TOSHIBA TB2902HQ

TB2902HQ
TOSHIBA Bi-CMOS Digital Integrated Circuit Silicon Monolithic
TB2902HQ
Maximum Power 41 W BTL × 4-ch Audio Power IC
The TB2902HQ is 4ch audio amplifier for car audio application.
This IC can generate high power, high quality sound output,
POUT MAX = 41 W, using a pure complementary P-ch and N-ch
DMOS output stage.
The built-in self diagnosis function which is included can be
controlled via I2C BUS.
In addition, stand-by and mute function, and various
Protection feature are included.
Features
Weight: 7.7 g (typ.)
•
High power output
: POUT MAX (1) = 41 W (typ.)
(VCC = 14.4 V, f = 1 kHz, JEITA max, RL = 4 Ω)
: POUT MAX (2) = 37 W (typ.)
(VCC = 13.7 V, f = 1 kHz, JEITA max, RL = 4 Ω)
: POUT MAX (3) = 70 W (typ.)
(VCC = 14.4 V, f = 1 kHz, JEITA max, RL = 2 Ω)
: POUT (1) = 27 W (typ.)
(VCC = 14.4 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
: POUT (2) = 23 W (typ.)
(VCC = 13.2 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
: POUT (3) = 45 W (typ.)
(VCC = 14.4 V, f = 1 kHz, THD = 10%, RL = 2 Ω)
•
Low distortion ratio: THD = 0.015% (typ.)
(VCC = 13.2 V, f = 1 kHz, POUT = 5 W, RL = 4 Ω)
•
Low noise: VNO = 90 µVrms (typ.)
(VCC = 13.2 V, Rg = 0 Ω, BW = 20 Hz to 20 kHz, RL = 4 Ω)
•
Built in stand by & muting function: controlled via I2C Bus (pin 16)
•
Built in clipping detection (pin 4)
•
Built in I2C Bus for stand-by, mute, voltage gain control, self diagnosis: Output short detection, offset detection,
tweeter or speaker open detection (pin 22 and 25)
•
Built-in various protection circuits (Note 1, Note 2)
Thermal shut down, over-voltage, out to GND, out to VCC, out to out short circuit
•
Operating supply voltage: VCC (opr) = 9 to 18 V (RL = 4 Ω)
VCC (opr) = 9 to 16 V (RL = 2 Ω)
Note 1: Install the product correctly. Otherwise, it may result in break down, damage and/or degradation to the
product or equipment.
Note 2: These protection functions are intended to avoid some output short circuits or other abnormal conditions
temporarily. These protect functions do not warrant to prevent the IC from being damaged.
- In case of the product would be operated with exceeded guaranteed operating ranges, these protection
features may not operate and some output short circuits may result in the IC being damaged.
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Block Diagram
20
VCC1
C1
11
IN1
8
7
5
C1
12
IN2
2
3
C4
16
For Mute
Time constant
17
15
IN3
18
C1
19
13 Pre-GND
14
21
IN4
24
C1
23
PW-GND1
RF
RR
LF
LR
Out1 (−)
Out2 (+)
PW-GND2
Out2 (−)
Out3 (+)
PW-GND3
Out3 (−)
Out4 (+)
PW-GND4
Out4 (−)
22
SCL
25
SDA
2
SW
4 Clip Detection
Out1 (+)
RL = 4 Ω
9
RL = 4 Ω
6
VCC2
RL = 4 Ω
1
TAB
RL = 4 Ω
10
Ripple
C3
C5
C2
+B
IC
Bus
Diagnosis
Some of the functional blocks, circuits, or constants labels in the block diagram may have been omitted or
simplified for clarity.
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Caution and Application Information (description is made referring only on the single
channel.)
1. Voltage Gain Adjustment
This IC has no NF (negative feedback) Pins. Therefore, the voltage gain can not be adjusted (except by
software). However, this feature makes possible space and cost saving.
Amp. 2A
Amp. 1
Input
Amp. 2B
Figure 1
Block Diagram
The amplifier gain, GV = 26dB, is calculated using the expression below:
The voltage gain of amp.1: GV1 = 0dB
The voltage gain of amp.2A, B: GV2 = 20dB
The voltage gain of BTL connection: GV (BTL) = 6dB
Therefore, the total voltage gain is decided by expression below.
GV = GV1 + GV2 + GV (BTL) = 0 + 20 + 6 = 26dB
In the case when GV = 12dB selected via I2C, GV1 changed from 0dB to −14dB so that the output
dynamic range is reduced as the output of Amp.1 is attenuated.
2. Muting Time Constant and Pop Noise Suppression when VCC Rapidly Falls (pin 16)
C4
1 µF
The capacitor C4 at pin 16 is for muting time
constant to suppress the pop noise. The larger
value capacitor is used, the lower pop noise
becomes but the longer the muting time from the
mute ON command sent to muting an output
16
To mute circuit
sound actually. The charge period, which makes
the delay of muting after "Mute On" command is
written, is MIN=30msec, MAX=180msec in case
From low voltage
of C4 (Pin 16) = 1 uF, Vcc=9 to 18V and Tj = -40
muting circuit
to 150 degrees condition.
As the VCC is rapidly falling, the IC internal low
voltage muting operates to eliminate the large
pop noise basically.
If the effect of the internal low voltage muting
is not enough in such a case, make this pin 16 set
Figure 2 Pin 16 Muting Circuit
at low: 5 V and less by external circuit for more
effective to suppress the pop noise.
In this case, this pin 16 has to be released from setting at low before going back to play mode.
Additionally, the initial state after turning the amplifier “ON” or after turning stand by “off” by I2C Bus
is muted, so that it is necessary to send a “mute off” command to change from this condition to play mode.
Caution on the use of the muting function
The audio muting function is enabled when pin 16 is not set Low. While the time constant of the muting
function is determined by the value of C4, the designer should take into account the possible generation of
pop noise during switching operations. The pop noise which is generated when the power or muting
function is turned ON/OFF will vary according to the time constant set by capacitor C4 value.
In the case when C4 value is large and the time constant is long, pop noise will be suppressed during the
time interval when the voltage on pin 16 is falling.
However, the pop noise may become apparent as a “peaky” sound if the mute ON or OFF command is
sent from µController while the voltage at pin 16 is rising.
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3. Clip Detection
The output clip detection terminal, pin 4, has an open collector output structure on chip as shown in
Figure 3. In the case when the output waveform is clipping, the clip detection circuit is operated and the
NPN Tr. is turned on.
It is possible to improve the audio output quality by controlling the volume and/or tone control circuits
through a low pass filter (L.P.F) smoothing circuit as shown in Figure 3.
The sensitivity of the circuit to clipping level can be selected T.H.D. = 1% or 10% via I2C bus.
In the event that this function is not used, pin4 should be left open circuit.
