White Electronic Designs WF1M32B-XXX3 1Mx32 3.3V Flash Module FEATURES Access Times of 100, 120, 150ns ■ Boot Code Sector Architecture (Bottom) ■ Packaging ■ Low Power CMOS, 1.0mA Standby • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401) • 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180") square (Package 509) ■ Embedded Erase and Program Algorithms ■ Built-in Decoupling Caps for Low Noise Operation ■ Erase Suspend/Resume ■ 1,000,000 Erase/Program Cycles ■ Sector Architecture • Supports reading data from or programing data to a sector not being erased ■ • One 16KByte, two 8KBytes, one 32KByte, and fifteen 64kBytes in byte mode Typical values at 5MHz: • 40mA Active Read Current • Any combination of sectors can be concurrently erased. Also supports full chip erase • 80mA Program/Erase Current ■ ■ Organized as 1Mx32 ■ Commercial, Industrial and Military Temperature Ranges ■ 3.3 Volt for Read and Write Operations Low Current Consumption Weight WF1M32B-XG2TX3 -8 grams typical WF1M32B-XHX3 -13 grams typical Note: For programming information refer to Flash Programming 8M3 Application Note. PIN CONFIGURATION FOR WF1M32B-XHX3 Pin Description Top View 1 12 23 34 45 56 I/O0-31 Data Inputs/Outputs A0-19 Address Inputs WE# Write Enable CS1-4# Chip Selects I/O8 RESET# I/O15 I/O24 VCC I/O31 I/O9 CS2# I/O14 I/O25 CS4# I/O30 OE# Output Enable I/O10 GND I/O13 I/O26 NC I/O29 RESET# Reset A14 I/O11 I/O12 A7 I/O27 I/O28 VCC Power Supply GND Ground NC Not Connected A16 A10 OE# A12 A4 A1 A11 A9 A17 NC A5 A2 A0 A15 WE# A13 A6 A3 A18 VCC I/O7 A8 NC I/O23 I/O0 CS1# I/O6 I/O16 CS3# I/O22 I/O1 A19 I/O5 I/O17 GND I/O21 I/O2 I/O3 I/O4 I/O18 I/O19 I/O20 Block Diagram CS1# 1M x 8 11 22 33 44 55 CS2# CS3# CS4# RESET# WE# OE# A0-19 1M x 8 1M x 8 1M x 8 66 8 8 8 8 I/O0-7 I/O8-15 I/O16-23 I/O24-31 White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 Pin Configuration for WF1M32B-XG2TX3 Top View RESET# A0 A1 A2 A3 A4 A5 CS3# GND CS4# WE1# A6 A7 A8 A9 A10 VCC Pin Description 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 10 60 11 59 12 58 13 57 14 56 15 55 16 54 17 53 18 52 19 51 20 50 21 49 22 48 23 47 24 46 25 45 26 44 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 The White 68 lead G2T CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2T has the TCE and lead inspection advantage of the CQFP form. Data Inputs/Outputs A0-19 Address Inputs WE1-4 Write Enables CS1-4 Chip Selects OE Output Enable RESET Reset/Powerdown VCC Power Supply GND Ground Block Diagram VCC A11 A12 A13 A14 A15 A16 CS1# OE# CS2# A17 WE2# WE3# WE4# A18 A19 NC I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 I/O0-31 WE1# CS1# WE2# CS2# WE3# CS3# WE4# CS4# 1M x 8 1M x 8 1M x 8 1M x 8 8 8 8 8 I/O0-7 I/O8-15 I/O16-23 I/O24-31 RESET# OE# A0-19 White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 ABSOLUTE MAXIMUM RATINGS Parameter Operating Temperature Supply Voltage Range (VCC) Signal Voltage Range Storage Temperature Range Lead Temperature (soldering, 10 seconds) Endurance (write/erase cycles) -55 to +125 -0.5 to +4.0 -0.5 to Vcc +0.5 -65 to +150 +300 1,000,000 min. CAPACITANCE TA = +25°C Unit °C V V °C °C cycles Symbol Parameter OE# capacitance COE WE#1-4 capacitance CWE CS1-4 capacitance CCS Data I/O capacitance CI/O Address input capacitance CAD RECOMMENDED OPERATING CONDITIONS Symbol Min Max 3.0 3.6 VCC VIH 0.7 x VCC VCC + 0.3 VIL -0.5 +0.8 TA -55 +125 TA -40 +85 Max 50 20 20 20 50 Unit pF pF pF pF pF This parameter is guaranteed by design but not tested. NOTES: 1. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Parameter Supply Voltage Input High Voltage Input Low Voltage Operating Temp. (Mil.) Operating Temp. (Ind.) Conditions VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz VI/O = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz DATA RETENTION Unit V V V °C °C Parameter Minimum Pattern Data Retention Time Test Conditions 150°C 125°C Min 10 20 Unit Years Years DC CHARACTERISTICS – CMOS COMPATIBLE VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Input Leakage Current Output Leakage Current VCC Active Current for Read (1) VCC Active Current for Program or Erase (2) VCC Standby Current Output Low Voltage Output High Voltage Low VCC Lock-Out Voltage (4) Symbol ILI ILOx32 ICC1 ICC2 ICC3 VOL VOH1 VLKO Conditions VCC = 3.6, VIN = GND or VCC VCC = 3.6, VIN = GND or VCC CS# = VIL, OE# = VIH, f = 5MHz CS# = VIL, OE# = VIH VCC = 3.6, CS = VIH, f = 5MHz IOL = 5.8 mA, VCC = 3.0 IOH = -2.0 mA, VCC = 3.0 Min 0.85 X VCC 2.3 Max 10 10 120 140 200 0.45 2.5 Unit µA µA mA mA µA V V V NOTES: 1. The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 8 mA/MHz, with OE# at VIH. 2. ICC active while Embedded Algorithm (program or erase) is in progress. 3. DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V 4. Guaranteed by design, but not tested. White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS – CS# CONTROLLED VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol Write Cycle Time Write Enable Setup Time Chip Select Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Chip Select Pulse Width High Duration of Byte Programming Operation (1) Sector Erase Time Read Recovery Time (2) Chip Programming Time tAVAV tWLEL tELEH tAVEL tDVEH tEHDX tELAX tEHEL -100 tWC tWS tCP tAS tDS tDH tAH tCPH tWHWH1 tWHWH2 tGHEL Min 100 0 45 0 45 0 45 20 -120 Max Min 120 0 50 0 50 0 50 20 300 15 0 -150 Max Min 150 0 50 0 50 0 50 20 300 15 0 50 Unit Max ns ns ns ns ns ns ns ns µs sec µs sec 300 15 0 50 50 1. Typical value for tWHWH1 is 9µs. 2. Guaranteed by design, but not tested. AC TEST CIRCUIT AC TEST CONDITIONS Parameter I OL Current Source VZ D.U.T. ≈ 1.5V (Bipolar Supply) C eff = 50 pf Typ Unit Input Pulse Levels VIL = 0, VIH = 2.5 V Input Rise and Fall 5 ns Input and Output Reference Level 1.5 V Output Timing Reference Level 1.5 V NOTES: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 Ω. VZ is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. I OH Current Source White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS – WE# CONTROLLED VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol Write Cycle Time Chip Select Setup Time Write Enable Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Write Enable Pulse Width High Duration of Byte Programming Operation (1) Sector Erase Read Recovery Time before Write (3) VCC Setup Time Chip Programming Time Output Enable Setup Time Output Enable Hold Time (2) tAVAV tELWL tWLWH tAVWL tDVWH tWHDX tWLAX tWHWL tWHWH1 tWHWH2 tGHWL tVCS -100 tWC tCS tWP tAS tDS tDH tAH tWPH Min 100 0 50 0 50 0 50 30 -120 Max Min 120 0 50 0 50 0 50 30 300 15 0 50 Min 150 0 65 0 65 0 65 35 0 50 300 15 0 50 50 0 10 Unit Max 300 15 50 tOES tOEH -150 Max 0 10 50 0 10 ns ns ns ns ns ns ns ns µs sec µs µs sec ns ns 1. Typical value for tWHWH1 is 9µs. 2. For Toggle and Data Polling. 