STMICROELECTRONICS TDA7564BPDTR

TDA7564B
4 x 50W multifunction quad power amplifier
with built-in diagnostics features
Features
■
Multipower BCD technology
■
MOSFET output power stage
■
DMOS power output
■
New Hi-efficiency (class SB)
■
High output power capability 4x28W/4Ω @
14.4V, 1KHz, 10% THD, 4x50W max, power
■
Max. output power 4x72W/2Ω
■
Full I2C bus driving:
– St-by
– Independent front/rear soft play/mute
– Selectable gain (for low noise line output
function)
– High efficiency enable/disable
– I2C bus digital diagnostics (including AC
and DC load detection)
Flexiwatt25
(Vertical)
PowerSO36
Flexiwatt25/PowerSO36 package specially
intended for car radio applications.
■
Full fault protection
■
DC offset detection
■
Four independent short circuit protection
■
Clipping detector (2%/10%)
■
Linear thermal shutdown with multiple thermal
warning
■
ESD protection
Description
The TDA7564B is a new BCD technology QUAD
BRIDGE type of car radio amplifier in
Table 1.
Flexiwatt25
(Horizontal)
Thanks to the DMOS output stage the TDA7564B
has a very low distortion allowing a clear powerful
sound. Among the features, its superior efficiency
performance coming from the internal exclusive
structure, makes it the most suitable device to
simplify the thermal management in high power
sets.
The dissipated output power under average
listening condition is in fact reduced up to 50%
when compared to the level provided by
conventional class AB solutions. This device is
equipped with a full diagnostics array that
communicates the status of each speaker through
the I2C bus.
Device summary
Order code
Package
Packing
TDA7564B
Flexiwatt25 (vertical)
Tube
TDA7564BH
Flexiwatt25 (horizontal)
Tube
TDA7564BPD
PowerSO36
Tube
TDA7564BPDTR
PowerSO36
Tape and reel
January 2008
Rev 2
1/34
www.st.com
1
Contents
TDA7564B
Contents
1
Block diagrams and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4
5
3.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Diagnostics functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1
Turn-on diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.2
Permanent diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.3
Output DC offset detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.4
AC diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Multiple faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.1
6
Faults availability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Thermal protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.1
I2C programming/reading sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7
Fast muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8
I2C Bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8.1
Data validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8.2
Start and stop conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8.3
Byte format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8.4
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
9
Software specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
10
Examples of bytes sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2/34
TDA7564B
Contents
11
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3/34
List of tables
TDA7564B
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
4/34
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Double fault table for turn-on diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
IB1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
IB2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
DB1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
DB2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
DB3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
DB4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
TDA7564B
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Flexiwatt25 pins connection diagram (top of view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
PowerSO36 (slug-up) pins connection diagram (top of view). . . . . . . . . . . . . . . . . . . . . . . . 7
Quiescent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Output power vs. supply voltage (4W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Output power vs. supply voltage (2W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. output power (4W, STD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. output power (4Ω, HI-EFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Distortion vs. output power (2Ω, STD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Distortion vs. frequency (4W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Distortion vs. frequency (2W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Crosstalk vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Supply voltage rejection vs. freq. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Power dissipation and efficiency vs. output power (4W, STD, SINE) . . . . . . . . . . . . . . . . . 13
Power dissipation and efficiency vs. output power (4Ω, HI-EFF, SINE) . . . . . . . . . . . . . . . 13
Power dissipation vs. average output power (audio program simulation, 4W) . . . . . . . . . . 13
Power dissipation vs. average output power (audio program simulation, 2W) . . . . . . . . . . 13
Turn - on diagnostic: working principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SVR and output behavior (case 1: without turn-on diagnostic). . . . . . . . . . . . . . . . . . . . . . 14
SVR and output pin behavior (case 2: with turn-on diagnostic) . . . . . . . . . . . . . . . . . . . . . 15
Short circuit detection thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Load detection thresholds - high gain setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Load detection threshold - low gain setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Restart timing without diagnostic enable (permanent) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Restart timing with diagnostic enable (permanent). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Current detection high: load impedance |Z| vs. output peak voltage . . . . . . . . . . . . . . . . . 18
Current detection low: load impedance |Z| vs. output peak voltage . . . . . . . . . . . . . . . . . . 18
Thermal foldback diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Data validity on the I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Timing diagram on the I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Acknowledge on the I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Flexiwatt25 (horizontal) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . 30
Flexiwatt25 (vertical) mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . 31
PowerSO36 (slug up) mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . 32
5/34
Block diagrams and application circuit
1
TDA7564B
Block diagrams and application circuit
Figure 1.
Block diagram
CLK
VCC1 VCC2
DATA
CD_OUT
I2CBUS
THERMAL
PROTECTION
& DUMP
MUTE1
CLIP
DETECTOR
REFERENCE
MUTE2
IN RF
OUT RF+
OUT RF-
12/26dB
SHORT CIRCUIT
PROTECTION &
DIAGNOSTIC
IN RR
OUT RR+
OUT RR-
12/26dB
SHORT CIRCUIT
PROTECTION &
DIAGNOSTIC
OUT LF+
IN LF
OUT LF-
12/26dB
SHORT CIRCUIT
PROTECTION &
DIAGNOSTIC
OUT LR+
IN LR
OUT LR-
12/26dB
SHORT CIRCUIT
PROTECTION &
DIAGNOSTIC
SVR
AC_GND
TAB
S_GND
RF
RR
LF
LR
D00AU1211
PW_GND
Figure 2.
Application circuit
C8
0.1μF
C7
3300μF
Vcc1
Vcc2
6
DATA
20
17
18
25
I2C BUS
19
CLK
22
21
C1 0.22μF
IN RF
23
C2 0.22μF
9
14
+
OUT RR
+
8
7
C3 0.22μF
IN LF
OUT RF
24
15
IN RR
+
11
5
OUT LF
+
2
C4 0.22μF
IN LR
3
12
S-GND
13
16
10
4
1
OUT LR
TAB
47K
C5
1μF
V
C6
10μF
D00AU1212
CD OUT
6/34
TDA7564B
2
Pins description
Pins description
Figure 3.
