STMICROELECTRONICS TDA7563BPD

TDA7563B
4 x 50W multifunction quad power amplifier
with built-in diagnostics feature
Features
■
Multipower BCD technology
■
MOSFET output power stage
■
DMOS power output
■
New Hi-efficiency (class SB)
■
High output power capability 4x28W/4Ω @
14.4V, 1KHZ, 10% THD, 4x50W max, power
■
Max. output power 4x72W/2Ω
■
Flexiwatt27
(Horizontal)
Flexiwatt27
(Vertical)
Description
2
Full I C bus driving:
– St-by
– Independent front/rear soft play/mute
– Selectable gain 30dB /16dB (for low noise
line output function)
– High efficiency enable/disable
– I2C bus digital diagnostics (including DC
bus AC load detection)
■
Full fault protection
■
DC offset detection
■
Four independent short circuit protection
■
Clipping detector pin with selectable threshold
(2%/10%)
■
St-by/mute pin
■
Linear thermal shutdown with multiple thermal
warning
■
ESD protection
Table 1.
PowerSO36
The TDA7563B is a new BCD technology quad
bridge type of car radio amplifier in Flexiwatt27
package specially intended for car radio
applications.
Thanks to the DMOS output stage the TDA7563B
has a very low distortion allowing a clear powerful
sound. Among the features, its superior efficiency
performance coming from the internal exclusive
structure, makes it the most suitable device to
simplify the thermal management in high power
sets.
The dissipated output power under average
listening condition is in fact reduced up to 50%
when compared to the level provided by
conventional class AB solutions.
This device is equipped with a full diagnostics
array that communicates the status of each
speaker through the I2C bus.
Device summary
Order code
Package
Packing
TDA7563B
Flexiwatt27 (vertical)
Tube
TDA7563BH
Flexiwatt27 (horizontal)
Tube
TDA7563BPD
PowerSO36
Tube
TDA7563BPDTR
PowerSO36
Tape and reel
December 2007
Rev 2
1/33
www.st.com
1
Contents
TDA7563B
Contents
1
Block diagram and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4
5
3.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Diagnostics functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1
Turn-on diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.2
Permanent diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.3
Output DC offset detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.4
AC diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Multiple faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.1
6
Thermal protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.1
7
Faults availability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Fast muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.1
I2C Programming/reading sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.2
I2C Bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.2.1
Data validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.2.2
Start and stop conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.2.3
Byte format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.2.4
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8
Software specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9
Examples of bytes sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2/33
TDA7563B
Contents
10
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3/33
List of tables
TDA7563B
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
4/33
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Double fault table for turn on diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
IB1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
IB2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DB1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DB2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
DB3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
DB4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
TDA7563B
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pins connection diagram of the Flexiwatt27 (top of view). . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pins connection diagram of the PowerSO36 slug up (top of view) . . . . . . . . . . . . . . . . . . . . 7
Quiescent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Output power vs. supply voltage (4W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Output power vs. supply voltage (2W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. output power (4W, STD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. output power (4Ω, HI-EFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Distortion vs. output power (2Ω, STD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Distortion vs. frequency (4W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Distortion vs. frequency (2W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Crosstalk vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Supply voltage rejection vs. freq. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Power dissipation and efficiency vs. output power (4W, STD, SINE) . . . . . . . . . . . . . . . . . 13
Power dissipation and efficiency vs. output power (4W, HI-EFF, SINE). . . . . . . . . . . . . . . 13
Power dissipation vs. average ouput power (audio program simulation, 4W) . . . . . . . . . . 13
Power dissipation vs. average ouput power (audio program simulation, 2W) . . . . . . . . . . 13
Turn - on diagnostic: working principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SVR and output behaviour (Case 1: without turn-on diagnostic) . . . . . . . . . . . . . . . . . . . . 14
SVR and output pin behaviour (Case 2: with turn-on diagnostic) . . . . . . . . . . . . . . . . . . . . 15
Short circuit detection thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Load detection thresholds - high gain setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Load detection threshold - low gain setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Restart timing without Diagnostic Enable (Permanent) . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Restart timing with Diagnostic Enable (Permanent) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Current detection: Load impedance |Z| vs. output peak voltage. . . . . . . . . . . . . . . . . . . . . 18
Thermal foldback diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Data validity on the I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Timing diagram on the I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Acknowledge on the I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Flexiwatt27 (horizontal) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . 29
Flexiwatt27 (vertical) mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . 30
PowerSO36 (slug up) mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . 31
5/33
Block diagram and application circuit
1
TDA7563B
Block diagram and application circuit
Figure 1.
Block diagram
CLK
DATA
VCC1
VCC2
ST-BY/MUTE
Thermal
Protection
& Dump
I2CBUS
Mute1 Mute2
IN RF
Reference
CD_OUT
Clip
Detector
F
OUT RF+
16/30dB
IN RR
Short Circuit
Protection &
Diagnostic
R
OUT RFOUT RR+
16/30dB
IN LF
OUT RR-
Short Circuit
Protection &
Diagnostic
F
OUT LF+
16/30dB
IN LR
OUT LF-
Short Circuit
Protection &
Diagnostic
R
OUT LR+
16/30dB
Short Circuit
Protection &
Diagnostic
AC_GND
SVR
RF RR
OUT LR-
S_GND
TAB
LF LR
PW_GND
Figure 2.
Application circuit
C8
0.1μF
C7
3300μF
Vcc1
V(4V .. VCC)
7
2
DATA
26
CLK
23
Vcc2
21
18
+
19
20
I2C BUS
22
OUT RF
+
25
C1 0.22μF
IN RF
16
24
10
C2 0.22μF
IN RR
+
9
15
8
C3 0.22μF
IN LF
OUT RR
6
12
OUT LF
+
3
C4 0.22μF
IN LR
4
13
S-GND
14
17
11
5
1, 27
OUT LR
TAB
47K
C5
1μF
C6
10μF
V
D00AU1231A
CD OUT
6/33
TDA7563B
2
Pins description
Pins description
Figure 3.