3. Guaranteed by design, but not tested. AC CHARACTERISTICS – READ-ONLY OPERATIONS VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Select High to Output High Z (1) Output Enable High to Output High Z (1) Output Hold from Addresses, CS# or OE# Change, whichever is First Symbol tAVAV tAVQV tELQV tGLQV tEHQZ tGHQZ tAXQX -100 tRC tACC tCE tOE tDF tDF tOH Min 100 -120 Max Min 120 100 100 40 30 30 0 -150 Max Min 150 120 120 50 30 30 0 Unit Max 150 150 55 40 40 0 ns ns ns ns ns ns ns 1. Guaranteed by design, not tested. White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 Outputs WE# OE# CS# Addresses High Z tACC tCE tOE Addresses Stable tRC Output Valid tOH tDF H ig h Z AC WAVEFORMS FOR READ OPERATIONS White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 A0A0H tDH tWPH Data tDS tCS WE# OE# 5.0 V tWP tGHWL tWC CS# NOTES: 1. PA is the address of the memory location to be programmed. 2. PD is the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. DOUT is the output of the data written to the device. 5. Figure indicates last two bus cycles of four bus cycle sequence. Addresses 5555H tAS PA PD tAH tWHWH1 Data# Polling PA D7 # DOUT tOE tCE tRC tDF tOH WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 5555H AAAAH tDS tDH tWPH tVCS VCC Data WE# OE# Addresses NOTE: 1. SA is the sector address for Sector Erase. CS# tGHWL tCS tWP tAS 2AAAH 5555H tAH 5555H 8080H 5555H AAAAH 2AAAH 5555H SA 1010H/3030H AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 I/O0-15 Valid Data I/O0-6 and I/O8-14 Invalid t OE I/O7 and I/O15 Valid Data I/O0-6 and I/O8-14 I/O7 and I/O15 Data WE# OE# CS# t CH tOEH tCE t OE tWHWH 1 or 2 I/O7 # and I/O15 # t OH t DF High Z AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 A0H tDH tCPH 5.0 V tDS Data CS# OE# tWS tWC WE# Addresses 5555H tGHEL tCP tAS PA PD t AH tWHWH1 Data# Polling PA D7 # DOUT ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS NOTES: 1. PA represents the address of the memory location to be programmed. 2. PD represents the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. DOUT is the output of the data written to the device. 5. Figure indicates the last two bus cycles of a four bus cycle sequence. White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 PACKAGE 509: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T) 25.15 (0.990) ± 0.26 (0.010) SQ 4.57 (0.180) MAX 22.36 (0.880) ± 0.26 (0.010) SQ 0.27 (0.011) ± 0.04 (0.002) 0.25 (0.010) REF Pin 1 R 0.25 (0.010) 24.03 (0.946) ± 0.26 (0.010) 0.19 (0.007) ± 0.06 (0.002) 1° / 7° 1.0 (0.040) ± 0.127 (0.005) 23.87 (0.940) REF DETAIL A 1.27 (0.050) TYP SEE DETAIL "A" 0.38 (0.015) ± 0.05 (0.002) 20.3 (0.800) REF The WEDC 68 lead G2T CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2T has the TCE and lead inspection advantage of the CQFP form. 0.940" ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 11 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 PACKAGE 401: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1) 30.1 (1.185) ± 0.38 (0.015) SQ PIN 1 IDENTIFIER SQUARE PAD ON BOTTOM 25.4 (1.0) TYP 3.81 (0.150) ± 0.1 (0.005) 1.27 (0.050) ± 0.1 (0.005) 0.76 (0.030) ± 0.1 (0.005) 2.54 (0.100) TYP 15.24 (0.600) TYP 1.27 (0.050) TYP DIA 0.46 (0.018) ± 0.05 (0.002) DIA 25.4 (1.0) TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 ORDERING INFORMATION W F 1M32 B - XXX X X 3 X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads PROGRAMMING VOLTAGE 3 = 3.3V DEVICE GRADE: M = Military Screened I = Industrial C = Commercial -55°C to +125°C -40°C to +85°C 0°C to +70°C PACKAGE TYPE: H = Ceramic Hex In line Package, HIP (Package 401) G2T = 22mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509) ACCESS TIME (ns) IMPROVEMENT MARK B = Boot Block (Bottom Sector) ORGANIZATION, 1M x 32 User configurable as 2M x 16 or 4M x 8 Flash WHITE ELECTRONIC DESIGNS CORP. White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 13 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com