clock for
the ARM core, and feeds the dividers for the AHB, APB, External Memory Interface, and
FMI units.
3.10.3
AHB clock (HCLK)
The RCLK can be divided by 1, 2 or 4 to generate the AHB clock. The AHB clock is the bus
clock for the AHB bus and all bus transfers are synchronized to this clock. The maximum
HCLK frequency is 96 MHz.
3.10.4
APB clock (PCLK)
The RCLK can be divided by 1, 2, 4 or 8 to generate the APB clock. The APB clock is the
bus clock for the APB bus and all bus transfers are synchronized to this clock. Many of the
peripherals that are connected to the AHB bus also use the PCLK as the source for external
bus data transfers. The maximum PCLK frequency is 48 MHz.
3.10.5
Flash memory interface clock (FMICLK)
The FMICLK clock is an internal clock derived from RCLK, defaulting to RCLK frequency at
power up. The clock can be optionally divided by 2. The FMICLK determines the bus
bandwidth between the ARM core and the Flash memory. Typically, codes in the Flash
memory can be fetched one word per FMICLK clock in burst mode. The maximum FMICLK
frequency is 96 MHz.
21/101
Functional overview
3.10.6
STR91xFAx3x, STR91xFAx4x
Baud rate clock (BRCLK)
The baud rate clock is an internal clock derived from fMSTR that is used by the three on-chip
UART peripherals for baudrate generation and to generate the SSPCLK to drive the two
SSP peripherals. The frequency can be optionally divided by 2.
3.10.7
External memory interface bus clock (BCLK)
The BCLK is an internal clock that controls the EMI bus. All EMI bus signals are
synchronized to the BCLK. The BCLK is derived from the HCLK and the frequency can be
configured to be the same or half that of the HCLK. Refer to Table 17 on page 65 for the
maximum BCLK frequency (fBCLK). The BCLK clock is available on the LFBGA package as
an output pin.
3.10.8
USB interface clock
Special consideration regarding the USB interface: The clock to the USB interface must
operate at 48 MHz and comes from one of three sources, selected under firmware control:
3.10.9
●
CCU master clock output of 48 MHz.
●
CCU master clock output of 96 MHz. An optional divided-by-two circuit is available to
produce 48 MHz for the USB while the CPU system runs at 96MHz.
●
STR91xFA pin P2.7. An external 48 MHz oscillator connected to pin P2.7 can directly
source the USB while the CCU master clock can run at some frequency other than 48
or 96 MHz.
Ethernet MAC clock
Special consideration regarding the Ethernet MAC: The external Ethernet PHY interface
device requires it’s own 25 MHz clock source. This clock can come from one of two sources:
3.10.10
●
A 25 MHz clock signal coming from a dedicated output pin (P5.2) of the STR91xFA. In
this case, the STR91xFA must use a 25 MHz signal on its main oscillator input in order
to pass this 25 MHz clock back out to the PHY device through pin P5.2. The advantage
here is that an inexpensive 25 MHz crystal may be used to source a clock to both the
STR91xFA and the external PHY device.
●
An external 25 MHz oscillator connected directly to the external PHY interface device.
In this case, the STR91xFA can operate independent of 25 MHz.
External RTC calibration clock
The RTC_CLK can be enabled as an output on the JRTCK pin. The RTC_CLK is used for
RTC oscillator calibration. The RTC_CLK is active in Sleep mode and can be used as a
system wake up control clock.
3.10.11
Operation example
As an example of CCU operation, a 25 MHz crystal can be connected to the main oscillator
input on pins X1_CPU and X2_CPU, a 32.768 kHz crystal connected to pins X1_RTC and
X2_RTC, and the clock input of an external Ethernet PHY device is connected to STR91xFA
output pin P5.2. In this case, the CCU can run the CPU at 96 MHz from PLL, the USB
interface at 48 MHz, and the Ethernet interface at 25 MHz. The RTC is always running in the
background at 32.768 kHz, and the CPU can go to very low power mode dynamically by
running from 32.768 kHz and shutting off peripheral clocks and the PLL as needed.
22/101
STR91xFAx3x, STR91xFAx4x
3.11
Functional overview
Flexible power management
The STR91xFA offers configurable and flexible power management control that allows the
user to choose the best power option to fit the application. Power consumption can be
dynamically managed by firmware and hardware to match the system’s requirements.
Power management is provided via clock control to the CPU and individual peripherals.
Clocks to the CPU and peripherals can be individually divided and gated off as needed. In
addition to individual clock divisors, the CCU master clock source going to the CPU, AHB,
APB, EMI, and FMI can be divided dynamically by as much as 1024 for low power operation.
Additionally, the CCU may switch its input to the 32.768 kHz RTC clock at any time for low
power.
The STR91xFA supports the following three global power control modes:
●
Run Mode: All clocks are on with option to gate individual clocks off via clock mask
registers.
●
Idle Mode: CPU and FMI clocks are off until an interrupt, reset, or wake-up occurs.
Pre-configured clock mask registers selectively allow individual peripheral clocks to
continue run during Idle Mode.
●
Sleep Mode: All clocks off except RTC clock. Wake up unit remains powered, PLL is
forced off.
A special mode is used when JTAG debug is active which never gates off any clocks even if
the CPU enters Idle or Sleep mode.
3.11.1
Run mode
This is the default mode after any reset occurs. Firmware can gate off or scale any individual
clock. Also available is a special Interrupt Mode which allows the CPU to automatically run
full speed during an interrupt service and return back to the selected CPU clock divisor rate
when the interrupt has been serviced. The advantage here is that the CPU can run at a very
low frequency to conserve power until a periodic wake-up event or an asynchronous
interrupt occurs at which time the CPU runs full speed immediately.
3.11.2
Idle mode
In this mode the CPU suspends code execution and the CPU and FMI clocks are turned off
immediately after firmware sets the Idle Bit. Various peripherals continue to run based on
the settings of the mask registers that exist just prior to entering Idle Mode. There are 3
ways to exit Idle Mode and return to Run Mode:
●
Any reset (external reset pin, watchdog, low-voltage, power-up, JTAG debug command)
●
Any interrupt (external, internal peripheral, RTC alarm or interval)
●
Input from wake-up unit on GPIO pins
Note:
It is possible to remain in Idle Mode for the majority of the time and the RTC can be
programmed to periodically wake up to perform a brief task or check status.
3.11.3
Sleep mode
In this mode all clock circuits except the RTC are turned off and main oscillator input pins
X1_CPU and X2_CPU are disabled. The RTC clock is required for the CPU to exit Sleep
23/101
Functional overview
STR91xFAx3x, STR91xFAx4x
Mode. The entire chip is quiescent (except for RTC and wake-up circuitry). There are three
means to exit Sleep Mode and re-start the system:
3.12
●
Some resets (external reset pin, low-voltage, power-up, JTAG debug command)
●
RTC alarm
●
Input from wake-up unit
Voltage supplies
The STR91xFA requires two separate operating voltage supplies. The CPU and memories
operate from a 1.65V to 2.0V on the VDD pins, and the I/O ring operates at 2.7V to 3.6V on
the VDDQ pins.
In Standby mode, both VDD and VDDQ must be shut down. Otherwise the specified
maximum power consumption for Standby mode (IRTC_STBY and ISRAM_STBY) may be
exceeded. Leakage may occur if only one of the voltage supplies is off.
3.12.1
Independent A/D converter supply and reference voltage
The ADC unit on 128-pin and 144-ball packages has an isolated analog voltage supply input
at pin AVDD to accept a very clean voltage source, independent of the digital voltage
supplies. Additionally, an isolated analog supply ground connection is provided on pin AVSS
only on 128-pin and 144-ball packages for further ADC supply isolation. On 80-pin
packages, the analog voltage supply is shared with the ADC reference voltage pin (as
described next), and the analog ground is shared with the digital ground at a single point in
the STR91xFA device on pin AVSS_VSSQ.
A separate external analog reference voltage input for the ADC unit is available on 128-pin
and 144-ball packages at the AVREF pin for better accuracy on low voltage inputs. For 80pin packages, the ADC reference voltage is tied internally to the ADC unit supply voltage at
pin AVREF_AVDD, meaning the ADC reference voltage is fixed to the ADC unit supply
voltage.
See Table 11: Operating conditions, for restrictions to the relative voltage levels of VDDQ,
AVDD, AVREF, and AVREF_AVDD.
3.12.2
Battery supply
An optional stand-by voltage from a battery or other source may be connected to pin VBATT
to retain the contents of SRAM in the event of a loss of the main digital supplies (VDD and
VDDQ) . The SRAM will automatically switch its supply from the internal VDD source to the
VBATT pin when the voltage of VDD drops below the LVD threshold. In order to use the
battery supply, the LVD must be enabled.
The VBATT pin also supplies power to the RTC unit, allowing the RTC to function even when
the main digital supplies (VDD and VDDQ) are switched off. By configuring the RTC register,
it is possible to select whether or not to power from VBATT only the RTC unit, or power the
RTC unit and the SRAM when the STR91xFA device is powered off.
24/101
STR91xFAx3x, STR91xFAx4x
3.13
Functional overview
System supervisor
The STR91xFA monitors several system and environmental inputs and will generate a
global reset, a system reset, or an interrupt based on the nature of the input and
configurable settings. A global reset clears all functions on the STR91xFA, a system reset
will clear all but the Clock Control Unit (CCU) settings and the system status register. At any
time, firmware may reset individual on-chip peripherals. System supervisor inputs include:
Note:
●
GR: CPU voltage supply (VDD) drop out or brown out
●
GR: I/O voltage supply (VDDQ) drop out or brown out
●
GR: Power-Up condition
●
SR: Watchdog timer timeout
●
SR: External reset pin (RESET_INn)
●
SR: JTAG debug reset command
GR: means the input causes Global Reset, SR: means the input causes System Reset
The CPU may read a status register after a reset event to determine if the reset was caused
by a watchdog timer timeout or a voltage supply drop out. This status register is cleared only
by a power up reset.
3.13.1
Supply voltage brownout
Each operating voltage source (VDD and VDDQ) is monitored separately by the Low Voltage
Detect (LVD) circuitry. The LVD will generate an early warning interrupt to the CPU when
voltage sags on either VDD or VDDQ voltage inputs. This is an advantage for battery powered
applications because the system can perform an orderly shutdown before the batteries
become too weak. The voltage trip point to cause a brown out interrupt is typically 0.25V
above the LVD dropout thresholds that cause a reset.
CPU firmware may prevent all brown-out interrupts by writing to interrupt mask registers at
run-time.
3.13.2
Supply voltage dropout
LVD circuitry will always cause a global reset if the CPU’s VDD source drops below it’s fixed
threshold of 1.4V.
However, the LVD trigger threshold to cause a global reset for the I/O ring’s VDDQ source is
set to one of two different levels, depending if VDDQ will be operated in the range of 2.7V to
3.3V, or 3.0V to 3.6V. If VDDQ operation is at 2.7V to 3.3V, the LVD dropout trigger threshold
is 2.4V. If VDDQ operation is 3.0V and 3.6V, the LVD threshold is 2.7V. The choice of trigger
level is made by STR91xFA device configuration software from STMicroelectronics or IDE
from 3rd parties, and is programmed into the STR91xFA device along with other
configurable items through the JTAG interface when the Flash memory is programmed.
CPU firmware may prevent some LVD resets if desired by writing a control register at runtime. Firmware may also disable the LVD completely for lowest-power operation when an
external LVD device is being used.
3.13.3
Watchdog timer
The STR91xFA has a 16-bit down-counter (not one of the four TIM timers) that can be used
as a watchdog timer or as a general purpose free-running timer/counter. The clock source is
the peripheral clock from the APB, and an 8-bit clock pre-scaler is available. When enabled
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Functional overview
STR91xFAx3x, STR91xFAx4x
by firmware as a watchdog, this timer will cause a system reset if firmware fails to
periodically reload this timer before the terminal count of 0x0000 occurs, ensuring firmware
sanity. The watchdog function is off by default after a reset and must be enabled by
firmware.
3.13.4
External RESET_INn pin
This input signal is active-low with hystereses (VHYS). Other open-drain, active-low system
reset signals on the circuit board (such as closure to ground from a push-button) may be
connected directly to the RESET_INn pin, but an external pull-up resistor to VDDQ must be
present as there is no internal pullup on the RESET_INn pin.
A valid active-low input signal of tRINMIN duration on the RESET_INn pin will cause a system
reset within the STR91xFA. There is also a RESET_OUTn pin on the STR91xFA that can
drive other system components on the circuit board. RESET_OUTn is active-low and has
the same timing of the Power-On-Reset (POR) shown next, tPOR.
3.13.5
Power-up
The LVD circuitry will always generate a global reset when the STR91xFA powers up,
meaning internal reset is active until VDDQ and VDD are both above the LVD thresholds. This
POR condition has a duration of tPOR, after which the CPU will fetch its first instruction from
address 0x0000.0000 in Flash memory. It is not possible for the CPU to boot from any other
source other than Flash memory.
3.13.6
JTAG debug command
When the STR91xFA is in JTAG debug mode, an external device which controls the JTAG
interface can command a system reset to the STR91xFA over the JTAG channel.
3.13.7
Tamper detection
On 128-pin and 144-ball STR91xFA devices only, there is a tamper detect input pin,
TAMPER_IN, used to detect and record the time of a tamper event on the end product such
as malicious opening of an enclosure, unwanted opening of a panel, etc. The activation
mode of the tamper pin is programmable to one of two modes. One is Normally
Closed/Tamper Open, the other mode will detect when a signal on the tamper input pin is
driven from low-to-high, or high-to-low depending on firmware configuration. Once a tamper
event occurs, the RTC time (millisecond resolution) and the date are recorded in the RTC
unit. Simultaneously, the SRAM standby voltage source will be cut off to invalidate all SRAM
contents. Tamper detection control and status logic are part of the RTC unit.
3.14
Real-time clock (RTC)
The RTC combines the functions of a complete time-of-day clock (millisecond resolution)
with an alarm programmable up to one month, a 9999-year calender with leap-year support,
periodic interrupt generation from 1 to 512 Hz, tamper detection (described in
Section 3.13.7), and an optional clock calibration output on the JRTCK pin. The time is in 24
hour mode, and time/calendar values are stored in binary-coded decimal format.
The RTC also provides a self-isolation mode that is automatically activated during power
down. This feature allows the RTC to continue operation when VDDQ and VDD are absent,
as long as an alternate power source, such as a battery, is connected to the VBATT input
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STR91xFAx3x, STR91xFAx4x
Functional overview
pin. The current drawn by the RTC unit on the VBATT pin is very low in this standby mode,
IRTC_STBY.
3.15
JTAG interface
An IEEE-1149.1 JTAG interface on the STR91xFA provides In-System-Programming (ISP)
of all memory, boundary scan testing of pins, and the capability to debug the CPU.
STR91xFA devices are shipped from ST with blank Flash memories. The CPU can only boot
from Flash memory (selection of which Flash bank is programmable). Firmware must be
initially programmed through JTAG into one of these Flash memories before the STR91xFA
is used.
Six pins are used on this JTAG serial interface. The five signals JTDI, JTDO, JTMS, JTCK,
and JTRSTn are all standard JTAG signals complying with the IEEE-1149.1 specification.
The sixth signal, JRTCK (Return TCK), is an output from the STR91xFA and it is used to
pace the JTCK clock signal coming in from the external JTAG test equipment for debugging.
The frequency of the JTCK clock signal coming from the JTAG test equipment must be at
least 10 times less than the ARM966E-S CPU core operating frequency (fCPUCLK). To
ensure this, the signal JRTCK is output from the STR91xFA and is input to the external
JTAG test equipment to hold off transitions of JTCK until the CPU core is ready, meaning
that the JTAG equipment cannot send the next rising edge of JTCK until the equipment
receives a rising edge of JRTCK from the STR91xFA. The JTAG test equipment must be
able to interpret the signal JRTCK and perform this adaptive clocking function. If it is known
that the CPU clock will always be at least ten times faster than the incoming JTCK clock
signal, then the JRTCK signal is not needed.
The two die inside the STR91xFA (CPU die and Flash memory die) are internally daisychained on the JTAG bus, see Figure 3 on page 28. The CPU die has two JTAG Test Access
Ports (TAPs), one for boundary scan functions and one for ARM CPU debug. The Flash
memory die has one TAP for program/erase of non-volatile memory. Because these three
TAPs are daisy-chained, only one TAP will converse on the JTAG bus at any given time while
the other two TAPs are in BYPASS mode. The TAP positioning order within this JTAG chain
is the boundary scan TAP first, followed by the ARM debug TAP, followed by the Flash TAP.
All three TAP controllers are reset simultaneously by one of two methods:
●
A chip-level global reset, caused only by a Power-On-Reset (POR) or a Low Voltage
Detect (LVD).
●
A reset command issued by the external JTAG test equipment. This can be the
assertion of the JTAG JTRSTn input pin on the STR91xFA or a JTAG reset command
shifted into the STR91xFA serially.
This means that chip-level system resets from watchdog time-out or the assertion of
RESET_INn pin do not affect the operation of any JTAG TAP controller. Only global resets
effect the TAPs.
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Functional overview
Figure 3.
STR91xFAx3x, STR91xFAx4x
JTAG chaining inside the STR91xFA
STR91xx
MAIN FLASH
SECONDARY FLASH
JTAG TAP CONTROLLER #3
TDO
TMS
TCK TRST
TDI
BURST FLASH
MEMORY DIE
JTAG
Instruction
register length
is 8 bits
JTDO
JTRSTn
JTCK
JTMS
JTDI
ARM966ES DIE
JRTCK
TDI
TMS
TCK TRST
JTAG TAP CONTROLLER #1
BOUNDARY SCAN
3.15.1
TDO
TDI
TRST
TCK
TMS
JTAG TAP CONTROLLER #2
TDO
JTAG
Instruction
register length:
5 bits for TAP #1
4 bits for TAP #2
CPU DEBUG
In-system-programming
The JTAG interface is used to program or erase all memory areas of the STR91xFA device.
The pin RESET_INn must be asserted during ISP to prevent the CPU from fetching invalid
instructions while the Flash memories are being programmed.
Note that the 32 bytes of OTP memory locations cannot be erased by any means once
programmed by JTAG ISP or the CPU.
3.15.2
Boundary scan
Standard JTAG boundary scan testing compliant with IEEE-1149.1 is available on the
majority of pins of the STR91xFA for circuit board test during manufacture of the end
product. STR91xFA pins that are not serviced by boundary scan are the following:
3.15.3
●
JTAG pins JTCK, JTMS, JTDI, JTDO, JTRSTn, JRTCK
●
Oscillator input pins X1_CPU, X2_CPU, X1_RTC, X2_RTC
●
Tamper detect input pin TAMPER_IN (128-pin and 144-pin packages only)
CPU debug
The ARM966E-S CPU core has standard ARM EmbeddedICE-RT logic, allowing the
STR91xFA to be debugged through the JTAG interface. This provides advanced debugging
features making it easier to develop application firmware, operating systems, and the
hardware itself. Debugging requires that an external host computer, running debug software,
is connected to the STR91xFA target system via hardware which converts the stream of
debug data and commands from the host system’s protocol (USB, Ethernet, etc.) to the
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STR91xFAx3x, STR91xFAx4x
Functional overview
JTAG EmbeddedICE-RT protocol on the STR91xFA. These protocol converters are
commercially available and operate with debugging software tools.