Flexiwatt25 pins connection diagram (top of view)
25
DATA
25
DATA
24
PW_GND RR
24
PW_GND RR
23
OUT RR-
23
OUT RR-
22
CK
22
CK
OUT RR+
OUT RR+
Vertical
20
VCC2
20
VCC2
19
OUT RF-
19
OUT RF-
18
PW_GND RF
18
PW_GND RF
17
OUT RF+
17
OUT RF+
16
AC GND
16
AC GND
15
IN RF
15
IN RF
14
IN RR
14
IN RR
13
S GND
13
S GND
12
IN LR
12
IN LR
11
IN LF
11
IN LF
10
SVR
10
SVR
9
OUT LF+
9
OUT LF+
8
PW_GND LF
8
PW_GND LF
7
OUT LF-
7
OUT LF-
6
VCC1
6
VCC1
Horizontal
OUT LR+
OUT LR+
4
CD-OUT
4
CD-OUT
3
OUT LR-
3
OUT LR-
2
PW_GND LR
2
PW_GND LR
1
TAB
1
TAB
AU1037_H
D99AU1037
Figure 4.
PowerSO36 (slug-up) pins connection diagram (top of view)
VCC
36
1
TAB
OUT3-
35
2
CK
N.C.
34
3
N.C.
N.C.
33
4
OUT4+
PWGND
32
5
N.C.
OUT3+
31
6
PWGND
ACGND
30
7
VCC
IN3
29
8
DATA
IN4
28
9
OUT4-
SGND
27
10
OUT2-
IN2
26
11
N.C.
IN1
25
12
VCC
SVR
24
13
PWGND
OUT1+
23
14
N.C.
PWGND
22
15
OUT2+
N.C.
21
16
N.C.
OUT1-
20
17
N.C.
VCC
19
18
CD
AC00182
7/34
Electrical specifications
TDA7564B
3
Electrical specifications
3.1
Absolute maximum ratings
Table 2.
Absolute maximum ratings
Symbol
Unit
Operating supply voltage
18
V
VS
DC supply voltage
28
V
Vpeak
Peak supply voltage (for t = 50ms)
50
V
VCK
CK pin voltage
6
V
Data pin voltage
6
V
IO
Output peak current (not repetitive t = 100ms)
8
A
IO
Output peak current (repetitive f > 10Hz)
6
A
Power dissipation Tcase = 70°C
85
W
-55 to 150
°C
PowerSO Flexiwatt
Unit
Ptot
Tstg, Tj
Storage and junction temperature
Thermal data
Table 3.
Thermal data
Symbol
Rth j-case
3.3
Value
Vop
VDATA
3.2
Parameter
Parameter
Thermal resistance junction to caseMax.
1
1
°C/W
Electrical characteristics
Refer to the test circuit, VS = 14.4V; RL = 4Ω; f = 1KHz; GV = 30dB; Tamb = 25°C; unless
otherwise specified.
Table 4.
Electrical characteristics
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
18
V
300
mA
Power amplifier
VS
Supply voltage range
Id
Total quiescent drain current
8
170
Max. power (VS = 15.2V, square
wave input (2Vrms))
PO
8/34
Output power
THD = 10%
THD = 1%
25
20
50
W
28
22
W
W
TDA7564B
Table 4.
Electrical specifications
Electrical characteristics (continued)
Symbol
PO
THD
Parameter
Output power
Total harmonic distortion
CT
Cross talk
RIN
GV1
Test Condition
RL = 2Ω; EIAJ (VS = 13.7V)
RL = 2Ω; THD 10%
RL = 2Ω; THD 1%
RL = 2Ω; MAX POWER
Min.
Typ.
55
40
32
60
68
50
40
75
Max.
Unit
W
W
W
W
PO = 1W to 10W; STD MODE
HE MODE; PO = 1.5W
HE MODE; PO = 8W
0.02
0.015
0.15
0.1
0.1
0.5
%
%
%
GV = 12dB; STD Mode
VO = 0.1 to 5VRMS
0.02
0.05
%
50
60
Input impedance
60
100
130
KΩ
Voltage gain 1
25
26
27
dB
Voltage gain match 1
-1
1
dB
Voltage gain 2
11
13
dB
ΔGV2
Voltage gain match 2
-1
1
dB
EIN1
Output noise voltage 1
Rg = 600Ω 20Hz to 22kHz
35
100
µV
EIN2
Output noise voltage 2
Rg = 600Ω; GV = 12dB
20Hz to 22kHz
12
30
µV
SVR
Supply Voltage Rejection
f = 100Hz to 10kHz; Vr = 1Vpk;
Rg = 600Ω
BW
Power bandwidth
100
ASB
Stand-by attenuation
90
ISB
Stand-by current
AM
Mute attenuation
VOS
Offset voltage
VAM
Min. supply mute threshold
ΔGV1
GV2
f = 1KHz to 10KHz, Rg = 600Ω
50
Vst-by = 0
Mute & Play
12
dB
60
dB
KHz
110
25
dB
50
µA
80
100
dB
-100
0
100
mV
6.5
7
8
V
Input CMRR
VCM = 1Vpk-pk; Rg = 0 Ω
55
TON
Turn ON Delay
D2/D1 (IB1) 0 to 1
20
40
ms
TOFF
Turn OFF Delay
D2/D1 (IB1) 1 to 0
20
40
ms
CDLK
Clip det high leakage current
CD off
0
5
μA
CDSAT
Clip det sat. voltage
CD on; ICD = 1mA
150
300
mV
CDTHD
Clip det THD level
CMRR
dB
D0 (IB1) = 1
5
10
15
%
D0 (IB1) = 0
1
2
3
%
9/34
Electrical specifications
Table 4.
Symbol
TDA7564B
Electrical characteristics (continued)
Parameter
Test Condition
Min.
Typ.
Max.