Pins connection diagram of the Flexiwatt27 (top of view)
27
TAB
27
TAB
26
DATA
26
DATA
25
PW_GND RR
25
PW_GND RR
24
OUT RR-
24
OUT RR-
23
CK
23
CK
22
OUT RR+
22
OUT RR+
21
VCC2
21
VCC2
20
OUT RF-
20
OUT RF-
19
PW_GND RF
19
PW_GND RF
18
OUT RF+
18
OUT RF+
17
AC GND
17
AC GND
16
IN RF
16
IN RF
15
IN RR
15
IN RR
14
S_GND
14
S_GND
IN LR
13
IN LR
12
IN LF
12
IN LF
11
SVR
11
SVR
10
OUT LF+
10
OUT LF+
13
9
PW_GND LF
9
PW_GND LF
8
OUT LF-
8
OUT LF-
7
VCC1
7
VCC1
6
OUT LR+
6
OUT LR+
5
CD-OUT
5
CD-OUT
4
OUT LR-
4
OUT LR-
3
PW_GND LR
3
PW_GND LR
2
STBY
2
STBY
1
TAB
1
TAB
D00AU1416
D00AU1230
Flexiwatt27 (vertical)
Figure 4.
Flexiwatt27 (horizontal)
Pins connection diagram of the PowerSO36 slug up (top of view)
VCC
36
1
TAB
OUT3-
35
2
CK
N.C.
34
3
N.C.
N.C.
33
4
OUT4+
PWGND
32
5
N.C.
OUT3+
31
6
PWGND
ACGND
30
7
VCC
IN3
29
8
DATA
IN4
28
9
OUT4-
SGND
27
10
OUT2-
IN2
26
11
STBY
IN1
25
12
VCC
SVR
24
13
PWGND
OUT1+
23
14
N.C.
PWGND
22
15
OUT2+
N.C.
21
16
N.C.
OUT1-
20
17
N.C.
VCC
19
18
CD
D04AU1547A
7/33
Electrical specifications
TDA7563B
3
Electrical specifications
3.1
Absolute maximum ratings
Table 2.
Absolute maximum ratings
Symbol
Unit
Operating supply voltage
18
V
VS
DC supply voltage
28
V
Vpeak
Peak supply voltage (for t = 50ms)
50
V
VCK
CK pin voltage
6
V
Data pin voltage
6
V
IO
Output peak current (not repetitive t = 100ms)
8
A
IO
Output peak current (repetitive f > 10Hz)
6
A
Power dissipation Tcase = 70°C
85
W
-55 to 150
°C
PowerSO Flexiwatt
Unit
Ptot
Tstg, Tj
Storage and junction temperature
Thermal data
Table 3.
Thermal data
Symbol
Rth j-case
3.3
Value
Vop
VDATA
3.2
Parameter
Parameter
Thermal resistance junction to case
1
Max.
1
°C/W
Electrical characteristics
Refer to the test circuit, VS = 14.4V; RL = 4Ω; f = 1KHz; GV = 30dB; Tamb = 25°C; unless
otherwise specified.
Table 4.
Electrical characteristics
Symbol
Parameter
Test condition
Min.
Typ.
Max.
Unit
18
V
300
mA
Power amplifier
VS
Supply voltage range
Id
Total quiescent drain current
8
170
Max. power (VS = 15.2V, square
wave input (2Vrms))
PO
8/33
Output power
THD = 10%
THD = 1%
25
20
50
W
28
22
W
W
TDA7563B
Table 4.
Electrical specifications
Electrical characteristics (continued)
Symbol
PO
THD
Parameter
Output power
Total harmonic distortion
CT
Cross talk
RIN
Input impedance
GV1
Voltage gain 1
ΔGV1
GV2
Test condition
RL = 2Ω; EIAJ (VS = 13.7V)
RL = 2Ω; THD 10%
RL = 2Ω; THD 1%
RL = 2Ω; MAX POWER
Min.
Typ.
55
40
32
60
68
50
40
75
Max.
Unit
W
W
W
W
PO = 1W to 10W; STD MODE
HE MODE; PO = 1.5W
HE MODE; PO = 8W
0.03
0.02
0.15
0.1
0.1
0.5
%
%
%
PO = 1-10W, f = 10kHz
0.2
0.5
%
GV = 16dB; STD Mode
VO = 0.1 to 5VRMS
0.02
0.05
%
f = 1KHz to 10KHz, Rg = 600Ω
Voltage gain match 1
50
60
60
100
130
KΩ
29.5
30
30.5
dB
1
dB
16.5
dB
1
dB
-1
Voltage gain 2
15.5
16
dB
ΔGV2
Voltage gain match 2
EIN1
Output noise voltage 1
Rg = 600Ω 20Hz to 22kHz
50
100
µV
EIN2
Output noise voltage 2
Rg = 600Ω; GV = 16dB
20Hz to 22kHz
15
30
µV
SVR
Supply voltage rejection
f = 100Hz to 10kHz; Vr = 1Vpk;
Rg = 600Ω
BW
Power bandwidth
100
ASB
Stand-by attenuation
90
ISB
Stand-by current
AM
Mute attenuation
VOS
Offset voltage
VAM
Min. supply mute threshold
TON
Turn on delay
TOFF
Turn off delay
VSBY
St-by/mute pin for st-by
VMU
St-by/mute pin for mute
CMRR
Input CMRR
VOP
St-by/mute pin for operating
IMU
St-by/mute pin current
-1
50
Vst-by = 0
60
dB
KHz
110
1
dB
10
µA
80
100
-100
0
100
mV
7
7.5
8
V
D2/D1 (IB1) 0 to 1
5
20
ms
D2/D1 (IB1) 1 to 0
5
20
ms
0
1.5
V
3.5
5
V
Mute & Play
VCM = 1Vpk-pk; Rg = 0 Ω
dB
55
7
dB
VS
V
Vst-by/mute = 8.5V
20
40
µA
Vst-by/mute < 1.5V
0
5
µA
0
5
µA
300
mV
CDLK
Clip det high leakage current
CD off / VCD = 6V
CDSAT
Clip det sat. voltage
CD on; ICD = 1mA
9/33
Electrical specifications
Table 4.