The CPU may be forced into a Debug State by a breakpoint (code fetch), a watchpoint (data
access), or an external debug request over the JTAG channel, at which time the CPU core
and memory system are effectively stopped and isolated from the rest of the system. This is
known as Halt Mode and allows the internal state of the CPU core, memory, and peripherals
to be examined and manipulated. Typical debug functions are supported such as run, halt,
and single-step. The EmbeddedICE-RT logic supports two hardware compare units. Each
can be configured to be either a watchpoint or a breakpoint. Breakpoints can also be datadependent.
Debugging (with some limitations) may also occur through the JTAG interface while the CPU
is running full speed, known as Monitor Mode. In this case, a breakpoint or watchpoint will
not force a Debug State and halt the CPU, but instead will cause an exception which can be
tracked by the external host computer running monitor software. Data can be sent and
received over the JTAG channel without affecting normal instruction execution. Time critical
code, such as Interrupt Service Routines may be debugged real-time using Monitor Mode.
3.15.4
JTAG security bit
This is a non-volatile bit (Flash memory based), which when set will not allow the JTAG
debugger or JTAG programmer to read the Flash memory contents.
Using JTAG ISP, this bit is typically programmed during manufacture of the end product to
prevent unwanted future access to firmware intellectual property. The JTAG Security Bit can
be cleared only by a JTAG “Full Chip Erase” command, making the STR91xFA device blank
(except for programmed OTP bytes), and ready for programming again. The CPU can read
the status of the JTAG Security Bit, but it may not change the bit value.
3.16
Embedded trace module (ARM ETM9, v. r2p2)
The ETM9 interface provides greater visibility of instruction and data flow happening inside
the CPU core by streaming compressed data at a very high rate from the STR91xFA though
a small number of ETM9 pins to an external Trace Port Analyzer (TPA) device. The TPA is
connected to a host computer using USB, Ethernet, or other high-speed channel. Real-time
instruction flow and data activity can be recorded and later formatted and displayed on the
host computer running debugger software, and this software is typically integrated with the
debug software used for EmbeddedICE-RT functions such as single-step, breakpoints, etc.
Tracing may be triggered and filtered by many sources, such as instruction address
comparators, data watchpoints, context ID comparators, and counters. State sequencing of
up to three triggers is also provided. TPA hardware is commercially available and operates
with debugging software tools.
The ETM9 interface is nine pins total, four of which are data lines, and all pins can be used
for GPIO after tracing is no longer needed. The ETM9 interface is used in conjunction with
the JTAG interface for trace configuration. When tracing begins, the ETM9 engine
compresses the data by various means before broadcasting data at high speed to the TPA
over the four data lines. The most common ETM9 compression technique is to only output
address information when the CPU branches to a location that cannot be inferred from the
source code. This means the host computer must have a static image of the code being
executed for decompressing the ETM9 data. Because of this, self-modified code cannot be
traced.
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Functional overview
3.17
STR91xFAx3x, STR91xFAx4x
Ethernet MAC interface with DMA
STR91xFA devices in 128-pin and 144-ball packages provide an IEEE-802.3-2002
compliant Media Access Controller (MAC) for Ethernet LAN communications through an
industry standard Medium Independent Interface (MII). The STR91xFA requires an external
Ethernet physical interface device (PHY) to connect to the physical LAN bus (twisted-pair,
fiber, etc.). The PHY is connected to the STR91xFA MII port using as many as 18 signals
(see pins which have signal names MII_* in Table 8).
The MAC corresponds to the OSI Data Link layer and the PHY corresponds to the OSI
Physical layer. The STR91xFA MAC is responsible for:
●
Data encapsulation, including frame assembly before transmission, and frame
parsing/error detection during and after reception.
●
Media access control, including initiation of frame transmission and recover from
transmission failure.
The STR91xFA MAC includes the following features:
●
Supports 10 and 100 Mbps rates
●
Tagged MAC frame support (VLAN support)
●
Half duplex (CSMA/CD) and full duplex operation
●
MAC control sublayer (control frames) support
●
32-bit CRC generation and removal
●
Several address filtering modes for physical and multicast address (multicast and group
addresses)
●
32-bit status code for each transmitted or received frame
●
Internal FIFOs to buffer transmit and receive frames. Transmit FIFO depth is 4 words
(32 bits each), and the receive FIFO is 16 words deep.
A 32-bit burst DMA channel residing on the AHB is dedicated to the Ethernet MAC for highspeed data transfers, side-stepping the CPU for minimal CPU impact during transfers. This
DMA channel includes the following features:
3.18
●
Direct SRAM to MAC transfers of transmit frames with the related status, by descriptor
chain
●
Direct MAC to SRAM transfers of receive frames with the related status, by descriptor
chain
●
Open and Closed descriptor chain management
USB 2.0 slave device interface with DMA
The STR91xFA provides a USB slave controller that implements both the OSI Physical and
Data Link layers for direct bus connection by an external USB host on pins USBDP and
USBPN. The USB interface detects token packets, handles data transmission and
reception, and processes handshake packets as required by the USB 2.0 standard.
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STR91xFAx3x, STR91xFAx4x
Functional overview
The USB slave interface includes the following features:
3.18.1
●
Supports USB low and full-speed transfers (12 Mbps), certified to comply with the USB
2.0 specification
●
Supports isochronous, bulk, control, and interrupt endpoints
●
Configurable number of endpoints allowing a mixture of up to 20 single-buffered
monodirectional endpoints or up to 10 double-buffered bidirectional endpoints
●
Dedicated, dual-port 2 Kbyte USB Packet Buffer SRAM. One port of the SRAM is
connected by a Packet Buffer Interface (PBI) on the USB side, and the CPU connects
to the other SRAM port.
●
CRC generation and checking
●
NRZI encoding-decoding and bit stuffing
●
USB suspend resume operations
Packet buffer interface (PBI)
The PBI manages a set of buffers inside the 2 Kbyte Packet Buffer, both for transmission
and reception. The PBI will choose the proper buffer according to requests coming from the
USB Serial Interface Engine (SIE) and locate it in the Packet SRAM according to addresses
pointed by endpoint registers. The PBI will also auto-increment the address after each
exchanged byte until the end of packet, keeping track of the number of exchanged bytes and
preventing buffer overrun. Special support is provided by the PBI for isochronous and bulk
transfers, implementing double-buffer usage which ensures there is always an available
buffer for a USB packet while the CPU uses a different buffer.
3.18.2
DMA
A programmable DMA channel may be assigned by CPU firmware to service the USB
interface for fast and direct transfers between the USB bus and SRAM with little CPU
involvement. This DMA channel includes the following features:
3.18.3
●
Direct USB Packet Buffer SRAM to system SRAM transfers of receive packets, by
descriptor chain for bulk or isochronous endpoints.
●
Direct system SRAM to USB Packet Buffer SRAM transfers of transmit packets, by
descriptor chain for bulk or isochronous endpoints.
●
Linked-list descriptor chain support for multiple USB packets
Suspend mode
CPU firmware may place the USB interface in a low-power suspend mode when required,
and the USB interface will automatically wake up asynchronously upon detecting activity on
the USB pins.
3.19
CAN 2.0B interface
The STR91xFA provides a CAN interface complying with CAN protocol version 2.0 parts A
and B. An external CAN transceiver device connected to pins CAN_RX and CAN_TX is
required for connection to the physical CAN bus.
The CAN interface manages up to 32 Message Objects and Identifier Masks using a
Message SRAM and a Message Handler. The Message Handler takes care of low-level
CAN bus activity such as acceptance filtering, transfer of messages between the CAN bus
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Functional overview
STR91xFAx3x, STR91xFAx4x
and the Message SRAM, handling of transmission requests, and interrupt generation. The
CPU has access to the Message SRAM via the Message Handler using a set of 38 control
registers.
The follow features are supported by the CAN interface:
●
Bitrates up to 1 Mbps
●
Disable Automatic Retransmission mode for Time Triggered CAN applications
●
32 Message Objects
●
Each Message Object has its own Identifier Mask
●
Programmable FIFO mode
●
Programmable loopback mode for self-test operation
The CAN interface is not supported by DMA.
3.20
UART interfaces with DMA
The STR91xFA supports three independent UART serial interfaces, designated UART0,
UART1, and UART2. Each interface is very similar to the industry-standard 16C550 UART
device. All three UART channels support IrDA encoding/decoding, requiring only an external
LED transceiver to pins UARTx_RX and UARTx_Tx for communication. One UART channel
(UART0) supports full modem control signals.
UART interfaces include the following features:
●
Maximum baud rate of 1.5 Mbps
●
Separate FIFOs for transmit and receive, each 16 deep, each FIFO can be disabled by
firmware if desired
●
Programmable FIFO trigger levels between 1/8 and 7/8
●
Programmable baud rate generator based on CCU master clock, or CCU master clock
divided by two
●
Programmable serial data lengths of 5, 6, 7, or 8 bits with start bit and 1 or 2 stop bits
●
Programmable selection of even, odd, or no-parity bit generation and detection
●
False start-bit detection
●
Line break generation and detection
●
Support of IrDA SIR ENDEC functions for data rates of up to 115.2K bps
●
IrDA bit duration selection of 3/16 or low-power (1.14 to 2.23 µsec)
●
Channel UART0 supports modem control functions CTS, DCD, DSR, RTS, DTR, and
RI
For your reference, only two standard 16550 UART features are not supported, 1.5 stop bits
and independent receive clock.
3.20.1
DMA
A programmable DMA channel may be assigned by CPU firmware to service channels
UART0 and UART1 for fast and direct transfers between the UART bus and SRAM with little
CPU involvement. Both DMA single-transfers and DMA burst-transfers are supported for
transmit and receive. Burst transfers require that UART FIFOs are enabled.
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STR91xFAx3x, STR91xFAx4x
3.21
Functional overview
I2C interfaces
The STR91xFA supports two independent I2C serial interfaces, designated I2C0, and I2C1.
Each interface allows direct connection to an I2C bus as either a bus master or bus slave
device (firmware configurable). I2C is a two-wire communication channel, having a bidirectional data signal and a single-directional clock signal based on open-drain line drivers,
requiring external pull-up resistors.
Byte-wide data is transferred between a Master device and a Slave device on two wires.
More than one bus Master is allowed, but only one Master may control the bus at any given
time. Data is not lost when another Master requests the use of a busy bus because I2C
supports collision detection and arbitration. More than one Slave device may be present on
the bus, each having a unique address. The bus Master initiates all data movement and
generates the clock that permits the transfer. Once a transfer is initiated by the Master, any
device that is addressed is considered a Slave. Automatic clock synchronization allows I2C
devices with different bit rates to communicate on the same physical bus. A single device
can play the role of Master or Slave, or a single device can be a Slave only. A Master or
Slave device has the ability to suspend data transfers if the device needs more time to
transmit or receive data.
Each I2C interface on the STR91xFA has the following features:
3.22
●
Programmable clock supports various rates up to I2C Standard rate (100 KHz) or Fast
rate (400 KHz).
●
Serial I/O Engine (SIOE) takes care of serial/parallel conversion; bus arbitration; clock
generation and synchronization; and handshaking
●
Multi-master capability
●
7-bit or 10-bit addressing
SSP interfaces (SPI, SSI, and Microwire) with DMA
The STR91xFA supports two independent Synchronous Serial Port (SSP) interfaces,
designated SSP0, and SSP1. Primary use of each interface is for supporting the industry
standard Serial Peripheral Interface (SPI) protocol, but also supporting the similar
Synchronous Serial Interface (SSI) and Microwire communication protocols.
SPI is a three or four wire synchronous serial communication channel, capable of full-duplex
operation. In three-wire configuration, there is a clock signal, and two data signals (one data
signal from Master to Slave, the other from Slave to Master). In four-wire configuration, an
additional Slave Select signal is output from Master and received by Slave.
The SPI clock signal is a gated clock generated from the Master and regulates the flow of
data bits. The Master may transmit at a variety of baud rates, up to 24 MHz
In multi-Slave operation, no more than one Slave device can transmit data at any given time.
Slave selection is accomplished when a Slave’s “Slave Select” input is permanently
grounded or asserted active-low by a Master device. Slave devices that are not selected do
not interfere with SPI activities. Slave devices ignore the clock signals and keep their data
output pins in high-impedance state when not selected. The STR91xFA supports SPI multiMaster operation because it provides collision detection.
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Functional overview
STR91xFAx3x, STR91xFAx4x
Each SSP interface on the STR91xFA has the following features:
●
Full-duplex, three or four-wire synchronous transfers
●
Master or Slave operation
●
Programmable clock bit rate with prescaler, up to 24 MHz for Master mode and 4 MHz
for Slave mode
●
Separate transmit and receive FIFOs, each 16-bits wide and 8 locations deep
●
Programmable data frame size from 4 to 16 bits
●
Programmable clock and phase polarity
●
Specifically for Microwire protocol:
–
●
3.22.1
Half-duplex transfers using 8-bit control message
Specifically for SSI protocol:
–
Full-duplex four-wire synchronous transfer
–
Transmit data pin tri-stateable when not transmitting
DMA
A programmable DMA channel may be assigned by CPU firmware to service each SSP
channel for fast and direct transfers between the SSP bus and SRAM with little CPU
involvement. Both DMA single-transfers and DMA burst-transfers are supported for transmit
and receive. Burst transfers require that FIFOs are enabled.
3.23
General purpose I/O
There are up to 80 GPIO pins available on 10 I/O ports for 128-pin and 144-ball devices, and
up to 40 GPIO pins on 5 I/O ports for 80-pin devices. Each and every GPIO pin by default
(during and just after a reset condition) is in high-impedance input mode, and some GPIO
pins are additionally routed to certain peripheral function inputs. CPU firmware may initialize
GPIO pins to have alternate input or output functions as listed in Table 8. At any time, the
logic state of any GPIO pin may be read by firmware as a GPIO input, regardless of its
reassigned input or output function.
Bit masking is available on each port, meaning firmware may selectively read or write
individual port pins, without disturbing other pins on the same port during a write.
Firmware may designate each GPIO pin to have open-drain or push-pull characteristics.
All GPIO pins are 5V tolerant, meaning they can drive a voltage level up to VDDQ, and can
be safely driven by a voltage up to 5V.
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STR91xFAx3x, STR91xFAx4x
3.24
Functional overview
A/D converter (ADC) with DMA
The STR91xFA provides an eight-channel, 10-bit successive approximation analog-todigital converter. The ADC input pins are multiplexed with other functions on Port 4 as
shown in Table 8. Following are the major ADC features:
3.24.1
●
Fast conversion time, as low as 0.7 usec
●
Accuracy. Integral and differential non-linearity are typically within 4 conversion counts.
●
0 to 3.6V input range. External reference voltage input pin (AVREF) available on 128pin packages for better accuracy on low-voltage inputs. See Table 11: Operating
conditions, for restrictions to the relative voltage levels of VDDQ, AVDD, AVREF, and
AVREF_AVDD.
●
CPU Firmware may convert one ADC input channel at a time, or it has the option to set
the ADC to automatically scan and convert all eight ADC input channels sequentially
before signalling an end-of-conversion
●
Automatic continuous conversion mode is available for any number of designated ADC
input channels
●
Analog watchdog mode provides automatic monitoring of any ADC input, comparing it
against two programmable voltage threshold values. The ADC unit will set a flag or it
will interrupt the CPU if the input voltage rises above the higher threshold, or drops
below the lower threshold.
●
The ADC unit goes to stand-by mode (very low-current consumption) after any reset
event. CPU firmware may also command the ADC unit to stand-by mode at any time.
●
ADC conversion can be started or triggered by software command as well as triggers
from Timer/Counter (TIM), Motor Controller and input from external pin.
DMA
A programmable DMA channel may be assigned by CPU firmware to service each ADC
conversion result for fast DMA single-transfer.
3.25
Standard timers (TIM) with DMA
The STR91xFA has four independent, free-running 16-bit timer/counter modules designated
TIM0, TIM1, TIM2, and TIM3. Each general purpose timer/counter can be configured by
firmware for a variety of tasks including; pulse width and frequency measurement (input
capture), generation of waveforms (output compare and PWM), event counting, delay
timing, and up/down counting.
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Functional overview
STR91xFAx3x, STR91xFAx4x
Each of the four timer units have the following features:
3.25.1
●
16-bit free running timer/counter
●
Internal timer/counter clock source from a programmable 8-bit prescale of the CCU
PCLK clock output
●
Optional external timer/counter clock source from pin P2.4 shared by TIM0/TIM1, and
pin P2.5 shared by TIM2/TIM3. Frequency of these external clocks must be at least 4
times less the frequency of the internal CCU PCLK clock output.
●
Two dedicated 16-bit Input Capture registers for measuring up to two input signals.
Input Capture has programmable selection of input signal edge detection
●
Two dedicated 16-bit Output Compare registers for generation up to two output signals
●
PWM output generation with 16-bit resolution of both pulse width and frequency
●
One pulse generation in response to an external event
●
A dedicated interrupt to the CPU with five interrupt flags
●
The OCF1 flag (Output Compare 1) from the timer can be configured to trigger an ADC
conversion
DMA
A programmable DMA channel may be assigned by CPU firmware to service each
timer/counter module TIM0 and TIM1 for fast and direct single transfers.
3.26
Three-phase induction motor controller (IMC)
The STR91xFA provides an integrated controller for variable speed motor control
applications.
Six PWM outputs are generated on high current drive pins P6.0 to P6.5 for controlling a
three-phase AC induction motor drive circuit assembly. Rotor speed feedback is provided by
capturing a tachometer input signal on pin P6.6, and an asynchronous hardware emergency
stop input is available on pin P6.7 to stop the motor immediately if needed, independently of
firmware.
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STR91xFAx3x, STR91xFAx4x
Functional overview
The IMC unit has the following features:
3.27
●
Three PWM outputs generated using a 10 or 16-bit PWM counter, one for each phase
U, V, W. Complimentary PWM outputs are also generated for each phase.
●
Choice of classic or zero-centered PWM generation modes
●
10 or 16-bit PWM counter clock is supplied through a programmable 8-bit prescaler of
the APB clock.
●
Programmable 6 or 10-bit dead-time generator to add delay to each of the three
complimentary PWM outputs
●
8-bit repetition counter
●
Automatic rotor speed measurement with 16-bit resolution. Schmitt trigger tachometer
input with programmable edge detection
●
Hardware asynchronous emergency stop input
●
A dedicated interrupt to CPU with eight flags
●
Enhanced Motor stop output polarity configuration
●
Double update option when PWM counter reaches the max and min values in Zerocentered mode
●
Locking feature to prevent some control register bits from being advertently modified
●
Trigger output to start an ADC conversion
External memory interface (EMI)
STR91xFA devices in 128-pin and 144-ball packages offer an external memory bus for
connecting external parallel peripherals and memories. The EMI bus resides on ports 7, 8,
and 9 and operates with either an 8 or 16-bit data path. The configuration of 8 or 16 bit
mode is specified by CPU firmware writing to configuration registers at run-time. If the
application does not use the EMI bus, then these port pins may be used for general purpose
I/O as shown in Table 8.