4
Volume control circuit
L.P.F.
smoothing
circuit
Clip detector
Tone control circuit
Output AC
waveform
Internal detection
circuit
Clip Det. 5 V
output
GND
Waveform L.P.F
output
Figure 3
Clip Detection
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4. External Component Values
Component Recommended
Name
Value
C1
0.22 µF
Effect
Purpose
To eliminate DC
Lower than Recommended
Value
Cut-off frequency becomes
higher
Higher than Recommended
Value
Cut-off frequency becomes
lower
Notes
Pop noise is
concerned with
this capacitor.
To reduce ripple
C2
10 µF
C3
0.1 µF
C4
1 µF
C5
3900 µF
To determine the
time of turn on
diag
Power ON/OFF time and turn Power ON/OFF time and turn
ON diag cycle shorter
ON diag cycle longer
To provide
sufficient
oscillation margin
Reduces noise and provides sufficient oscillation margin
To reduce pop
noise
Pop noise becomes larger
Muting ON/OFF time is
shorter
Ripple filter
Power supply ripple filtering
Pop noise becomes smaller
Muting ON/OFF time is
longer
Note 3: In case of the recommended value not used.
5. Fast Mute Mode
This feature will normally be used to suppress pop noise resulting from VCC transients during engine
cranking condition.
The fast mute mode can be entered on receipt of a command via I2C bus.
Using the IB2 register and setting to ‘one’ the bit D6, it is possible to generate a fast I2C mute command.
If a fast mute command is received, this IC will operate and will discharge the capacitor C4 at pin16.
Therefore the Pop sound will be reduced compared to the condition when Fast Mute is not used in the
engine cranking condition.
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6. Explanation for Self Diagnosis Via I2C
(1)
Bus map
【Slave Address】
Bit7
1
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0
Write Mode
1
Read Mode
0
1
1
0
0
⎯
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
1
Details
Hex
D8H
【WRITE】
•
Bit7
Sub address
Bit6
Details
Hex
0
Page Mode (auto increment) OFF
1
Page Mode (auto increment) ON
⎯
0
0
0
0
0
0
1
Control Byte1
01H
⎯
0
0
0
0
0
1
0
Control Byte2
02H
•
Control byte1 (01H)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0
0
0
0
0
0
0
1
Clip Det 1% to 10% change
0
0
0
0
0
0
1
0
R-ch Muting off (play)
0
0
0
0
0
1
0
0
Fch Muting off (play)
0
0
0
0
1
0
0
0
R-ch Gain 26dB to 12dB
0
0
0
1
0
0
0
0
Fch Gain 26dB to 12dB
0
0
1
0
0
0
0
0
Offset Det Enable
0
1
0
0
0
0
0
0
Diag Cycle Enable
1
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Turn-on Select (normal/repeatedly)
•
Function
Control byte2 (02H)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Function
0
0
0
0
0
0
0
1
R-ch Iccq become Lower
0
0
0
0
0
0
1
0
Fch Iccq become Lower
0
0
0
0
0
1
0
0
Current Detection Enable
0
0
0
0
1
0
0
0
Line Drive Diag
0
0
0
1
0
0
0
0
Stand By OFF (play)
0
0
1
0
0
0
0
0
Clip Det Pin change to Offset Det
⎯
1
⎯
⎯
⎯
⎯
⎯
⎯
Fast mute ON/OFF
1
0
0
0
0
0
0
0
Current Detection. Level change from 500 mA
(max) to 300 mA (max)
Note 4: Self mute circuit is included on chip and is in independent from I2C bus stage.
Self mute operating voltage is VCC = 7.8 V
Note 5: Auto Increment is available.
If control byte 1 is chosen by sub address, it is not necessary to send byte 2 in cases when both byte 1 and
2 are to be written.
Ex) In case of sub address = byte1 chosen:
Sub address byte 1 → byte 1 writing → Sub address byte 2 → byte 2 writing: available
Sub address byte 1 → byte 1 writing ---------------------------- → byte 2 writing: available
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【READ】
Byte 1
At “Bit = 1” Condition
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0
0
0
0
0
0
0
1
Ch1 Short to GND
0
0
0
0
0
0
1
0
Ch1 Short to VCC
0
0
0
0
0
1
0
0
Ch1 Open load or Offset Detected
0
0
0
0
1
0
0
0
Ch1 Short load
0
0
0
1
0
0
0
0
Ch1 Diagnosis condition (bit = 1: permanent, 0: turn-on)
Ch1 Current Detection (at IB2 D2 = 1 = enable only)
0
0
1
0
0
0
0
0
(IB2 − D7 = 0: bit = 1: <250 mA, 0: >500 mA)
(IB2 − D7 = 1: bit = 1: <100 mA, 0: >300 mA)
0
1
0
0
0
0
0
0
Bit = 1: Diag. Cycle terminated, 0: Not terminated
1
0
0
0
0
0
0
0
TSD Mute ON (thermal warning)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0
0
0
0
0
0
0
1
Ch2 Short to GND
0
0
0
0
0
0
1
0
Ch2 Short to VCC
0
0
0
0
0
1
0
0
Ch2 Open load or Offset Detected
0
0
0
0
1
0
0
0
Ch2 Short load
0
0
0
1
0
0
0
0
Ch2 Diagnosis condition (bit = 1: permanent, 0: turn-on)
0
0
1
0
0
0
0
0
Byte 2
At “Bit = 1” Condition
Ch2 Current Detection (at IB2 D2 = 1 = enable only)
(IB2 − D7 = 0: bit = 1: <250 mA, 0: >500 mA)
(IB2 − D7 = 1: bit = 1: <100 mA, 0: >300 mA)
0
1
0
0
0
0
0
0
Current sensor activated (D6 = 1)
1
0
0
0
0
0
0
⎯
Offset detection activated (D7 = 1)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0
0
0
0
0
0
0
1
Ch3 Short to GND
0
0
0
0
0
0
1
0
Ch3 Short to VCC
0
0
0
0
0
1
0
0
Ch3 Open load or Offset Detected
0
0
0
0
1
0
0
0
Ch3 Short load
0
0
0
1
0
0
0
0
Ch3 Diagnosis condition (bit = 1: permanent, 0: turn-on)
Byte 3
At “Bit = 1” Condition
Ch3 Current Detection (at IB2 D2 = 1 = enable only)
0
0
1
0
0
0
0
0
(IB2 − D7 = 0: bit = 1: <250 mA, 0: >500 mA)
(IB2 − D7 = 1: bit = 1: <100 mA, 0: >300 mA)
⎯
1
⎯
⎯
⎯
⎯
⎯
⎯
Diagnotic status (= IB1 − D6 bit = 1: diag enable)
1
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Stand-by status (= IB2 − D4 bit = 1: play)
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Byte 4
At “Bit = 1” Condition
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0
0
0
0
0
0
0
1
Ch4 Short to GND
0
0
0
0
0
0
1
0
Ch4 2 Short to VCC
0
0
0
0
0
1
0
0
Ch4 Open load or Offset Detected
0
0
0
0
1
0
0
0
Ch4 Short load
0
0
0
1
0
0
0
0
Ch4 Diagnosis condition (bit = 1: permanent, 0: turn-on)
Ch4 Current Detection (at IB2 D2 = 1 = enable only)
0
0
1
0
0
0
0
0
(IB2 − D7 = 0: bit = 1: <250 mA, 0: >500 mA)
(IB2 − D7 = 1: bit = 1: <100 mA, 0: >300 mA)
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
x
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
x
Note 6: Short circuit protection can be operated channel by channel.