Symbol
CDTHD
TDA7563B
Electrical characteristics (continued)
Parameter
Test condition
Min.
Typ.
Max.
Unit
D0 (IB1) = 1
5
10
15
%
D0 (IB1) = 0
1
2
3
%
1.2
V
Clip det THD level
Turn on diagnostics 1 (Power amplifier mode)
Pgnd
Short to GND det. (below this
limit, the Output is considered in
short circuit to GND)
Pvs
Short to Vs det. (above this limit,
the output isconsidered in short
circuit to Vs)
Pnop
Vs -1.2
Power amplifier in st-by
Normal operation thresholds.
(Within these limits, the output is
considered without faults).
1.8
Lsc
Shorted load det.
Lop
Open load det.
130
Lnop
Normal load det.
1.5
V
Vs -1.8
V
0.5
Ω
Ω
70
Ω
1.2
V
Turn on diagnostics 2 (Line driver mode)
Pgnd
Short to GND det. (below this
limit, the output is considered in
short circuit to GND)
Pvs
Short to Vs det. (above this limit,
the output isconsidered in short
circuit to Vs)
Vs -1.2
Pnop
Normal operation thresholds.
(Within these limits, the output is
considered without faults).
1.8
Power amplifier in st-by
Lsc
Shorted Load det.
Lop
Open Load det.
400
Lnop
Normal Load det.
4.5
V
Vs -1.8
V
1.5
Ω
Ω
200
Ω
1.2
V
Permanent diagnostics 2 (Power amplifier mode or line driver mode)
Pgnd
Pvs
Pnop
LSC
10/33
Short to GND det. (below this
limit, the Output is considered in
short circuit to GND)
Short to Vs det. (above this limit, Power amplifier in mute or play,
the output is considered in short one or more short circuits
circuit to Vs)
protection activated
Normal operation thresholds.
(Within these limits, the output is
considered without faults).
Vs -1.2
1.8
V
Vs -1.8
V
Power amplifier mode
0.5
Ω
Line driver mode
1.5
Ω
Shorted load Det.
TDA7563B
Table 4.
Electrical specifications
Electrical characteristics (continued)
Symbol
Parameter
Test condition
Power amplifier in play,
AC input signals = 0
VO
Offset detection
INL
Normal load current detection
IOL
Open load current detection
Min.
Typ.
Max.
Unit
±1.5
±2
±2.5
V
500
mA
VO < (VS-5)pk
250
mA
I2C Bus interface
SCL
Clock frequency
400
KHz
VIL
Input low voltage
1.5
V
VIH
Input high voltage
2.3
3.4
Electrical characteristics curves
Figure 5.
Quiescent current vs. supply voltage
Figure 6.
Id (mA)
V
Output power vs. supply voltage (4Ω)
Po (W)
250
70
65
230
210
Po-max
60
Vin = 0
NO LOADS
RL = 4 Ohm
f = 1 KHz
55
50
190
THD = 10 %
45
170
40
150
35
30
130
25
110
20
90
15
THD = 1 %
10
70
8
10
12
14
16
18
Vs (V)
Figure 7.
5
8
9
Output power vs. supply voltage (2Ω) Figure 8.
Po (W)
100
10
12
13
Vs (V)
14
15
16
17
18
Distortion vs. output power (4Ω, STD)
STANDARD MODE
Vs = 14.4 V
RL = 4 Ohm
Po-max
RL = 2 Ohm
f = 1 KHz
70
11
THD (%)
90
80
10
1
THD = 10 %
60
f = 10 KHz
50
40
0.1
30
f = 1 KHz
THD = 1 %
20
10
8
9
10
11
12
Vs (V)
13
14
15
16
0.01
0.1
1
10
Po (W)
11/33
Electrical specifications
Figure 9.
10
TDA7563B
Distortion vs. output power (4Ω, HI- Figure 10. Distortion vs. output power (2Ω,
EFF)
STD)
THD (%)
THD (%)
10
HI-EFF MODE
Vs = 14.4 V
RL = 4 Ohm
1
HI-EFF MODE
Vs = 14.4 V
RL = 2 Ohm
1
f = 10 KHz
f = 10 KHz
0.1
f = 1 KHz
0.1
f = 1 KHz
0.01
0.001
0.1
1
0.01
0.1
10
Po (W)
Figure 12. Distortion vs. frequency (2Ω)
THD (%)
THD (%)
10
10
STANDARD MODE
Vs = 14.4 V
RL = 4 Ohm
Po = 4 W
1
0.1
100
f (Hz)
1000
10000
Figure 13. Crosstalk vs. frequency
0.01
10
90
80
80
70
70
60
1000
10000
60
STANDARD MODE
RL = 4 Ohm
Po = 4 W
Rg = 600 Ohm
50
40
30
STD & HE MODE
Rg = 600 Ohm
Vripple = 1 Vpk
30
100
1000
f (Hz)
12/33
f (Hz)
SVR (dB)
CROSSTALK (dB)
20
10
100
Figure 14. Supply voltage rejection vs. freq.
