Si4620DY Vishay Siliconix N-Channel 30-V (D-S) MOSFET with Schottky Diode FEATURES MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) (Ω) ID (A) 0.035 at VGS = 10 V 7.4 0.052 at VGS = 4.5 V 6.1 • Halogen-free According to IEC 61249-2-21 Definition • LITTLE FOOT® Plus Power MOSFET • Compliant to RoHS Directive 2002/95/EC Qg (Typ.) 4.2 nC SCHOTTKY PRODUCT SUMMARY APPLICATIONS VKA (V) VF (V) Diode Forward Voltage IF (A)a 30 0.470 at 3 A 3 • Load Switch for Portable Applications - Ideal for Boost Circuits • HDD Driver SO-8 K D A 1 8 K A 2 7 K S 3 6 D G 4 5 D G Top View S Ordering Information: Si4620DY-T1-E3 (Lead (Pb)-free) Si4620DY-T1-GE3 (Lead (Pb)-free and Halogen-free) A N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage (MOSFET) Reverse Voltage (Schottky) Gate-Source Voltage (MOSFET) Continuous Drain Current (TJ = 150 °C) (MOSFET) Symbol VDS VKA VGS TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C IDM Pulsed Drain Current (MOSFET) Continuous Source Current (MOSFET Diode Conduction) TC = 25 °C TA = 25 °C Maximum Power Dissipation (Schottky) Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature) Document Number: 73862 S09-1341-Rev. D, 13-Jul-09 IS IF Average Forward Current (Schottky) Pulsed Forward Current (Schottky) Maximum Power Dissipation (MOSFET) ID IFM TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C PD TJ, Tstg Limit 30 30 ± 20 7.5 6 6 4.8 40 2.6 Unit V A 1.7a, b 3 8 3.1 2 2a, b 1.3a, b 3 1.9 1.8 1.1 - 55 to 150 260 W °C www.vishay.com 1 Si4620DY Vishay Siliconix THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Maximum Junction-to-Ambient (MOSFET)a, c Maximum Junction-to-Foot (Drain) (MOSFET) RthJA 53 62.5 RthJF 30 40 Maximum Junction-to-Ambient (Schottky) RthJA 55 65 Maximum Junction-to-Foot (Drain) (Schottky) RthJF 32 42 Unit °C/W Notes: a. Surface Mounted on FR4 board. b. t ≤ 10 s. c. Maximum under Steady State conditions for MOSFETS is 110 °C/W. d. Maximum under Steady State conditions for Schottky is 115 °C/W. SPECIFICATIONS TJ = 25 °C, unless otherwise noted Parameter Symbol Test Conditions Min. VDS VGS = 0 V, ID = 250 µA 30 Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS Temperature Coefficient ΔVDS/TJ VGS(th) Temperature Coefficient ΔVGS(th)/TJ Gate-Source Threshold Voltage V 32.5 ID = 250 µA mV/°C - 5.3 VGS(th) VDS = VGS, ID = 250 µA 2.5 V Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA Zero Gate Voltage Drain Current IDSS VDS = 30 V, VGS = 0 V 1 VDS = 30 V, VGS = 0 V, TJ = 55 °C 10 On-State Drain Currenta ID(on) Drain-Source On-State Resistancea Forward Transconductancea RDS(on) gfs VDS ≤ 5 V, VGS = 10 V 1.2 30 µA A VGS = 10 V, ID = 6 A 0.028 0.035 VGS = 4.5 V, ID = 4.9 A 0.041 0.052 VDS = 15 V, ID = 6 A 12 520 1040 VDS = 15 V, VGS = 0 V, f = 1 MHz 115 230 55 110 Ω S Dynamicb Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time www.vishay.com 2 Rg VDS = 15 V, VGS = 10 V, ID = 6 A VDS = 15 V, VGS = 4.5 V, ID = 6 A td(off) tf 13 4.2 6.5 1.8 nC 1.5 f = 1 MHz td(on) tr 8.6 pF VDD = 15 V, RL = 3.1 Ω ID ≅ 4.8 A, VGEN = 4.5 V, Rg = 6 Ω Ω 2.8 16 30 36 54 21 40 17 40 ns Document Number: 73862 S09-1341-Rev. D, 13-Jul-09 Si4620DY Vishay Siliconix SPECIFICATIONS TJ = 25 °C, unless otherwise noted Parameter Symbol Test Conditions IS TC = 25 °C Min. Typ. Max. Unit Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulse Diode Forward Current ISM Body Diode Voltage VSD Body Diode Reverse Recovery Time trr Body Diode Reverse Recovery Charge Qrr Reverse Recovery Fall Time ta Reverse Recovery Rise Time tb 2.6 40 IS = 1.7 A, VGS = 0 V IF = 1.7 A, dI/dt = 100 A/µs, TJ = 25 °C A 0.8 1.2 V 20 40 ns 14 30 nC 14 ns 6 Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing. SCHOTTKY SPECIFICATIONS TJ = 25 °C, unless otherwise noted Parameter Forward Voltage Drop Maximum Reverse Leakage Current Junction Capacitance Symbol VF Irm CT Test Conditions Typ. Max. IF = 3 A Min. 0.39 0.470 IF = 3 A, TJ = 125 °C 0.35 0.420 Vr = 5 V 0.1 0.2 Vr = 5 V, TJ = 85 °C 3.5 17.5 Vr = 5 V, TJ = 106 °C 12 60 Vr = 30 V 0.22 0.5 Vr = 30 V, TJ = 85 °C 10 50 Vr = 30 V, TJ = 125 °C 40 200 Vr = 15 V 100 Unit V mA pF Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Document Number: 73862 S09-1341-Rev. D, 13-Jul-09 www.vishay.com 3 Si4620DY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 