EX) If channel 1 output is shorted, channel 1 is protected but other channels are available.
Caution: sub address 0x15 (15H) is for our internal testing only. Do not apply for your using.
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(2)
Description for turn on diagnosis
This IC can determine whether the conditions listed below occur or not at turn ON:
-Short to GND
-Short to VCC
-Output to output short
-Speaker open
As first “switch on”, the write data is sent to “turn ON” the IC.
If the turn on diagnostic is activated at this time, the write data, with the diagnostic cycle byte: IB1
D6 set at 1, is sent at the same time
The result of self diagnosis can be obtained from the read data sent after the turn on diagnostic
data permitted time, as below Figure:
WRITE DATA
READ DATA
READ DATA
Pin10
ripple
voltage
Permanent diagnostic
enable
Turn On diagnostic DATA
permitted time
Turn On diagnostic
acquisition time (80 ms typ.)
Permanent diagnostic
DATA permitted time
FAULT
event
Figure 4
WRITE DATA
Set the
diagnostic
l
READ DATA
Diagnosis Timing Chart
WRITE DATA
To become standby off
(turning or power ON)
READ DATA
Pin10
ripple
voltage
Turn On diagnostic
acquisition time
(80 ms typ.)
Figure 5
Turn On diagnostic
between On and Off time
(100 ms typ.)
Number of Times Turn ON Diagnosis Timing Chart
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As initially, the write data is set when the on diagnostic cycle enable (IB1 D6 = 1), the turn on
diagnosis can be available for repeated use by sending the read command repeatedly after the initial
set up as shown as Figure 5.
Therefore, it is useful to check number of cycles from Power ON to the output appearance.
This IC has two built-in diagnostic modes dependent on the Turn-on timing.
A) Normal mode (one shot) of Turn-on diagnostics (data of IB1, D7 = 1)
B) Repeatability mode of Turn-on diagnostics (data of IB1, D7 = 0)
A) Normal mode (one shot diag.)
For example, if you want to get two valid readings, you have to send the command to read three
times.
True data are second data and third data.
This is trigger to enable the
diag cycle.
Writing
(diag cycle enable = 1)
(stand by OFF = 0)
You have to read for an
interval of 150 ms or more to
get a valid reading.
Reading 1
Reading 2
The Data just received was detected
on the previous diagnostic cycle.
Reading 3
2
I C command
Pin 10
About 100 m
DB1 D6
Diag enable
Fault event
Latch
For example
Short Load, Open Load etc.
When “Diag enable” goes
high, “Latch” is reflected at the
“Fault event”.
10
Diag cycle with Turn-ON
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B) Repetition mode
Maximum interval:
You can select the acquisition time.
Minimum interval:
It is determined by the speed of microcomputer.
Writing
(diag cycle enable = 1)
(stand by OFF = 0)
Reading 1
Reading 5
Reading 3
Reading 2
Reading 6
Reading 4
2
I C command
Pin 10
About 100 ms
DB1 D6
(acquisition time with only turn-ON)
About 80 ms
About 80 ms
Diag enable
Fault event
Latch
The turn ON diagnostic acquisition time is determined by the ripple filter capacitance C2 and
the equivalent internal resistance Rr as below expression.
Acquisition time = 2 × C2 × Rr = 4400 × C2 (typ.)
Rr is fixed in internal circuit and it is not varied by the fluctuation of power supply VCC voltage.
C2 value determines the time from power ON (standby off) to the appearance of sound signal
from output and the characteristic for ripple rejection ratio, too. So, take care with the decision on
C2 value.
If the turn ON diagnosis is not used, in other words the diagnostic cycle defeat command is sent,
the waveform of ripple terminal voltage will change but the time from turning on to the output
signal appearance will not change as illustrated below in Figure 6.
WRITE DATA
Pin10
ripple
pin
voltage
Turn ON diagnosis enable
Turn ON diagnosis defeat
Figure 6 Turn on Diagnosis Timing Chart when Turn on diagnosis not used.
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(3)
Description for permanent diagnosis
This IC can provide permanent diagnosis under the following conditions, whether they occur before
or after turning ON:
-Short to GND
-Short to VCC
-Output to output short circuit
-Output offset detection
-Current detection for tweeter open
This permanent diagnosis is available not only with the diagnostic cycle byte: IB1 D6 set at 1 but
also when set at 0.
Additionally, the signal can be obtained by entering just a read command. It is not necessary to
write the data.
With permanent diagnosis fault detection, the first read data after fault removal will still show a
Fault. Therefore, it is necessary to obtain 3 or more readings in order to prevent a miss judgment.
For example, the speaker sometimes makes a large counter electro motive force which this IC could
recognize as a fault event.
Additionally, this permanent diagnosis is automatically on after the turning on diagnosis operation
finished therefore there is no need to send the extra command.
READ DATA
WRITE DATA
READ DATA
result faulty
READ DATA
result faulty
READ DATA
result not faulty
Pin10
ripple
voltage
Permanent diagnostic DATA
permitted time
Turn On diagnostic
DATA permitted time
Turn On diagnostic
acquisition time (80 ms typ.)
FAULT
event
Figure 7
FAULT
removed
Permanent Diagnosis Timing Chart for Each Short Detection
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Regarding operation of the output offset detection, The software always detects the output offset
but the result is not latched internally as shown in the Figure below:
READ DATA
result faulty
WRITE DATA
READ DATA
result not faulty
Correct Tvos
READ DATA
result not faulty
Correct Tvos
Pin10
ripple
voltage
Permanent diagnostic DATA
permitted time
Turn On diagnostic
DATA permitted time
Turn On diagnostic
acquisition time (80 ms typ.)
FAULT
event
Figure 8
FAULT
removed
Software Output Offset Detection Timing Chart
However, this detection has to be performed in real time: Time voltage offset (Tvos) between read
and next read is set at Tvos = 1/the lowest signal frequency ,or more. For instance Tvos > 50 ms if the
lowest output signal frequency is 20 Hz, and to obtain 2 or more readings in order not to make a
misjudgment
Additionaly, the threshold level is designed at +/−2 V.
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The output from the terminal of pin 4 can be changed from clip detector to offset detector output by
sending the write command via I2C.
If the L.P.F output voltage has become a half of pull up voltage for a while, firstly the signal output
volume goes down (cliping detector function). After that, it can be judged that the abnormal output
offset has occurred, if the L.P.F. output voltage does not rise above half of pull up voltage.
