STD95N2LH5 STU95N2LH5 N-channel 25 V - 0.0038 Ω - 80 A - DPAK - IPAK STripFET™ V Power MOSFET Features Type VDSS RDS(on) ID STD95N2LH5 25 V <0.0045 Ω 80 A STU95N2LH5 25 V <0.0049 Ω 80 A 3 3 ■ RDS(on) * Qg industry benchmark ■ Extremely low on-resistance RDS(on) ■ High avalanche ruggedness ■ Low gate drive power losses 2 1 1 DPAK IPAK Application Switching applications Figure 1. Description Internal schematic diagram This product utilizes the 5th generation of design rules of ST’s proprietary STripFET™ technology. The lowest available RDS(on)*Qg, in the standard packages, makes this device suitable for the most demanding DC-DC converter applications, where high power density is to be achieved. Table 1. Device summary Order codes Marking Package Packaging STD95N2LH5 95N2LH5 DPAK Tape and reel STU95N2LH5 95N2LH5 IPAK Tube February 2008 Rev 2 1/15 www.st.com 15 Contents STD95N2LH5 - STU95N2LH5 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2/15 ................................................ 8 STD95N2LH5 - STU95N2LH5 1 Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit 25 V ± 20 V VDS Drain-source voltage (VGS=0) VGS Gate-Source voltage ID (1) Drain current (continuous) at TC = 25°C 80 A ID Drain current (continuous) at TC = 100°C 67 A IDM (2) Drain current (pulsed) 320 A PTOT Total dissipation at TC = 25°C 70 W Derating factor 0.47 W/°C EAS (3) Single pulse avalanche energy 165 mJ Tj Operating junction temperature Storage temperature -55 to 175 °C Tstg 1. Limited by wire bonding 2. Pulse width limited by safe operating area 3. Starting Tj = 25°C, Id = 40 A, Vdd = 20 V Table 3. Symbol Thermal resistance Parameter Value Unit Rthj-case Thermal resistance junction-case max 2.14 °C/W Rthj-amb Thermal resistance junction-case max 100 °C/W Maximum lead temperature for soldering purpose 275 °C Tj 3/15 Electrical characteristics 2 STD95N2LH5 - STU95N2LH5 Electrical characteristics (TCASE=25°C unless otherwise specified) Table 4. Symbol V(BR)DSS Static Parameter Drain-source breakdown Voltage Test conditions ID = 250 µA, VGS= 0 Zero gate voltage drain current (VGS = 0) IGSS Gate body leakage current (VDS = 0) VGS = ± 20 V Gate threshold voltage VDS= VGS, ID = 250 µA VGS= 5 V, ID= 40 A SMD version VGS= 5 V, ID= 40 A Table 5. Symbol Ciss Coss Crss Qg Qgs Qgd Qgs1 Qgs2 RG 4/15 1 10 µA µA ±100 nA 1 VGS= 10 V, ID= 40 A Unit V VDS = 25 V,Tc = 125°C SMD version Static drain-source on resistance Max. 25 VGS= 10 V, ID= 40 A RDS(on) Typ. VDS = 25 V IDSS VGS(th) Min. V 0.0038 0.0045 Ω 0.0044 0.0049 Ω 0.005 0.006 Ω 0.006 0.007 Ω Typ. Max. Unit Dynamic Parameter Test conditions Input capacitance Output capacitance Reverse transfer capacitance VDS =25 V, f=1 MHz, VGS=0 Total gate charge Gate-source charge Gate-drain charge VGS =5 V Pre Vth gate-to-source charge Post Vth gate-to-source charge Gate input resistance VDD=13 V, ID = 80 A (see Figure 16) VDD=13 V, ID = 80 A (see Figure 19) f=1 MHz gate bias Bias= 0 test signal level=20 mV open drain Min 1817 420 67 pF pF pF 13.4 6.7 4.1 nC nC nC 3.5 nC 3.2 nC 1.1 Ω STD95N2LH5 - STU95N2LH5 Table 6. Symbol td(on) tr td(off) tf Table 7. Symbol ISD ISDM (1) VSD(2) trr Qrr IRRM Electrical characteristics Switching on/off (inductive load) Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test conditions Min. VDD=12.5 V, ID= 40 A, RG= 4.7 Ω, VGS= 10 V (see Figure 15) VDD=12.5 V, ID= 40 A, RG= 4.7 Ω, VGS= 10 V (see Figure 15) Typ. Max. Unit 7 38 ns ns 22 7 ns ns Source drain diode Parameter