The EMI has the following features:
●
Supports static asynchronous memory access cycles, including page mode for nonmux operation. The bus control signals include:
–
EMI_RDn - read signal, x8 or x16 mode
–
EMI_BWR_WRLn - write signal in x8 mode and write low byte signal in x16 mode
–
EMI_WRHn - write high byte signal in x16 mode
–
EMI_ALE - address latch signal for x8 or x16 mux bus mode with programmable
polarity
●
Four configurable memory regions, each with a chip select output (EMI_CS0n ...
EMI_CS3n)
●
Programmable wait states per memory region for both write and read operations
●
16-bit multiplexed data mode (Figure 4): 16 bits of data and 16 bits of low-order
address are multiplexed together on ports 8 and 9, while port 7 contains eight more
high-order address signals. The output signal on pin EMI_ALE is used to demultiplex
the signals on ports 8 and 9, and the polarity of EMI_ALE is programmable. The output
signals on pins EMI_BWR_WRLn and EMI_WRHn are the write strobes for the low and
37/101
Functional overview
STR91xFAx3x, STR91xFAx4x
high data bytes respectively. The output signal EMI_RDn is the read strobe for both the
low and high data bytes.
●
8-bit multiplexed data mode: This is a variant of the 16-bit multiplexed mode.
Although this mode can provide 24 bits of address and 8 bits of data, it does require an
external latch device on Port 8. However, this mode is most efficient when connecting
devices that only require 8 bits of address on an 8-bit multiplexed address/data bus,
and have simple read, write, and latch inputs as shown in Figure 5
To use all 24 address bits, the following applies: 8 bits of lowest-order data and 8 bits of
lowest-order address are multiplexed on port 8. On port 9, 8-bits of mid-order address are
multiplexed with 8 bits of data, but these 8 data values are always at logic zero on this port
during a write operation, and these 8 data bits are ignored during a read operation. An
external latch device is needed to de-multiplex the mid-order 8 address bits that are
generated on port 8. Port 7 outputs the 8 highest-order address signals directly (not
multiplexed). The output signal on pin EMI_ALE is used to demultiplex the signals on ports 8
and 9, and the polarity of EMI_ALE is programmable. The output signal on pin
EMI_BWR_WRLn is the data write strobe, and the output on pin EMI_RDn is the data read
strobe.
●
8-bit non-multiplexed data mode (Figure 6): Eight bits of data are on port 8, while 16
bits of address are output on ports 7 and 9. The output signal on pin EMI_BWR_BWLn
is the data write strobe and the output on pin EMI_RDn is the data read strobe.
●
Burst Mode Support (LFBGA package only): The EMI bus supports synchronized
burst read and write bus cycle in multiplexed and non-multiplexed mode. The additional
EMI signals in the LFBGA package that support the burst mode are:
–
EMI_BCLK -the bus clock output. The EMI_BCLK has the same frequency or half
of that of the HCLK and can be disabled by the user
–
EMI_WAITn - the not ready or wait input signal for synchronous access
–
EMI_BAAn - burst address advance or burst enable signal
–
EMI_WEn - write enable signal
–
EMI_UBn, EMI_LBn - upper byte and lower byte enable signals. These two signals
share the same pins as the EMI_WRLn and EMI_WRHn and are user configurable
through the EMI register.
By defining the bus parameters such as burst length, burst type, read and write timings
in the EMI control registers, the EMI bus is able to interface to standard burst memory
devices. The burst timing specification and waveform will be provided in the next data
sheet release
38/101
STR91xFAx3x, STR91xFAx4x
Figure 4.
Functional overview
EMI 16-bit multiplexed connection example
STR91xx
16-BIT
DEVICE
EMI_CS3n
EMI_CS2n
EMI_CS1n
EMI_CS0n
CHIP_SELECT
EMI_WRHn
EMI_BWR_WRLn
WRITE_HIGH_BYTE
WRITE_LOW_BYTE
EMI_RDn
EMI_ALE
EMI_A23
EMI_A22
EMI_A21
EMI_A20
EMI_A19
EMI_A18
EMI_A17
EMI_A16
EMI_AD15
EMI_AD14
EMI_AD13
EMI_AD12
EMI_AD11
EMI_AD10
READ
ADDR_LATCH
P7.7
P7.6
P7.5
P7.4
P7.3
P7.2
P7.1
P7.0
P9.7
P9.6
P9.5
P9.4
P9.3
P9.2
P9.1
EMI_AD9
P9.0
EMI_AD8
EMI_AD7
P8.7
P8.6
EMI_AD6
P8.5
EMI_AD5
P8.4
EMI_AD4
P8.3
EMI_AD3
P8.2
EMI_AD2
P8.1
EMI_AD1
P8.0
EMI_AD0
Figure 5.
A23
A22
A21
A20
A19
A18
A17
A16
AD15
AD14
AD13
AD12
AD11
AD10
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
EMI 8-bit multiplexed connection example
ST R91xx EMI_CS3n
EMI_CS2n
EMI_CS1n
EMI_CS0n
8-BIT
DEVICE
CHIP_SELECT
EMI_BWR_WRLn
EMI_RDn
EMI_ALE
EMI_AD7
EMI_AD6
EMI_AD5
EMI_AD4
EMI_AD3
EMI_AD2
EMI_AD1
EMI_AD0
WRIT E
READ
ADDR_LAT CH
P8.7
P8.6
P8.5
P8.4
P8.3
P8.2
P8.1
P8.0
AD 7
AD 6
AD 5
AD 4
AD 3
AD 2
AD 1
AD 0
39/101
Functional overview
Figure 6.
STR91xFAx3x, STR91xFAx4x
EMI 8-bit non-multiplexed connection example
STR91xx
8-BIT
DEVICE
EMI_CS3n
EMI_CS2n
EMI_CS1n
EMI_CS0n
CHIP_SELECT
EMI_BWR_WRLn
EMI_RDn
EMI_A15
EMI_A14
EMI_A13
EMI_A12
EMI_A11
EMI_A10
EMI_A9
EMI_A8
EMI_A7
EMI_A6
EMI_A5
EMI_A4
EMI_A3
EMI_A2
EMI_A1
EMI_A0
EMI_D7
EMI_D6
EMI_D5
EMI_D4
EMI_D3
EMI_D2
EMI_D1
EMI_D0
40/101
WRITE
READ
P9.7
P9.6
P9.5
P9.4
P9.3
P9.2
P9.1
P9.0
P7.7
P7.6
P7.5
P7.4
P7.3
P7.2
P7.1
P7.0
P8.7
P8.6
P8.5
P8.4
P8.3
P8.2
P8.1
P8.0
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
STR91xFAx3x, STR91xFAx4x
4
Related documentation
Related documentation
Available from www.arm.com:
ARM966E-S Rev 2 Technical Reference Manual
Available from www.st.com:
STR91xFA Reference Manual
STR9 Flash Programming Manual (PM0020)
The above is a selected list only, a full list STR91xFA application notes can be viewed at
http://www.st.com.
41/101
Pin description
5
STR91xFAx3x, STR91xFAx4x
Pin description
STR91xFAM 80-pin package pinout
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
P4.4
P4.5
P4.6
P4.7
AVREF_AVDD
VSSQ
VDDQ
JTDO
JTDI
VSS
VDD
JTMS
JTCK
JTRSTn
VSSQ
X1_CPU
X2_CPU
VDDQ
RESET_OUTn
JRTCK
Figure 7.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
STR91xFAM
80-pin LQFP
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
USBDP (1)
USBDN (1)
P6.7
P6.6
RESET_INn
VSSQ
VDDQ
P6.5
P6.4
VSS
VDD
P5.7
P5.6
P5.5
VDDQ
VSSQ
P5.4
P3.7
P3.6
P3.5
P2.2
P2.3
P2.4
VBATT
VSSQ
X2_RTC
X1_RTC
VDDQ
P2.5
VSS
VDD
P2.6
(2) USBCLK_P.27
P3.0
VSSQ
VDDQ
P3.1
P3.2
P3.3
P3.4
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
P4.3
P4.2
P4.1
P4.0
VSS_VSSQ
VDDQ
P2.0
P2.1
P5.0
VSS
VDD
P5.1
P6.2
P6.3
VDDQ
VSSQ
P5.2
P5.3
P6.0
P6.1
1. NU (Not Used) on STR910FAM devices. Pin 59 is not connected, pin 60 must be pulled up by a 1.5Kohm
resistor to VDDQ.
2. No USBCLK function on STR910FAM devices.
42/101
STR91xFAx3x, STR91xFAx4x
STR91xFAW 128-pin package pinout
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
P4.3
P4.4
P4.5
P4.6
P4.7
AVREF
AVDD
VSSQ
VDDQ
P7.7
P7.6
JTDO
P1.7
JTDI
P1.6
VSS
VDD
JTMS
P1.5
P1.4
JTCK
JTRSTn
P1.3
VSSQ
X1_CPU
X2_CPU
VDDQ
P1.2
RESET_OUTn
P1.1
P1.0
JRTCK
Figure 8.
Pin description
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
STR91xFAW
128-pin LQFP
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
USBDP (1)
USBDN (1)
MII_MDIO (1)
P6.7
P6.6
TAMPER_IN
P0.7
RESET_INn
P0.6
VSSQ
VDDQ
P0.5
P6.5
P6.4
VSS
VDD
P5.7
P5.6
P0.4
P5.5
P0.3
EMI_RDn
EMI_ALE
VDDQ
VSSQ
P0.2
P5.4
P0.1
P3.7
P0.0
P3.6
P3.5
P2.2
P8.4
P2.3
P8.5
P2.4
P8.6
VBATT
VSSQ
X2_RTC
X1_RTC
VDDQ
P8.7
P2.5
P9.0
P9.1
VSS
VDD
P9.2
P9.3
P9.4
P2.6
(2) USBCLK_P2.7
P3.0
VSSQ
VDDQ
P9.5
P3.1
P3.2
P3.3
P9.6
P3.4
P9.7
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
P4.2
P4.1
P4.0
AVSS
P7.0
P7.1
P7.2
VSSQ
VDDQ
P2.0
P2.1
P5.0
P7.3
P7.4
P7.5
VSS
VDD
P5.1
P6.2
P6.3
EMI_BWR_WRLn
EMI_WRHn
VDDQ
VSSQ
(3) PHYCLK_P5.2
P8.0
P5.3
P8.1
P6.0
P8.2
P6.1
P8.3
1. NU (Not Used) on STR910FAW devices. Pin 95 is not connected, pin 96 must be pulled up by a 1.5Kohm
resistor to VDDQ.
2. No USBCLK function on STR910FAW devices.
3. No PHYCLK function on STR910FAW devices.
43/101
Pin description
5.1
STR91xFAx3x, STR91xFAx4x
LFBGA144 ball connections
Table 7.
A
●
In Table 7 balls labelled NC are no connect balls. These NC balls are reserved for
future devices and should NOT be connected to ground or any other signal. There are
total of 9 NC (no connection) balls.
●
Balls H1 and G4 are assigned as EMI bus write signals (EMI_BWR_WRLn and
EMI_WRHn). These two balls can also be configured by the user as EMI low or high
byte select signals (EMI_LBn and EMI_UBn).
●
The PLLGND (B8) and PLLVDDQ (C9) balls can be connected to VSSQ and VDDQ.
STR91x LFBGA144 Ball Connections
B
C
D
E
F
G
H
J
K
L
M
VDDQ
PHYCLK
_P5.2(1)
P8.0
P2.2
1
P4.2
P7.2
NC
P7.0
VDDQ
P7.3
P7.4
EMI_WR
Hn
(EMI_UB
n)
2
AVREF
P4.1
P4.0
P7.1
P2.0
NC
P6.2
P5.3
P8.2
P8.3
VSSQ
P8.6
3
AVDD
P4.3
AVSS
NC
P2.1
VSS
P6.3
P8.1
P6.1
P2.3
P8.4
VBATT
4
P4.6
P4.5
P4.4
VSSQ
P5.0
VDD
EMI_BWR
_WRLn
(EMI_LBn)
P6.0
P8.5
VSSQ
P2.4
X2_RTC
5
P7.7
VDDQ
VSSQ
P4.7
P7.5
NC
VSSQ
VSS
P2.5
P8.7
VDDQ
X1_RTC
6
JTMS
JTDO
JTDI
P1.7
P7.6
P5.1
P2.6
P9.4
P9.3
P9.2
VDD
P9.0
P9.1
7
P1.5
P1.4
NC
VDD
VSS
P1.6
P6.5
VDDQ
VSSQ
P3.0
USBCLK
_P2.7 (2)
8
VSSQ
PLLVSS
Q
P1.3
JRSTn
JTCK
VSSQ
P6.4
EMI_BAA
n
P3.3
EMI_WAI
Tn
P9.5
EMI_BCL
K
9
RESET_
OUTn
P1.2
PLLVDDQ
VDDQ
P6.6
VDDQ
NC
P5.6
EMI_RDn
P9.7
P3.4
P9.6
10
X1_CPU
P1.0
P1.1
USBDN
(3)
TAMPER
_ IN
NC
VSS
P0.4
EMI_ALE
P0.1
P3.5
P3.1
11
X2_CPU
JRTCK
USBDP(2)
MII_MDI
O (3)
P0.6
P0.5
VDD
P5.5
P0.2
P3.7
P0.0
P3.2
12
EMI_WE
n
P0.7
RESET_I
Nn
P6.7
NC
NC
P5.7
P0.3
P5.4
VDDQ
VSSQ
P3.6
1. No PHYCLK function on STR910FAW devices.
2. No USBCLK function on STR910FAW devices.
3.
NU (Not Used) on STR910FAW devices. D10 is not connected, C11 must be pulled up by a 1.5 kOhm resistor to VDDQ.
44/101
STR91xFAx3x, STR91xFAx4x
5.2
Pin description
Default pin functions
During and just after reset, all pins on ports 0-9 default to high-impedance input mode until
CPU firmware assigns other functions to the pins. This initial input mode routes all pins on
ports 0-9 to be read as GPIO inputs as shown in the “Default Pin Function” column of
Table 8. Simultaneously, certain port pin signals are also routed to other functional inputs as
shown in the “Default Input Function” column of Table 8, and these pin input functions will
remain until CPU firmware makes other assignments. At any time, even after the CPU
assigns pins to alternate functions, the CPU may always read the state of any pin on ports
0-9 as a GPIO input. CPU firmware may assign alternate functions to port pins as shown in
columns “Alternate Input 1” or “Alternate Output 1, 2, 3” of Table 8 by writing to control
registers at run-time.
5.2.1
General notes on pin usage
1
Since there are no internal or programmable pull-up resistors on ports 0-9, it is advised to
pull down to ground, or pull up to VDDQ (using max. 47 KΩ resistors), all unused pins on
port 0-9. Another solution is to use the GPIO control registers to configure the unused pins
on ports 0-9 as output low level. The purpose of this is to reduce noise susceptibility, noise
generation, and minimize power consumption
2
All pins on ports 0 - 9 are 5V tolerant
3
Pins on ports 0,1,2,4,5,7,8,9 have 4 mA drive and 4mA sink. Ports 3 and 6 have 8 mA drive
and 8 mA sink.
4
For 8-bit non-muxed EMI operation: Port 8 is eight bits of data, ports 7 and 9 are 16 bits of
address.
5
For 16-bit muxed EMI operation: Ports 8 and 9 are 16 bits of muxed address and data bits,
port 7 is up to eight additional bits of high-order address
6
Signal polarity is programmable for interrupt request inputs, EMI_ALE, timer input capture
inputs and output compare/PWM outputs, motor control tach and emergency stop inputs,
and motor control phase outputs.
7
HiZ = High Impedance, V = Voltage Source, G = Ground, I/O = Input/Output
8
STR910FA devices do not support USB. On these devices USBDP and USBDN signals are
"Not Used" (USBDN is not connected, USBDP must be pulled up by a 1.5K ohm resistor to
VDDQ), and all functions named “USB" are not available.
9
STR910FA 128-pin and 144-ball devices do not support Ethernet. On these devices
PHYCLK and all functions named “MII*" are not available.
Device pin description
Alternate functions
LFBGA144
Default
Input
Function
LQFP128
Default Pin
Function
LQFP80
Pkg
Signal Type
Table 8.
Pin
Name
-
67
L11
P0.0
I/O
GPIO_0.0,
GP Input, HiZ
MII_TX_CLK,
PHY Xmit clock
I2C0_CLKIN,
I2C clock in
GPIO_0.0,
GP Output
I2C0_CLKOUT,
I2C clock out
ETM_PCK0,
ETM Packet
-
69
K10
P0.1
I/O
GPIO_0.1,
GP Input, HiZ
-
I2C0_DIN,
I2C data in
GPIO_0.1,
GP Output
I2C0_DOUT,
I2C data out
ETM_PCK1,
ETM Packet
-
71
J11
P0.2
I/O
GPIO_0.2,
GP Input, HiZ
MII_RXD0,
PHY Rx data0
I2C1_CLKIN,
I2C clock in
GPIO_0.2,
GP Output
I2C1_CLKOUT,
I2C clock out
ETM_PCK2,
ETM Packet
Alternate
Input 1
Alternate
Output 1
Alternate
Output 2
Alternate
Output 3
45/101
Pin description
Device pin description (continued)
Alternate functions
LQFP128
LFBGA144
Default Pin
Function
Default
Input
Function
LQFP80
Pkg
Signal Type
Table 8.