90
40
STANDARD MODE
Vs = 14.4 V
RL = 2 Ohm
Po = 4 W
0.1
0.01
10
50
10
Po (W)
Figure 11. Distortion vs. frequency (4Ω)
1
1
10000
20
10
100
f (Hz)
1000
10000
TDA7563B
Electrical specifications
Figure 15. Power dissipation and efficiency vs. Figure 16. Power dissipation and efficiency vs.
output power (4Ω, STD, SINE)
output power (4W, HI-EFF, SINE)
n (%)
Ptot (W)
90
n
STANDARD MODE
Vs = 14.4 V
RL = 4 x 4 Ohm
f = 1 KHz SINE
80
90
80
80
70
70
60
60
60
50
50
50
70
n (%)
Ptot (W)
90
90
HI-EFF MODE
Vs = 14.4 V
RL = 4 x 4 Ohm
f = 1 KHz SINE
80
n
70
60
50
Ptot
40
40
40
30
30
30
30
20
20
20
20
10
10
10
10
40
Ptot
0
0
2
4
6
8
0
10 12 14 16 18 20 22 24 26 28 30
Po (W)
0
0
0.1
1
10
Po (W)
Figure 17. Power dissipation vs. average ouput Figure 18. Power dissipation vs. average ouput
power (audio program simulation,
power (audio program simulation,
4Ω)
2Ω)
Ptot (W)
Ptot (W )
45
90
40
35
80
STD MODE
Vs = 14 V
RL = 4 x 4 Ohm
GAUSSIAN NOISE
Vs = 14 V
RL = 4 x 2 Ohm
GAUSSIAN NOISE
70
STD MODE
60
30
CLIP
START
25
50
HI-EFF MODE
20
CLIP
START
40
15
30
10
20
5
10
HI-EFF MODE
0
0
0
1
2
3
Po (W)
4
5
0
1
2
3
4
5
Po (W )
6
7
8
9
13/33
Diagnostics functional description
TDA7563B
4
Diagnostics functional description
4.1
Turn-on diagnostic
It is activated at the turn-on (stand-by out) under I2Cbus request. Detectable output faults
are:
●
SHORT TO GND
●
SHORT TO Vs
●
SHORT ACROSS THE SPEAKER
●
OPEN SPEAKER
To verify if any of the above misconnections are in place, a subsonic (inaudible) current
pulse (fig. 19) is internally generated, sent through the speaker(s) and sunk back.The Turn
On diagnostic status is internally stored until a successive diagnostic pulse is requested
(after a I2C reading).
If the "stand-by out" and "diag. enable" commands are both given through a single
programming step, the pulse takes place first (power stage still in stand-by mode, low,
outputs= high impedance).
Afterwards, when the Amplifier is biased, the PERMANENT diagnostic takes place. The
previous Turn On state is kept until a short appears at the outputs.
Figure 19. Turn - on diagnostic: working principle
Vs~5V
Isource
I (mA)
Isource
CH+
Isink
CHIsink
~100mS
t (ms)
Measure time
Figure 20 and 21 show SVR and OUTPUT waveforms at the turn-on (stand-by out) with and
without turn-on diagnostic.
Figure 20. SVR and output behaviour (Case 1: without turn-on diagnostic)
Vsvr
Out
Permanent diagnostic
acquisition time (100mS Typ)
Bias (power amp turn-on)
I2CB DATA
14/33
Diagnostic Enable
(Permanent)
t
FAULT
event
Permanent Diagnostics data (output)
permitted time
Read Data
TDA7563B
Diagnostics functional description
Figure 21. SVR and output pin behaviour (Case 2: with turn-on diagnostic)
Vsvr
Out
Turn-on diagnostic
acquisition time (100mS Typ)
Permanent diagnostic
acquisition time (100mS Typ)
Turn-on Diagnostics data (output)
permitted time
Diagnostic Enable
(Turn-on)
Bias (power amp turn-on)
permitted time
FAULT
event
Diagnostic Enable
(Permanent)
Read Data
t
Permanent Diagnostics data (output)
permitted time
I2CB DATA
The information related to the outputs status is read and memorized at the end of the
current pulse top. The acquisition time is 100 ms (typ.). No audible noise is generated in the
process. As for SHORT TO GND / Vs the fault-detection thresholds remain unchanged from
30 dB to 16 dB gain setting. They are as follows: TDA7563B
Figure 22. Short circuit detection thresholds
S.C. to GND
0V
x
1.2V
Normal Operation
1.8V
x
VS-1.8V
S.C. to Vs
VS-1.2V
D01AU1253
VS
Concerning SHORT ACROSS THE SPEAKER / OPEN SPEAKER, the threshold varies
from 30 dB to 16 dB gain setting, since different loads are expected (either normal speaker's
impedance or high impedance). The values in case of 30 dB gain are as follows:
Figure 23. Load detection thresholds - high gain setting
S.C. across Load
0V
x
0.5Ω
Normal Operation
1.5Ω
x
Open Load
130Ω
70Ω
Infinite
D01AU1254
If the Line-Driver mode (Gv= 16 dB and Line Driver Mode diagnostic = 1) is selected, the
same thresholds will change as follows:
Figure 24. Load detection threshold - low gain setting
S.C. across Load
0Ω
1.5Ω
x
Normal Operation
4.5Ω
200Ω
x
Open Load
400Ω
infinite
D01AU1252
15/33
Diagnostics functional description
4.2
TDA7563B
Permanent diagnostics
Detectable conventional faults are:
–
Short to GND
–
Short to Vs
–
Short across the speaker
The following additional features are provided:
–
Output offset detection
The TDA7563B has 2 operating statuses:
1.
RESTART mode. The diagnostic is not enabled. Each audio channel operates
independently from each other. If any of the a.m. faults occurs, only the channel(s)
interested is shut down. A check of the output status is made every 1 ms (Figure 25).
