White Electronic Designs WMF512K8-XXX5 512Kx8 MONOLITHIC FLASH, SMD 5962-96692 FEATURES Access Times of 60, 70, 90, 120, 150ns Organized as 512Kx8 Packaging • 32 pin, Hermetic Ceramic, 0.600" DIP (Package 300) Commercial, Industrial and Military Temperature Ranges 5 Volt Programming. 5V ± 10% Supply. • 32 lead, Hermetic Ceramic, 0.400" SOJ (Package 101) Low Power CMOS Embedded Erase and Program Algorithms • 32 pin, Rectangular Ceramic Leadless Chip Carrier (Package 601) TTL Compatible Inputs and CMOS Outputs Page Program Operation and Internal Program Control Time. • 32 lead Flatpack (Package 220) 1,000,000 Erase/Program Cycles Minimum Sector Erase Architecture Note: For programming information refer to Flash Programming 4M5 Application Note. This product is subject to change without notice. • 8 equal size sectors of 64K bytes each • Any combination of sectors can be concurrently erased. Also supports full chip erase WE# VCC A18 4 3 2 1 32 31 30 A14 A13 A8 A9 A11 OE# A10 CS# I/O7 I/O6 I/O5 Pin Description A0-18 I/O0-7 CS# OE# WE# VCC VSS 5 29 6 28 7 27 8 26 25 9 10 24 11 23 12 22 13 21 14 15 16 17 18 19 20 I/O4 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O3 VCC WE# A17 A14 A13 A8 A9 A11 OE# A10 CS# I/O7 I/O6 I/O5 I/O4 I/O3 VSS 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 I/O2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A16 Top View A15 32 CLCC Top View A12 32 DIP 32 CSOJ 32 Flatpack I/O1 A18 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 VSS Pin Configuration For WMF512K8-XCLX5 A17 Pin Configuration For WMF512K8-XXX5 Address Inputs Data Input/Output Chip Select Output Enable Write Enable +5.0V Power Ground White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs ABSOLUTE MAXIMUM RATINGS (1) Parameter Operating Temperature Supply Voltage (VCC) (1) Signal Voltage Range(any pin except A9) (2) Storage Temperature Range Lead Temperature (soldering, 10 seconds) Data Retention Mil Temp Endurance - erase/program cycles (Mil Temp) A9 Voltage for sector protect (VID) (3) -55 to +125 -2.0 to +7.0 -2.0 to +7.0 -65 to +150 +300 20 100,000 min -2.0 to +14.0 WMF512K8-XXX5 RECOMMENDED OPERATING CONDITIONS Unit °C V V °C °C years cycles V Parameter Supply Voltage Input High Voltage Input Low Voltage Operating Temp. (Mil.) Operating Temp. (Ind.) A9 Voltage for Sector Protect Symbol VCC VIH VIL TA TA VID Min 4.5 2.0 -0.5 -55 -40 11.5 Max 5.5 VCC + 0.5 +0.8 +125 +85 12.5 Unit V V V °C °C V CAPACITANCE NOTES: 1. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may overshoot VSS to -2.0 V for periods of up to 20ns. Maximum DC voltage on output and I/O pins is VCC + 0.5V. During voltage transitions, outputs may overshoot to Vcc + 2.0 V for periods of up to 20ns. 3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is +13.5V which may overshoot to 14.0 V for periods up to 20ns. TA = +25°C Parameter Address Input capacitance Output Enable capacitance Write Enable capacitance Chip Select capacitance Data I/O capacitance Symbol CAD COE CWE CCS CI/O Conditions Max Unit VI/O = 0 V, f = 1.0 MHz 15 pF VIN = 0 V, f = 1.0 MHz 15 pF VIN = 0 V, f = 1.0 MHz 15 pF VIN = 0 V, f = 1.0 MHz 15 pF VI/O = 0 V, f = 1.0 MHz 15 pF This parameter is guaranteed by design but not tested. DC CHARACTERISTICS — CMOS COMPATIBLE VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Input Leakage Current Output Leakage Current VCC Active Current for Read (1) VCC Active Current for Program or Erase (2) VCC Standby Current Output Low Voltage Output High Voltage Low VCC Lock-Out Voltage Symbol ILI ILOx32 ICC1 ICC2 ICC4 VOL VOH1 VLKO Conditions VCC = 5.5, VIN = GND to VCC VCC = 5.5, VIN = GND to VCC CS# = VIL, OE# = VIH, f = 5MHz CS# = VIL, OE# = VIH VCC = 5.5, CS# = VIH, f = 5MHz IOL = 8.0 mA, VCC = 4.5 IOH = -2.5 mA, VCC = 4.5 Min 0.85 x VCC 3.2 Max 10 10 50 60 1.6 0.45 4.2 Unit µA µA mA mA mA V V V NOTES: 1. The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 2 mA/MHz, with OE# at VIH. 2. ICC active while Embedded Algorithm (program or erase) is in progress. 3. DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF512K8-XXX5 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,CS# CONTROLLED VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -60 Min -70 Max Min -90 Max Min -120 Max Min -150 Max Min Max Unit Write Cycle Time tAVAV tWC 60 70 90 120 150 Write Enable Setup Time tWLEL tWS 0 0 0 0 0 ns ns Chip Select Pulse Width tELEH tCP 40 45 45 50 50 ns Address Setup Time tAVEL tAS 0 0 0 0 0 ns Data Setup Time tDVEH tDS 40 45 45 50 50 ns Data Hold Time tEHDX tDH 0 0 0 0 0 ns Address Hold Time tELAX tAH 40 45 45 50 50 ns Chip Select Pulse Width High tEHEL tCPH 20 Duration of Byte Programming Operation (1) tWHWH1 Sector Erase Time (2) tWHWH2 Read Recovery Time tGHEL 20 300 15 0 20 300 15 0 20 300 15 0 20 300 15 0 ns 300 µs 15 sec 0 ns Chip Programming Time 11 11 11 11 11 sec Chip Erase Time (3) 64 64 64 64 64 sec NOTES: 1. Typical value for tWHWH1 is 7µs. 2. Typical value for tWHWH2 is 1sec. 3. Typical value for Chip Erase time is 8sec. AC Test Conditions AC TEST CIRCUIT Parameter Input Pulse Levels Input Rise and Fall Input and Output Reference Level Output Timing Reference Level I OL Current Source VZ D.U.T. 1.5V Unit V ns V V Notes: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 Ω. VZ is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. (Bipolar Supply) C eff = 50 pf Typ VIL = 0, VIH = 3.0 5 1.5 1.5 I OH Current Source White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF512K8-XXX5 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE# CONTROLLED VCC = 5.0V, -55°C ≤ TA ≤ +125°C Parameter Symbol Write Cycle Time Chip Select Setup Time Write Enable Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Write Enable Pulse Width High Duration of Byte Programming Operation (1) Sector Erase Time (2) Read Recovery Time before Write VCC Set-up Time Chip Programming Time Output Enable Setup Time Output Enable Hold Time (4) Chip Erase Time (3) tAVAV tELWL tWLWH tAVWH tDVWH tWHDX tWHAX tWHWL tWHWH1 tWHWH2 tGHWL tWC tCS tWP tAS tDS tDH tAH tWPH -60 Min 60 0 40 0 40 0 40 20 -70 Max Min 70 0 45 0 45 0 45 20 300 15 tVCS 0 50 tOES tOEH 0 10 -90 Max Min 90 0 45 0 45 0 45 20 300 15 0 50 11 Min 120 0 50 0 50 0 50 20 300 15 0 50 11 0 10 64 -120 Max Min 150 0 50 0 50 0 50 20 300 15 0 50 11 0 10 64 -150 Max 300 15 0 50 11 0 10 64 Max 11 0 10 64 64 Unit ns ns ns ns ns ns ns ns µs sec ms µs sec ns ns sec NOTES: 1. Typical value for tWHWH1 is 7µs. 2. Typical value for tWHWH2 is 1sec. 3. Typical value for Chip Erase time is 8sec. 4. For Toggle and Data# Polling. AC CHARACTERISTICS – READ ONLY OPERATIONS VCC = 5.0V, -55°C ≤ TA ≤ +125°C -60 Parameter -70 -90 -120 -150 Unit Symbol Min Max 60 Min Max 70 Min Max Max Max tRC Address Access Time tAVQV tACC 60 70 90 120 150 ns Chip Select Access Time tELQV tCE 60 70 90 120 150 ns Output Enable to Output Valid tGLQV tOE 35 35 35 50 55 ns Chip Select to Output High Z (1) tEHQZ tDF 20 20 20 30 35 ns Output Enable High to Output High Z (1) tGHQZ tDF 20 20 20 30 35 ns Output Hold from Address, CS# or OE# Change, whichever is First tAXQX tOH 0 0 120 Min tAVAV 0 90 Min Read Cycle Time 0 150 0 ns ns NOTES: 1. Guaranteed by design, but not tested White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF512K8-XXX5 AC WAVEFORMS FOR READ OPERATIONS tRC Addresses Addresses Stable tACC CS# tDF tOE OE# WE# tCE tOH High Z Outputs High Z Output Valid WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED Data# Polling Addresses 5555H PA tWC tAS PA tAH tRC CS# tGHWL OE# tWP WE# tWHWH1 tWPH tCS tDH A0H Data tDF tOE I/O7# PD I/OOUT tDS tOH 5.0 V tCE NOTES: 1. PA is the address of the memory location to be programmed. 