4
Volume control circuit
L.P.F.
smoothing
circuit
Offset detector
System shut down
Abnormal offset occured
Vth
Output
waveform
Vth
Offset detector
output pin 4
Volume down
Judgement
Waveform
L.P.F output
Detection delay time
Waiting time for Prevention
misjudgement
Figure 9 Hardware Output Offset Detection
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When the current detector for Tweeter open check is used, it is neccesary to take care as below:
- Need to input the pulse or signal which is the higher out of audience frequency for example f =
20 kHz
- The pulse or signal input timing has to be after mute off (play mode)
- At least, the read timing has to be after 1 cycle of input pulse or signal and more, the
recommadation cycles are 3 cycle and more if can.
- The level of input pulse or signal is more than the detection threshold level 300 mA or 500 mA.
For instance, if the tweeter impedance is 20 Ω at f = 20 kHz which is same as input signal frequency,
the output minimum voltage is: Vout = 500 mA × 20 Ω = 10 V and more.
Play
Mute
Mute ON
WRITE DATA
stand by off
mute on
WRITE DATA
mute off
Output
READ DATA
invalidity
READ DATA
invalidity
READ DATA
invalidity
Current detector is not effective
Figure 10
READ DATA
validity
READ DATA
validity
Effective →
Tweeter Open Detection Timing Chart
Finally, if DB1 D7 = 1 then the temperature of IC chip is close to the thermal shutdown point.
This warning bit becomes high, about 10 degrees below the temperature at which the
overtemperature protection operates.
Note 7: Timing charts may have been simplified for ease of reading.
Note 8: Please arrange to read all self-diagnosis functions twice or more and apply judgment in order to
avoid false triggering.
<Since the first diagnostic result has low confidence, please diagnose 2 times or more.>
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(4)
Multiple faults
The self diagnosis shows as below tables when there are multi fault connection for the audio
outputs.
At Turning ON:
S.GND (out+)
S.GND (out+)
S.GND (out−)
S.VCC
Out to Out. S
Open L
S.GND
S.GND
S.Load
S.GND
S.GND + No open
S.GND
S.Load
S.GND
S.GND + No open
S.VCC + S.Load
S.VCC + S.Load
S.VCC + S.Load +
open or No open
S.Load
S.Load + No open
S.GND (out−)
S.VCC
Out to Out.S
Open L
Open
At Permanent:
S.GND (out+)
S.GND (out+)
S.GND (out−)
S.GND
S.GND
S.VCC
S.GND or S.VCC
Out to Out. S
S.GND
S.GND
(Note 10)
S.GND (out−)
S.GND
S.GND or S.VCC
(Note 9)
S.GND
S.GND
(Note 10)
S.VCC
S.VCC
(Note 9)
S.VCC
S.Load + S.GND
Out to Out.S
Open L
Open L
S.VCC
(Note 9)
N/A
Normal
Note 9: If the DC offset detection mode is ON, the information which the DC offset is appeared is added.
Note10: The chance which they can read this exact information is only one time although in case of other
diagnosis, the more times sending read command, the higher the confidence of the result.
For example,
a) ch1+ is connected to GND
b) ch1− is connected to VCC
c) They can read or get the “Short to GND” information when the uP send the Read command.
d) Next, however, they can not get the “Short to GND” or “Short to VCC” information when the uP
send the Read command again.
(5)
Note 11: Please arrange to read all self-diagnosis functions twice or more and apply judgment in order to
avoid false triggering.
Explanation of I2C bus commands
Below the “ADDRESS BYTE”, presently the address byte is fixed at 216 dec = D8hex = 101100xbin.
- Address Selection is D8hexa:
A7
Address bit
1
A6
Address bit
1
A5
Address bit
0
A4
Address bit
1
A3
Address bit
1
A2
Address bit
0
A1
Address bit
0
A0 (R/W)
Read/Write bit
X
X: 0 = Write instruction to device; 1 = Read instruction to device
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TB2902HQ
- If R/W = 0, the Up Sends Two Instruction Bytes, IB1 and IB2:
IB1 Instruction Byte:
Bit
D7
Turn-on diag timing
Normal (D7 = 1)
Repeat (D7 = 0)
D6
Diagnostic cycle enable (D6 = 1)
Diagnostic cycle defeat (D6 = 0)
D5
Offset Detection enable (D5 = 1)
Offset Detection defeat (D5 = 0)
D4
Front Channel
Gain = 26dB (D4 = 0)
Gain = 12dB (D4 = 1)
D3
Rear Channel
Gain = 26dB (D3 = 0)
Gain = 12dB (D3 = 1)
D2
Mute front channels (D2 = 0)
Unmute front channels (D2 = 1)
D1
Mute rear channels (D1 = 0)
Unmute rear channels (D1 = 1)
D0
CD 1% (D0 = 0)
CD 10% (D0 = 1)
IB2 Instruction Byte:
Bit
D7
Current Det 500 mA (max) (D7 = 0)
Current Det 300 mA (max) (D7 = 1)
D6
Fast mute on (D6 = 1) off (D6 = 0)
D5
Pin4 Clip Detection (D5 = 0)
Pin4 Offset Detection (D5 = 1)
D4
Std-by on-PA not working (D4 = 0)
Std-by off-PA working (D4 = 1)
D3
Amplifier mode diagnostic (D3 = 0)
Line driver mode diagnostic (D3 = 1)
D2
Current Det. diag enabled (D2 = 1)
Current Det. diag defeat (D2 = 0)
D1
Front Channels
Work standard mode (D1 = 0)
Work Low Iccq mode (D1 = 1)
D0
Rear Channels
Work standard mode (D1 = 0)
Work Low Iccq mode (D1 = 1)
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2004-08-18
TB2902HQ
- If R/W = 1, the Power Amplifier Sends Four Diagnostics Bytes, DB1, DB2, DB3 and DB4:
DB1 Diagnostic Byte:
Bit
D7
D6
Thermal warning active (D7 = 1)
Diag not actived or not terminated (D6 = 0)
Diag terminated (D6 = 1)
D5
Channel 1 current detection
Output peak current < 250 mA (IB2 − D7 = 0) − open load (D5 = 1)
Output peak current < 100 mA (IB2 − D7 = 1) − open load (D5 = 1)
Output peak current > 500 mA (IB2 − D7 = 0) − normal load (D5 = 0)
Output peak current > 300 mA (IB2 − D7 = 1) − normal load (D5 = 0)
D4
Channel 1
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
D3
Channel 1
Normal load (D3 = 0)
Short load (D3 = 1)
D2
D1
Channel 1
Turn-on diag: No open load (D2 = 0)
Open load detected (D2 = 1)
Offset diag: No output offset (D2 = 0)
Output offset detected (D2 = 1)
Channel 1
No short to VCC (D1 = 0)
Short to VCC (D1 = 1)
D0
Channel 1
No short to GND (D0 = 0)
Short to GND (D0 = 1)
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2004-08-18
TB2902HQ
DB2 Diagnostic Byte:
Bit
D7
Offset detection not activated (D7 = 0)
Offset detection activated (D7 = 1)
D6
Current sensor not activated (D6 = 0)
Current sensor activated (D6 = 1)
D5
Channel 2 current detection
Output peak current < 250 mA (IB2 − D7 = 0) − open load (D5 = 1)
Output peak current < 100 mA (IB2 − D7 = 1) − open load (D5 = 1)
Output peak current > 500 mA (IB2 − D7 = 0) − normal load (D5 = 0)
Output peak current > 300 mA (IB2 − D7 = 1) − normal load (D5 = 0)
D4
Channel 2
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
D3
Channel 2
Normal load (D3 = 0)
Short load (D3 = 1)
D2
D1
Channel 2
Turn-on diag: No open load (D2 = 0)
Open load detected (D2 = 1)
Offset diag: No output offset (D2 = 0)
Output offset detected (D2 = 1)
Channel 2
No short to VCC (D1 = 0)
Short to VCC (D1 = 1)
D0
Channel 2
No short to GND (D0 = 0)
Short to GND (D0 = 1)
Note 12: DBx (D5) is effective only at the time of “Current detection enable”.