STR91xFAx3x, STR91xFAx4x
Pin
Name
-
76
H12
P0.3
I/O
GPIO_0.3,
GP Input, HiZ
MII_RXD1,
PHY Rx data
I2C1_DIN,
I2C data in
GPIO_0.3,
GP Output
I2C1_DOUT,
I2C data out
ETM_PCK3,
ETM Packet
-
78
H10
P0.4
I/O
GPIO_0.4,
GP Input, HiZ
MII_RXD2,
PHY Rx data
TIM0_ICAP1,
Input Capture
GPIO_0.4,
GP Output
EMI_CS0n,
EMI Chip Select
ETM_PSTAT0,
ETM pipe status
-
85
F11
P0.5
I/O
GPIO_0.5,
GP Input, HiZ
MII_RXD3,
PHY Rx data
TIM0_ICAP2,
Input Capture
GPIO_0.5,
GP Output
EMI_CS1n,
EMI Chip Select
ETM_PSTAT1,
ETM pipe status
-
88
E11
P0.6
I/O
GPIO_0.6,
GP Input, HiZ
MII_RX_CLK,
PHY Rx clock
TIM2_ICAP1,
Input Capture
GPIO_0.6,
GP Output
EMI_CS2n,
EMI Chip Select
ETM_PSTAT2,
ETM pipe status
-
90
B12
P0.7
I/O
GPIO_0.7,
GP Input, HiZ
MII_RX_DV,
PHY data valid
TIM2_ICAP2,
Input Capture
GPIO_0.7,
GP Output
EMI_CS3n,
EMI Chip Select
ETM_TRSYNC,
ETM trace sync
-
98
B10
P1.0
I/O
GPIO_1.0,
GP Input, HiZ
MII_RX_ER,
PHY rcv error
ETM_EXTRIG,
ETM ext. trigger
GPIO_1.0,
GP Output
UART1_TX,
UART xmit data
SSP1_SCLK,
SSP mstr clk out
-
99
C10
P1.1
I/O
GPIO_1.1,
GP Input, HiZ
-
UART1_RX,
UART rcv data
GPIO_1.1,
GP Output
MII_TXD0,
MAC Tx data
SSP1_MOSI,
SSP mstr dat out
-
101
B9
P1.2
I/O
GPIO_1.2,
GP Input, HiZ
-
SSP1_MISO,
SSP mstr data in
GPIO_1.2,
GP Output
MII_TXD1,
MAC Tx data
UART0_TX,
UART xmit data
-
106
C8
P1.3
I/O
GPIO_1.3,
GP Input, HiZ
-
UART2_RX,
UART rcv data
GPIO_1.3,
GP Output
MII_TXD2,
MAC Tx data
SSP1_NSS,
SSP mstr sel out
-
109
B7
P1.4
I/O
GPIO_1.4,
GP Input, HiZ
-
I2C0_CLKIN,
I2C clock in
GPIO_1.4,
GP Output
MII_TXD3,
MAC Tx data
I2C0_CLKOUT,
I2C clock out
-
110
A7
P1.5
I/O
GPIO_1.5,
GP Input, HiZ
MII_COL,
PHY collision
CAN_RX,
CAN rcv data
GPIO_1.5,
GP Output
UART2_TX,
UART xmit data
ETM_TRCLK,
ETM trace clock
-
114
F7
P1.6
I/O
GPIO_1.6,
GP Input, HiZ
MII_CRS,
PHY carrier sns
I2C0_DIN,
I2C data in
GPIO_1.6,
GP Output
CAN_TX,
CAN Tx data
I2C0_DOUT,
I2C data out
-
116
D6
P1.7
I/O
GPIO_1.7,
GP Input, HiZ
-
ETM_EXTRIG,
ETM ext. trigger
GPIO_1.7,
GP Output
MII_MDC,
MAC mgt dat ck
ETM_TRCLK,
ETM trace clock
7
10
E2
P2.0
I/O
GPIO_2.0,
GP Input, HiZ
UART0_CTS,
Clear To Send
I2C0_CLKIN,
I2C clock in
GPIO_2.0,
GP Output
I2C0_CLKOUT,
I2C clock out
ETM_PCK0,
ETM Packet
8
11
E3
P2.1
I/O
GPIO_2.1,
GP Input, HiZ
UART0_DSR,
Data Set Ready
I2C0_DIN,
I2C data in
GPIO_2.1,
GP Output
I2C0_DOUT,
I2C data out
ETM_PCK1,
ETM Packet
21
33
M1
P2.2
I/O
GPIO_2.2,
GP Input, HiZ
UART0_DCD,
Dat Carrier Det
I2C1_CLKIN,
I2C clock in
GPIO_2.2,
GP Output
I2C1_CLKOUT,
I2C clock out
ETM_PCK2,
ETM Packet
22
35
K3
P2.3
I/O
GPIO_2.3,
GP Input, HiZ
UART0_RI,
Ring Indicator
I2C1_DIN,
I2C data in
GPIO_2.3,
GP Output
I2C1_DOUT,
I2C data out
ETM_PCK3,
ETM Packet
23
37
L4
P2.4
I/O
GPIO_2.4,
GP Input, HiZ
EXTCLK_T0T1E
xt clk timer0/1
SSP0_SCLK,
SSP slv clk in
GPIO_2.4,
GP Output
SSP0_SCLK,
SSP mstr clk out
ETM_PSTAT0,
ETM pipe status
29
45
J5
P2.5
I/O
GPIO_2.5,
GP Input, HiZ
EXTCLK_T2T3E
xt clk timer2/3
SSP0_MOSI,
SSP slv dat in
GPIO_2.5,
GP Output
SSP0_MOSI,
SSP mstr dat out
ETM_PSTAT1,
ETM pipe status
32
53
G6
P2.6
I/O
GPIO_2.6,
GP Input, HiZ
-
SSP0_MISO,
SSP mstr data in
GPIO_2.6,
GP Output
SSP0_MISO,
SSP slv data out
ETM_PSTAT2,
ETM pipe status
33
54
L7
USBCLK
_P2.7
I/O
GPIO_2.7,
GP Input, HiZ
USB_CLK48M,
48MHz to USB
SSP0_NSS,
SSP slv sel in
GPIO_2.7,
GP Output
SSP0_NSS,
SSP mstr sel out
ETM_TRSYNC,
ETM trace sync
46/101
Alternate
Input 1
Alternate
Output 1
Alternate
Output 2
Alternate
Output 3
STR91xFAx3x, STR91xFAx4x
Device pin description (continued)
Alternate functions
Pin
Name
34
55
K7
P3.0
I/O
GPIO_3.0,
GP Input, HiZ
DMA_RQST0,
Ext DMA requst
UART0_RxD,
UART rcv data
GPIO_3.0,
GP Output
UART2_TX,
UART xmit data
TIM0_OCMP1,
Out comp/PWM
37
59
M10
P3.1
I/O
GPIO_3.1,
GP Input, HiZ
DMA_RQST1,
Ext DMA requst
UART2_RxD,
UART rcv data
GPIO_3.1,
GP Output
UART0_TX,
UART xmit data
TIM1_OCMP1,
Out comp/PWM
38
60
M11
P3.2
I/O
GPIO_3.2,
GP Input, HiZ
EXINT2,
External Intr
UART1_RxD,
UART rcv data
GPIO_3.2,
GP Output
CAN_TX,
CAN Tx data
UART0_DTR,
Data Trmnl Rdy
39
61
J8
P3.3
I/O
GPIO_3.3,
GP Input, HiZ
EXINT3,
External Intr
CAN_RX,
CAN rcv data
GPIO_3.3,
GP Output
UART1_TX,
UART xmit data
UART0_RTS,
Ready To Send
40
63
L9
P3.4
I/O
GPIO_3.4,
GP Input, HiZ
EXINT4,
External Intr
SSP1_SCLK,
SSP slv clk in
GPIO_3.4,
GP Output
SSP1_SCLK,
SSP mstr clk out
UART0_TX,
UART xmit data
41
65
L10
P3.5
I/O
GPIO_3.5,
GP Input, HiZ
EXINT5,
External Intr
SSP1_MISO,
SSP mstr data in
GPIO_3.5,
GP Output
SSP1_MISO,
SSP slv data out
UART2_TX,
UART xmit data
42
66
M12
P3.6
I/O
GPIO_3.6,
GP Input, HiZ
EXINT6,
External Intr
SSP1_MOSI,
SSP slv dat in
GPIO_3.6,
GP Output
SSP1_MOSI,
SSP mstr dat out
CAN_TX,
CAN Tx data
43
68
K11
P3.7
I/O
GPIO_3.7,
GP Input, HiZ
EXINT7,
External Intr
SSP1_NSS,
SSP slv select in
GPIO_3.7,
GP Output
SSP1_NSS,
SSP mstr sel out
TIM1_OCMP1,
Out comp/PWM
4
3
C2
P4.0
I/O
GPIO_4.0,
GP Input, HiZ
ADC0,
ADC input chnl
TIM0_ICAP1,
Input Capture
GPIO_4.0,
GP Output
TIM0_OCMP1,
Out comp/PWM
ETM_PCK0,
ETM Packet
3
2
B2
P4.1
I/O
GPIO_4.1,
GP Input, HiZ
ADC1,
ADC input chnl
TIM0_ICAP2,
Input Capture
GPIO_4.1,
GP Output
TIM0_OCMP2,
Out comp
ETM_PCK1,
ETM Packet
2
1
A1
P4.2
I/O
GPIO_4.2,
GP Input, HiZ
ADC2,
ADC input chnl
TIM1_ICAP1,
Input Capture
GPIO_4.2,
GP Output
TIM1_OCMP1,
Out comp/PWM
ETM_PCK2,
ETM Packet
1
128
B3
P4.3
I/O
GPIO_4.3,
GP Input, HiZ
ADC3,
ADC input chnl
TIM1_ICAP2,
Input Capture
GPIO_4.3,
GP Output
TIM1_OCMP2,
Out comp
ETM_PCK3,
ETM Packet
80
127
C4
P4.4
I/O
GPIO_4.4,
GP Input, HiZ
ADC4,
ADC input chnl
TIM2_ICAP1,
Input Capture
GPIO_4.4,
GP Output
TIM2_OCMP1,
Out comp/PWM
ETM_PSTAT0,
ETM pipe status
79
126
B4
P4.5
I/O
GPIO_4.5,
GP Input, HiZ
ADC5,
ADC input chnl
TIM2_ICAP2,
Input Capture
GPIO_4.5,
GP Output
TIM2_OCMP2,
Out comp
ETM_PSTAT1,
ETM pipe status
78
125
A4
P4.6
I/O
GPIO_4.6,
GP Input, HiZ
ADC6,
ADC input chnl
TIM3_ICAP1,
Input Capture
GPIO_4.6,
GP Output
TIM3_OCMP1,
Out comp/PWM
ETM_PSTAT2,
ETM pipe status
77
124
D5
P4.7
I/O
GPIO_4.7,
GP Input, HiZ
ADC7,
ADC input chnl
/ADC Ext. trigger
TIM3_ICAP2,
Input Capture
GPIO_4.7,
GP Output
TIM3_OCMP2,
Out comp
ETM_TRSYNC,
ETM trace sync
9
12
E4
P5.0
I/0
GPIO_5.0,
GP Input, HiZ
EXINT8,
External Intr
CAN_RX,
CAN rcv data
GPIO_5.0,
GP Output
ETM_TRCLK,
ETM trace clock
UART0_TX,
UART xmit data
12
18
F6
P5.1
I/0
GPIO_5.1,
GP Input, HiZ
EXINT9,
External Intr
UART0_RxD,
UART rcv data
GPIO_5.1,
GP Output
CAN_TX,
CAN Tx data
UART2_TX,
UART xmit data
17
25
K1
PHYCLK
_P5.2
I/O
GPIO_5.2,
GP Input, HiZ
EXINT10,
External Intr
UART2_RxD,
UART rcv data
GPIO_5.2,
GP Output
MII_PHYCLK,
25Mhz to PHY
TIM3_OCMP1,
Out comp/PWM
18
27
H2
P5.3
I/O
GPIO_5.3,
GP Input, HiZ
EXINT11,
External Intr
ETM_EXTRIG,
ETM ext. trigger
GPIO_5.3,
GP Output
MII_TX_EN,
MAC xmit enbl
TIM2_OCMP1,
Out comp/PWM
LQFP80
LFBGA144
Default Pin
Function
Default
Input
Function
LQFP128
Pkg
Signal Type
Table 8.
Pin description
Alternate
Input 1
Alternate
Output 1
Alternate
Output 2
Alternate
Output 3
47/101
Pin description
Device pin description (continued)
Alternate functions
Pin
Name
44
70
J12
P5.4
I/O
GPIO_5.4,
GP Input, HiZ
EXINT12,
External Intr
SSP0_SCLK,
SSP slv clk in
GPIO_5.4,
GP Output
SSP0_SCLK,
SSP mstr clk out
EMI_CS0n,
EMI Chip Select
47
77
H11
P5.5
I/O
GPIO_5.5,
GP Input, HiZ
EXINT13,
External Intr
SSP0_MOSI,
SSP slv dat in
GPIO_5.5,
GP Output
SSP0_MOSI,
SSP mstr dat out
EMI_CS1n,
EMI Chip Select
48
79
H9
P5.6
I/O
GPIO_5.6,
GP Input, HiZ
EXINT14,
External Intr
SSP0_MISO,
SSP mstr dat in
GPIO_5.6,
GP Output
SSP0_MISO,
SSP slv data out
EMI_CS2n,
EMI Chip Select
49
80
G12
P5.7
I/O
GPIO_5.7,
GP Input, HiZ
EXINT15,
External Intr
SSP0_NSS,
SSP slv select in
GPIO_5.7,
GP Output
SSP0_NSS,
SSP mstr sel out
EMI_CS3n,
EMI Chip Select
19
29
H4
P6.0
I/O
GPIO_6.0,
GP Input, HiZ
EXINT16,
External Intr
TIM0_ICAP1,
Input Capture
GPIO_6.0,
GP Output
TIM0_OCMP1,
Out comp/PWM
MC_UH,
IMC phase U hi
20
31
J3
P6.1
I/O
GPIO_6.1,
GP Input, HiZ
EXINT17,
External Intr
TIM0_ICAP2,
Input Capture
GPIO_6.1,
GP Output
TIM0_OCMP2,
Out comp
MC_UL,
IMC phase U lo
13
19
G2
P6.2
I/O
GPIO_6.2,
GP Input, HiZ
EXINT18,
External Intr
TIM1_ICAP1,
Input Capture
GPIO_6.2,
GP Output
TIM1_OCMP1,
Out comp/PWM
MC_VH,
IMC phase V hi
14
20
G3
P6.3
I/O
GPIO_6.3,
GP Input, HiZ
EXINT19,
External Intr
TIM1_ICAP2,
Input Capture
GPIO_6.3,
GP Output
TIM1_OCMP2,
Out comp
MC_VL,
IMC phase V lo
52
83
G8
P6.4
I/O
GPIO_6.4,
GP Input, HiZ
EXINT20,
External Intr
TIM2_ICAP1,
Input Capture
GPIO_6.4,
GP Output
TIM2_OCMP1,
Out comp/PWM
MC_WH,
IMC phase W hi
53
84
G7
P6.5
I/O
GPIO_6.5,
GP Input, HiZ
EXINT21,
External Intr
TIM2_ICAP2,
Input Capture
GPIO_6.5,
GP Output
TIM2_OCMP2,
Out comp
MC_WL,
IMC phase W lo
57
92
E9
P6.6
I/O
GPIO_6.6,
GP Input, HiZ
EXINT22_TRIG,
Ext Intr & Tach
UART0_RxD,
UART rcv data
GPIO_6.6,
GP Output
TIM3_OCMP1,
Out comp/PWM
ETM_TRCLK,
ETM trace clock
58
93
D12
P6.7
I/O
GPIO_6.7,
GP Input, HiZ
EXINT23_STOP,
Ext Intr & Estop
ETM_EXTRIG,
ETM ext. trigger
GPIO_6.7,
GP Output
TIM3_OCMP2,
Out comp
UART0_TX,
UART xmit data
-
5
D1
P7.0
I/O
GPIO_7.0,
GP Input, HiZ
EXINT24,
External Intr
TIM0_ICAP1,
Input Capture
GPIO_7.0,
GP Output
8b) EMI_A0,
16b) EMI_A16
ETM_PCK0,
ETM Packet
-
6
D2
P7.1
I/O
GPIO_7.1,
GP Input, HiZ
EXINT25,
External Intr
TIM0_ICAP2,
Input Capture
GPIO_7.1,
GP Output
8b) EMI_A1,
16b) EMI_A17
ETM_PCK1,
ETM Packet
-
7
B1
P7.2
I/O
GPIO_7.2,
GP Input, HiZ
EXINT26,
External Intr
TIM2_ICAP1,
Input Capture
GPIO_7.2,
GP Output
8b) EMI_A2,
16b) EMI_A18
ETM_PCK2,
ETM Packet
-
13
F1
P7.3
I/O
GPIO_7.3,
GP Input, HiZ
EXINT27,
External Intr
TIM2_ICAP2,
Input Capture
GPIO_7.3,
GP Output
8b) EMI_A3,
16b) EMI_A19
ETM_PCK3,
ETM Packet
-
14
G1
P7.4
I/O
GPIO_7.4,
GP Input, HiZ
EXINT28,
External Intr
UART0_RxD,
UART rcv data
GPIO_7.4,
GP Output
8b) EMI_A4,
16b) EMI_A20
EMI_CS3n,
EMI Chip Select
-
15
E5
P7.5
I/O
GPIO_7.5,
GP Input, HiZ
EXINT29,
External Intr
ETM_EXTRIG,
ETM ext. trigger
GPIO_7.5,
GP Output
8b) EMI_A5,
16b) EMI_A21
EMI_CS2n,
EMI Chip Select
-
118
E6
P7.6
I/O
GPIO_7.6,
GP Input, HiZ
EXINT30,
External Intr
TIM3_ICAP1,
Input Capture
GPIO_7.6,
GP Output
8b) EMI_A6,
16b) EMI_A22
EMI_CS1n,
EMI Chip Select
-
119
A5
P7.7
I/O
GPIO_7.7,
GP Input, HiZ
EXINT31,
External Intr
TIM3_ICAP2,
Input Capture
GPIO_7.7,
GP Output
EMI_CS0n,
EMI chip select
16b) EMI_A23,
8b) EMI_A7
LQFP80
LFBGA144
Default Pin
Function
Default
Input
Function
LQFP128
Pkg
Signal Type
Table 8.
STR91xFAx3x, STR91xFAx4x
48/101
Alternate
Input 1
Alternate
Output 1
Alternate
Output 2
Alternate
Output 3
STR91xFAx3x, STR91xFAx4x
Device pin description (continued)
Alternate functions
LQFP128
LFBGA144
Default Pin
Function
Default
Input
Function
LQFP80
Pkg
Signal Type
Table 8.