10 40 VGS = 10 V thru 6 V 35 5V 8 I D - Drain Current (A) I D - Drain Current (A) 30 25 20 4V 15 6 4 TC = 125 °C 10 2 5 0 0.0 0 0 1 2 3 4 - 55 °C 25 °C 3V 5 0.5 1.0 VDS - Drain-to-Source Voltage (V) 1.5 2.0 2.5 3.0 3.5 4.0 VGS - Gate-to-Source Voltage (V) Output Characteristics Transfer Characteristics 0.10 800 600 C - Capacitance (pF) R D S(on) - On-Resistance (Ω) 700 0.08 0.06 VGS = 4.5 V 0.04 VGS = 10 V Ciss 500 400 300 200 Coss 0.02 100 Crss 0.00 0 0 5 10 15 20 25 30 35 40 0 5 ID - Drain Current (A) 10 20 25 30 VDS - Drain-to-Source Voltage (V) On-Resistance vs. Drain Current and Gate Voltage Capacitance 10 1.6 VGS = 10 V ID = 6 A ID = 6 A 8 1.4 R D S(on) - On-Resistance (Normalized) VG S - Gate-to-Source Voltage (V) 15 VDS = 15 V 6 VDS = 24 V 4 2 1.2 1.0 0.8 0 0 2 4 6 Qg - Total Gate Charge (nC) Gate Charge www.vishay.com 4 8 10 0.6 - 50 - 25 0 25 50 75 100 125 150 TJ - Junction Temperature (°C) On-Resistance vs. Junction Temperature Document Number: 73862 S09-1341-Rev. D, 13-Jul-09 Si4620DY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 0.12 40 R DS(on) - On-Resistance (mΩ) I S - Source Current (A) ID = 6 A TJ = 150 °C 10 TJ = 25 °C 0.10 0.08 0.06 125 °C 25 °C 0.04 0.02 1 0.0 0.00 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1.6 2 VSD - Source-to-Drain Voltage (V) 4 6 8 10 VGS - Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage On-Resistance vs. Gate-to-Source Voltage 2.4 50 2.2 40 ID = 250 µA Power (W) VGS(th) (V) 2.0 1.8 30 20 1.6 10 1.4 1.2 - 50 - 25 0 25 50 75 100 125 0 10-3 150 10-2 TJ - Temperature (°C) 10-1 1 10 100 600 Time (s) Threshold Voltage Single Pulse Power 100 Limited by RDS(on)* P(t) = 0.0001 I D - Drain Current (A) 10 P(t) = 0.001 1 P(t) = 0.01 P(t) = 0.1 P(t) = 1 P(t) = 10 0.1 DC TA = 25 °C Single Pulse 0.01 0.1 BVDSS Limited 1 10 100 VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified Safe Operating Area, Junction-to-Ambient Document Number: 73862 S09-1341-Rev. D, 13-Jul-09 www.vishay.com 5 Si4620DY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 10 4 Power Dissipation (W) I D - Drain Current (A) 8 6 4 3 2 1 2 0 0 0 25 50 75 100 TC - Case Temperature (°C) Current Derating* 125 150 25 50 75 100 125 150 TC - Case Temperature (°C) Power Derating * The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. www.vishay.com 6 Document Number: 73862 S09-1341-Rev. D, 13-Jul-09 Si4620DY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 2 Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5 0.2 Notes: 0.1 PDM 0.1 0.05 t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 92 °C/W 0.02 3. TJM - TA = PDMZthJA(t) Single Pulse 0.01 10-4 10-3 4. Surface Mounted 10-2 10-1 1 10 100 600 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient 2 Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10-4 10-3 10-2 10-1 1 10 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Foot Document Number: 73862 S09-1341-Rev. D, 13-Jul-09 www.vishay.com 7 Si4620DY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 1000 10 I F - Forward Current (A) I R - Reverse Current (mA) 100 10 I R = 30 V 1 I R = 10 V 0.1 0.01 TJ = 150 °C 1 TJ = 25 °C 0.1 0.001 0.0001 - 50 0.01 - 25 0 25 50 75 100 125 150 0 0.1 0.2 0.3 0.4 0.5 0.6 VF - Forward Voltage Drop (V) TC - Junction Temperature (°C) Forward Voltage Drop Reverse Current vs. Junction Temperature C T - Junction Capacitance (pF) 300 240 180 120 60 0 0 4 8 12 16 20 VKA - Reverse Voltage (V) Capacitance www.vishay.com 8 Document Number: 73862 S09-1341-Rev. D, 13-Jul-09 Si4620DY Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 Notes: 0.05 PDM 0.02 t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 93 °C 3. TJM - TA = PDMZthJA(t) Single Pulse 0.01 10-4 4. Surface Mounted 10-3 10-2 10-1 10 1 100 1000 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10 -4 10-3 10-2 10-1 1 10 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Foot Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?73862. Document Number: 73862 S09-1341-Rev. D, 13-Jul-09 www.vishay.com 9 Package Information Vishay Siliconix SOIC (NARROW): 8-LEAD JEDEC Part Number: MS-012 8 6 7 5 E 1 3 2 H 4 S h x 45 D C 0.25 mm (Gage Plane) A e B All Leads q A1 L 0.004" MILLIMETERS INCHES DIM Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.20 