Unit
1.2
V
Turn on diagnostics 1 (Power amplifier mode)
Pgnd
Short to GND det. (below this
limit, the output is considered in
short circuit to GND)
Pvs
Short to Vs det. (above this limit,
the output is considered in short
circuit to VS)
Pnop
Vs -1.2
Power Amplifier in st-by
Normal operation thresholds.
(Within these limits, the output is
considered without faults).
V
1.8
Lsc
Shorted load det.
Lop
Open load det.
85
Lnop
Normal load det.
1.5
Vs -1.8
V
0.5
Ω
Ω
45
Ω
1.2
V
Turn on diagnostics 2 (Line driver mode)
Pgnd
Short to GND det. (below this
limit, the output is considered in
short circuit to GND)
Pvs
Short to Vs det. (above this limit,
the output is considered in short
circuit to VS)
Vs -1.2
Pnop
Normal operation thresholds.
(Within these limits, the output is
considered without faults).
1.8
Lsc
Shorted load det.
Lop
Open load det.
Lnop
Normal load det.
Power Amplifier in st-by
V
Vs -1.8
V
2
Ω
Ω
330
7
180
Ω
1.2
V
Permanent diagnostics 2 (Power amplifier mode or line driver mode)
Pgnd
Pvs
Pnop
Short to GND det. (below this
limit, the output is considered in
short circuit to GND)
Short to Vs det. (above this limit, Power Amplifier in Mute or Play,
the output is considered in short one or more short circuits
circuit to VS)
protection activated
Normal operation thresholds.
(within these limits, the output is
considered without faults).
Vs -1.2
1.8
Vs -1.8
V
Pow. Amp. mode
0.5
Ω
Line Driver mode
2
Ω
±2.5
V
LSC
Shorted load det.
VO
Offset detection
Power Amplifier in play,
AC Input signals = 0
±1.5
INLH
Normal load current detection
VO < (VS - 5)pk IB2 (D7) = 0
500
10/34
V
±2
mA
TDA7564B
Electrical specifications
Table 4.
Electrical characteristics (continued)
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
250
Unit
INLL
Normal load current detection
VO < (VS - 5)pk IB2 (D7) = 1
mA
IOLH
Open load current detection
VO < (VS - 5)pk IB2 (D7) = 0
250
mA
IOLL
Open load current detection
VO < (VS - 5)pk IB2 (D7) =1
125
mA
I2C Bus interface
SCL
Clock frequency
400
KHz
VIL
Input low voltage
1.5
V
VIH
Input high voltage
2.3
3.4
Electrical characteristics curves
Figure 5.
Quiescent current vs. supply
voltage
Figure 6.
Id (mA)
V
Output power vs. supply voltage
(4Ω)
Po (W)
250
70
Po-max
65
230
60
Vin = 0
NO LOADS
210
RL = 4 Ohm
f = 1 KHz
55
190
50
170
40
150
35
130
25
THD = 10 %
45
30
THD = 1 %
20
110
15
90
10
5
70
8
10
12
14
16
18
8
9
10
11
12
Vs (V)
Figure 7.
Output power vs. supply voltage
(2Ω)
Figure 8.
Po (W)
13
Vs (V)
14
15
16
17
18
Distortion vs. output power (4Ω,
STD)
THD (%)
100
10
90
Po-max
RL = 2 Ohm
f = 1 KHz
80
70
1
60
STANDARD MODE
Vs = 14.4 V
RL = 4 Ohm
THD = 10 %
50
f = 10 KHz
40
0.1
30
THD = 1 %
f = 1 KHz
20
10
8
9
10
11
12
Vs (V)
13
14
15
16
0.01
0.1
1
Po (W)
10
11/34
Electrical specifications
Figure 9.
10
TDA7564B
Distortion vs. output power (4Ω, HI- Figure 10. Distortion vs. output power (2Ω,
EFF)
STD)
THD (%)
THD (%)
10
HI-EFF MODE
Vs = 14.4 V
RL = 4 Ohm
1
STANDARD MODE
Vs = 14.4 V
RL = 2 Ohm
1
f = 10 KHz
f = 10 KHz
0.1
f = 1 KHz
0.1
f = 1 KHz
0.01
0.001
0.1
1
0.01
0.1
10
1
Figure 11. Distortion vs. frequency (4Ω)
Figure 12. Distortion vs. frequency (2Ω)
THD (%)
THD (%)
10
1
10
STANDARD MODE
Vs = 14.4 V
RL = 4 Ohm
Po = 4 W
STANDARD MODE
Vs = 14.4 V
RL = 2 Ohm
Po = 8 W
1
0.1
0.1
0.01
10
100
1000
10000
10
100
f (Hz)
CROSSTALK (dB)
SVR (dB)
90
80
80
70
70
60
STANDARD MODE
RL = 4 Ohm
Po = 4 W
Rg = 600 Ohm
50
40
40
30
30
20
10
12/34
10000
Figure 14. Supply voltage rejection vs. freq.
90
50
1000
f (Hz)
Figure 13. Crosstalk vs. frequency
60
10
Po (W)
Po (W)
100
f (Hz)
1000
10000
20
10
STD & HE MODE
Rg = 600 Ohm
Vripple = 1 Vpk
100
f (Hz)
1000
10000
TDA7564B
Electrical specifications
Figure 15. Power dissipation and efficiency vs. Figure 16. Power dissipation and efficiency vs.