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2004-08-18
TB2902HQ
DB3 Diagnostic Byte:
Bit
D7
Stand-by status (= IB2 − D4)
D6
Diagnostic status (= IB1 − D6)
D5
Channel 3 current detection
Output peak current < 250 mA (IB2 − D7 = 0) − open load (D5 = 1)
Output peak current < 100 mA (IB2 − D7 = 1) − open load (D5 = 1)
Output peak current > 500 mA (IB2 − D7 = 0) − normal load (D5 = 0)
Output peak current > 300 mA (IB2 − D7 = 1) − normal load (D5 = 0)
D4
Channel 3
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
D3
Channel 3
Normal load (D3 = 0)
Short load (D3 = 1)
D2
D1
Channel 3
Turn-on diag: No open load (D2 = 0)
Open load detected (D2 = 1)
Offset diag: No output offset (D2 = 0)
Output offset detected (D2 = 1)
Channel 3
No short to VCC (D1 = 0)
Short to VCC (D1 = 1)
D0
Channel 3
No short to GND (D0 = 0)
Short to GND (D0 = 1)
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2004-08-18
TB2902HQ
DB4 Diagnostic Byte:
Bit
D7
X
D6
X
D5
Channel 4 current detection
Output peak current < 250 mA (IB2 − D7 = 0) − open load (D5 = 1)
Output peak current < 100 mA (IB2 − D7 = 1) − open load (D5 = 1)
Output peak current > 500 mA (IB2 − D7 = 0) − normal load (D5 = 0)
Output peak current > 300 mA (IB2 − D7 = 1) − normal load (D5 = 0)
D4
Channel 4
Turn-on diagnostic (D4 = 0)
Permanent diagnostic (D4 = 1)
D3
Channel 4
Normal load (D3 = 0)
Short load (D3 = 1)
D2
D1
Channel 4
Turn-on diag: No open load (D2 = 0)
Open load detected (D2 = 1)
Offset diag: No output offset (D2 = 0)
Output offset detected (D2 = 1)
Channel 4
No short to VCC (D1 = 0)
Short to VCC (D1 = 1)
D0
Channel 4
No short to GND (D0 = 0)
Short to GND (D0 = 1)
Note 13: DBx (D5) is effective only at the time of “Current detection enable”.
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2004-08-18
TB2902HQ
7. Caution for use
Turn on diagnosis mode
<Output stage>
<RL short/open detector, at TURN-on mode>
5V
OUT
AMP
AMP
Comparator
DET circuit 1
(VCC/GND short)
DET circuit 2
(short/open)
S
SP
AMP
I = constant current
AMP
OUT
The comparator detect the voltage between speaker both ends.
If that voltage is larger, this detector judges “output load open”, while, if it is smaller, this detector judges
the “short load”.
But, in case of output shorted to VCC or shorted to GND condition, the voltage between speaker will be
surely changed.
Therefore, this system can not present exact information, for example, "Short to VCC" and "Short load"
are showed though output is shorted to Vcc but no short load.
In this case, the result as DET2 shall be dropped or ignored and DET1 is effective as DET1 is prior to
DET2.
Permanent diagnosis mode
Please arrange to read all self-diagnosis functions twice or more and apply judgment in order to avoid false
triggering. <Since the first diagnostic result has low confidence, please diagnose 2 times or more.>
Automatic turn on muting
The automatic turn on muting operates from when the turn on write command is sent, it is continued until
the Pin 10 ripple pin voltage reaches to about 5.6V.
During this automatic turn on muting operation, output sound can not appear even if the mute off write
command is sent because the internal muting circuit operates.
The automatic turn on muting operation period is MIN=0.1 sec, MAX=1.0 sec in case of C2 (Pin 10)
= 10 uF, Vcc=9 to 18V and Tj = -40 to 150 degrees condition.
When the Turn on diagnosis is enable, the automatic muting period starts after Turn on diag cycle period.
This period is in proportion to the value of the C2 so that the characteristic of C2 shall be had a care, for
example, temperature, variation and so on.
WRITE DATA
Automatic Turn ON Muting
at Turn on diag enable
Turn ON diagnosis enable
Turn ON diagnosis defeat
Possible to play music if the mute off write command is sent at Turn on diag enable
Pin10 ripple pin
Voltage=5.6V →
Automatic Turn ON Muting
at Turn on diag defeat
Possible to play music if the mute off write command is sent
at Turn on diag defeat
Figure 11 Automatic Turn on Muting Timing Chart
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2004-08-18
TB2902HQ
Examples of Bytes Sequence
1 - Turn-On Diagnostic - Write Operation
Start
Address byte with D0 = 0
ACK
Sub-address D0 = 1
ACK
IB with D6 = 1
ACK
IB2
ACK
DB4
ACK
STOP
STOP
Note 14: Auto increment
2 - Turn-On Diagnostic - Read Operation
Start
Address byte with D0 = 1
ACK
DB1
ACK
DB2
ACK
DB3
ACK
3a - Turn-On of the Power Amplifier with 26dB Gain, Mute On, Diagnostic Defeat.
Start Address byte with D0 = 0
ACK
Sub-address D0 = 1
ACK
IB 1
ACK
X0X0000X
IB2
ACK
STOP
ACK
STOP
ACK
STOP
XXX1X0XX
Note 15: Auto increment
3b - Turn-Off of the Power Amplifier
Start Address byte with D0 = 0
ACK
Sub-address D0 = 1
ACK
IB 1
ACK
X0XXXXXX
IB2
XXX0XXXX
Note 16: Auto increment
4 - Offset Detection Procedure Enable
Start Address byte with D0 = 0
ACK
Sub-address D0 = 1
ACK
IB 1
ACK
XX1XX11X
IB2
XXX1X0XX
Note 17: Auto increment
5 - Offset detection procedure stop and reading operation (the results are valid only for the
offset detection bits (D2 of the bytes DB1, DB2, DB3, DB4).