2. PD is the data to be programmed at byte address. 3. I/O7# is the output of the complement of the data written to the device. 4. I/OOUT is the output of the data written to the device. 5. Figure indicates last two bus cycles of four bus cycle sequence. White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF512K8-XXX5 AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS tAH Addresses 5555H 2AAAH 5555H 5555H 2AAAH SA tAS CS# tGHWL OE# tWP WE# tWPH tCS tDH Data AAH 55H 80H AAH 55H 10H/30H tDS VCC tVCS NOTES: 1. SA is the Sector Address for Sector Erase. AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS t CH CS# t DF t OE OE# tOEH WE# tCE t OH I/O7 = Valid Data I/O7# I/O7 High Z tWHWH 1 or 2 Data I/O0-6 I/O0-7 Valid Data I/O0-6 = Invalid t OE White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF512K8-XXX5 ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS Data# Polling Addresses 5555H PA tWC tAS PA tAH WE# tGHEL OE# tCP CS# tWHWH1 tCPH tWS tDH A0H Data I/O7# PD I/OOUT tDS 5.0 V Notes: 1. PA represents the address of the memory location to be programmed. 2. PD represents the data to be programmed at byte address. 3. I/O7# is the output of the complement of the data written to the device. 4. I/OOUT is the output of the data written to the device. 5. Figure indicates the last two bus cycles of a four bus cycle sequence. White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF512K8-XXX5 PACKAGE 101: 32 LEAD, CERAMIC SOJ 3.96 (0.156) MAX 21.1 (0.830) ± 0.25 (0.010) 0.89 (0.035) Radius TYP 0.2 (0.008) ± 0.05 (0.002) 11.3 (0.442) ± 0.30 (0.012) 9.55 (0.376) ± 0.25 (0.010) 1.27 (0.050) ± 0.25 (0.010) PIN 1 IDENTIFIER 1.27 (0.050) TYP 19.1 (0.750) TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 220: 32 LEAD, CERAMIC FLATPACK 20.83 (0.820) ± 0.25 (0.010) PIN 1 IDENTIFIER 2.60 (0.102) MAX 10.41 (0.410) ± 0.13 (0.005) 10.16 (0.400) ± 0.51 (0.020) 0.43 (0.017) ± 0.05 (0.002) 0.127 (0.005) + 0.05 (0.002) – 0.025 (0.001) 1.27 (0.050) TYP 19.05 (0.750) TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF512K8-XXX5 PACKAGE 300: 32 PIN, CERAMIC DIP, SINGLE CAVITY SIDE BRAZED 42.4 (1.670) ± 0.4 (0.016) 15.04 (0.592) ± 0.3 (0.012) 4.34 (0.171) ± 0.79 (0.031) PIN 1 IDENTIFIER 3.2 (0.125) MIN 0.84 (0.033) ± 0.4 (0.014) 2.5 (0.100) TYP 1.27 (0.050) ± 0.1 (0.005) 0.46 (0.018) ± 0.05 (0.002) 0.25 (0.010) ± 0.05 (0.002) 15.25 (0.600) ± 0.25 (0.010) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF512K8-XXX5 PACKAGE 601: 32 PIN, RECTANGULAR CERAMIC LEADLESS CHIP CARRIER 7.62 (0.300) TYP 3.81 (0.150) TYP 5.08 (0.200) TYP 0.56 (0.022) 0.71 (0.028) 10.16 (0.400) TYP PIN 1 0.38 (0.015) x 45° PIN 1 IDENTIFIER 11.25 (0.443) 14.15 (0.557) 1.63 (0.064) 2.54 (0.100) 13.79 (0.543) 14.15 (0.557) 1.02 (0.040) x 45° 3 PLACES ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF512K8-XXX5 ORDERING INFORMATION W M F 512K 8 - XXX X X 5 X WHITE ELECTRONIC DESIGNS CORP. MONOLITHIC Flash ORGANIZATION, 512K x 8 ACCESS TIME (ns) PACKAGE TYPE: C = 32 Pin Ceramic DIP (Package 300) CL = 32 Pin Rectangular