output power (4Ω, STD, SINE)
output power (4Ω, HI-EFF, SINE)
n
80
STANDARD MODE
Vs = 14.4 V
RL = 4 x 4 Ohm
f = 1 KHz SINE
70
60
Ptot (W )
n (%)
Ptot (W)
90
50
90
90
80
80
70
70
60
60
50
50
n (%)
90
80
HI-EFF MODE
Vs = 14.4 V
RL = 4 x 4 Ohm
f = 1 KHz SINE
n
70
60
50
Ptot
40
40
30
30
30
30
20
20
20
20
10
10
10
10
40
Ptot
0
0
2
4
6
8
0
10 12 14 16 18 20 22 24 26 28 30
Po (W)
0
0.1
Figure 17. Power dissipation vs. average
output power (audio program
simulation, 4Ω)
40
0
1
10
Po (W )
Figure 18. Power dissipation vs. average
output power (audio program
simulation, 2Ω)
Ptot (W)
Ptot (W )
45
90
40
35
80
STD MODE
Vs = 14 V
RL = 4 x 4 Ohm
GAUSSIAN NOISE
Vs = 14 V
RL = 4 x 2 Ohm
GAUSSIAN NOISE
70
STD MODE
60
30
CLIP
START
25
50
HI-EFF MODE
20
CLIP
START
40
15
30
10
20
5
10
HI-EFF MODE
0
0
0
1
2
3
Po (W)
4
5
0
1
2
3
4
5
Po (W )
6
7
8
9
13/34
Diagnostics functional description
TDA7564B
4
Diagnostics functional description
4.1
Turn-on diagnostic
It is activated at the turn-on (stand-by out) under I2C bus request. Detectable output faults
are:
●
Short to GND
●
Short to Vs
●
Short across the speaker
●
Open speaker
To verify if any of the above misconnections are in place, a subsonic (inaudible) current
pulse (Figure 19) is internally generated, sent through the speaker(s) and sunk back.The
Turn-on diagnostic status is internally stored until a successive diagnostic pulse is
requested (after a I2C reading).
If the "stand-by out" and "diag. enable" commands are both given through a single
programming step, the pulse takes place first (power stage still in stand-by mode, low,
outputs= high impedance).
Afterwards, when the Amplifier is biased, the PERMANENT diagnostic takes place. The
previous Turn-on state is kept until a short appears at the outputs.
Figure 19. Turn - on diagnostic: working principle
Vs~5V
Isource
I (mA)
Isource
CH+
Isink
CHIsink
~100mS
t (ms)
Measure time
Figure 20 and 21 show SVR and OUTPUT waveforms at the turn-on (stand-by out) with and
without turn-on diagnostic.
Figure 20. SVR and output behavior (case 1: without turn-on diagnostic)
Vsvr
Out
Permanent diagnostic
acquisition time (100mS Typ)
Bias (power amp turn-on)
I2CB DATA
14/34
Diagnostic Enable
(Permanent)
t
FAULT
event
Permanent Diagnostics data (output)
permitted time
Read Data
TDA7564B
Diagnostics functional description
Figure 21. SVR and output pin behavior (case 2: with turn-on diagnostic)
Vsvr
Out
Turn-on diagnostic
acquisition time (100mS Typ)
Permanent diagnostic
acquisition time (100mS Typ)
Turn-on Diagnostics data (output)
permitted time
Diagnostic Enable
(Turn-on)
Bias (power amp turn-on)
permitted time
FAULT
event
Diagnostic Enable
(Permanent)
Read Data
t
Permanent Diagnostics data (output)
permitted time
I2CB DATA
The information related to the outputs status is read and memorized at the end of the
current pulse top. The acquisition time is 100 ms (typ.). No audible noise is generated in the
process. As for SHORT TO GND / Vs the fault-detection thresholds remain unchanged from
26 dB to 12 dB gain setting. They are as follows:
Figure 22. Short circuit detection thresholds
S.C. to GND
0V
x
1.2V
Normal Operation
1.8V
x
VS-1.8V
S.C. to Vs
VS-1.2V
D01AU1253
VS
Concerning Short across the speaker / Open speaker, the threshold varies from 26 dB to 12
dB gain setting, since different loads are expected (either normal speaker's impedance or
high impedance). The values in case of 26 dB gain are as follows:
Figure 23. Load detection thresholds - high gain setting
S.C. across Load
0V
x
0.5Ω
Normal Operation
1.5Ω
x
Open Load
85Ω
45Ω
Infinite
AC00060
If the Line-Driver mode (Gv= 12 dB and Line Driver Mode diagnostic = 1) is selected, the
same thresholds will change as follows:
Figure 24. Load detection threshold - low gain setting
S.C. across Load
0Ω
2Ω
x
Normal Operation
7Ω
180Ω
x
Open Load
330Ω
infinite
D02AU1340
15/34
Diagnostics functional description
4.2
TDA7564B
Permanent diagnostics
Detectable conventional faults are:
–
Short to gnd
–
Short to VS
–
Short across the speaker
The following additional features are provided:
–
Output offset detection
The TDA7564B has 2 operating statuses:
1.
RESTART mode. The diagnostic is not enabled. Each audio channel operates
independently from each other. If any of the a.m. faults occurs, only the channel(s)
interested is shut down. A check of the output status is made every 1 ms (Figure 25).
Restart takes place when the overload is removed.
2.
DIAGNOSTIC mode. It is enabled via I2C bus and self activates if an output overload
(such to cause the intervention of the short-circuit protection) occurs to the speakers
outputs. Once activated, the diagnostics procedure develops as follows (Figure 26):
–
To avoid momentary re-circulation spikes from giving erroneous diagnostics, a
check of the output status is made after 1ms: if normal situation (no overloads) is
detected, the diagnostic is not performed and the channel returns back active.
–
Instead, if an overload is detected during the check after 1 ms, then a diagnostic
cycle having a duration of about 100 ms is started.
–
After a diagnostic cycle, the audio channel interested by the fault is switched to
RESTART mode. The relevant data are stored inside the device and can be read
by the microprocessor. When one cycle has terminated, the next one is activated
by an I2C reading. This is to ensure continuous diagnostics throughout the carradio operating time.
–
To check the status of the device a sampling system is needed. The timing is
chosen at microprocessor level (over half a second is recommended).
Figure 25. Restart timing without diagnostic enable (permanent) - Each 1mS time, a
sampling of the fault is done
Out
1-2mS
1mS
1mS
1mS
1mS
t
Overcurrent and short
circuit protection intervention
(i.e. short circuit to GND)
Short circuit removed
Figure 26. Restart timing with diagnostic enable (permanent)
1-2mS
100/200mS
1mS
1mS
t
Overcurrent and short
circuit protection intervention
(i.e. short circuit to GND)
16/34
Short circuit removed
TDA7564B
4.3
Diagnostics functional description
Output DC offset detection
Any DC output offset exceeding ±2 V are signalled out. This inconvenient might occur as a
consequence of initially defective or aged and worn-out input capacitors feeding a DC
component to the inputs, so putting the speakers at risk of overheating.