Start
Address byte with D0 = 1
ACK
DB1
ACK
DB2
ACK
23
DB3
ACK
DB4
ACK
STOP
2004-08-18
TB2902HQ
I2C Bus control format outline
The BUS control format of TB2902HQ is based on the Philips I2C bus control format.
Data Transmission Format
S
Slave address
0 A
Sub address
7 bit
A
Data
8 bit
MSB
A P
8 bit
MSB
S: Start conditions
P: Stop conditions
A: Acknowledgement
MSB
Note 18: It is transmitting, without forgetting. P conditions.
(1)
Start conditions & stop conditions
(2)
SDA
Bit transmission
SDA
SCL
S
P
Start conditions
SCL
Stop conditions
SDA can not be changed
(3)
SDA can be changed
Acknowledgement
High impedance
SDA from a
master
High impedance
SCL from a
master
1
8
A7
A6
A5
A4
A3
A2
A1
A0
R/ W
1
1
0
1
1
0
0
X
9
S
Start conditions
Purchase of TOSHIBA I2C components conveys a license under the Philips I2C Patent Rights to use these
components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by
Philips.
24
2004-08-18
TB2902HQ
TB2902HQ I2C Bus Transmission Format
(1)
Write mode
In addition to usual transmission, it corresponds to continuation transmission and the auto
increment mode as a transmission format. After a transmission end, in case data transmission is
newly, it is necessary to open the term beyond 1 clock.
1)
Continuation transmission
(An address to change is specified. At this time, MSB of a sub-address is set as 0.)
S
2)
Slave ADD
0 A
Sub ADD a
A
DATA 7 to 0
A
Sub ADD b
A
DATA 7 to 0
A
Sub ADD x
A
DATA 7 to 0
P
Auto increment
(Sub address are set to increment from N one by one. MSB of a sub-address is set as 1.)
S
Slave ADD
0 A
(sub ADD N)&80h
DATA 7 to 0
A
(sub ADD N + 1)
DATA 7 to 0
A
DATA 7 to 0
DATA 7 to 0
A
A
(sub ADD N + 2)
P
(sub ADD N + m)
(2)
Read mode
The slave address became the read mode by changing the 8 Bit of the slave address from 0 to 1.
The data output from TB2902HQ starts after the micro controller receives the ACK 1 bit which
follows a slave address.
Stop condition are shown in the under the map.
The micro controller shall send the stop condition P after it sent the reversed Acknowledge (high) in
case of the read mode finished.
The data transmission became not available condition if the micro controller intended to send the
stop condition P expect for this procedure because this IC occupies the data bus until the micro
controller send the start conditions again.
S
Slave ADD (R)
A DATA1 A DATA2 A DATA3 A DATA4 A P
........send a DATA from microcontroller.
........send a DATA from TB2902HQ.
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2004-08-18
TB2902HQ
Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
VCC (surge)
50
V
DC supply voltage
VCC (DC)
28
V
Operation supply voltage
VCC (opr)
18
V
Output current (peak)
IO (peak)
9
A
125
W
Peak supply voltage (0.2 s)
Power dissipation
PD
(Note 19)
Operation temperature
Topr
−40 to 85
°C
Storage temperature
Tstg
−55 to 150
°C
Note 19: Package thermal resistance θj-T = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)
The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not
be exceeded during operation, even for an instant. If any of these rating would be exceeded during operation, the
device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no
longer be guaranteed. Moreover, these operations with exceeded ratings may cause break down, damage and/or
degradation to any other equipment. Applications using the device should be designed such that each maximum
rating will never be exceeded in any operating conditions. Before using, creating and/or producing designs, refer to
and comply with the precautions and conditions set forth in this documents.
26
2004-08-18
TB2902HQ
Electrical Characteristics
(unless otherwise specified, VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, Ta = 25°C)
Characteristics
Quiescent current
Output power
Output power (RL = 2 Ω)
Symbol
Test
Circuit
ICCQ
⎯
POUT MAX
(1)
Min
Typ.
Max
Unit
VIN = 0
⎯
200
300
mA
⎯
VCC = 14.4 V, max POWER
⎯
41
⎯
POUT MAX
(2)
⎯
VCC = 13.7 V, max POWER
⎯
37
⎯
POUT (1)
⎯
VCC = 14.4 V, THD = 10%
24
27
⎯
POUT (2)
⎯
THD = 10%
⎯
23
⎯
POUT MAX
(3)
⎯
VCC = 14.4 V, max POWER
⎯
70
⎯
POUT MAX
(4)
⎯
VCC = 13.7 V, max POWER
⎯
64
⎯
POUT (3)
⎯
VCC = 14.4 V, THD = 10%
42
45
⎯
POUT (4)
⎯
THD = 10%
⎯
39
⎯
THD (1)
⎯
POUT = 5 W
⎯
0.015
0.1
THD (2)
⎯
Vo = 2 Vrms, GV = 12dB
⎯
0.01
0.1
GV (1)
⎯
VOUT = 0.775 Vrms
25
26
27
GV (2)
⎯
VOUT = 0.775 Vrms,
GV = 12dB
11
12
13
∆GV
⎯
VOUT = 0.775 Vrms
−1
0
1
Vno (1)
⎯
Rg = 0 Ω, DIN45405
⎯
100
⎯
Vno (2)
⎯
Rg = 0 Ω,
⎯
90
200
Total harmonic distortion
Voltage gain
Voltage gain ratio
Output noise voltage
Test Condition
BW = 20 Hz to 20 kHz
⎯
BW = 20 Hz to 20 kHz
W
%
dB
dB
µVrms
Rg = 0 Ω,
Vno (3)
W
⎯
30
50
40
50
⎯
dB
⎯
65
⎯
dB
GV = 12dB
fripple = 100 Hz, Rg = 620 Ω
Ripple rejection ratio
R.R.
⎯
Cross talk
C.T.
⎯
VOFFSET
⎯
⎯
−150
0
150
mV
Input resistance
RIN
⎯
⎯
⎯
90
⎯
kΩ
Standby current
ISB
⎯
Stand-by condition by BUS
⎯
30
60
µA
VSM H
⎯
For operation, mute enable
7.0
⎯
VCC
VSM L
⎯
For mute, stand by OFF
0
⎯
5.0
ATT M
⎯
80
90
⎯
CD (1)
⎯
Low (01H D = 0)
⎯
1
2.5
CD (2)
⎯
High (01H D = 1)
5
10
15
Output offset voltage
Stand by & mute control voltage
Mute attenuation
Clip det THD level
Vrip = 0.775 Vrms
Rg = 620 Ω
VOUT = 0.775 Vrms
Mute: ON
VOUT = 7.75 Vrms → Mute: OFF
V
dB
%
Note 20: ISB specification will be decided to after final evaluation on tolerance spls.