Restart takes place when the overload is removed.
2.
DIAGNOSTIC mode. It is enabled via I2C bus and self activates if an output overload
(such to cause the intervention of the short-circuit protection) occurs to the speakers
outputs . Once activated, the diagnostics procedure develops as follows (Figure 26):
–
To avoid momentary re-circulation spikes from giving erroneous diagnostics, a
check of the output status is made after 1ms: if normal situation (no overloads) is
detected, the diagnostic is not performed and the channel returns back active.
–
Instead, if an overload is detected during the check after 1 ms, then a diagnostic
cycle having a duration of about 100 ms is started.
–
After a diagnostic cycle, the audio channel interested by the fault is switched to
RESTART mode. The relevant data are stored inside the device and can be read
by the microprocessor. When one cycle has terminated, the next one is activated
by an I2C reading. This is to ensure continuous diagnostics throughout the carradio operating time.
–
To check the status of the device a sampling system is needed. The timing is
chosen at microprocessor level (over half a second is recommended).
Figure 25. Restart timing without Diagnostic Enable (Permanent) - Each 1mS time, a
sampling of the fault is done
Out
1-2mS
1mS
1mS
1mS
1mS
t
Overcurrent and short
circuit protection intervention
(i.e. short circuit to GND)
Short circuit removed
Figure 26. Restart timing with Diagnostic Enable (Permanent)
1-2mS
100/200mS
1mS
1mS
t
Overcurrent and short
circuit protection intervention
(i.e. short circuit to GND)
16/33
Short circuit removed
TDA7563B
4.3
Diagnostics functional description
Output DC offset detection
Any DC output offset exceeding ±2 V are signalled out. This inconvenient might occur as a
consequence of initially defective or aged and worn-out input capacitors feeding a DC
component to the inputs, so putting the speakers at risk of overheating.
This diagnostic has to be performed with low-level output AC signal (or Vin = 0).
The test is run with selectable time duration by microprocessor (from a "start" to a "stop"
command):
–
START = Last reading operation or setting IB1 - D5 - (OFFSET enable) to 1
–
STOP = Actual reading operation
Excess offset is signalled out if persistent throughout the assigned testing time. This feature
is disabled if any overloads leading to activation of the short-circuit protection occurs in the
process.
4.4
AC diagnostic
It is targeted at detecting accidental disconnection of tweeters in 2-way speaker and, more
in general, presence of capacitively (AC) coupled loads.
This diagnostic is based on the notion that the overall speaker's impedance (woofer +
parallel tweeter) will tend to increase towards high frequencies if the tweeter gets
disconnected, because the remaining speaker (woofer) would be out of its operating range
(high impedance). The diagnostic decision is made according to peak output current
thresholds, as follows:
Iout > 500mApk = normal status
Iout < 250mApk = open tweeter
To correctly implement this feature, it is necessary to briefly provide a signal tone (with the
amplifier in "play") whose frequency and magnitude are such to determine an output current
higher than 500mApk with in normal conditions and lower than 250mApk should the parallel
tweeter be missing.
The test has to last for a minimum number of 3 sine cycles starting from the activation of the
AC diagnostic function IB2<D2>) up to the I2C reading of the results (measuring period). To
confirm presence of tweeter, it is necessary to find at least 3 current pulses over 500mA
over all the measuring period, else an "open tweeter" message will be issued.
The frequency / magnitude setting of the test tone depends on the impedance
characteristics of each specific speaker being used, with or without the tweeter connected
(to be calculated case by case). High-frequency tones (> 10 KHz) or even ultrasonic signals
are recommended for their negligible acoustic impact and also to maximize the impedance
module's ratio between with tweeter-on and tweeter-off.
Figure 27 shows the Load Impedance as a function of the peak output voltage and the
relevant diagnostic fields.
This feature is disabled if any overloads leading to activation of the short-circuit protection
occurs in the process.
17/33
Diagnostics functional description
TDA7563B
Figure 27. Current detection: Load impedance |Z| vs. output peak voltage
Load |z| (Ohm)
50
Iout (peak) <250mA
30
20
Low current detection area
(Open load)
D5 = 1 of the DBx byres
Iout (peak) >500mA
10
High current detection area
(Normal load)
D5 = 0 of the DBx bytes
5
3
2
1
1
2
3
4
Vout (Peak)
18/33
5
6
7
8
TDA7563B
5
Multiple faults
Multiple faults
When more misconnections are simultaneously in place at the audio outputs, it is
guaranteed that at least one of them is initially read out. The others are notified after
successive cycles of I2C reading and faults removal, provided that the diagnostic is enabled.
This is true for both kinds of diagnostic (Turn on and Permanent).
The table below shows all the couples of double-fault possible. It should be taken into
account that a short circuit with the 4 ohm speaker unconnected is considered as double
fault.
Table 5.
Double fault table for turn on diagnostic
S. GND (so)
S. GND (sk)
S. Vs
S. Across L.
Open L.
S. GND (so)
S. GND
S. GND
S. Vs + S.
GND
S. GND
S. GND
S. GND (sk)
/
S. GND
S. Vs
S. GND
Open L. (*)
S. Vs
/
/
S. Vs
S. Vs
S. Vs
S. Across L.
/
/
/
S. Across L.
N.A.
Open L.
/
/
/
/
Open L. (*)
S. GND (so) / S. GND (sk) in the above table make a distinction according to which of the 2
outputs is shorted to ground (test-current source side= so, test-current sink side = sk). More
precisely, in Channels LF and RR, so = CH+, sk = CH-; in Channels LR and RF, so = CH-, sk
= CH+ .
In Permanent Diagnostic the table is the same, with only a difference concerning Open
Load(*) , which is not among the recognisable faults. Should an Open Load be present
during the device's normal working, it would be detected at a subsequent Turn on Diagnostic
cycle (i.e. at the successive Car Radio Turn on).