This diagnostic has to be performed with low-level output AC signal (or Vin = 0).
The test is run with selectable time duration by microprocessor (from a "start" to a "stop"
command):
–
Start = Last reading operation or setting IB1 - D5 - (offset enable) to 1
–
Stop = Actual reading operation
Excess offset is signalled out if persistent throughout the assigned testing time. This feature
is disabled if any overloads leading to activation of the short-circuit protection occurs in the
process.
4.4
AC diagnostic
It is targeted at detecting accidental disconnection of tweeters in 2-way speaker and, more
in general, presence of capacitive (AC) coupled loads.
This diagnostic is based on the notion that the overall speaker's impedance (woofer +
parallel tweeter) will tend to increase towards high frequencies if the tweeter gets
disconnected, because the remaining speaker (woofer) would be out of its operating range
(high impedance). The diagnostic decision is made according to peak output current
thresholds, and it is enabled by setting (IB2-D2) = 1. Two different detection levels are
available:
–
High current threshold IB2 (D7) = 0
Iout > 500mApk = normal status
Iout < 250mApk = open tweeter
–
Low current threshold IB2 (D7) = 1
Iout > 250mApk = normal status
Iout < 125mApk = open tweeter
To correctly implement this feature, it is necessary to briefly provide a signal tone (with the
amplifier in "play") whose frequency and magnitude are such to determine an output current
higher than 500mApk with IB2(D7)=0 (higher than 250mApk with IB2(D7)=1) in normal
conditions and lower than 250mApk with IB2(D7)=0 (lower than 125mApk with IB2(D7)=1)
should the parallel tweeter be missing.
The test has to last for a minimum number of 3 sine cycles starting from the activation of the
AC diagnostic function IB2<D2>) up to the I2C reading of the results (measuring period). To
confirm presence of tweeter, it is necessary to find at least 3 current pulses over the above
threadless over all the measuring period, else an "open tweeter" message will be issued.
The frequency / magnitude setting of the test tone depends on the impedance
characteristics of each specific speaker being used, with or without the tweeter connected
(to be calculated case by case). High-frequency tones (> 10 KHz) or even ultrasonic signals
are recommended for their negligible acoustic impact and also to maximize the impedance
module's ratio between with tweeter-on and tweeter-off.
Figure 27 shows the load impedance as a function of the peak output voltage and the
relevant diagnostic fields.
17/34
Diagnostics functional description
TDA7564B
This feature is disabled if any overloads leading to activation of the short-circuit protection
occurs in the process.
Figure 27. Current detection high: load impedance |Z| vs. output peak voltage
Load |z| (Ohm)
50
Iout (peak) <250mA
Low current detection area
(Open load)
D5 = 1 of the DBx byres
30
20
Iout (peak) >500mA
10
IB2(D7) = 0
High current detection area
(Normal load)
D5 = 0 of the DBx bytes
5
3
2
1
1
2
3
4
5
6
7
8
Vout (Peak)
Figure 28. Current detection low: load impedance |Z| vs. output peak voltage
Load |z| (Ohm)
50
Iout (peak) <125mA
30
20
Low current detection area
(Open load)
D5 = 1 of the DBx byres
Iout (peak) >250mA
10
IB2(D7) = 1
High current detection area
(Normal load)
D5 = 0 of the DBx bytes
5
3
2
1
0.5
1
1.5
2
Vout (Peak)
18/34
2.5
3
3.5
4
TDA7564B
5
Multiple faults
Multiple faults
When more misconnections are simultaneously in place at the audio outputs, it is
guaranteed that at least one of them is initially read out. The others are notified after
successive cycles of I2C reading and faults removal, provided that the diagnostic is enabled.
This is true for both kinds of diagnostic (Turn on and Permanent).
The table below shows all the couples of double-fault possible. It should be taken into
account that a short circuit with the 4 ohm speaker unconnected is considered as double
fault.
Table 5.
Double fault table for turn-on diagnostic
S. GND (so)
S. GND (sk)
S. Vs
S. Across L.
Open L.
S. GND (so)
S. GND
S. GND
S. Vs + S.
GND
S. GND
S. GND
S. GND (sk)
/
S. GND
S. Vs
S. GND
Open L. (*)
S. Vs
/
/
S. Vs
S. Vs
S. Vs
S. Across L.
/
/
/
S. Across L.
N.A.
Open L.
/
/
/
/
Open L. (*)
S. GND (so) / S. GND (sk) in the above table make a distinction according to which of the 2
outputs is shorted to ground (test-current source side= so, test-current sink side = sk). More
precisely, in Channels LF and RR, so = CH+, sk = CH-; in Channels LR and RF, so = CH-, sk
= CH+.
In Permanent Diagnostic the table is the same, with only a difference concerning Open
Load(*), which is not among the recognizable faults. Should an Open Load be present
during the device's normal working, it would be detected at a subsequent Turn on Diagnostic
cycle (i.e. at the successive Car Radio Turn on).
5.1
Faults availability
All the results coming from I2C bus, by read operations, are the consequence of
measurements inside a defined period of time. If the fault is stable throughout the whole
period, it will be sent out.
To guarantee always resident functions, every kind of diagnostic cycles (Turn on,
Permanent, Offset) will be reactivate after any I2C reading operation. So, when the micro
reads the I2C, a new cycle will be able to start, but the read data will come from the previous
diag. cycle (i.e. The device is in Turn On state, with a short to Gnd, then the short is
removed and micro reads I2C. The short to Gnd is still present in bytes, because it is the
result of the previous cycle. If another I2C reading operation occurs, the bytes do not show
the short). In general to observe a change in Diagnostic bytes, two I2C reading operations
are necessary.
19/34
Thermal protection
6
TDA7564B
Thermal protection
Thermal protection is implemented through thermal foldback (Figure 29).
Thermal foldback begins limiting the audio input to the amplifier stage as the junction
temperatures rise above the normal operating range. This effectively limits the output power
capability of the device thus reducing the temperature to acceptable levels without totally
interrupting the operation of the device.
