STTH3012 Ultrafast recovery - 1200 V diode Main product characteristics A IF(AV) 30 A VRRM 1200 V Tj 175° C VF (typ) 1.30 V trr (typ) 57 ns A K DO-247 STTH3012W Features and benefits ■ Ultrafast, soft recovery ■ Very low conduction and switching losses ■ High frequency and/or high pulsed current operation ■ High reverse voltage capability ■ High junction temperature K A K TO-220AC STTH3012D Description The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Order codes Part Number Marking STTH3012D STTH3012D STTH3012W STTH3012W Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. March 2006 Rev 1 1/9 www.st.com 9 Characteristics STTH3012 1 Characteristics Table 1. Absolute ratings (limiting values at 25° C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) RMS forward current IF(AV) Average forward current, δ = 0.5 IFRM Repetitive peak forward current IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal Tstg Storage temperature range Tj Table 2. IR(1) 1200 V 50 A 30 A 300 A 210 A -65 to + 175 °C 175 °C Tc = 105° C tp = 5 µs, F = 5 kHz square Thermal parameters Parameter Junction to case Rth(j-c) Symbol Unit Maximum operating junction temperature Symbol Table 3. Value Value Unit 0.95 °C/W Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Min. Typ VF(2) Forward voltage drop µA 15 IF = 25 A 1.25 1.9 1.20 1.8 V Tj = 25° C 2.25 IF = 30 A Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 1.60 x IF(AV) + 0.012 IF2(RMS) 2/9 150 2.1 Tj = 150° C Tj = 125° C Unit 20 VR = VRRM Tj = 25° C Tj = 125° C Max. 1.35 2.05 1.30 1.95 STTH3012 Characteristics Table 4. Dynamic characteristics Symbol Parameter trr Test conditions Min. Typ Max. IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C Reverse recovery time Unit 115 ns IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25° C 57 80 Reverse recovery current IF = 30 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C 25 35 A S Softness factor IF = 30 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C 1.5 tfr Forward recovery time dIF/dt = 100 A/µs IF = 30 A VFR = 1.5 x VFmax, Tj = 25° C 550 ns Forward recovery voltage IF = 30 A, dIF/dt = 100 A/µs, Tj = 25° C IRM VFP Figure 1. Conduction losses versus average current Figure 2. P(W) 6 V Forward voltage drop versus forward current IFM(A) 80 120 δ = 0.2 70 δ = 0.5 110 100 δ = 0.1 60 Tj=150°C (typical values) 90 δ = 0.05 50 80 δ=1 70 40 Tj= 25°C (maximum values) 60 50 30 40 20 Tj=150°C (maximum values) 30 T 20 10 IF(AV)(A) δ=tp/T 0 0 5 10 15 20 25 30 10 tp VFM(V) 0 35 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 3/9 Characteristics Figure 3. STTH3012 Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Peak reverse recovery current versus dIF/dt (typical values) IRM(A) Zth(j-c)/Rth(j-c) 1.0 60 0.9 55 VR=600V Tj=125°C 50 0.8 45 0.7 IF=2 x IF(AV) 40 IF=IF(AV) 0.6 35 0.5 30 0.4 25 20 Single pulse 0.3 IF=0.5 x IF(AV) 15 0.2 10 0.1 5 tp(s) 0.0 dIF/dt(A/µs) 0 1.E-03 1.E-02 Figure 5. 1.E-01 1.E+00 Reverse recovery time versus dIF/dt (typical values) 0 50 Figure 6. 100 150 200 250 300 350 400 450 500 Reverse recovery charges versus dIF/dt (typical values) Qrr(µC) trr(ns) 8 800 VR=600V Tj=125°C VR=600V Tj=125°C 7 IF=2 x IF(AV) 700 6 IF=2 x IF(AV) 600 5 IF=IF(AV) IF=IF(AV) 4 500 IF=0.5 x IF(AV) IF=0.5 x IF(AV) 3 400 2 300 1 dIF/dt(A/µs) dIF/dt(A/µs) 200 0 50 Figure 7. 100 150 200 250 300 0 350 400 450 500 Softness factor versus dIF/dt (typical values) 0 50 Figure 8. S factor 100 150 200 250 300 350 400 450 500 Relative variations of dynamic parameters versus junction temperature 2.00 3.0 IF ≤ 2xIF(AV) VR=600V Tj=125°C 2.5 1.75 IF=IF(AV) VR=600V Reference: Tj=125°C S factor 1.50 1.25 2.0 1.00 trr 0.75 1.5 IRM 0.50 1.0 QRR 0.25 Tj(°C) dIF/dt(A/µs) 0.5 25 0 4/9 0.00 50 100 150 200 250 300 350 400 450 500 50 75 100 125 STTH3012 Figure 9. Characteristics Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) tfr(ns) VFP(V) 1100 30 IF=IF(AV) Tj=125°C IF=IF(AV) VFR=1.5 x VF max. Tj=125°C 1000 25 900 20 800 700 15 600 10 500 400 5 300 dIF/dt(A/µs) 0 dIF/dt(A/µs) 200 0 100 200 300 400 500 0 100 200 300 400 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C 100 VR(V) 10 1 10 100 1000 5/9 Package information 2 STTH3012 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC) Recommended torque value: 0.80 Nm (DO-247) Maximum torque value: 0.7 Nm (TO-220AC) Maximum torque value: 1.0 Nm (DO-247) Table 5. DO-247 dimensions DIMENSIONS REF. Millimeters Inches Min. Max Min. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 V Dia V F2 A H F3 2.00 2.00 G L5 L L2 L4 F2 L3 F G M E 0.094 0.429 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.169 0.145 18.50 14.20 0.728 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. 6/9 0.078 H L3 D V2 2.40 10.90 L2 L1 F3 0.078 3.55 3.65 0.139 0.143 STTH3012 Package information Table 6. T0-220AC dimensions DIMENSIONS REF. A H2 ØI C L5 L7 L6 L2 F1 Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 D L9 L2 L4 F M E G Millimeters 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information 3 4 8/9 STTH3012 Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH3012D STTH3012D TO-220AC 1.86 g 50 Tube STTH3012W STTH3012W DO-247 4.4 g 30 Tube Revision history Date Revision 02-Mar-2006 1 Description of Changes First issue. STTH3012 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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