Pin description
Pin
Name
-
26
L1
P8.0
I/O
GPIO_8.0,
GP Input, HiZ
-
-
GPIO_8.0,
GP Output
8b) EMI_D0,
16b) EMI_AD0
-
-
28
H3
P8.1
I/O
GPIO_8.1,
GP Input, HiZ
-
-
GPIO_8.1,
GP Output
8b) EMI_D1,
16b) EMI_AD1
-
-
30
J2
P8.2
I/O
GPIO_8.2,
GP Input, HiZ
-
-
GPIO_8.2,
GP Output
8b) EMI_D2,
16b) EMI_AD2
-
-
32
K2
P8.3
I/O
GPIO_8.3,
GP Input, HiZ
-
-
GPIO_8.3,
GP Output
8b) EMI_D3,
16b) EMI_AD3
-
-
34
L3
P8.4
I/O
GPIO_8.4,
GP Input, HiZ
-
-
GPIO_8.4,
GP Output
8b) EMI_D4,
16b) EMI_AD4
-
-
36
J4
P8.5
I/O
GPIO_8.5,
GP Input, HiZ
-
-
GPIO_8.5,
GP Output
8b) EMI_D5,
16b) EMI_AD5
-
-
38
M2
P8.6
I/O
GPIO_8.6,
GP Input, HiZ
-
-
GPIO_8.6,
GP Output
8b) EMI_D6,
16b) EMI_AD6
-
-
44
K5
P8.7
I/O
GPIO_8.7,
GP Input, HiZ
-
-
GPIO_8.7,
GP Output
8b) EMI_D7,
16b) EMI_AD7
-
-
46
M6
P9.0
I/O
GPIO_9.0,
GP Input, HiZ
-
-
GPIO_9.0,
GP Output
8b) EMI_A8
16b) EMI_AD8
-
-
47
M7
P9.1
I/O
GPIO_9.1,
GP Input, HiZ
-
-
GPIO_9.1,
GP Output
8b) EMI_A9,
16b) EMI_AD9
-
-
50
K6
P9.2
I/O
GPIO_9.2,
GP Input, HiZ
-
-
GPIO_9.2,
GP Output
8b) EMI_A10,
16b)EMI_AD10
-
-
51
J6
P9.3
I/O
GPIO_9.3,
GP Input, HiZ
-
-
GPIO_9.3,
GP Output
8b) EMI_A11,
16b)EMI_AD11
-
-
52
H6
P9.4
I/O
GPIO_9.4,
GP Input, HiZ
-
-
GPIO_9.4,
GP Output
8b) EMI_A12,
16b)EMI_AD12
-
-
58
L8
P9.5
I/O
GPIO_9.5,
GP Input, HiZ
-
-
GPIO_9.5,
GP Output
8b) EMI_A13,
16b)EMI_AD13
-
-
62
M9
P9.6
I/O
GPIO_9.6,
GP Input, HiZ
-
-
GPIO_9.6,
GP Output
8b) EMI_A14,
16b)EMI_AD14
-
-
64
K9
P9.7
I/O
GPIO_9.7,
GP Input, HiZ
-
-
GPIO_9.7,
GP Output
8b) EMI_A15,
16b)EMI_AD15
-
O
EMI byte write
strobe (8 bit
mode) or low
byte write
strobe (16 bit
mode)
Can also be
configured as
EMI_LBn in
BGA package
-
21
G4
EMI_BW
R
_WRLn
Alternate
Input 1
Alternate
Output 1
Alternate
Output 2
Alternate
Output 3
N/A
49/101
Pin description
Table 8.
STR91xFAx3x, STR91xFAx4x
Device pin description (continued)
Alternate functions
22
H1
EMI_WR
Hn
O
-
74
J10
EMI_ALE
O
EMI address
latch enable
(mux mode)
N/A
-
75
J9
EMI_RDn
O
EMI read
strobe
N/A
-
-
H8
EMI_BAA
n
O
EMI Burst
address
advance
N/A
-
-
K8
EMI_WAI
Tn
I
EMI Wait input
for burst mode
device
N/A
-
-
M8
EMI_BCL
K
O
EMI bus clock
N/A
-
-
A12
EMI_WE
n
O
EMI write
enable
N/A
-
91
E10
TAMPER
_IN
I
Tamper
detection input
N/A
-
94
D11
MII_MDI
O
I/O
MAC/PHY
management
data line
N/A
59
95
D10
USBDN
I/O
USB data (-)
bus connect
N/A
60
96
C11
USBDP
I/O
USB data (+)
bus connect
N/A
56
89
C12
RESET
_INn
I
External reset
input
N/A
62
100
A9
RESET
_OUTn
O
Global or
System reset
output
N/A
65
104
A10
X1_CPU
I
CPU oscillator
or crystal input
N/A
64
103
A11
X2_CPU
O
CPU crystal
connection
N/A
27
42
M5
X1_RTC
I
RTC oscillator
or crystal input
(32.768 kHz)
N/A
26
41
M4
X2_RTC
O
RTC crystal
connection
N/A
61
97
B11
JRTCK
O
JTAG return
clock or RTC
clock
N/A
67
107
D8
JTRSTn
I
JTAG TAP
controller reset
N/A
50/101
LFBGA144
-
EMI high byte
write strobe
(16-bit mode)
Can also be
configured as
EMI_UBn in
BGA package
LQFP128
Default Pin
Function
LQFP80
Signal Type
Pkg
Pin
Name
Default
Input
Function
Alternate
Input 1
Alternate
Output 1
N/A
Alternate
Output 2
Alternate
Output 3
STR91xFAx3x, STR91xFAx4x
Device pin description (continued)
Alternate functions
Pin
Name
68
108
E8
JTCK
I
JTAG clock
N/A
69
111
A6
JTMS
I
JTAG mode
select
N/A
72
115
C6
JTDI
I
JTAG data in
N/A
73
117
B6
JTDO
O
JTAG data out
N/A
-
122
A3
AVDD
V
ADC analog
voltage source,
2.7V - 3.6V
N/A
-
4
C3
AVSS
G
ADC analog
ground
N/A
5
-
-
AVSS
_VSSQ
G
Common
ground point for
digital I/O &
analog ADC
N/A
-
123
A2
AVREF
V
ADC reference
voltage input
N/A
V
Combined ADC
ref voltage and
ADC analog
voltage source,
2.7V - 3.6V
N/A
Standby
voltage input
for RTC and
SRAM backup
N/A
V Source for
I/O and USB.
2.7V to 3.6V
N/A
LQFP80
LFBGA144
Default
Input
Function
LQFP128
Pkg
Signal Type
Table 8.
Pin description
76
-
-
AVREF
_AVDD
24
39
M3
VBATT
V
6
9
E1
VDDQ
V
15
23
J1
VDDQ
V
36
57
-
VDDQ
V
46
73
K12
VDDQ
V
54
86
B5
VDDQ
V
28
43
L5
VDDQ
V
63
102
H7
VDDQ
V
74
120
D9
VDDQ
V
-
-
F9
VDDQ
V
Default Pin
Function
Alternate
Input 1
Alternate
Output 1
Alternate
Output 2
Alternate
Output 3
51/101
Pin description
Device pin description (continued)
LQFP128
LFBGA144
Alternate functions
LQFP80
Pkg
Signal Type
Table 8.
STR91xFAx3x, STR91xFAx4x
Pin
Name
-
8
L2
VSSQ
G
16
24
K4
VSSQ
G
35
56
C5
VSSQ
G
-
-
D4
VSSQ
G
45
72
G5
VSSQ
G
55
87
J7
VSSQ
G
25
40
A8
VSSQ
G
66
105
F8
VSSQ
G
75
121
L12
VSSQ
G
11
17
F4
VDD
V
31
49
D7
VDD
V
50
81
L6
VDD
V
70
112
G11
VDD
V
10
16
F3
VSS
G
30
48
H5
VSS
G
51
82
G10
VSS
G
71
113
E7
VSS
G
-
-
C9
PLLVDD
Q
V
V Source for
PLL
2.7 to 3.6 V
G
Digital Ground
for PLL
-
-
52/101
B8
PLLVSSQ
Default Pin
Function
Default
Input
Function
Alternate
Input 1
Alternate
Output 1
Digital Ground
for
!/O and USB
N/A
V Source for
CPU.
1.65V - 2.0V
N/A
Digital Ground
for CPU
N/A
N/A
Alternate
Output 2
Alternate
Output 3
STR91xFAx3x, STR91xFAx4x
6
Memory mapping
Memory mapping
The ARM966E-S CPU addresses a single linear address space of 4 giga-bytes (232) from
address 0x0000.0000 to 0xFFFF.FFFF as shown in Figure 9. Upon reset the CPU boots
from address 0x0000.0000, which is chip-select zero at address zero in the Flash Memory
Interface (FMI).
The Instruction TCM and Data TCM enable high-speed CPU operation without incurring any
performance or power penalties associated with accessing the system buses (AHB and
APB). I-TCM and D-TCM address ranges are shown at the bottom of the memory map in
Figure 9.
6.1
Buffered and non-buffered writes
The CPU makes use of write buffers on the AHB and the D-TCM to decouple the CPU from
any wait states associated with a write operation. The user may choose to use write with
buffers on the AHB by setting bit 3 in control register CP15 and selecting the appropriate
AHB address range when writing. By default at reset, buffered writes are disabled (bit 3 of
CP15 is clear) and all AHB writes are non-buffered until enabled. Figure 9 shows that most
addressable items on the AHB are aliased at two address ranges, one for buffered writes
and another for non-buffered writes. A buffered write will allow the CPU to continue program
execution while the write-back is performed through a FIFO to the final destination on the
AHB. If the FIFO is full, the CPU is stalled until FIFO space is available. A non-buffered write
will impose an immediate delay to the CPU, but results in a direct write to the final AHB
destination, ensuring data coherency. Read operations from AHB locations are always direct
and never buffered.
6.2
System (AHB) and peripheral (APB) buses
The CPU will access SRAM, higher-speed peripherals (USB, Ethernet, Programmable
DMA), and the external bus (EMI) on the AHB at their respective base addresses indicated
in Figure 9. Lower-speed peripherals reside on the APB and are accessed using two
separate AHB-to-APB bridge units (APB0 and APB1). These bridge units are essentially
address windows connecting the AHB to the APB. To access an individual APB peripheral,
the CPU will place an address on the AHB bus equal to the base address of the appropriate
bridge unit APB0 or APB1, plus the offset of the particular peripheral, plus the offset of the
individual data location within the peripheral. Figure 9 shows the base addresses of bridge
units APB0 and APB1, and also the base address of each APB peripheral. Please consult
the STR91xFA Reference manual for the address of data locations within each individual
peripheral.
6.3
SRAM
The SRAM is aliased at three separate address ranges as shown in Figure 9. When the
CPU accesses SRAM starting at 0x0400.0000, the SRAM appears on the D-TCM. When
CPU access starts at 0x4000.0000, SRAM appears in the buffered AHB range. Beginning at
CPU address 0x5000.0000, SRAM is in non-buffered AHB range. The SRAM size must be
specified by CPU intitialization firmware writing to a control register after any reset condition.
53/101
Memory mapping
STR91xFAx3x, STR91xFAx4x
Default SRAM size is 32K bytes, with option to set to 64K bytes on STR91xFAx3x devices,
and to 96K bytes on STR91xFAx4x devices.
When other AHB bus masters (such as a DMA controller) write to SRAM, their access is
never buffered. Only the CPU can make use of buffered AHB writes.
6.4
Two independent Flash memories
The STR91xFA has two independent Flash memories, the larger primary Flash and the
small secondary Flash. It is possible for the CPU to erase/write to one of these Flash
memories while simultaneously reading from the other.
One or the other of these two Flash memories may reside at the “boot” address position of
0x0000.0000 at power-up or at reset as shown in Figure 9. The default configuration is that
the first sector of primary Flash memory is enabled and residing at the boot position, and the
secondary Flash memory is disabled. This default condition may be optionally changed as
described below.
6.4.1
Default configuration
When the primary Flash resides at boot position, typical CPU initialization firmware would
set the start address and size of the main Flash memory, and go on to enable the secondary
Flash, define it’s start address and size. Most commonly, firmware would place the
secondary Flash start address at the location just after the end of the primary Flash
memory. In this case, the primary Flash is used for code storage, and the smaller secondary
flash can be used for data storage (EEPROM emulation).
6.4.2
Optional configuration
Using the STR91xFA device configuration software tool, or IDE from 3rd party, one can
specify that the smaller secondary Flash memory is at the boot location at reset and the
primary Flash is disabled. The selection of which Flash memory is at the boot location is
programmed in a non-volatile Flash-based configuration bit during JTAG ISP. The boot
selection choice will remain as the default until the bit is erased and re-written by the JTAG
interface. The CPU cannot change this choice for boot Flash, only the JTAG interface has
access.
In this case where the secondary Flash defaults to the boot location upon reset, CPU
firmware would typically initialize the Flash memories the following way. The secondary
Flash start address and size is specified, then the primary Flash is enabled and its start
address and size is specified. The primary Flash start address would typically be located
just after the final address location of the secondary Flash. This configuration is particularly
well-suited for In-Application-Programming (IAP). The CPU would boot from the secondary
Flash memory, initialize the system, then check the contents of the primary Flash memory
(by checksum or other means). If the contents of primary Flash is OK, then CPU execution
continues from either Flash memory. If the main Flash contents are incorrect, the CPU,
while executing code from the secondary Flash, can download new data from any
STR91xFA communication channel and program into primary Flash memory. Application
code then starts after the new contents of primary Flash are verified.
54/101
STR91xFAx3x, STR91xFAx4x
6.5
Memory mapping
STR91xFA memory map
The memory map is shown in Figure 9: STR91xFA memory map on page 56:
●
Either of the two Flash memories may be placed at CPU boot address 0x0000.0000.
By default, the primary Flash memory is in boot position starting at CPU address
0x0000.0000 and the secondary Flash memory may be placed at a higher address
following the end of the primary Flash memory. This default option may be changed
using the STR91xx device configuration software, placing the secondary Flash memory
at CPU boot location 0x0000.0000, and then the primary Flash memory may be placed
at a higher address.
●
The local SRAM (64KB or 96KB) is aliased in three address windows. A) At
0x0400.0000 the SRAM is accessible through the CPU’s D-TCM, at 0x4000.0000 the
SRAM is accessible through the CPU’s AHB in buffered accesses, and at 0x5000.0000
the SRAM is accessible through the CPU’s AHB in non-buffered accesses. An AHB bus
master other than the CPU can access SRAM in all three aliased windows, but these
accesses are always non-buffered. The CPU is the only AHB master that can
performed buffered writes.
●
APB peripherals reside in two AHB-to-APB peripheral bridge address windows, APB0
and APB1. These peripherals are accessible with buffered AHB access if the CPU
addresses them in the address range of 0x4800.0000 to 0x4FFF.FFFF, and nonbuffered access in the address range of 0x5800.0000 to 0x5FFF.FFFF.
●
Individual peripherals on the APB are accessed at the listed address offset plus the
base address of the appropriate AHB-to-APB bridge.
55/101
Memory mapping
Figure 9.
STR91xFAx3x, STR91xFAx4x
STR91xFA memory map
APB BASE +
OFFSET
TOTAL 4 GB CPU
MEMORY SPACE
APB1+0x03FF.FFFF
APB1+0x0000.E000
0xFFFF.FFFF
0xFFFF.F000
0xFC01.0000
0xFC00.0000
VIC0
4 KB
RESERVED
VIC1
APB1+0x0000.D000
AHB
NONBUFFERED
APB1+0x0000.C000
APB1+0x0000.B000
64 KB
APB1+0x0000.A000
APB1+0x0000.9000
RESERVED
APB1+0x0000.8000
APB1+0x0000.7000
APB1+0x0000.6000
0x8000.0000
0x7C00.0000
0x7800.0000
0x7400.0000
0x7000.0000
0x6C00.0000
0x6800.0000
0x6400.0000
0x6000.0000
0x5C00.0000
0x5800.0000
0x5400.0000
0x5000.0000
0x4C00.0000
0x4800.0000
0x4400.0000
0x4000.0000
0x3C00.0000
0x3800.0000
0x3400.0000
0x3000.0000
0x2C00.0000
0x2800.0000
0x2400.0000
0x2000.0000
ENET
64 MB
8-CH DMA
64 MB
EMI
64 MB
USB
64 MB
ENET
64 MB
8-CH DMA
64 MB
EMI
64 MB
USB
64 MB
APB1
64 MB
APB0
64 MB
FMI
64 MB
SRAM, AHB
64 MB
APB1
64 MB
APB0
64 MB
FMI
64 MB
SRAM, AHB
64 MB
Ext. MEM, CS0
64 MB
Ext. MEM, CS1
64 MB
Ext. MEM, CS2
64 MB
Ext. MEM, CS3
64 MB
Ext. MEM, CS0
64 MB
Ext. MEM, CS1
64 MB
Ext. MEM, CS2
64 MB
Ext. MEM, CS3
PERIPHERAL BUS
MEMORY SPACE
APB1+0x0000.5000
AHB
NONBUFFERED
APB1+0x0000.4000
APB1+0x0000.3000
APB1+0x0000.2000
APB1+0x0000.1000
APB1+0x0000.0000
AHB
BUFFERED
RESERVED
I2C1
4 KB
I2C0
4 KB
WATCHDOG
4 KB
ADC
4 KB
CAN
4 KB
SSP1
4 KB
SSP0
4 KB
UART2
4 KB
UART1
4 KB
UART0
4 KB
IMC
4 KB
SCU
4 KB
RTC
4 KB
APB1 CONFIG
4 KB
APB0+0x03FF.FFFF
APB0+0x0001.0000
PERIPHERAL BUS,
NON- BUFFERED
ACCESS
APB0+0x0000.F000
AHB
NONBUFFERED
APB0+0x0000.E000
APB0+0x0000.D000
APB0+0x0000.C000
PERIPHERAL BUS,
BUFFERED ACCESS
AHB
BUFFERED
APB0+0x0000.B000
APB0+0x0000.A000
APB0+0x0000.9000
APB0+0x0000.8000
APB0+0x0000.7000
AHB
NONBUFFERED
APB0+0x0000.6000
APB0+0x0000.5000
APB0+0x0000.4000
APB0+0x0000.3000
AHB
BUFFERED
APB0+0x0000.2000
APB0+0x0000.1000
64 MB
APB0+0x0000.0000
RESERVED
GPIO PORT P9
4 KB
GPIO PORT P8
4 KB
GPIO PORT P7
4 KB
GPIO PORT P6
4 KB
GPIO PORT P5
4 KB
GPIO PORT P4
4 KB
GPIO PORT P3
4 KB
GPIO PORT P2
4 KB
GPIO PORT P1
4 KB
GPIO PORT P0
4 KB
TIM3
4 KB
TIM2
4 KB
TIM1
4 KB
TIM0
4 KB
WAKE-UP UNIT
4 KB
APB0 CONFIG
4 KB
Order of the two Flash memories is user defined.
SECONDARY
FLASH (BANK 1),
32KB or 128KB
RESERVED
MAIN FLASH
(BANK 0),
256KB, 512KB,
1024KB or 2028KB
0x0800.0000
0x0400.0000
0x0000.0000
SRAM, D-TCM
FLASH, I-TCM
Using 64 KB or 96
KB
Using 288 KB, 544 KB,
1.1 MB or 2.1 MB
0x0000.0000
DEFAULT ORDER
56/101
APB1,
AHBto-APB
Bridge
MAIN FLASH
(BANK 0),
256KB, 512KB,
1024KB or 2048KB
SECONDARY
FLASH (BANK 1),
32KB or 128KB
OPTIONAL ORDER
APB0,
AHBto-APB
Bridge
STR91xFAx3x, STR91xFAx4x
Electrical characteristics
7
Electrical characteristics
7.1
Parameter conditions
Unless otherwise specified, all voltages are referred to VSS.
7.1.1
Minimum and maximum values
Unless otherwise specified the minimum and maximum values are guaranteed in the worst
conditions of ambient temperature, supply voltage and frequencies by tests in production on
100% of the devices with an ambient temperature at TAmax (given by the selected
temperature range).
Data based on product characterisation, design simulation and/or technology characteristics
are indicated in the table footnotes and are not tested in production. Based on
characterization, the minimum and maximum values refer to sample tests and represent the
mean value plus or minus three times the standard deviation (mean±3Σ).