The output power will decrease to the point at which thermal equilibrium is reached.
Thermal equilibrium will be reached when the reduction in output power reduces the
dissipated power such that the die temperature falls below the thermal foldback threshold.
Should the device cool, the audio level will increase until a new thermal equilibrium is
reached or the amplifier reaches full power. Thermal foldback will reduce the audio output
level in a linear manner.
Three Thermal warning are available through the I2C bus data.
Figure 29. Thermal foldback diagram
Vout
Vout
TH. WARN. TH. WARN. TH. WARN.
ON
ON
ON
125°
140°
< TSD
CD out
155°
TH. SH.
START
TH. SH.
END
> TSD (with same input
signal)
Tj ( °C)
Tj ( °C)
Tj ( °C)
6.1
I2C programming/reading sequences
A correct turn on/off sequence respectful of the diagnostic timings and producing no audible
noises could be as follows (after battery connection):
Turn-on: (stand-by out + diag enable) --- 500 ms (min.) --- muting out
Turn-off: muting in --- 20 ms --- (diag disable + stand-by in)
Car Radio Installation: diag enable (write) --- 200 ms --- I2C read (repeat until All faults
disappear).
AC test: feed h.f. tone -- AC diag enable (write) --- wait > 3 cycles --- I2C read
(repeat I2C reading until tweeter-off message disappears).
Offset test: Device in play (no signal) -- offset enable - 30ms - I2C reading
(repeat I2C reading until high-offset message disappears).
20/34
TDA7564B
7
Fast muting
Fast muting
The muting time can be shortened to less than 1.5ms by setting (IB2) D5 = 1. This option
can be useful in transient battery situations (i.e. during car engine cranking) to quickly
turnoff the amplifier for avoiding any audible effects caused by noise/transients being
injected by preamp stages. The bit must be set back to “0” shortly after the mute transition.
21/34
I2C Bus interface
8
TDA7564B
I2C Bus interface
Data transmission from microprocessor to the TDA7564B and vice versa takes place
through the 2 wires I2C Bus interface, consisting of the two lines SDA and SCL (pull-up
resistors to positive supply voltage must be connected).
8.1
Data validity
As shown by Figure 30, the data on the SDA line must be stable during the high period of
the clock. The HIGH and LOW state of the data line can only change when the clock signal
on the SCL line is LOW.
8.2
Start and stop conditions
As shown by Figure 31 a start condition is a high to low transition of the SDA line while SCL
is HIGH. The stop condition is a low to high transition of the SDA line while SCL is high.
8.3
Byte format
Every byte transferred to the SDA line must contain 8 bits. Each byte must be followed by an
acknowledge bit. The MSB is transferred first.
8.4
Acknowledge
The transmitter* puts a resistive high level on the SDA line during the acknowledge clock
pulse (see Figure 32). The receiver** the acknowledges has to pull-down (low) the SDA line
during the acknowledge clock pulse, so that the SDA line is stable low during this clock
pulse.
* Transmitter
–
master (μP) when it writes an address to the TDA7564B
–
slave (TDA7564B) when the μP reads a data byte from TDA7564B
** Receiver
–
slave (TDA7564B) when the μP writes an address to the TDA7564B
–
master (µP) when it reads a data byte from TDA7564B
Figure 30. Data validity on the I2C Bus
SDA
SCL
DATA LINE
STABLE, DATA
VALID
22/34
CHANGE
DATA
ALLOWED
D99AU1031
I2C Bus interface
TDA7564B
Figure 31. Timing diagram on the I2C Bus
SCL
I2CBUS
SDA
D99AU1032
START
STOP
Figure 32. Acknowledge on the I2C Bus
SCL
1
2
3
7
8
9
SDA
MSB
START
D99AU1033
ACKNOWLEDGMENT
FROM RECEIVER
23/34
Software specifications
9
TDA7564B
Software specifications
All the functions of the TDA7564B are activated by I2C interface.
The bit 0 of the "ADDRESS BYTE" defines if the next bytes are write instruction (from µP to
TDA7564B) or read instruction (from TDA7564B to µP).
D7
D0
1
1
0
1
1
0
X = 0 Write to device
X = 1 Read from device
If R/W = 0, the μP sends 2 "Instruction Bytes": IB1 and IB2.
Table 6.
IB1
Bit
24/34
Instruction decoding bit
D7
0
D6
Diagnostic enable (D6 = 1)
Diagnostic defeat (D6 = 0)
D5
Offset Detection enable (D5 = 1)
Offset Detection defeat (D5 = 0)
D4
Front Channel
Gain = 26dB (D4 = 0)
Gain = 12dB (D4 = 1)
D3
Rear Channel
Gain = 26dB (D3 = 0)
Gain = 12dB (D3 = 1)
D2
Mute front channels (D2 = 0)
Unmute front channels (D2 = 1)
D1
Mute rear channels (D1 = 0)
Unmute rear channels (D1 = 1)
D0
Clip detector 2% (D0 = 0)
Clip detector 10% (D0 = 1)
0
X
D8 Hex
TDA7564B
Software specifications
Table 7.
IB2
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Instruction decoding bit
Current detection threshold
High th (D7 = 0)
Low th (D7 =1)
0
Normal muting time (D5 = 0)
Fast muting time (D5 = 1)
Stand-by on - Amplifier not working - (D4 = 0)
Stand-by off - Amplifier working - (D4 = 1)
Power amplifier mode diagnostic (D3 = 0)
Line driver mode diagnostic (D3 = 1)
Current detection diagnostic enabled (D2 = 1)
Current detection diagnostic defeat (D2 = 0)
Right Channels
Power amplifier working in standard mode (D1 = 0)
Power amplifier working in high efficiency mode (D1 = 1)
Left Channels
Power amplifier working in standard mode (D0 = 0)
Power amplifier working in high efficiency mode (D0 = 1)
If R/W = 1, the TDA7564B sends 4 "Diagnostics Bytes" to μP: DB1, DB2, DB3 and DB4.
Table 8.