5.1
Faults availability
All the results coming from I2Cbus, by read operations, are the consequence of
measurements inside a defined period of time. If the fault is stable throughout the whole
period, it will be sent out.
To guarantee always resident functions, every kind of diagnostic cycles (Turn on,
Permanent, Offset) will be reactivate after any I2C reading operation. So, when the micro
reads the I2C, a new cycle will be able to start, but the read data will come from the previous
diag. cycle (i.e. The device is in Turn On state, with a short to Gnd, then the short is
removed and micro reads I2C. The short to Gnd is still present in bytes, because it is the
result of the previous cycle. If another I2C reading operation occurs, the bytes do not show
the short). In general to observe a change in Diagnostic bytes, two I2C reading operations
are necessary.
19/33
Thermal protection
6
TDA7563B
Thermal protection
Thermal protection is implemented through thermal foldback (Figure 28).
Thermal foldback begins limiting the audio input to the amplifier stage as the junction
temperatures rise above the normal operating range. This effectively limits the output power
capability of the device thus reducing the temperature to acceptable levels without totally
interrupting the operation of the device.
The output power will decrease to the point at which thermal equilibrium is reached.
Thermal equilibrium will be reached when the reduction in output power reduces the
dissipated power such that the die temperature falls below the thermal foldback threshold.
Should the device cool, the audio level will increase until a new thermal equilibrium is
reached or the amplifier reaches full power. Thermal foldback will reduce the audio output
level in a linear manner.
Three Thermal warning are available through the I2C bus data.
Figure 28. Thermal foldback diagram
Vout
Vout
TH. WARN. TH. WARN. TH. WARN.
ON
ON
ON
125°
140°
< TSD
CD out
155°
TH. SH.
START
TH. SH.
END
> TSD (with same input
signal)
Tj ( °C)
Tj ( °C)
Tj ( °C)
6.1
Fast muting
The muting time can be shortened to less than 1.5ms by setting (IB2) D5 = 1. This option
can be useful in transient battery situations (i.e. during car engine cranking) to quickly
turnoff the amplifier for avoiding any audible effects caused by noise/transients being
injected by preamp stages. The bit must be set back to “0” shortly after the mute transition.
20/33
I2C Bus
TDA7563B
7
I2C Bus
7.1
I2C Programming/reading sequences
A correct turn on/off sequence respectful of the diagnostic timings and producing no audible
noises could be as follows (after battery connection):
7.2
–
TURN-ON: PIN2 > 7V --- 10ms --- (STAND-BY OUT + DIAG ENABLE) --- 500 ms
(min) --- MUTING OUT
–
TURN-OFF: MUTING IN --- 20 ms --- (DIAG DISABLE + STAND-BY IN) --- 10ms -- PIN2 = 0
–
Car Radio Installation: PIN2 > 7V --- 10ms DIAG ENABLE (write) --- 200 ms --I2C read (repeat until All faults disappear).
–
OFFSET TEST: Device in Play (no signal) -- OFFSET ENABLE - 30ms - I2C
reading (repeat I2C reading until high-offset message disappears).
I2C Bus interface
Data transmission from microprocessor to the TDA7563B and viceversa takes place through
the 2 wires I2C BUS interface, consisting of the two lines SDA and SCL (pull-up resistors to
positive supply voltage must be connected).
7.2.1
Data validity
As shown by Figure 29, the data on the SDA line must be stable during the high period of
the clock. The HIGH and LOW state of the data line can only change when the clock signal
on the SCL line is LOW.
7.2.2
Start and stop conditions
As shown by Figure 30 a start condition is a HIGH to LOW transition of the SDA line while
SCL is HIGH. The stop condition is a LOW to HIGH transition of the SDA line while SCL is
HIGH.
7.2.3
Byte format
Every byte transferred to the SDA line must contain 8 bits. Each byte must be followed by an
acknowledge bit. The MSB is transferred first.
21/33
I2C Bus
7.2.4
TDA7563B
Acknowledge
The transmitter* puts a resistive HIGH level on the SDA line during the acknowledge clock
pulse (see Figure 31). The receiver** the acknowledges has to pull-down (LOW) the SDA
line during the acknowledge clock pulse, so that the SDAline is stable LOW during this clock
pulse.
* Transmitter
–
master (μP) when it writes an address to the TDA7563B
–
slave (TDA7563B) when the μP reads a data byte from TDA7563B
** Receiver
–
slave (TDA7563B) when the μP writes an address to the TDA7563B
–
master (µP) when it reads a data byte from TDA7563B
Figure 29. Data validity on the I2C Bus
SDA
SCL
DATA LINE
STABLE, DATA
VALID
CHANGE
DATA
ALLOWED
D99AU1031
Figure 30. Timing diagram on the I2C Bus
SCL
I2CBUS
SDA
D99AU1032
START
STOP
Figure 31. Acknowledge on the I2C Bus
SCL
1
2
3
7
8
9
SDA
MSB
START
22/33
D99AU1033
ACKNOWLEDGMENT
FROM RECEIVER
TDA7563B
8
Software specifications
Software specifications
All the functions of the TDA7563B are activated by I2C interface.
The bit 0 of the "ADDRESS BYTE" defines if the next bytes are write instruction (from µP to
TDA7563B) or read instruction (from TDA7563B to µP).
Chip address
D7
D0
1
1
0
1
1
0
0
X
D8 Hex
X = 0 Write to device
X = 1 Read from device
If R/W = 0, the μP sends 2 "Instruction Bytes": IB1 and IB2.
Table 6.