0.004 0.008 B 0.35 0.51 0.014 0.020 C 0.19 0.25 0.0075 0.010 D 4.80 5.00 0.189 0.196 E 3.80 4.00 0.150 e 0.101 mm 1.27 BSC 0.157 0.050 BSC H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 L 0.50 0.93 0.020 0.037 q 0° 8° 0° 8° S 0.44 0.64 0.018 0.026 ECN: C-06527-Rev. I, 11-Sep-06 DWG: 5498 Document Number: 71192 11-Sep-06 www.vishay.com 1 VISHAY SILICONIX TrenchFET® Power MOSFETs Application Note 808 Mounting LITTLE FOOT®, SO-8 Power MOSFETs Wharton McDaniel Surface-mounted LITTLE FOOT power MOSFETs use integrated circuit and small-signal packages which have been been modified to provide the heat transfer capabilities required by power devices. Leadframe materials and design, molding compounds, and die attach materials have been changed, while the footprint of the packages remains the same. See Application Note 826, Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Siliconix MOSFETs, (http://www.vishay.com/ppg?72286), for the basis of the pad design for a LITTLE FOOT SO-8 power MOSFET. In converting this recommended minimum pad to the pad set for a power MOSFET, designers must make two connections: an electrical connection and a thermal connection, to draw heat away from the package. 0.288 7.3 0.050 1.27 0.196 5.0 0.027 0.69 0.078 1.98 0.2 5.07 Figure 1. Single MOSFET SO-8 Pad Pattern With Copper Spreading Document Number: 70740 Revision: 18-Jun-07 0.050 1.27 0.088 2.25 0.088 2.25 0.027 0.69 0.078 1.98 0.2 5.07 Figure 2. Dual MOSFET SO-8 Pad Pattern With Copper Spreading The minimum recommended pad patterns for the single-MOSFET SO-8 with copper spreading (Figure 1) and dual-MOSFET SO-8 with copper spreading (Figure 2) show the starting point for utilizing the board area available for the heat-spreading copper. To create this pattern, a plane of copper overlies the drain pins. The copper plane connects the drain pins electrically, but more importantly provides planar copper to draw heat from the drain leads and start the process of spreading the heat so it can be dissipated into the ambient air. These patterns use all the available area underneath the body for this purpose. Since surface-mounted packages are small, and reflow soldering is the most common way in which these are affixed to the PC board, “thermal” connections from the planar copper to the pads have not been used. Even if additional planar copper area is used, there should be no problems in the soldering process. The actual solder connections are defined by the solder mask openings. By combining the basic footprint with the copper plane on the drain pins, the solder mask generation occurs automatically. A final item to keep in mind is the width of the power traces. The absolute minimum power trace width must be determined by the amount of current it has to carry. For thermal reasons, this minimum width should be at least 0.020 inches. The use of wide traces connected to the drain plane provides a low impedance path for heat to move away from the device. www.vishay.com 1 APPLICATION NOTE In the case of the SO-8 package, the thermal connections are very simple. Pins 5, 6, 7, and 8 are the drain of the MOSFET for a single MOSFET package and are connected together. In a dual package, pins 5 and 6 are one drain, and pins 7 and 8 are the other drain. For a small-signal device or integrated circuit, typical connections would be made with traces that are 0.020 inches wide. Since the drain pins serve the additional function of providing the thermal connection to the package, this level of connection is inadequate. The total cross section of the copper may be adequate to carry the current required for the application, but it presents a large thermal impedance. Also, heat spreads in a circular fashion from the heat source. In this case the drain pins are the heat sources when looking at heat spread on the PC board. 0.288 7.3 Application Note 826 Vishay Siliconix RECOMMENDED MINIMUM PADS FOR SO-8 0.172 (4.369) 0.028 0.022 0.050 (0.559) (1.270) 0.152 (3.861) 0.047 (1.194) 0.246 (6.248) (0.711) Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index APPLICATION NOTE Return to Index www.vishay.com 22 Document Number: 72606 Revision: 21-Jan-08 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1