27
2004-08-18
TB2902HQ
Diagnosis/Bus Specification
Characteristics
Test Condition
Min
Typ.
Max
Unit
⎯
⎯
1.2
V
VCC −
1.2
⎯
⎯
V
Shorted load
⎯
⎯
0.5
Ω
Open load
85
⎯
⎯
Ω
Normal load
1.5
⎯
45
Ω
Turn on diagnosis (power amplifier mode)
Short to GND det.
Under stand-by condition
Short to VCC det.
Turn on diagnosis (line driver mode)
Short to GND det.
Under stand-by condition
Short to VCC det.
Shorted load
Open load
Normal load
⎯
⎯
1.2
V
VCC −
1.2
⎯
⎯
V
⎯
⎯
2
Ω
330
⎯
⎯
Ω
6
⎯
180
Ω
⎯
⎯
1.2
V
VCC −
1.2
⎯
⎯
V
Permanent diagnosis (power amplifier and line driver mode)
Short to GND det.
Power amplifier in mute or play
Short to VCC det.
Shorted load
Power amp mode only
⎯
0.5
⎯
Ω
Offset detection
Power amplifier in play (no signal)
⎯
+/−2
⎯
V
Current detector threshold 1
250
500
mA
Current detector threshold 2
100
300
mA
⎯
kHz
2
I C bus interface
⎯
Clock frequency
28
400
2004-08-18
TB2902HQ
C1: 0.22 µF
11
IN1
8
7
5
C1: 0.22 µF
12
IN2
2
3
C4:
1 µF
16
C1: 0.22 µF
For Mute
Time constant
17
15
IN3
18
19
13 Pre-GND
C1: 0.22 µF
14
21
IN4
24
23
SW
4 Clip Detection
I2C
Bus
Out1 (+)
PW-GND1
RL = 4 Ω
9
RF
RL = 4 Ω
20
VCC1
RR
RL = 4 Ω
6
VCC2
LF
RL = 4 Ω
1
TAB
+B
C3:
0.1 µF
10
Ripple
C5:
3900 µF
C2:
10 µF
Test Circuit
LR
Out1 (−)
Out2 (+)
PW-GND2
Out2 (−)
Out3 (+)
PW-GND3
Out3 (−)
Out4 (+)
PW-GND4
Out4 (−)
22
SCL
25
SDA
Diagnosis
LPF
Components in the test circuits are only used to obtain and confirm the device characteristics. These components
and circuits do not warrant to prevent the application equipment from malfunction or failure.
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2004-08-18
TB2902HQ
THD – POUT (ch1)
THD – POUT (ch2)
100
100
V
= 13.2 V
GCC
V = 26dB
50 RL = 4 Ω
RL = 4 Ω
30 測定
Filterch のみ入力
GV = 26dB
50
RL = 4 Ω
30 Filter
Filter
100 Hz : to 30 kHz
100
kHz
1kHzHz :: ~300
400 Hz
to 30 kHz
10
1kHz
400 Hz
Hz~30
10 kHz :: 400
to kHz
100 Hz : to 30 kHz
1kHz
10
: 400 Hz to 30 kHz
10 kHz : 400 Hz to
20 kHz : 400 Hz to
10
20 kHz
kHz :: 400
400 Hz~
Hz to
30 kHz : 400 Hz~
(%)
5
3
Total harmonic distortion THD
Total harmonic distortion THD
(%)
5
1
0.5
20 kHz
0.3
10 kHz
0.1
0.05
0.03
3
1
0.5
20 kHz
0.3
10 kHz
0.1
0.05
0.03
100 Hz
100 Hz
0.01
0.01
f = 1 kHz
f = 1 kHz
0.005
0.005
0.003
0.003
0.001
0.1
0.3 0.5
1
3
Output power
5
10
POUT
30 50
0.001
0.1
100
0.3 0.5
(W)
THD – POUT (ch3)
5
10
POUT
30 50
100
30 50
100
(W)
THD – POUT (ch4)
100
GV = 26dB
GV = 26dB
50
50
RL = 4 Ω
30 Filter
RL = 4 Ω
30 Filter
100 Hz : to 30 kHz
10
1kHz
100 Hz : to 30 kHz
: 400 Hz to 30 kHz
10
10 kHz : 400 Hz to
1kHz
: 400 Hz to 30 kHz
10 kHz : 400 Hz to
20 kHz : 400 Hz to
5
(%)
5
3
Total harmonic distortion THD
(%)
3
Output power
100
Total harmonic distortion THD
1
1
0.5
20 kHz
0.3
10 kHz
0.1
0.05
0.03
20 kHz : 400 Hz to
3
1
0.5
20 kHz
0.3
10 kHz
0.1
0.05
0.03
100 Hz
100 Hz
0.01
0.01
f = 1 kHz
0.005
0.003
0.001
0.1
f = 1 kHz
0.005
0.003
0.3 0.5
1
3
Output power
5
10
POUT
30 50
0.001
0.1
100
(W)
0.3 0.5
1
3
Output power
30
5
10
POUT
(W)
2004-08-18
TB2902HQ
THD – POUT (ch1)
THD – POUT (ch2)
100
50
30
13.2 V
(%)
10
GV = 26dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz to 30 kHz
5
3
Total harmonic distortion THD
Total harmonic distortion THD
(%)
50
30
100
1
0.5
0.3
16.0 V
0.1
VCC = 9.0 V
0.05
0.03
0.01
10
1
0.5
0.3
16.0 V
0.1
0.01
0.003
0.003
0.1
0.3
1
Output power
3
POUT
10
30
0.001
0.01
100
VCC = 9.0 V
0.05
0.03
0.005
0.03
0.03
(W)
0.1
THD – POUT (ch3)
3
POUT
10
30
100
(W)
THD – POUT (ch4)
GV = 26dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz to 30 kHz
50
30
13.2 V
(%)
10
5
3
1
0.5
0.3
16.0 V
0.1
VCC = 9.0 V
0.05
0.03
0.01
1
1
Output power
3
POUT
10
30
0.01
0.001
0.01
100
(W)
VCC = 9.0 V
0.05
0.03
0.003
0.3
16.0 V
0.1
0.003
0.1
13.2 V
0.5
0.3
0.005
0.03
GV = 26dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz to 30 kHz
5
3
0.005
0.001
0.01
1
100
Total harmonic distortion THD
Total harmonic distortion THD
(%)
10
0.3
Output power
100
50
30
13.2 V
5
3
0.005
0.001
0.01
GV = 26dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz to 30 kHz
0.03
0.1
0.3
1
Output power
31
3
POUT
10
30
100
(W)
2004-08-18
TB2902HQ
muteATT – f
R.R. – f
0
VCC = 13.2 V
−40
−60
−80
ch1
−100
−120
10
−20
R.R.