Test conditions Min. Typ. Source-drain current Source-drain current (pulsed) Forward on voltage ISD= 35 A, VGS=0 Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 80 A, VDD= 20 V di/dt =100 A/µs, (see Figure 17) 32.4 27.1 1.7 Max. Unit 80 320 A A 1.1 V ns nC A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration = 300 µs, duty cycle 1.5% 5/15 Electrical characteristics STD95N2LH5 - STU95N2LH5 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance Figure 4. Output characteristics Figure 5. Transfer characteristics Figure 6. Normalized BVDSS vs temperature Figure 7. Static drain-source on resistance 6/15 STD95N2LH5 - STU95N2LH5 Figure 8. Electrical characteristics Gate charge vs gate-source voltage Figure 9. Figure 10. Normalized gate threshold voltage vs temperature Capacitance variations Figure 11. Normalized on resistance vs temperature Figure 12. Source-drain diode forward characteristics 7/15 Test circuit 3 STD95N2LH5 - STU95N2LH5 Test circuit Figure 13. Unclamped inductive load test circuit Figure 14. Unclamped inductive waveform Figure 15. Switching times test circuit for resistive load Figure 16. Gate charge test circuit Figure 17. Test circuit for inductive load Figure 18. Switching time waveform switching and diode recovery times 8/15 STD95N2LH5 - STU95N2LH5 Test circuit Figure 19. Gate charge waveform Id Vds Vgs Vgs(th) Qgs1 Qgs2 Qgd 9/15 Package mechanical data 4 STD95N2LH5 - STU95N2LH5 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/15 STD95N2LH5 - STU95N2LH5 Package mechanical data DPAK MECHANICAL DATA mm. inch DIM. MIN. A A1 A2 B b4 C C2 D D1 E E1 e e1 H L (L1) L2 L4 R V2 TYP 2.2 0.9 0.03 0.64 5.2 0.45 0.48 6 MAX. MIN. 2.4 1.1 0.23 0.9 5.4 0.6 0.6 6.2 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 6.6 0.252 5.1 6.4 0.260 0.173 0.368 0.039 2.8 0.8 0.181 0.397 0.110 0.031 1 0.023 0.2 0° 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.185 0.090 4.6 10.1 0.6 MAX. 0.200 4.7 2.28 4.4 9.35 1 TYP. 0.039 0.008 8° 0° 8° 0068772-F 11/15 Package mechanical data STD95N2LH5 - STU95N2LH5 TO-251 (IPAK) MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. MIN. 2.4 0.086 TYP. MAX. A 2.2 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051 B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.094 0.85 B5 0.033 0.3 0.012 B6 0.95 0.037 C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023 D 6 6.2 0.236 0.244 E 6.4 6.6 0.252 0.260 G 4.4 4.6 0.173 0.181 H 15.9 16.3 0.626 0.641 L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039 A1 C2 A3 A C H B B3 = 1 = 2 G = = = E B2 = 3 B5 L D B6 L2 L1 0068771-E 12/15 STD95N2LH5 - STU95N2LH5 5 Packaging mechanical data Packaging mechanical data DPAK FOOTPRINT All dimensions are in millimeters TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 16.4 N 50 T TAPE MECHANICAL DATA DIM. mm MIN. inch MAX. MIN. 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 12.1 0.476 1.6 0.059 0.063 1.85 0.065 0.073 D 1.5 D1 1.5 E 1.65 MIN. MAX. 330 12.992 13.2 0.504 0.520 0.059 0.795 18.4 0.645 0.724 1.968 22.4 0.881 BASE QTY BULK QTY 2500 2500 MAX. A0 B1 inch MAX. 0.059 F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 R 40 W 15.7 0.075 0.082 1.574 16.3 0.618 0.641 13/15 Revision history 6 STD95N2LH5 - STU95N2LH5 Revision history 29- Table 8. 14/15 Document revision history Date Revision Changes 16-Oct-2007 1 First release 20-Feb-2008 2 Modified Table 4.: Static STD95N2LH5 - STU95N2LH5 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 15/15