IB1
Bit
Instruction decoding bit
D7
0
D6
Diagnostic enable (D6 = 1)
Diagnostic defeat (D6 = 0)
D5
Offset Detection enable (D5 = 1)
Offset Detection defeat (D5 = 0)
D4
Front Channel
Gain = 30dB (D4 = 0)
Gain = 16dB (D4 = 1)
D3
Rear Channel
Gain = 30dB (D3 = 0)
Gain = 16dB (D3 = 1)
D2
Mute front channels (D2 = 0)
Unmute front channels (D2 = 1)
D1
Mute rear channels (D1 = 0)
Unmute rear channels (D1 = 1)
D0
CD 2% (D0 = 0)
CD 10% (D0 = 1)
23/33
Software specifications
Table 7.
TDA7563B
IB2
Bit
Instruction decoding bit
D7
0
D6
0
D5
Normal muting time (D5 = 0)
Fast muting time (D5 = 1)
D4
Stand-by on - Amplifier not working - (D4 = 0)
Stand-by off - Amplifier working - (D4 = 1)
D3
Power amplifier mode diagnostic (D3 = 0)
Line driver mode diagnostic (D3 = 1)
D2
Current Detection Diagnostic Enabled (D2 =1)
Current Detection Diagnostic Defeat (D2 =0)
D1
Right ChannelPower amplifier working in standard mode (D1 = 0)
Power amplifier working in high efficiency mode (D1 = 1)
D0
Left ChannelPower amplifier working in standard mode (D0 = 0)
Power amplifier working in high efficiency mode (D0 = 1)
If R/W = 1, the TDA7563B sends 4 "Diagnostics Bytes" to μP: DB1, DB2, DB3 and DB4.
Table 8.
DB1
Bit
24/33
Instruction decoding bit
D7
Thermal warning 1 active (D7 = 1), Tj =155°C
D6
Diag. cycle not activated or not terminated (D6 = 0)
Diag. cycle terminated (D6 = 1)
D5
Channel LF
Current Detection
Output peak current <250mA - Output load (D5 = 1)
Output peak current >500mA - Output load (D5 = 0)
D4
Channel LF
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
D3
Channel LF
Normal load (D3 = 0)
Short load (D3 = 1)
D2
Channel LF
Turn-on diag.: No open load (D2 = 0)
Open load detection (D2 = 1)
Offset diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
D1
Channel LF
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
D0
Channel LF
No short to GND (D1 = 0)
Short to GND (D1 = 1)
TDA7563B
Software specifications
Table 9.
DB2
Bit
Instruction decoding bit
D7
Offset detection not activated (D7 = 0)
Offset detection activated (D7 = 1)
D6
X
D5
Channel LR
Current Detection
Output peak current <250mA - Output load (D5 = 1)
Output peak current >500mA - Output load (D5 = 0)
D4
Channel LR
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
D3
Channel LR
Normal load (D3 = 0)
Short load (D3 = 1)
D2
Channel LR
Turn-on diag.: No open load (D2 = 0)
Open load detection (D2 = 1)
Permanent diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
D1
Channel LR
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
D0
Channel LR
No short to GND (D1 = 0)
Short to GND (D1 = 1)
25/33
Software specifications
Table 10.
TDA7563B
DB3
Bit
26/33
Instruction decoding bit
D7
Stand-by status (= IB2 - D4)
D6
Diagnostic status (= IB1 - D6)
D5
Channel RF
Current Detection
Output peak current <250mA - Output load (D5 = 1)
Output peak current >500mA - Output load (D5 = 0)
D4
Channel RF
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
D3
Channel RF
Normal load (D3 = 0)
Short load (D3 = 1)
D2
Channel RF
Turn-on diag.: No open load (D2 = 0)
Open load detection (D2 = 1)
Permanent diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
D1
Channel RF
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
D0
Channel RF
No short to GND (D1 = 0)
Short to GND (D1 = 1)
TDA7563B
Software specifications
Table 11.
DB4
Bit
Instruction decoding bit
D7
Thermal warning 2 active (D7 = 1), Tj = 140°C
D6
Thermal warning 3 active (D6 = 1) Tj = 120°C
D5
Channel RR
Current Detection
Output peak current <250mA - Output load (D5 = 1)
Output peak current >500mA - Output load (D5 = 0)
D4
Channel RR
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
D3
Channel R
RNormal load (D3 = 0)
Short load (D3 = 1)
D2
Channel RR
Turn-on diag.: No open load (D2 = 0)
Open load detection (D2 = 1)
Permanent diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
D1
Channel RR
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
D0
Channel RR
No short to GND (D1 = 0)
Short to GND (D1 = 1)
27/33
Examples of bytes sequence
9
TDA7563B
Examples of bytes sequence
1 - Turn-On diagnostic - Write operation
Start
Address byte with D0 = 0
ACK
IB1 with D6 = 1
ACK
IB2
ACK
STOP
2 - Turn-On diagnostic - Read operation
Start Address byte with D0 = 1 ACK DB1
ACK DB2 ACK DB3 ACK DB4 ACK STOP
The delay from 1 to 2 can be selected by software, starting from 1ms
3a - Turn-On of the power amplifier with 30dB gain, mute on, diagnostic defeat, CD = 2%
.
Start
Address byte with D0 = 0
ACK
IB1
ACK
X0000000
IB2
ACK
STOP
ACK
STOP
ACK
STOP
XXX1XX11
3b - Turn-Off of the power amplifier
Start
Address byte with D0 = 0
ACK
IB1
ACK
X0XXXXXX
IB2
XXX0XXXX
4 - Offset detection procedure enable
Start
Address byte with D0 = 0
ACK
IB1
XX1XX11X
ACK
IB2
XXX1XXXX
5 - Offset detection procedure stop and reading operation (the results are valid only for the
offset detection bits (D2 of the bytes DB1, DB2, DB3, DB4)
.