Bit
D7
D6
D5
D4
D3
D2
D1
D0
DB1
Instruction decoding bit
Thermal warning 1 active (D7 = 1) T=155 °C
Diag. cycle not activated or not terminated (D6 = 0)
Diag. cycle terminated (D6 = 1)
Channel LF
Current detection IB2 (D7) = 0
Output peak current < 250 mA - Open load (D5 = 1)
Output peak current > 500 mA - Normal load (D5 = 0)
Channel LF
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
Channel LF
Normal load (D3 = 0)
Short load (D3 = 1)
Channel LF
Turn-on diag.: No open load (D2 = 0)
Open load detection (D2 = 1)
Offset diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
Channel LF
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
Channel LF
No short to GND (D1 = 0)
Short to GND (D1 = 1)
Channel LF
Current detection IB2 (D7) = 1
Output peak current < 125 mA - Open load (D5 = 1)
Output peak current > 250 mA - Normal load (D5 = 0)
25/34
Software specifications
Table 9.
TDA7564B
DB2
Bit
Instruction decoding bit
D7
Offset detection not activated (D7 = 0)
Offset detection activated (D7 = 1)
D6
Current sensor not activated (D6 = 0)
Current sensor activated (D6 = 1)
D5
Channel LR
Current detection IB2 (D7) = 0
Output peak current < 250 mA - Open load (D5 = 1)
Output peak current > 500 mA - Normal load (D5 = 0)
D4
Channel LR
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
D3
Channel LR
Normal load (D3 = 0)
Short load (D3 = 1)
D2
Channel LR
Turn-on diag.: No open load (D2 = 0)
Open load detection (D2 = 1)
Permanent diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
D1
Channel LR
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
D0
Channel LR
No short to GND (D1 = 0)
Short to GND (D1 = 1)
26/34
Channel LR
Current detection IB2 (D7) = 1
Output peak current < 250 mA - Open load (D5 = 1)
Output peak current > 500 mA - Normal load (D5 = 0)
TDA7564B
Table 10.
Software specifications
DB3
Bit
Instruction decoding bit
D7
Stand-by status (= IB2 - D4)
D6
Diagnostic status (= IB1 - D6)
D5
Channel RF
Current detection IB2 (D7) = 0
Output peak current < 250 mA - Open load (D5 = 1)
Output peak current > 500 mA - Normal load (D5 = 0)
D4
Channel RF
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
D3
Channel RF
Normal load (D3 = 0)
Short load (D3 = 1)
D2
Channel RF
Turn-on diag.: No open load (D2 = 0)
Open load detection (D2 = 1)
Permanent diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
D1
Channel RF
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
D0
Channel RF
No short to GND (D1 = 0)
Short to GND (D1 = 1)
Channel RF
Current detection IB2 (D7) = 1
Output peak current < 250 mA - Open load (D5 = 1)
Output peak current > 500 mA - Normal load (D5 = 0)
27/34
Software specifications
Table 11.
TDA7564B
DB4
Bit
Instruction decoding bit
D7
Thermal warning 2 active (D7 =1) T=140°C
D6
Thermal warning 3 active (D6 =1) T=125°C
D5
Channel RR
Current detection IB2 (D7) = 0
Output peak current < 250 mA - Open load (D5 = 1)
Output peak current > 500 mA - Normal load (D5 = 0)
D4
Channel RR
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
D3
Channel RR
Normal load (D3 = 0)
Short load (D3 = 1)
D2
Channel RR
Turn-on diag.: No open load (D2 = 0)
Open load detection (D2 = 1)
Permanent diag.: No output offset (D2 = 0)
Output offset detection (D2 = 1)
D1
Channel RR
No short to Vcc (D1 = 0)
Short to Vcc (D1 = 1)
D0
Channel RR
No short to GND (D1 = 0)
Short to GND (D1 = 1)
28/34
Channel RR
Current detection IB2 (D7) = 1
Output peak current < 250 mA - Open load (D5 = 1)
Output peak current > 500 mA - Normal load (D5 = 0)
TDA7564B
10
Examples of bytes sequence
Examples of bytes sequence
1 - Turn-on diagnostic - Write operation
Start
Address byte with D0 = 0
ACK
IB1 with D6 = 1
ACK
IB2
ACK
STOP
2 - Turn-on diagnostic - Read operation
Start Address byte with D0 = 1 ACK DB1
ACK DB2 ACK DB3 ACK DB4 ACK STOP
The delay from 1 to 2 can be selected by software, starting from 1 ms
3a - Turn-on of the power amplifier with 26dB gain, mute on, diagnostic defeat, High eff.
mode both channels.
.
Start
Address byte with D0 = 0
ACK
IB1
ACK
X000000X
IB2
ACK
STOP
ACK
STOP
ACK
STOP
XXX1X011
3b - Turn-off of the power amplifier
Start
Address byte with D0 = 0
ACK
IB1
ACK
X0XXXXXX
IB2
XXX0XXXX
4 - Offset detection procedure enable
Start
Address byte with D0 = 0
ACK
IB1
ACK
XX1XX11X
IB2
XXX1X0XX
5 - Offset detection procedure stop and reading operation (the results are valid only for the
offset detection bits (D2 of the bytes DB1, DB2, DB3, DB4)
.
Start Address byte with D0 = 1 ACK DB1
ACK
DB2 ACK DB3 ACK DB4 ACK STOP
●
The purpose of this test is to check if a D.C. offset (2V typ.) is present on the outputs,
produced by input capacitor with anomalous leakage current or humidity between pins.
●
The delay from 4 to 5 can be selected by software, starting from 1ms
6 - Current detection procedure start (the AC inputs must be with a proper signal that
depends on the type of load)
Start
Address byte with D0 = 0
ACK
IB1
ACK
XX01111X
IB2
ACK
STOP
XXX1X1XX
Current detection reading operation (the results valid only for the current sensor detection
bits - D5 of the bytes DB1, DB2, DB3, DB4)
.