7.1.2
Typical values
Unless otherwise specified, typical data are based on TA=25° C, VDDQ=3.3 V and
VDD=1.8 V. They are given only as design guidelines and are not tested.
Typical ADC accuracy values are determined by characterization of a batch of samples from
a standard diffusion lot over the full temperature range, where 95% of the devices have an
error less than or equal to the value indicated (mean±2Σ).
7.1.3
Typical curves
Unless otherwise specified, all typical curves are given only as design guidelines and are
not tested.
7.1.4
Loading capacitor
The loading conditions used for pin parameter measurement are shown in Figure 10.
Figure 10. Pin loading conditions
STR9 PIN
CL=50pF
7.1.5
Pin input voltage
The input voltage measurement on a pin of the device is described in Figure 11.
57/101
Electrical characteristics
STR91xFAx3x, STR91xFAx4x
Figure 11. Pin input voltage
STR9 PIN
VIN
7.2
Absolute maximum ratings
This product contains devices to protect the inputs against damage due to high static
voltages. However, it is advisable to take normal precautions to avoid application of any
voltage higher than the specified maximum rated voltages. It is also recommended to
ground any unused input pin to reduce power consumption and minimize noise.
Table 9.
Absolute maximum ratings
Value
Symbol
58/101
Unit
Min
Max
VDD
Voltage on VDD pin with respect to ground VSS
-0.3
2.4
V
VDDQ
Voltage on VDDQ pin with respect to ground VSS
-0.3
4.0
V
VBATT
Voltage on VBATT pin with respect to ground VSS
-0.3
4.0
V
AVDD
Voltage on AVDD pin with respect to ground VSS
(128-pin and 144-ball packages)
-0.3
4.0
V
AVREF
Voltage on AVREF pin with respect to ground VSS
(128-pin and 144-ball packages)
-0.3
4.0
V
AVREF_AVDD
Voltage on AVREF_AVDD pin with respect to
Ground VSS (80-pin package)
-0.3
4.0
V
Voltage on 5V tolerant pins with respect to ground
VSS
-0.3
5.5
V
Voltage on any other pin with respect to ground
VSS
-0.3
4.0
V
TST
Storage Temperature
-55
+150
°C
TJ
Junction Temperature
+125
°C
ESD
ESD Susceptibility (Human Body Model)
VIN
Note:
Parameter
2000
V
Stresses exceeding above listed recommended "Absolute Maximum Ratings" may cause
permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. During overload conditions (VIN>VDDQ or
VIN<VSSQ) the voltage on pins with respect to ground (VSSQ) must not exceed the
recommended values.
STR91xFAx3x, STR91xFAx4x
Table 10.
Electrical characteristics
Current characteristics
Symbol
IVDD_IO(1)
IVSS_IO(1)
Maximum
value
Ratings
Total current into VDD_IO power lines (source) (2)
Total current out of VSS ground lines (sink)
(2)
Output current sunk by any I/O and control pin
IIO
200
200
mA
25
Output current source by any I/Os and control pin
- 25
IINJ(PIN)(3)
Injected current on any pin during overload condition(4)
±5
ΣIINJ(PIN)(3)
Absolute sum of all input currents during overload condition
(4)
Unit
mA
± 25
1. The user can use GPIOs to source or sink current. In this case, the user must ensure that these absolute
max. values are not exceeded (taking into account the RUN power consumption).
2. All 3.3 V or 5.0 V power (VDD_IO, VDDA_ADC, VDDA_PLL) and ground (VSS_IO, VSSA_ADC, VDDA_ADC) pins
must always be connected to the external 3.3V or 5.0V supply.
3. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum
cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive
injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS.
4. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values). These results are based on
characterization with ΣIINJ(PIN) maximum current injection on four I/O port pins of the device.
59/101
Electrical characteristics
STR91xFAx3x, STR91xFAx4x
7.3
Operating conditions
Table 11.
Operating conditions
Value
Symbol
Parameter
Conditions
Unit
Flash size ≤ 512 KB
Min
Max
1.65
2.0
V
1.65
2.0
V
1.75
2.0
V
Flash size = 1 MB / 2 MB,
fCPUCLK ≤ 75 MHz during
VDD
Flash RWW and ≤ 85
MHz during all other
operations
Digital CPU supply voltage
Flash size = 1 MB / 2 MB,
fCPUCLK ≤ 85 MHz during
Flash RWW and ≤ 96
MHz during all other
operations
VDDQ
Digital I/O supply voltage
2.7
3.6
V
VBATT(1)
SRAM backup and RTC supply
voltage
2.5
3.6
V
AVDD
Analog ADC supply voltage (128pin and 144-ball packages)
2.7
VDDQ
V
AVREF
Analog ADC reference voltage
(128-pin and 144-ball packages)
2.65
AVDD(2)
V
AVREF_AVDD
Combined analog ADC reference
and ADC supply voltage (80-pin
package)
2.7
VDDQ
V
TA
Ambient temperature under bias
-40
+85
C
1. The VBATT pin should be connected to VDDQ if no battery is installed
2. AVREF must never exceed VDDQ
7.3.1
Operating conditions at power-up / power-down
Subject to general operating conditions for TA.
Table 12.
Symbol
Operating conditions at power-up / power-down
Parameter
Min(1)
Max(1)
μs/V
10
tVDD
VDD rise time rate
1. Data guaranteed by characterization, not tested in production.
60/101
Unit
10
ms/V
STR91xFAx3x, STR91xFAx4x
7.4
Electrical characteristics
RESET_INn and power-on-reset characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Table 13.
RESET_INn and power-on-reset characteristics
Value
Symbol
Parameter
tRINMIN
RESET_INn Valid Active Low
tPOR
Power-On-Reset Condition
duration
tRSO
RESET_OUT Duration
(Watchdog reset)
Test Conditions
Min(1)
Unit
Typ
Max
100
ns
10
ms
one PCLK
ns
VDDQ,VDD ramp
time is less than
10ms: 0V to VDD
1. Data based on bench measurements, not tested in production.
7.5
LVD electrical characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Table 14.
LVD electrical characteristics
Symbol
Parameter
Test
Conditions
Value
Unit
Min
Typ
Max
VDD_LVD+ (1.8V)
LVD threshold during VDD rise
1.43
1.50
1.58
V
VDD_LVD- (1.8V)
LVD threshold during VDD fall
1.33
1.40
1.47
V
VDD_BRN (1.8V)
VDD brown out warning threshold
1.65
V
VDDQ_LVD+ (3.0V) LVD threshold during VDDQ rise
(1)(2)
2.32
2.45
2.57
VDDQ_LVD- (3.0V)
LVD threshold during VDDQ fall
(1)(2)
2.23
2.35
2.46
VDDQ_BRN (3.0V)
VDDQ brown out warning threshold
(1)(2)
V
2.65
V
VDDQ_LVD+ (3.3V) LVD threshold during VDDQ rise
(2)(3)
2.61
2.75
2.89
VDDQ_LVD- (3.3V)
LVD threshold during VDDQ fall
(2)(3)
2.52
2.65
2.78
VDDQ brown out warning threshold
(2)(3)
VDDQ_BRN (3.3V)
2.95
V
V
1. For VDDQ I/O voltage operating at 2.7 - 3.3V.
2. Selection of VDDQ operation range is made using configuration software from ST, or IDE from 3rd parties. The default
condition is VDDQ=2.7V - 3.3V.
3. For VDDQ I/O voltage operating at 3.0 - 3.6V.
61/101
Electrical characteristics
7.5.1
STR91xFAx3x, STR91xFAx4x
LVD delay timing
Case 1: When VDDQ reaches the VDDQ_LVD+ threshold after the first ~10 ms delay
(introduced by the VDD rising edge), a new ~10 ms delay starts before the release of
RESET_OUTn. See Figure 12.
Figure 12. LVD reset delay case 1
VDDQ_LVD+
VDD_LVD+
VDD (green)
VDDQ (red)
RESET_OUTn (blue)
~10 ms delay
~10 ms delay
Case 2: When VDDQ reaches the VDDQ_LVD+ threshold before the first ~10 ms delay
(introduced by the VDD rising edge), RESET_OUTn will be released immediately at the end
of the delay. No new delay is introduced in this case. See Figure 13.
Figure 13. LVD reset delay case 2
VDDQ_LVD+
VDD_LVD+
VDD (green)
VDDQ (red)
RESET_OUTn (blue)
~10 ms delay
Case 3: When VDD reaches the VDD_LVD+ threshold after the VDDQ rising edge,
RESET_OUTn will be released at the end of a ~10 ms delay. See Figure 14
Figure 14. LVD reset delay case 3
VDDQ_LVD+
VDD_LVD+
VDD (green)
VDDQ (red)
RESET_OUTn (blue)
~10 ms delay
62/101
STR91xFAx3x, STR91xFAx4x
7.6
Electrical characteristics
Supply current characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Table 15.
Supply current characteristics
Value
Symbol
Parameter
Test Conditions
Unit
Min
IDDRUN
Run Mode Current
IIDLE
Idle Mode Current
ISLEEP(IDD)
Typ
Max
All peripherals on(1)(2)
1.7
2.3
All peripherals off(1)(2)
1.3
1.6
All peripherals on (2)(3)
1.14
1.7
mA/MHz
off(2)(4)
0.45
0.75
mA/MHz
50
820(5)
All peripherals
Sleep Mode
Current, IDD
Sleep Mode
ISLEEP(IDDQ)
Current, IDDQ
ARM core and all peripheral
clocks stopped (with
exception of RTC), LVD off
mA/MHz
µA
ARM core and all peripheral
clocks stopped (with
exception of RTC), LVD on
55
825(5)
Flash size ≤ 512 KB
LVD On (4)
7
80(5)
µA
Flash size ≤ 512 KB
LVD Off (4)
7
70(5)
µA
Flash size = 1 MB / 2 MB
LVD On (4)
7
TBD
µA
Flash size = 1 MB / 2 MB
LVD Off (4)
7
TBD
µA
IRTC_STBY
RTC Standby
Current
Measured on VBATT pin
0.9
1.2
µA
ISRAM_STBY
SRAM Standby
Current
Measured on VBATT pin
5
240
µA
1. ARM core and peripherals active with all clocks on. Power can be conserved by turning off clocks to
peripherals which are not required.
2. mA/MHz data valid down to 10 MHz. Below this frequency the ratio mA/MHz increases.
3. ARM core stopped and all peripheral clocks active.
4. ARM core stopped and all peripheral clocks stopped.
5. Results based on characterization, not tested in production.
63/101
Electrical characteristics
STR91xFAx3x, STR91xFAx4x
Figure 15. Sleep mode current vs temperature with LVD on
2000
VDD = 2.0 V
1800
1600
1400
VDD = 1.8 V
Idd[µA]
1200
1000
800
600
400
200
-40
-20
0
0
20
40
60
80
100
120
TEMP [°C]
7.6.1
Typical power consumption for frequencies below 10 MHz
The following conditions apply to Table 16:
Table 16.
Symbol
●
Program is executed from Flash. The program consists of an infinite loop.
●
A standard crystal source is used.
●
The PLL is off.
●
All clock dividers are with their default values.
Typical current consumption at 25°C
Parameter
All
peripherals
ON
IDDRUN
Run mode
current
All
peripherals
OFF
64/101
Test conditions
Typical current
on VDD (1.8 V)
fMSTR=fOSC=fPCLK=fHCLK=1 MHz
2.88
fMSTR=fOSC=fPCLK=fHCLK=2 MHz
5.8
fMSTR=fOSC=fPCLK=fHCLK=4 MHz
10.91
fMSTR=fOSC=fPCLK=fHCLK=6 MHz
15.97
fMSTR=fOSC=fPCLK=fHCLK=8 MHz
20.68
fMSTR=fOSC=fPCLK=fHCLK=10 MHz
25.13
fMSTR=fOSC=fPCLK=fHCLK=1 MHz
1.8
fMSTR=fOSC=fPCLK=fHCLK=2 MHz
3.62
fMSTR=fOSC=fPCLK=fHCLK=4 MHz
6.71
fMSTR=fOSC=fPCLK=fHCLK=6 MHz
9.81
fMSTR=fOSC=fPCLK=fHCLK=8 MHz
12.63
fMSTR=fOSC=fPCLK=fHCLK=10 MHz
15.47
Unit
mA
STR91xFAx3x, STR91xFAx4x
Electrical characteristics
7.7
Clock and timing characteristics
Table 17.
Internal clock frequencies
Value
Symbol
Parameter
Conditions
Unit
Min
fMSTR
fCPUCLK
CCU Master Clock
CPU Core Frequency
Typ
32.768
Max
fCPUCLKmax
kHz
Executing from SRAM
96
MHz
Flash size ≤ 512 KB
Executing from Flash
96
MHz
Flash size = 1 MB / 2
MB, executing from
SRAM or Flash (except
RWW)
VDD ≥ 1.75 V
96
MHz
Flash size = 1 MB / 2
MB, executing from
SRAM or Flash (except
RWW)
VDD ≥ 1.65 V
85
MHz
Flash size = 1 MB / 2
MB, Flash read while
write (RWW),
VDD ≥ 1.75 V(1)
85
MHz
Flash size = 1 MB / 2
MB, Flash read while
write (RWW),
1.65 < VDD < 1.75 V(1)
75
MHz
fPCLK
Peripheral Clock for APB
48
MHz
fHCLK
Peripheral Clock for AHB
fCPUCLKmax
MHz
fOSC
Clock Input
25
MHz
FMI Flash Bus clock
(internal clock)
fCPUCLKmax
MHz
fBCLK
External Memory Bus clock
fCPUCLKmax
MHz
fRTC
RTC Clock
fFMICLK
fEMAC
fUSB
fTIMCLKEXT
fTIMCLK
4
32.768
kHz
EMAC PHY Clock
25
MHz
USB Clock
48
MHz
Timer External Clock
0
fPCLKmax/4
= 12
MHz
Timer Clock when Internal
Clock (PCLK) is selected
0
fPCLKmax
= 48
MHz
1. To avoid the speed restriction on RWW, the Flash write erase routines can be executed from SRAM, at up to 85 or 96
MHz, depending on VDD.
65/101
Electrical characteristics
7.7.1
STR91xFAx3x, STR91xFAx4x
Main oscillator electrical characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Table 18.
Main oscillator electrical characteristics
Value
Symbol
Parameter
Test Conditions
Unit
Min
Typ
Max
2
3
VDD stable (1)
tSTUP(OSC) Oscillator Start-up Time
mS
1. Data characterized with quartz crystal, not tested in production.
7.7.2
X1_CPU external clock source
Subject to general operating conditions for VDD and TA.
Table 19.
External clock characteristics
Symbol
Test
Conditions(1)
Parameter
Value
Unit
Min
Typ
Max
fX1
External clock source
frequency
4
25
MHz
VX1H
X1 input pin high level
voltage
0.7xVDD
VDD
V
VX1L
X1 input pin low level
voltage
VSS
0.3xVDD
V
tw(X1H)
tw(X1L)
X1 high or low time(2)
tr(X1)
tf(X1)
X1 rise or fall time(2)
IL
CIN(X1)
See Figure 16
6
VSS≤VIN≤VDD
X1 input leakage current
X1 input
ns
capacitance(2)
20
ns
±1
µA
5
DuCy(X1) Duty cycle
45
pF
55
1. Data based on typical appilcation software.
2. Data based on design simulation and/or technology characteristics, not tested in production.
Figure 16. Typical application with an external clock source
90%
VX1H
10%
VX1L
tr(T1)
TX1
tf(X1)
tw(X1H)
tw(X1L)
X2_CPU
EXTERNAL
CLOCK SOURCE
fOSC
hi-Z
X1_CPU
IL
STR91xF
66/101
%
STR91xFAx3x, STR91xFAx4x
7.7.3
Electrical characteristics
RTC oscillator electrical characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Table 20.
Symbol
gM(RTC)
RTC oscillator electrical characteristics
Value
Test
Conditions
Parameter
Unit
Min
Oscillator Start _voltage(1)
(1)
tSTUP(RTC) Oscillator Start-up Time
Typ
Max
VDD_LVD+ (2)
V
VDD stable
1
S
1. Data based on bench measurements, not tested in production.
2. Refer to Table 14 for min. value of VDD_LVD+
Table 21.
RTC crystal electrical characteristics
Value
Symbol
Parameter
Unit
Min
fO
Resonant frequency
RS
Series resistance
CL
Load capacitance
Typ
Max
32.768
kHz
40
8
kΩ
pF
67/101
Electrical characteristics
7.7.4
STR91xFAx3x, STR91xFAx4x
PLL electrical characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Table 22.
PLL electrical characteristics
Value
Symbol
Parameter
Unit
Min
fPLL
PLL Output Clock
fOSC
Clock Input
tLOCK
PLL lock time
ΔtJITTER
PLL Jitter (peak to peak)(1)
Typ
Max
6.25
fCPUCLKmax
MHz
4
25
MHz
300
1500
µs
0.1
0.2
ns
1. Data based on bench measurements, not tested in production
7.8
Memory characteristics
7.8.1
SRAM characteristics
Table 23.
SRAM and hardware registers
Symbol
Parameter
VDR
Supply voltage for data
retention(1)
1. Guaranteed by characterization, not tested in production.
68/101
Conditions
Min
TA= 85°C (worst case)
1.1
Typ
Max
Unit
V
STR91xFAx3x, STR91xFAx4x
7.8.2
Electrical characteristics
Flash memory characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Note:
Flash read access for sequential addresses is 0 wait states at 96 MHz.
Flash read access for non-sequential accesses requires 2 wait states when FMI clock is
above 66 MHz. See STR91xF Flash Programming Manual for more information.
Table 24.
Flash memory program/erase characteristics (Flash size ≤ 512 KB)
Value
Typ(1)
Typ after
100K W/E
cycles(1)
Max
Primary Bank (512 Kbytes)
8
9
11.5
s
Primary Bank (256 Kbytes)
4
4.5
6
s
Secondary Bank (32 Kbytes)
700
750
950
ms
Of Primary Bank (64 Kbytes)
1300
1400
1800
ms
Of Secondary Bank (8 Kbytes)
300
320
450
ms
Primary Bank (512 Kbytes)
3700
4700
5100
ms
Primary Bank (256 Kbytes)
1900
2000
2550
ms
Secondary Bank (32 Kbytes)
250
260
320
ms
Of Primary Bank (64 Kbytes)
500
520
640
ms
Of Secondary Bank (8 Kbytes)
60
62
80
ms
8
9
11
µs
Parameter
Bank erase
Test Conditions
Unit
Sector erase
Bank program
Sector program
Word program
1.
Half word (16 bits)
VDD = 1.8V, VDDQ = 3.3V, TA = 25°C.
Table 25.