Start Address byte with D0 = 1 ACK DB1
28/33
ACK
DB2 ACK DB3 ACK DB4 ACK STOP
●
The purpose of this test is to check if a D.C. offset (2V typ.) is present on the outputs,
produced by input capacitor with anomalous leackage current or humidity between
pins.
●
The delay from 4 to 5 can be selected by software, starting from 1ms
TDA7563B
10
Package information
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 32. Flexiwatt27 (horizontal) mechanical data and package dimensions
DIM.
A
B
C
D
E
F (1)
G
G1
H (2)
H1
H2
H3
L (2)
L1
L2 (2)
L3
L4
L5
L6
M
M1
M2
N
P
R
R1
R2
R3
R4
V
V1
V2
V3
MIN.
4.45
1.80
0.37
0.80
25.75
28.90
21.64
10.15
15.50
7.70
5.15
1.80
2.75
3.20
mm
TYP.
4.50
1.90
1.40
2.00
0.39
1.00
26.00
29.23
17.00
12.80
0.80
22.04
10.5
15.70
7.85
5
5.45
1.95
3.00
4.73
5.61
2.20
3.50
1.70
0.50
0.30
1.25
0.50
MAX.
4.65
2.00
MIN.
0.175
0.070
0.42
0.57
1.20
26.25
29.30
0.014
0.031
1.014
1.139
22.44
10.85
15.90
7.95
0.852
0.40
0.610
0.303
5.85
2.10
3.50
0.203
0.070
0.108
3.80
0.126
inch
TYP.
0.177
0.074
0.055
0.079
0.015
0.040
1.023
1.150
0.669
0.503
0.031
0.868
0.413
0.618
0.309
0.197
0.214
0.077
0.118
0.186
0.220
0.086
0.138
0.067
0.02
0.12
0.049
0.02
MAX.
0.183
0.079
OUTLINE AND
MECHANICAL DATA
0.016
0.022
0.047
1.033
1.153
0.883
0.427
0.626
0.313
0.23
0.083
0.138
0.15
5˚ (Typ.)
3˚ (Typ.)
20˚ (Typ.)
45˚ (Typ.)
Flexiwatt27
(Horizontal)
(1): dam-bar protusion not included; (2): molding protusion included
7399738 A
29/33
Package information
TDA7563B
Figure 33. Flexiwatt27 (vertical) mechanical data and package dimensions
DIM.
MIN.
4.45
1.80
A
B
C
D
E
F (1)
G
G1
H (2)
H1
H2
H3
L (2)
L1
L2 (2)
L3
L4
L5
M
M1
N
O
R
R1
R2
R3
R4
V
V1
V2
V3
0.75
0.37
0.80
25.75
28.90
22.07
18.57
15.50
7.70
3.70
3.60
mm
TYP.
4.50
1.90
1.40
0.90
0.39
1.00
26.00
29.23
17.00
12.80
0.80
22.47
18.97
15.70
7.85
5
3.5
4.00
4.00
2.20
2
1.70
0.5
0.3
1.25
0.50
MAX.
4.65
2.00
MIN.
0.175
0.070
1.05
0.42
0.57
1.20
26.25
29.30
0.029
0.014
0.031
1.014
1.139
22.87
19.37
15.90
7.95
0.869
0.731
0.610
0.303
4.30
4.40
0.145
0.142
inch
TYP.
0.177
0.074
0.055
0.035
0.015
0.040
1.023
1.150
0.669
0.503
0.031
0.884
0.747
0.618
0.309
0.197
0.138
0.157
0.157
0.086
0.079
0.067
0.02
0.12
0.049
0.019
MAX.
0.183
0.079
OUTLINE AND
MECHANICAL DATA
0.041
0.016
0.022
0.047
1.033
1.153
0.904
0.762
0.626
0.313
0.169
0.173
5˚ (Typ.)
3˚ (Typ.)
20˚ (Typ.)
45˚ (Typ.)
Flexiwatt27 (vertical)
(1): dam-bar protusion not included
(2): molding protusion included
V
C
B
V
H
H1
V3
A
H2
O
H3
R3
L4
R4
V1
R2
L2
N
L3
R
L
L1
V1
V2
R2
D
R1
L5
Pin 1
R1
R1
E
G
G1
F
FLEX27ME
M
M1
7139011
30/33
TDA7563B
Package information
Figure 34. PowerSO36 (slug up) mechanical data and package dimensions
DIM.
A
A2
A4
A5
a1
b
c
D
D1
D2
E
E1
E2
E3
E4
e
e3
G
H
h
L
N
s
MIN.
3.25
3.1
0.8
mm
TYP.
MAX.
3.43
3.2
1
MIN.
0.128
0.122
0.031
-0.040
0.38
0.32
16
9.8
0.0011
0.008
0.009
0.622
0.37
14.5
11.1
2.9
6.2
3.2
0.547
0.429
0.2
0.030
0.22
0.23
15.8
9.4
5.8
2.9
0.8
OUTLINE AND
MECHANICAL DATA
-0.0015
0.015
0.012
0.630
0.38
0.039
0.57
0.437
0.114
0.244
1.259
0.228
0.114
0.65
11.05
0
15.5
MAX.
0.135
0.126
0.039
0.008
1
13.9
10.9
inch
TYP.
0.026
0.435
0.075
15.9
1.1
1.1
10˚
8˚
0
0.61
0.031
0.003
0.625
0.043
0.043
10˚
8˚
PowerSO36 (SLUG UP)
(1) “D and E1” do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.15mm (0.006”)
(2) No intrusion allowed inwards the leads.
7183931 D
31/33
Revision history
11
TDA7563B
Revision history
Table 12.
32/33
Document revision history
Date
Revision
Changes
5-Oct-2006
1
Intial release.
19-Dec-2007
2
Updated Table 3: Thermal data.
TDA7563B
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