Ceramic Leadless Chip Carrier (Package 601) DE = 32 Lead Ceramic SOJ (Package 101) FE = 32 Lead Flatpack (Package 220) DEVICE GRADE: M = Military Screened -55°C to +125°C I = Industrial -40°C to +85°C C = Commercial 0°C to +70°C VPP PROGRAMMING VOLTAGE 5 = 5V LEAD FINISH: Blank = Gold plated leads A = Solder dip leads White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 11 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs DEVICE TYPE SECTOR SIZE WMF512K8-XXX5 SPEED PACKAGE SMD NO. 512K x 8 Flash Monolithic 64KByte 150ns 32 pin DIP (C) 5962-96692 01HXX 512K x 8 Flash Monolithic 64KByte 120ns 32 pin DIP (C) 5962-96692 02HXX 512K x 8 Flash Monolithic 64KByte 90ns 32 pin DIP (C) 5962-96692 03HXX 512K x 8 Flash Monolithic 64KByte 70ns 32 pin DIP (C) 5962-96692 04HXX 512K x 8 Flash Monolithic 64KByte 150ns 32 lead SOJ (DE) 5962-96692 01HYX 512K x 8 Flash Monolithic 64KByte 120ns 32 lead SOJ (DE) 5962-96692 02HYX 512K x 8 Flash Monolithic 64KByte 90ns 32 lead SOJ (DE) 5962-96692 03HYX 512K x 8 Flash Monolithic 64KByte 70ns 32 lead SOJ (DE) 5962-96692 04HYX 512K x 8 Flash Monolithic 64KByte 150ns 32 lead Flatpack (FE) 5962-96692 01HUX 512K x 8 Flash Monolithic 64KByte 120ns 32 lead Flatpack (FE) 5962-96692 02HUX 512K x 8 Flash Monolithic 64KByte 90ns 32 lead Flatpack (FE) 5962-96692 03HUX 512K x 8 Flash Monolithic 64KByte 70ns 32 lead Flatpack (FE) 5962-96692 04HUX 512K x 8 Flash Monolithic 64KByte 150ns 32 lead Flatpack (FF) 5962-96692 01HTX 512K x 8 Flash Monolithic 64KByte 120ns 32 lead Flatpack (FF) 5962-96692 02HTX 512K x 8 Flash Monolithic 64KByte 90ns 32 lead Flatpack (FF) 5962-96692 03HTX 512K x 8 Flash Monolithic 64KByte 70ns 32 lead Flatpack (FF) 5962-96692 04HTX White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF512K8-XXX5 Document Title 512K x 8 Flash Monolithic Revision History Rev # History Release Date Status Rev 1 Initial Release Changes (Pg. 1) 1.1 Change status to Final Changes (Pg. 1) 1.1 Correct typo of Ceramic Changes (Pg. 10) 1.1 Remove pedestal from Flatpack package drawing Changes (Pg. 1) 1.1 Change name from ‘FP’ to Flatpack September 1996 May 1997 Preliminary Final February 1998 Final April 1998 Final February 1999 Final Rev 2 Changes (Pg. 1, 2, 3, 4, 13) 2.1 Change number of max program/erases to 1,000,000 2.2 Change temperature of max program/erases to 25C 2.3 Absolute Maximum Ratings Table: 2.3.1 Change Data Retention to 20years 2.3.2 Change Endurance to 100,000 cycles minimum 2.4 Write/Erase/Program Operations Tables: 2.4.1 Change tWHWH1 to 300µs 2.4.2 Add Note (1) Typical tWHWH1 = 7µs 2.4.3 Change tWHWH2 to 15sec 2.4.4 Add Note (2) Typical tWHWH2 = 1 sec 2.4.5 Change Chip Programming Time to 11 sec 2.4.6 Change Chip Erase Time too 64 sec 2.4.7 Add Note (3) Chip Erase Time = 8 sec 2.5 Ordering Information 2.5.1 Change Company Name to White EDC 2.6 Change Title Style to new WEDC look May 1999 Final Rev 3 Changes (Pg. 1, 2, 10, 12, 13) 3.1 Change package 206 to package 220 3.2 Remove temperature range notice for Endurance 3.3 Change width spec to 0.457" minimum for package 601 May 1999 Final Rev 4 Changes (Pg. 1, 3, 4) 4.1 Add 60ns speed grade option January 2003 Final Rev 5 Changes (Pg. 1, 11, 13) 5.1 Add 'T' case outline for 'FF' package April 2005 Final Rev 6 Changes (Pg. 1, 13) 6.1 Change revision history Rev 2.4.1 to 300 µs 6.2 Change revision history Rev 2.4.2 to 7µs November 2005 Final White Electronic Designs Corp. reserves the right to change products or specifications without notice. November 2005 Rev. 6 13 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com