Flash memory program/erase characteristics (Flash size = 1 MB / 2 MB)
Value
Typ(1)
Typ after
100K W/E
cycles(1)
Max
Primary Bank (2 Mbytes)
32
36
46
s
Primary Bank (1 Mbytes)
16
18
23
s
Secondary Bank (128 Kbytes)
2.5
3
4
s
Of Primary Bank (64 Kbytes)
1300
1400
1800
ms
Of Secondary Bank (16 Kbytes)
500
600
850
ms
Primary Bank (2 Mbytes)
15
20
22
s
Primary Bank (1 Mbytes)
7.5
10
11
s
1060
1140
1380
ms
Parameter
Bank erase
Test Conditions
Unit
Sector erase
Bank program
Secondary Bank (128 Kbytes)
69/101
Electrical characteristics
Table 25.
STR91xFAx3x, STR91xFAx4x
Flash memory program/erase characteristics (Flash size = 1 MB / 2 MB)
Value
Typ(1)
Typ after
100K W/E
cycles(1)
Max
Of Primary Bank (64 Kbytes)
500
520
640
ms
Of Secondary Bank (16 Kbytes)
120
130
160
ms
8
9
11
µs
Parameter
Test Conditions
Unit
Sector program
Word program
1.
Half word (16 bits)
VDD = 1.8V, VDDQ = 3.3V, TA = 25°C.
Table 26.
Flash memory endurance
Value
Parameter
Test Conditions
Unit
Min
Program/erase cycles
Data retention
70/101
Per word
Typ
Max
100K
cycles
20
years
STR91xFAx3x, STR91xFAx4x
7.9
Electrical characteristics
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
7.9.1
Functional EMS (electro magnetic susceptibility)
Based on a simple running application on the product (toggling 2 LEDs through I/O ports),
the product is stressed by two electro magnetic events until a failure occurs (indicated by the
LEDs).
●
ESD: Electro-Static Discharge (positive and negative) is applied on all pins of the
device until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
●
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to VDD, VDDQ
and VSS through a 100pF capacitor, until a functional disturbance occurs. This test
conforms with the IEC 1000-4-4 standard.
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Table 27.
EMS data
Severity/
Criteria(1)
Symbol
Parameter
Conditions
VFESD
Voltage limits to be applied on
any I/O pin to induce a functional
disturbance
VDD=1.8V, VDDQ=3.3V, TA=+25°C,
fOSC/fCPUCLK =4 MHz/96MHz PLL
VFFTB
Fast transient voltage burst limits
to be applied through 100pF on
VDD and VDDQ pins to induce a
functional disturbance
VDD=1.8V, VDDQ=3.3V, TA=+25°C,
fOSC/fCPUCLK =4 MHz/96 MHz PLL
conforms to IEC 1000-4-4
Unit
1B
kV
4A
1. Data based on characterization results, not tested in production.
7.9.2
Electro magnetic interference (EMI)
Based on a simple application running on the product (toggling 2 LEDs through the I/O
ports), the product is monitored in terms of emission. This emission test is in line with the
norm SAE J 1752/3 which specifies the board and the loading of each pin.
Table 28.
Symbol
SEMI
EMI data
Parameter
Peak level
Conditions
VDDQ=3.3V, VDD=1.8V,
TA=+25°C,
LQFP128 package(2)
conforming to SAE J
1752/3
Monitored
Frequency Band
Max vs.
[fOSC/fCPUCLK]
Unit
24 MHz /
48 MHz(1)
24 MHz /
96 MHz(1)
0.1MHz to 30 MHz
14
10
30 MHz to 130
MHz
18
19
130 MHz to 1GHz
18
22
SAE EMI Level
4
4
dBμV
-
1. Data based on characterization results, not tested in production.
71/101
Electrical characteristics
STR91xFAx3x, STR91xFAx4x
2. BGA and LQFP devices have similar EMI characteristics.
7.9.3
Absolute maximum ratings (electrical sensitivity)
Based on two different tests (ESD and LU) using specific measurement methods, the
product is stressed in order to determine its performance in terms of electrical sensitivity.
7.9.4
Electro-static discharge (ESD)
Electro-Static Discharges (3 positive then 3 negative pulses separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts*(n+1) supply pin). This test
conforms to the JESD22-A114A/A115A standard. For more details, refer to the application
note AN1181.
Table 29.
ESD data
Symbol
VESD(HBM)
VESD(CDM)
Ratings
Conditions
Electro-static discharge voltage
(Human Body Model)
TA=+25°C
conforming to
JESD22-A114
Electro-static discharge voltage
(Charged Device Model)
TA=+25°C
conforming to
JESD22-C101
Class
Maximum
value (1)
2
+/-2000
Unit
V
II
1000
1. Data based on characterization results, not tested in production.
7.9.5
Static latch-up
Two complementary static tests are required on 10 parts to assess the latch-up
performance.
●
A supply overvoltage (applied to each power supply pin) and
●
A current injection (applied to each input, output and configurable I/O pin) are
performed on each sample.
This test conforms to the EIA/JESD 78 IC latch-up standard. For more details, refer to the
application note AN1181.
7.9.6
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations:
72/101
STR91xFAx3x, STR91xFAx4x
Electrical characteristics
The software flowchart must include the management of runaway conditions such as:
●
Corrupted program counter
●
Unexpected reset
●
Critical Data corruption (control registers...)
Prequalification trials:
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
7.9.7
Electrical sensitivity
Table 30.
Symbol
LU
Static latch-up data
Parameter
Static latch-up class
Conditions
TA=+25°C conforming to JESD78A
Class (1)
II class A
1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the
JEDEC specifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B
Class strictly covers all the JEDEC criteria (international standard).
73/101
Electrical characteristics
7.10
STR91xFAx3x, STR91xFAx4x
I/O characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Table 31.
I/O characteristics
Value
Symbol
Parameter
Test conditions
Unit
Min
General inputs(1)
VIH
Input High Level
RESET and TCK inputs(1)
TAMPER_IN input
VHYS
VOH
VOL
Input Low Level
(2)
0.8VDDQ
VDDQ/2
V
0.8
RESET and TCK inputs(1)
0.2VDDQ
TAMPER_IN input(3)
VDDQ/2
Input Hysteresis
Schmitt Trigger
General inputs(4)
Output High Level
High current pins
I/O ports 3 and 6:
Push-Pull, IOH = 8mA
VDDQ-0.7
Output High Level
Standard current pins
I/O ports 0,1,2,4,5,7,8,9:
Push-Pull, IOH = 4mA
VDDQ-0.7
Output High Level
JTAG JTDO pin
IOH= -100 µA
VDDQ-0.1
Output Low Level
High current pins
I/O ports 3 and 6:
Push-Pull, IOL = 8mA
0.4
Output Low Level
Standard current pins
I/O ports 0,1,2,4,5,7,8,9:
Push-Pull, IOL = 4mA
0.4
Output Low Level
JTAG JTDO pin
IOL=100 µA
0.1
1. Guaranteed by characterization, not tested in production.
2. Input pins are 5V tolerant, max input voltage is 5.5V
3. Guaranteed by design, not tested in production.
4. TAMPER_IN pin has no built-in hysteresis
74/101
(3)
Max
inputs(1)
General
VIL
2.0
Typ
0.4
V
V
V
STR91xFAx3x, STR91xFAx4x
7.11
Electrical characteristics
External memory bus timings
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C, CL= 30 pF unless otherwise specified.
Table 32.
EMI bus clock period
Parameter(1)
Symbol
tBCLK
Value (2)
EMI Bus Clock period
1 /(fHCLK x EMI_ratio)
1. The internal EMI Bus clock signal is available externally only on LFBGA144 packages (ball M8), and not
available on LQFP packages.
2. EMI_ratio =1/ 2 by default (can be programmed to be 1 by setting the proper bits in the SCU_CLKCNTR
register)
7.11.1
Asynchronous mode
Non Mux Write
Figure 17. Non-mux write timings
EMI_CSxn
EMI_A[15:0]
Address
EMI_D[7:0]
Data
tWAS
tWDS
tWP
tWCR
EMI_BWR_WRLn
75/101
Electrical characteristics
Table 33.
STR91xFAx3x, STR91xFAx4x
EMI non-mux write operation
Value
Symbol
Parameter
Min
Max
(tBCLK/2) - 2 ns
(tBCLK/2) + 2 ns
tWCR
WRn to CSn
inactive
tWAS
Write Address
Setup Time
((WSTWEN + 1/2) x tBCLK ) - 2 ns
((WSTWEN + 1/2) x tBCLK) + 1 ns
tWDS
Write Data Setup
Time
((WSTWEN + 1/2) x tBCLK ) - 5 ns
((WSTWEN + 1/2) x tBCLK)
tWP
Write Pulse Width
(WSTWR-WSTWEN + 1) x tBCLK - 1 ns (WSTWR-WSTWEN + 1) x tBCLK + 1.5 ns
Non-mux read
Figure 18. Non-mux bus read timings
EMI_CSxn
tRCR
EMI_A [15:0]
A ddress
tRAH
EMI_D[7:0]
Data
tRAS
tRDS
tRP
EMI_RDn
Table 34.
tRDH
EMI read operation
Value
Symbol
Min
Max
0
1.5 ns
((WSTOEN) x tBCLK)- 1.5 ns
(WSTOEN) x tBCLK
tRCR
Read to CSn
inactive
tRAS
Read Address
Setup Time
tRDS
Read Data Setup
Time
12.5
-
tRDH
Read Data Hold
Time
0
-
((WSTRD-WSTOEN+1) x tBCLK)0.5 ns
((WSTRD-WSTOEN+1) x tBCLK)+
2 ns
tRP
76/101
Parameter
Read Pulse
Width
STR91xFAx3x, STR91xFAx4x
Electrical characteristics
Mux write
Figure 19. Mux write diagram
EMI_CSxn
EMI_A LE
tAW
t W CR
EMI_A [23:16]
A ddress
tAA S
EMI_A D[15:0]
tA AH
tW DS
Data
A ddress
tW A S
EMI_WRLn
EMI_WRHn
Table 35.
t WP
Mux write times
Value
Symbol
Parameter
Min
Max
(tBCLK/2) - 2ns
(tBCLK/2) + 2ns
(WSTWEN + 1/2) x
tBCLK - 2.5 ns
(WSTWEN + 1/2) x
tBCLK + 2 ns
tWCR
WRn to CSn
inactive
tWAS
Write Address
Setup Time
tWDS
Write Data
Setup Time
((WSTWEN - ALE_LENGTH) x tBCLK) - 2
((WSTWEN - ALE_LENGTH) x tBCLK) + 1 ns
ns
tWP
Write Pulse
Width
((WSTWR-WSTWEN + 1) x tBCLK) - 1 ns
((WSTWR-WSTWEN + 1) x tBCLK) + 1.5 ns
tAW
ALE pulse width
(ALE_LENGTH x tBCLK )- 3.5 ns
(ALE_LENGTH x tBCLK )
tAAS
Address to ALE
setup time
(ALE_LENGTH x tBCLK )- 3.5 ns
(ALE_LENGTH x tBCLK )
tAAH
Address to ALE
hold time
(tBCLK/2) - 1 ns
(tBCLK/2) + 2 ns
77/101
Electrical characteristics
STR91xFAx3x, STR91xFAx4x
Mux read
Figure 20. Mux read diagram
EMI_CSxn
EMI_A LE
t AW
t RCR
EMI_A [23:16]
A ddress
t A AS
EMI_A D[15:0]
tAA H
t RDH
A ddress
Data
tRAS
tRDS
tRP
EMI_RDn
Table 36.
Mux read times
Value
Symbol
Parameter
Min
tRCR
tRAS
tRDS
tRDH
tRP
tAW
tAAS
tAAH
78/101
Max
Read to CSn
0
1.5 ns
inactive
Read Address Setup
((WSTOEN) x tBCLK)
((WSTOEN) x tBCLK)- 4 ns
Time
Read Data Setup
12 ns
Time
Read Data Hold
0
Time
Read Pulse Width
((WSTRD-WSTOEN+1) x tBCLK) - 0.5 ns ((WSTRD-WSTOEN+1) x tBCLK) + 2.5 ns
ALE pulse width
(ALE_LENGTH x tBCLK) - 3.5 ns
(ALE_LENGTH x tBCLK )
Address to ALE
(ALE_LENGTH x tBCLK )
(ALE_LENGTH x tBCLK) - 3.5 ns
setup time
Address to ALE hold
(tBCLK/2) + 2 ns
(tBCLK/2)- 1 ns
time
STR91xFAx3x, STR91xFAx4x
Electrical characteristics
Page mode read
Figure 21. Page mode read diagram
CSx
EMI_RD
tRAS
tRCR
A15-A2
A15-A2
tADW
Addr 0
A1-A0
Addr 3
Addr 2
Addr 1
tRP
Data 1
Data 0
D0-D7
tRDS
Table 37.
Data 3
Data 2
tRDH
Page mode read times
Value
Symbol
Parameter
Min
Max
tRDH
Read Data Hold Time
tRDS
Read Data Setup
Time
12 ns
-
tADW
ALE pulse width
(tBCLK) - 1.5 ns
(tBCLK )+ 0.5 ns
tRAS
Read Address Setup
Time
((WSTOEN) x tBCLK)
((WSTOEN) x tBCLK) + 2.5 ns
tRP
Read Pulse Width
((WSTRD-WSTOEN+1) x tBCLK)
((WSTRD-WSTOEN+1) x tBCLK) + 2 ns
0
1 ns
tRCR
Read to CSn inactive
0
79/101
Electrical characteristics
7.11.2
STR91xFAx3x, STR91xFAx4x
Synchronous mode
Sync burst write
Figure 22. Sync burst write diagram
EMI_BCLK
EMI_ALE
CS
EMI_WE
EMI_UB
EMI_LBN
EMI_BAA
EMI_WAIT
AD15:0
D_OUT15:0
A15:0
EMI_BCLK
EMI_ALE
CS
EMI_WE
EMI_BAA
A[15:0]
D_IN[15:0]
Data 0
Data 1 Data 2 Data 3
tD1
tD2
tDS
tDH
DATA
tWS
EMI_WAIT
80/101
Data n
STR91xFAx3x, STR91xFAx4x
Table 38.
Electrical characteristics
Sync burst write times
Value
Symbol
Parameter
Min
Max
tD1BAA
BAA tD1
0
2 ns
tD2BAA
BAA tD2
0.5 ns
2.5 ns
tD1ALE
ALE tD1
1 ns
3.5 ns
tD2ALE
ALE tD2
(tBCLK/2) -0.5 ns
(tBCLK/2) + 3.5 ns
tD1WR
RD tD1
0
2ns
tD2WR
RD tD2
0.5 ns
2.5 ns
tD1A
Address tD1
1.5 ns
4 ns
tD2A
Address tD2
2ns
4.5 ns
tD1CS
CS tD1
0.5ns
3 ns
tD2CS
CS tD2
1 ns
3.5 ns
tWS
WAIT setup time
3 ns
6 ns
tDS
Data setup time
(tBCLK/2) -3.5 ns
(tBCLK/2)+ 0.5 ns
tDH
Data hold time
(tBCLK/2) - 1 ns
(tBCLK/2)+3.5 ns
81/101
Electrical characteristics
STR91xFAx3x, STR91xFAx4x
Sync burst read
Figure 23. Sync burst read diagram
EMI_BCLK
tD1
EMI_ALE
CSxn
EMI_RDn
EMI_BAAn
A[15:0]
tD2
tDH
tDS
D_IN[15:0]
DATA
tWS
EMI_WAITn
Table 39.
Sync burst read times
Value
Symbol
82/101
Parameter
Min
Max
tD1BAA
BAA tD1
0 ns
2 ns
tD2BAA
BAA tD2
0.5ns
2.5 ns
tD1ALE
ALE tD1
1 ns
3.5 ns
tD2ALE
ALE tD2
(tBCLK/2)+0.5 ns
(tBCLK/2)+3 ns
tD1RD
RD tD1
0
2 ns
tD2RD
RD tD2
0.5 ns
2.5 ns
tD1A
Address tD1
2 ns
4 ns
tD2A
Address tD2
2.5 ns
3.5 ns
tD1CS
CS tD1
0.5 ns
3 ns
tD2CS
CS tD2
1 ns
3.5 ns
tWS
WAIT set up time
1 ns
4 ns
tDS
Data setup time
4.5 ns
-
tDH
Data hold time
0
-
STR91xFAx3x, STR91xFAx4x
Electrical characteristics
7.12
Communication interface electrical characteristics
7.12.1
10/100 Ethernet MAC electrical characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Ethernet MII interface timings
Figure 24. MII_RX_CLK and MII_TX_CLK timing diagram
3
MII_RX_TCLK, MII_TX_CLK
2
4
4
1
Table 40.
MII_RX_CLK and MII_TX_CLK timing table
Value
Symbol
Parameter
Symbol
Unit
Min
Max
1
Cycle time
tc(CLK)
2
Pulse duration HIGH
tHIGH(CLK)
40%
60%
3
Pulse duration LOW
tLOW(CLK)
40%
60%
4
Transition time
tt(CLK)
40
ns
1
ns
Figure 25. MDC timing diagram
3
MDC
2
4
4
1
Table 41.
MDC timing table
Value
Symbol
Parameter
Symbol
Unit
Min
Max
1
Cycle time
tc(MDC)
266
ns
2
Pulse duration HIGH
tHIGH(MDC)
40%
60%
3
Pulse duration LOW
tLOW(MDC)
40%
60%
4
Transition time
tt(MDC)
1
ns
83/101
Electrical characteristics
STR91xFAx3x, STR91xFAx4x
Ethernet MII management timings
Figure 26. Ethernet MII management timing diagram
MDC
1
MDIO
output
2
3
MDIO
input
Table 42.
Ethernet MII management timing table
Value
Symbol
Parameter
Symbol
Unit
Min
Max
1
MDIO delay from rising
edge of MDC
tc(MDIO)
2
MDIO setup time to rising
edge of MDC
Tsu (MDIO)
2.70
ns
3
MDIO hold time from rising
edge of MDC
Th (MDIO)
-2.03
ns
2.83
ns
Ethernet MII transmit timings
Figure 27. Ethernet MII transmit timing diagram
MII_TX_CLK
2
1
3
MII_TX_EN
4
5
MII_CRS
6
8
MII_COL
7
MII_TXD
Table 43.
Ethernet MII transmit timing table
Value
Symbol
Parameter
Symbol
Unit
Min
84/101
Max
1
MII_TX_CLK high to
MII_TX_EN valid
tVAL(MII_TX_EN)
4.20
ns
2
MII_TX_CLK high to
MII_TX_EN invalid
Tinval(MII_TX_EN)
4.86
ns
3
MII_CRS valid to
MII_TX_CLK high
Tsu(MII_CRS)
0.61
ns
4
MII_TX_CLK high to
MII_CRS invalid
Th(MII_CRS)
0.00
ns
5
MII_COL valid to
MII_TX_CLK high
Tsu(MII_COL)
0.81
ns
STR91xFAx3x, STR91xFAx4x
Table 43.