(dB)
VCC = 13.2 V
−20 RL = 4 Ω
VOUT = 7.75 Vrms (20dBm)
Ripple rejection ratio
Mute attenuation muteATT (dB)
0
100
1k
Frequency f
10 k
RL = 4 Ω
RG = 620 Ω
Vrip = 0.775 Vrms (0dBm)
−40
1ch
4ch
−60
−80
10
100 k
3ch
2ch
100
(Hz)
1k
Frequency f
GV – f
10 k
100 k
10 k
100 k
(Hz)
THD – f
40
3
20
Total harmonic distortion THD
GV (dB)
30
Voltage gain
(%)
VCC = 13.2 V
ch1 to ch4
VCC = 13.2 V
10
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm)
0
10
100
1k
Frequency f
10 k
1
0.3
(Hz)
No filter
0.1
1ch
0.03
3ch
4ch
0.01
2ch
0.003
0.001
10
100 k
RL = 4 Ω
POUT = 5 W
100
1k
Frequency f
32
(Hz)
2004-08-18
TB2902HQ
VIN – POUT (ch1)
VIN – POUT (ch2)
60
60
1 kHz
40
10 kHz
30
Output power POUT
Output power POUT
100 Hz
(W)
50
(W)
50
f = 20 kHz
20
VCC = 13.2 V
10
2
6
4
Input voltage
VIN
8
40
10 kHz
30
f = 20 kHz
20
VCC = 13.2 V
RL = 4 Ω
No filter
0
0
10
2
(Vrms)
VIN – POUT (ch3)
(Vrms)
Output power POUT
10 kHz
30
f = 20 kHz
20
VCC = 13.2 V
6
4
Input voltage
VIN
8
1 kHz
40
10 kHz
30
f = 20 kHz
20
VCC = 13.2 V
10
RL = 4 Ω
No filter
2
100 Hz
(W)
(W)
Output power POUT
1 kHz
40
0
0
RL = 4 Ω
No filter
0
0
10
2
(Vrms)
6
4
Input voltage
ICCQ –VCC
VIN
8
10
(Vrms)
PD MAX – Ta
120
Allowable power dissipation PD MAX (W)
250
VIN = 0
(mA)
10
VIN – POUT (ch4)
50
100 Hz
10
ICCQ
VIN
8
60
50
Quiescent Current
6
4
Input voltage
60
RL = ∞
200
150
100
50
0
0
1 kHz
10
RL = 4 Ω
No filter
0
0
100 Hz
(1) Infinite heat sink
RθJC = 1°C/W
(2) Heat sink (RθHS = 3.5°C/W)
100
RθJC + RθHS = 4.5°C/W
(3) No heat sink
80
RθJA = 39°C/W
(1)
60
40
20
(2)
(3)
0
5
10
15
Supply voltage
20
25
0
30
VCC (V)
25
50
75
Ambient temperature
33
100
125
150
Ta (°C)
2004-08-18
TB2902HQ
C.T. – f (ch1)
C.T. – f (ch2)
0
VCC = 13.2 V
RL = 4 Ω
f = 1 kHz
−20 VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
Cross talk C.T. (dB)
Cross talk C.T. (dB)
0
−40
ch2
−60
ch3
ch4
−80
−100
10
VCC = 13.2 V
RL = 4 Ω
f = 1 kHz
−20 VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
−40
ch1
ch3
−60
ch4
−80
100
1k
Frequency f
10 k
−100
10
100 k
100
(Hz)
C.T. – f (ch3)
Cross talk C.T. (dB)
Cross talk C.T. (dB)
ch4
−60
ch2
ch1
−80
VCC = 13.2 V
RL = 4 Ω
f = 1 kHz
−20 VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
−40
ch3
−60
ch2
1k
10 k
−100
10
100 k
100
(Hz)
100 k
(Hz)
PD – POUT
f = 1 kHz
RL = 4 Ω
4ch drive
60
18 V
PD
(W)
RL = 4 Ω
f = 1 kHz
Filter
to 20 kHz
(µVrms)
10 k
80
VCC = 13.2 V
Power dissipation
200
ch1 to ch4
100
100
1k
Frequency f
VNO – Rg
Output noise voltage VNO
ch1
−80
Frequency f
0
10
(Hz)
C.T. – f (ch4)
−40
100
100 k
0
VCC = 13.2 V
RL = 4 Ω
f = 1 kHz
−20 VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
300
10 k
Frequency f
0
−100
10
1k
1k
Signal source resistance
10 k
40
16 V
13.2 V
20
9.0 V
0
0
100 k
Rg (Ω)
5
10
Output power
34
15
POUT
20
25
(W)
2004-08-18
TB2902HQ
THD – POUT (ch1)
THD – POUT (ch2)
100
50
30
13.2 V
(%)
10
GV = 26dB
RL = 2 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
5
3
Total harmonic distortion THD
Total harmonic distortion THD
(%)
50
30
100
1
0.5
0.3
0.1
0.05
0.03
VCC = 9.0 V
0.01
16.0 V
10
1
0.5
0.3
0.1
0.05
0.03
0.005
0.003
0.1
0.3
1
Output power
3
POUT
10
30
0.001
0.01
100
VCC = 9.0 V
16.0 V
0.01
0.003
0.03
0.03
(W)
0.1
THD – POUT (ch3)
3
POUT
10
30
100
(W)
THD – POUT (ch4)
GV = 26dB
RL = 2 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
50
30
13.2 V
(%)
10
5
3
1
0.5
0.3
0.1
0.05
0.03
VCC = 9.0 V
0.01
16.0 V
1
0.1
1
Output power
3
POUT
10
30
0.001
0.01
100
(W)
16.0 V
0.01
0.003
0.3
VCC = 9.0 V
0.05
0.03
0.005
0.1
13.2 V
0.5
0.3
0.003
0.03
GV = 26dB
RL = 2 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
5
3
0.005
0.001
0.01
1
100
Total harmonic distortion THD
Total harmonic distortion THD
(%)
10
0.3
Output power
100
50
30
13.2 V
5
3
0.005
0.001
0.01
GV = 26dB
RL = 2 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
0.03
0.1
0.3
1
Output power
35
3
POUT
10
30
100
(W)
2004-08-18
TB2902HQ
PD – POUT
80
f = 1 kHz
RL = 2 Ω
4ch drive
16 V
Power dissipation
PD
(W)
100
13.2 V
60
40
9.0 V
20
0
0
5
10
Output power
15
POUT
20
25
(W)
36
2004-08-18
TB2902HQ
Package Dimensions
Weight: 7.7 g (typ.)
37
2004-08-18
TB2902HQ
About solderability, following conditions were confirmed
•
Solderability
(1) Use of Sn-63Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE
030619EBF
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
• This product generates heat during normal operation. However, substandard performance or malfunction may
cause the product and its peripherals to reach abnormally high temperatures.
The product is often the final stage (the external output stage) of a circuit. Substandard performance or
malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the
product.
38
2004-08-18