Start Address byte with D0 = 1 ACK DB1 ACK DB2
ACK
DB3
ACK
DB4
ACK STOP
●
During the test, a sinus wave with a proper amplitude and frequency (depending on the
loudspeaker under test) must be present. The minimum number of periods that are
needed to detect a normal load is 5.
●
The delay from 6 to 7 can be selected by software, starting from 1ms.
29/34
Package information
11
TDA7564B
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 33. Flexiwatt25 (horizontal) mechanical data and package dimensions
DIM.
A
B
C
D
E
F (1)
G
G1
H (2)
H1
H2
H3
L (2)
L1
L2 (2)
L3
L4
L5
L6
M
M1
M2
N
P
R
R1
R2
R3
R4
V
V1
V2
V3
MIN.
4.45
1.80
0.37
0.75
23.70
28.90
21.64
10.15
15.50
7.70
5.15
1.80
2.75
3.20
mm
TYP.
4.50
1.90
1.40
2.00
0.39
1.00
24.00
29.23
17.00
12.80
0.80
22.04
10.5
15.70
7.85
5
5.45
1.95
3.00
4.73
5.61
2.20
3.50
1.70
0.50
0.30
1.25
0.50
MAX.
4.65
2.00
MIN.
0.175
0.070
0.42
0.57
1.25
24.30
29.30
0.014
22.44
10.85
15.90
7.95
0.852
0.40
0.610
0.303
5.85
2.10
3.50
0.203
0.070
0.108
3.80
0.126
0.029
0.933
1.139
inch
TYP.
0.177
0.074
0.055
0.079
0.015
0.040
0.945
1.150
0.669
0.503
0.031
0.868
0.413
0.618
0.309
0.197
0.214
0.077
0.118
0.186
0.220
0.086
0.138
0.067
0.02
0.12
0.049
0.02
MAX.
0.183
0.079
OUTLINE AND
MECHANICAL DATA
0.016
0.022
0.049
0.957
1.153
0.883
0.427
0.626
0.313
0.23
0.083
0.138
0.15
5˚ (Typ.)
3˚ (Typ.)
20˚ (Typ.)
45˚ (Typ.)
Flexiwatt25
(Horizontal)
(1): dam-bar protusion not included; (2): molding protusion included
7399733 A
30/34
TDA7564B
Package information
Figure 34. Flexiwatt25 (vertical) mechanical data and package dimensions
DIM.
A
B
C
D
E
F (1)
G
G1
H (2)
H1
H2
H3
L (2)
L1
L2 (2)
L3
L4
L5
M
M1
N
O
R
R1
R2
R3
R4
V
V1
V2
V3
MIN.
4.45
1.80
0.75
0.37
0.80
23.75
28.90
22.07
18.57
15.50
7.70
3.70
3.60
mm
TYP.
4.50
1.90
1.40
0.90
0.39
1.00
24.00
29.23
17.00
12.80
0.80
22.47
18.97
15.70
7.85
5
3.5
4.00
4.00
2.20
2
1.70
0.5
0.3
1.25
0.50
MAX.
4.65
2.00
MIN.
0.175
0.070
1.05
0.42
0.57
1.20
24.25
29.30
0.029
0.014
0.031
0.935
1.139
22.87
19.37
15.90
7.95
0.869
0.731
0.610
0.303
4.30
4.40
0.145
0.142
inch
TYP.
0.177
0.074
0.055
0.035
0.015
0.040
0.945
1.150
0.669
0.503
0.031
0.884
0.747
0.618
0.309
0.197
0.138
0.157
0.157
0.086
0.079
0.067
0.02
0.12
0.049
0.019
MAX.
0.183
0.079
OUTLINE AND
MECHANICAL DATA
0.041
0.016
0.022
0.047
0.955
1.153
0.904
0.762
0.626
0.313
0.169
0.173
Flexiwatt25 (vertical)
5˚ (T p.)
3˚ (Typ.)
20˚ (Typ.)
45˚ (Typ.)
(1): dam-bar protusion not included
(2): molding protusion included
V
C
B
V
H
H1
V3
A
H2
O
H3
R3
L4
R4
V1
R2
L2
N
L3
R
L
L1
V1
V2
R2
D
R1
L5
Pin 1
R1
R1
E
G
G1
F
FLEX25ME
M
M1
7034862
31/34
Package information
TDA7564B
Figure 35. PowerSO36 (slug up) mechanical data and package dimensions
DIM.
A
A2
A4
A5
a1
b
c
D
D1
D2
E
E1
E2
E3
E4
e
e3
G
H
h
L
N
s
MIN.
3.25
3.1
0.8
mm
TYP.
MAX.
3.43
3.2
1
MIN.
0.128
0.122
0.031
-0.040
0.38
0.32
16
9.8
0.0011
0.008
0.009
0.622
0.37
14.5
11.1
2.9
6.2
3.2
0.547
0.429
0.2
0.030
0.22
0.23
15.8
9.4
5.8
2.9
0.8
OUTLINE AND
MECHANICAL DATA
-0.0015
0.015
0.012
0.630
0.38
0.039
0.57
0.437
0.114
0.244
1.259
0.228
0.114
0.65
11.05
0
15.5
MAX.
0.135
0.126
0.039
0.008
1
13.9
10.9
inch
TYP.
0.026
0.435
0.075
15.9
1.1
1.1
10˚
8˚
0
0.61
0.031
0.003
0.625
0.043
0.043
10˚
8˚
PowerSO36 (SLUG UP)
(1) “D and E1” do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.15mm (0.006”)
(2) No intrusion allowed inwards the leads.
7183931 D
32/34
TDA7564B
12
Revision history
Revision history
Table 12.
Document revision history
Date
Revision
14-Sep-2006
1
Initial release.
2
Add new package and part numbers in Table 1: Device
summary on page 1.
Add PowerSO36 pin connections diagram Figure 4 on page 7.
Changed the max. value of the “Lonp” parameter in Table 4 on
page 8.
Modified Figure 23 on page 15.
Add PowerSO36 package information Figure 35 on page 32.
Changed the min. and typ. value of the VM parameter in the
Table 4.
Updated Table 3: Thermal data.
22-Jan-2007
Changes
33/34
TDA7564B
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