Electrical characteristics
Ethernet MII transmit timing table
Value
Symbol
Parameter
Symbol
Unit
Min
Max
6
MII_TX_CLK high to
MII_COL invalid
Th(MII_COL)
7
MII_TX_CLK high to
MII_TXD valid
tVAL(MII_TXD)
5.02
ns
8
MII_TXCLK high to
MII_TXD invalid
Tinval(MII_TXD
5.02
ns
0.00
ns
Ethernet MII receive timings
Figure 28. Ethernet MII receive timing diagram
MII_RX_CLK
2
1
MII_RXD
MII_RX_DV
MII_RX_ER
Table 44.
Ethernet MII receive timing table
Value
Symbol
Parameter
Symbol
Unit
Min
7.12.2
Max
1
MII_RXD valid to
MII_RX_CLK high
Tsu(MII_RXD)
0.81
ns
2
MII_RX_CLK high to
MII_RXD invalid
Th(MII_RXD)
0.00
ns
USB electrical interface characteristics
USB 2.0 Compliant in Full Speed Mode
7.12.3
CAN interface electrical characteristics
Conforms to CAN 2.0B protocol specification
85/101
Electrical characteristics
7.12.4
STR91xFAx3x, STR91xFAx4x
I2C electrical characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Table 45.
I2C electrical characteristics
Standard I2C
Symbol
Fast I2C
Parameter
Unit
Min
Max
Min
Max
tBUF
Bus free time between a STOP
and START condition
4.7
1.3
ms
tHD:STA
Hold time START condition.
After this period, the first clock
pulse is generated(1)
4.0
0.6
µs
tLOW
LOW period of the SCL clock
4.7
1.3
µs
tHIGH
HIGH period of the SCL clock
4.0
0.6
µs
tSU:STA
Set-up time for a repeated
START condition
4.7
0.6
µs
tHD:DAT
Data hold time(2)
0
0
ns
tSU:DAT
Data set-up time
250
100
ns
tR
Rise time of both SDA and SCL
signals
1000
20+0.1Cb
300
ns
tF
Fall time of both SDA and SCL
signals
300
20+0.1Cb
300
ns
tSU:STO
Set-up time for STOP condition
Cb
Capacitive load for each bus
line
4.0
(3)
(3)
0.6
400
µs
400
pF
1. The maximum hold time of the START condition has only to be met if the interface does not stretch the low
period of SCL signal
2. The device must internally provide a hold time of at least 300 ns for the SDA signal in order to bridge the
undefined region of the falling edge of SCL.
3. Cb = total capacitance of one bus line in pF
86/101
STR91xFAx3x, STR91xFAx4x
SPI electrical characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Table 46.
SPI electrical characteristics
Value
Symbol
Parameter
Test Conditions
Unit
Typ
fSCLK
1/tc(SCLK)
tr(SCLK)
Max
Master
24
Slave
4
SPI clock frequency
MHz
SPI clock rise and fall times
50pF load
0.1
V/ns
tsu(SS)
SS setup time
Slave
1
th(SS)
SS hold time
Slave
1
SCLK high and low time
Master
Slave
1
tsu(MI)
tsu(SI)
Data input setup time
Master
Slave
TBD
5
th(MI)
th(SI)
Data input hold time
Master
Slave
TBD
6
ta(SO)
Data output access time
Slave
6
tdis(SO)
Data output disable time
Slave
6
tv(SO)
Data output valid time
6
th(SO)
Data output hold time
Slave (after enable
edge)
tv(MO)
Data output valid time
th(MO)
Data output hold time
tf(SCLK)
tw(SCLKH)
tw(SCLKL)
tPCLK
0
Master (before capture
edge)
0.25
0.25
Figure 29. SPI slave timing diagram with CPHA=0
NSS INPUT
tsu(NSS)
SCLK INPUT
7.12.5
Electrical characteristics
tc(SCLK)
th(NSS)
CPHA=0
CPOL=0
CPHA=0
CPOL=1
ta(SO)
MISO OUTPUT
tw(SCLKH)
tw(SCLKL)
MSB OUT
tsu(SI)
MOSI INPUT
tv(SO)
th(SO)
BIT6 OUT
tdis(SO)
tr(SCLK)
tf(SCLK)
LSB OUT
th(SI)
MSB IN
BIT1 IN
LSB IN
87/101
Electrical characteristics
STR91xFAx3x, STR91xFAx4x
Figure 30. SPI slave timing diagram with CPHA=1
NSS INPUT
SCLK INPUT
tsu(NSS)
tc(SCLK)
th(NSS)
CPHA=1
CPOL=0
CPHA=1
CPOL=1
tw(SCLKH)
tw(SCLKL)
ta(SO)
MISO OUTPUT
tv(SO)
MSB OUT
HZ
tsu(SI)
th(SO)
BIT6 OUT
LSB OUT
th(SI)
MSB IN
MOSI INPUT
tdis(SO)
tr(SCLK)
tf(SCLK)
BIT1 IN
LSB IN
Figure 31. SPI master timing diagram
NSS INPUT
tc(SCLK)
SCLK IOUTPUT
CPHA=0
CPOL=0
CPHA=0
CPOL=1
CPHA=1
CPOL=0
CPHA=1
CPOL=1
tw(SCLKH)
tw(SCLKL)
tsu(MI)
MISO INPUT
MOSI OUTPUT
88/101
th(MI)
MSB IN
tv(MO)
tr(SCLK)
tf(SCLK)
BIT6 IN
LSB IN
th(MO)
MSB OUT
BIT6 OUT
LSB OUT
STR91xFAx3x, STR91xFAx4x
7.13
Electrical characteristics
ADC electrical characteristics
VDDQ = 2.7 - 3.6V, VDD = 1.65 - 2V, TA = -40 / 85 °C unless otherwise specified.
Table 47.
General ADC electrical characteristics
Parameter(1)
Symbol
VAIN
Input Voltage Range
RES
Test
Conditions
Value
Unit
Min
Typ
0
Max
AVREF
V
Resolution
10
Bits
NCH
Number of Input Channels
8
N
fADC
ADC Clock Frequency
25
MHz
500
ms
1
ms
15
µs
tPOR(ADC) POR bit set to Standby mode
tck_off(ADC) ADC clock disabled before conversion (2)
tSTAB
Stabilization time
CIN
Input Capacitance
5
pF
ED
Differential Non-Linearity
(3) (4)
EL
Integral Non-Linearity
(3)
3
6
LSB(5)
EO
Offset Error
(3)
3
6
LSB(5)
EG
Gain Error
(3)
0.5
2
LSB(5)
ET
Total Unadjusted Error
(3)
4
6
LSB(5)
IADC
IVREF
Power Consumption
Current on VREF input pin
1
3
LSB(5)
4.6
(6) (7)
mA
920
µA
1. Guaranteed by design, not tested in production.
2. The ADC clock can be disabled by setting the ADC bit in the SCU_PCGR1 register or by setting the ACG bit in the
SCU_GPIOANA register (for Rev H and higher)
3. Conditions: AVSS = 0 V, AVDD = 3.3 V fADC = 25 MHz.
4. The A/D is monotonic, there are no missing codes.
5. 1 LSB = (AVDD - AVSS)/1024
6. Data based on characterization, not tested in production.
7. Conditions: VDD=1.8 V, fCPU=96 MHz , fADC=24 MHz
89/101
Electrical characteristics
Table 48.
Symbol
tCONV(S]
TR(S)
tCONV(C]
TR(C)
STR91xFAx3x, STR91xFAx4x
ADC conversion time (silicon Rev G)
Parameter(1) (2)
Value
Test
Conditions
Single mode conversion time
Unit
Min
3*16/fADC
1.33
2
fADC = 24 MHz
500
µs
ksps
1*16/fADC
µs
fADC = 24 MHz
0.66
µs
fADC = 24 MHz
1500
ksps
Continuous mode conversion time(4)
Continuous mode throughput rate
Max
2*16/fADC
fADC = 24 MHz
Single mode throughput rate (3)
Typ
1. Guaranteed by design, not tested in production.
2. Parameters in this table apply to devices with silicon Rev G. Refer to Table 5 for device rev identification in OTP memory
and to Section 8: Device marking.
3. Value obtained on conversions started by trigger in single mode
4. All sucessive conversions in continuous and scan modes.
Table 49.
Symbol
tCONV(S]
TR(S)
tCONV(C]
TR(C)
ADC conversion time (silicon Rev H and higher)
Parameter(1) (2)
Test
Conditions
Single mode conversion time
fADC = 24 MHz
Single mode throughput rate (3)
Value
Unit
Min
tCONV(FT]
Fast trigger mode conversion time(5)
TR(FT)
Fast trigger mode throughput rate(6)
Max
1*16/fADC
2*16/fADC
0.66
1.33
fADC = 24 MHz
750
µs
ksps
1*16/fADC
µs
fADC = 24 MHz
0.66
µs
fADC = 24 MHz
1500
ksps
1*16/fADC
µs
0.66
µs
Continuous mode conversion time(4)
Continuous mode throughput rate
Typ
fADC = 24 MHz
fADC = 24 MHz
100
1200
ksps
1. Guaranteed by design, not tested in production.
2. Parameters in this table apply to devices with silicon Rev H and higher. Refer to Table 5 for device rev identification in OTP
memory and to Section 8: Device marking.
3. Value obtained from conversions started by trigger in single mode
4. All successive conversions in continuous and scan modes.
5. Conversion started by trigger when automatic clock gated mode enabled. Fast trigger mode is available only in devices with
silicon Rev H and higher.
6. Value obtained from conversions started by fast trigger in single mode
90/101
STR91xFAx3x, STR91xFAx4x
Electrical characteristics
Figure 32. ADC conversion characteristics
Digital Result
EG
1023
1022
1LSB
1021
IDEAL
V
–V
DDA
SSA
= -----------------------------------------
1024
(2)
ET
(3)
7
(1)
6
5
4
EO
EL
3
ED
2
1 LSBIDEAL
1
0
1
AVSS
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
ET=Total Unadjusted Error: maximum deviation between the actual and the ideal
transfer curves.
EO=Offset Error: deviation between the
first actual transition and the first ideal
one.
EG=Gain Error: deviation between the last
ideal transition and the last actual one.
ED=Differential Linearity Error: maximum
deviation between actual steps and the
ideal one.
EL=Integral Linearity Error: maximum deviation between any actual transition and
the end point correlation line.
Vin
2
3
4
5
6
7
1021 1022 1023 1024
AVDD
91/101
Device marking
STR91xFAx3x, STR91xFAx4x
8
Device marking
8.1
STR91xFAx32 / STR91xFAx42 / STR91xFAx44
Figure 33. Device marking for revision G
LQFP80 and LQFP128 packages
Figure 34. Device marking for revision G
LFBGA144 packages
Figure 35. Device marking for revision H
LQFP80 and LQFP128 packages
Figure 36. Device marking for revision H
LFBGA144 packages
92/101
STR91xFAx3x, STR91xFAx4x
8.2
Device marking
STR91xFAx46 / STR91xFAx47
Figure 37. Device marking for revision A
LQFP80 and LQFP128 packages
Figure 38. Device marking for revision A
LFBGA144 packages
A
A
93/101
Package mechanical data
9
STR91xFAx3x, STR91xFAx4x
Package mechanical data
Figure 39. 80-Pin low profile quad flat package (LQFP80)
SEATING
PLANE
C
0.25 mm
GAGE PLANE
b
c
A1
A
A2
Min
ccc
C
k
D
A1
D1
L
D2
60
L1
Typ Max
A
Min
Typ
1.60
Max
0.0630
A1
0.05 0.10 0.15 0.0020 0.0039 0.0059
A2
1.35 1.40 1.45 0.0531 0.0551 0.0571
b
0.17 0.22 0.27 0.0067 0.0087 0.0106
c
0.09
D
13.80 14.00 14.20 0.5433 0.5512 0.5591
0.20 0.0035
0.0079
D1 11.90 12.00 12.10 04685 0.4724 0.4764
41
61
D2
40
E
9.50
0.3740
13.80 14.00 14.20 0.5433 0.5512 0.5591
E1 11.90 12.00 12.10 04685 0.4724 0.4764
b
E2
E1
E
E2
9.50
0.3740
e
0.50
0.0197
L
0.45 0.60 0.75 0.0177 0.0236 0.0295
L1
80
21
k
ddd
1
PIN 1
IDENTIFICATION
1.00
0d
0.039
7d
0d
0.08
7d
0.0031
20
Number of Pins
e
94/101
inches1)
mm
Dim.
N
80
1Values
in inches are converted from mm and rounded to 4 decimal
digits.
STR91xFAx3x, STR91xFAx4x
Package mechanical data
Figure 40. 128-Pin low profile quad flat package (LQFP128)
SEATING
PLANE
C
inches1]
mm
Dim.
0.25 mm
GAGE PLANE
b
c
A1
A
A2
Min
ccc
C
D
k
A1
D1
L
D3
96
L1
65
97
Typ Max
A
Min
Typ
Max
1.60
0.0630
0.15 0.0020
0.0059
A1
0.05
A2
1.35 1.40 1.45 0.0531 0.0551 0.0571
b
0.13 0.18 0.23 0.0051 0.0071 0.0091
c
0.09
D
15.80 16.00 16.20 0.6220 0.6299 0.6378
0.20 0.0035
0.0079
D1 13.80 14.00 14.20 0.5433 0.5512 0.5591
D3
64
E
b
12.40
0.4882
15.80 16.00 16.20 0.6220 0.6299 0.6378
E1 13.80 14.00 14.20 0.5433 0.5512 0.5591
E3
E1
E
E3
12.40
0.4882
e
0.40
0.0157
L
128
33
k
1
32
e
0.45 0.60 0.75 0.0177 0.0236 0.0295
L1
1.00
0d
ccc
3.5d
0.0394
7d
0d
3.5d
0.08
PIN 1
IDENTIFICATION
7d
0.0031
Number of Pins
N
128
1Values
in inches are converted from
mm and rounded to 4 decimal digits.
95/101
Package mechanical data
STR91xFAx3x, STR91xFAx4x
Figure 41. 144-ball low profile fine pitch ball grid array package (LFBGA144)
inches1)
mm
Dim.
Min
A
1.21
A1
0.21
A2
Typ
Max
Min
1.70
0.0476
Typ
Max
0.0669
0.0083
1.085
0.0427
b
0.35
0.40
D
9.85
10.00 10.15 0.3878 0.3937 0.3996
D1
E
0.45
0.0138 0.0157 0.0177
8.80
9.85
0.3465
10.00 10.15 0.3878 0.3937 0.3996
E1
8.80
0.3465
e
0.80
0.0315
F
0.60
0.0236
ddd
0.10
0.0039
eee
0.15
0.0059
fff
0.08
0.0031
Number of Pins
N
1
144
Values in inches are converted from mm and
rounded to 4 decimal digits.
Figure 42. Recommended PCB Design rules (0.80/0.75mm pitch BGA)
Dpad
0.37 mm
0.52 mm typ. (depends on solder
Dsm
mask registration tolerance
Solder paste 0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
Dpad
Dsm
96/101
STR91xFAx3x, STR91xFAx4x
9.1
Package mechanical data
Soldering information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label (JEDEC 020C).
ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com.
97/101
Package mechanical data
9.2
STR91xFAx3x, STR91xFAx4x
Thermal characteristics
The average chip-junction temperature, TJ must never exceed 125° C.
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the
following equation:
TJ = TA + (PD x ΘJA)(1)
Where:
–
TA is the Ambient Temperature in °C,
–
ΘJA is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,
–
PD is the sum of PINT and PI/O (PD = PINT + PI/O),
–
PINT is the product of IDD and VDD, expressed in Watts. This is the Chip
Internal Power.
PI/O represents the Power Dissipation on Input and Output Pins;
Most of the time for the applications PI/O < PINT and may be neglected. On the other hand,
PI/O may be significant if the device is configured to drive continuously external modules
and/or memories. The worst case PINT of the STR91xFA is 500mW (IDD x VDD, or 250mA x
2.0V).
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273°C) (2)
Therefore (solving equations 1 and 2):
K = PD x (TA + 273°C) + ΘJA x PD2(3)
where:
–
Table 50.
Symbol
98/101
K is a constant for the particular part, which may be determined from
equation (3) by measuring PD (at equilibrium) for a known TA. Using this
value of K, the values of PD and TJ may be obtained by solving
equations (1) and (2) iteratively for any value of TA.
Thermal characteristics
Parameter
Value
Unit
ΘJA
Thermal Resistance Junction-Ambient
LQFP 80 - 12 x 12 mm / 0.5 mm pitch
41.5
°C/W
ΘJA
Thermal Resistance Junction-Ambient
LQFP128 - 14 x 14 mm / 0.4 mm pitch
38
°C/W
ΘJA
Thermal Resistance Junction-Ambient
LFBGA 144 - 10 x 10 x 1.7mm
36.5
°C/W
STR91xFAx3x, STR91xFAx4x
10
Ordering information
Ordering information
Table 51.
Ordering information scheme
STR9
Example:
1
2
F
A
W
4
4
X
6
T
Family
ARM9 Microcontroller Family
Series
1 = STR9 Series 1
Feature set
0 = CAN, UART, IrDA, I2C, SSP
1 = USB, CAN, UART, IrDA, I2C, SSP
2 = USB, CAN, UART, IrDA, I2C, SSP, ETHERNET
Memory type
F = Flash
Revision at product level
A = Revison A
No. of pins
M = 80
W = 128
Z = 144
SRAM size
3 = 64K
4 = 96K
Primary Memory Size
2 = 256K
4 = 512K
6= 1024K
7= 2048K
Package
X = plastic LQFP
H = LFBGA
Temperature Range
6 = -40 to 85°C
Shipping Option
T = Tape & Reel Packing
For a list of available options (e.g. speed, package) or for further information on any aspect of this
device, please contact the ST Sales Office nearest to you.
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Revision history
11
STR91xFAx3x, STR91xFAx4x
Revision history
Table 52.
Document revision history
Date
Revision
09-May-2007
1
Initial release
2
Updated Standby current in Table 15: Supply current
characteristics on page 63
Added Section 7.1: Parameter conditions on page 57
Added Section 7.7.2: X1_CPU external clock source on page 66
Updated Section 7.11: External memory bus timings on page 75
Added Figure 14: LVD reset delay case 3 on page 62
Added Table 48 and Table 49 in ADC characteristics section
Added min/max values for E, D, E1, D1 in Figure 40 on page 95
3
Added 1MB and 2M devices, creating merged datasheet from
seperate STR91xFAx32, 42, 44, 46 and 47 devices.
Added STR912FAW32 to Table 3: STR912 device summary on
page 11
Added paragraph on voltage supply shutdown in Section 3.12 on
page 24
Removed DMA feature for I2C in Section 3.21 on page 33
Updated Sleep mode current in Table 10: Current characteristics
on page 59
Added Table 16: Typical current consumption at 25°C on page 64
Updated operating conditions for VDD and fCPUCLK in Section 7.3
on page 60 and Section 7.7 on page 65
Changed SPI master tSU and tH to TBD in Section Table 46. on
page 87
26-Nov-2007
14-May-2008
100/101
Changes
STR91xFAx3x, STR91xFAx4x
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