TELEFUNKEN Semiconductor TFDU4100/TFDS4500/TFDT4500 2.7–5.5V Serial Infrared Transceiver Module Family (SIR, 115.2 kbit/s) Features Compliant to IrDA 1.2 (up to 115.2 kbit/s) Wide Operating Voltage Range (2.7 to 5.5 V ) Low Power Consumption (1.3 mA Supply Current) Power Sleep Mode Through VCC1/SD Pin (5 nA Sleep Current) Long Range (up to 3.0 m at 115.2 kbit/s) Three Surface Mount Package Options – Universal (9.7 x 4.7 x 4.0 mm) – Side View (13.0 x 5.95 x 5.3 mm) – Top View (13.0 x 7.6 x 5.95 mm) Applications BabyFace (Universal) Package Capable of Surface Mount Solderability to Side- and Top-View Orientation Directly Interfaces with Various Super I/O and Controller Devices and TEMIC’s TOIM3000 and TOIM3232 I/Os Few External Components Required Backward Compatible to All TEMIC SIR Infrared Transceivers Built–in EMI Protection – No External Shielding Necessary Notebook Computers, Desktop PCs, Palmtop Computers (Win CE, Palm PC), PDAs Digital Still and Video Cameras Printers, Fax Machines, Photocopiers, Screen Projectors Telecommunication Products (Cellular Phones, Pagers) Internet TV Boxes, Video conferencing systems External Infrared Adapters (Dongles) Medical and Industrial Data Collection Devices Description The TFDU4100, TFDS4500, and TFDT4500 are a family of low-power infrared transceiver modules compliant to the IrDA 1.2 standard for serial infrared (SIR) data communication, supporting IrDA speeds up to 115.2 kbit/s. Integrated within the transceiver modules are a photo PIN diode, infrared emitter (IRED), and a low-power analog control IC to provide a total front–end solution in a single package. TEMIC’s SIR transceivers are available in three package options, including our BabyFace package (TFDU4100), the smallest SIR transceiver available on the market. This wide selection provides flexibility for a variety of applications and space constraints. The transceivers are capable of directly interfacing with a wide variety of I/O chips which perform the pulse-width modulation/demodulation function, including TEMIC’s TOIM3000 and TOIM3232. At a minimum, a current-limiting resistor in series with the infrared emitter and a Vcc bypass capacitor are the only external components required to implement a complete solution. Package Options TFDU4100 Baby Face (Universal) TFDS4500 Side View TFDT4500 Top View This product is currently in devleopment. Inquiries regarding the status of this product should be directed to TEMIC Marketing. Pending—Rev. A, 03-Apr-98 1 Pre-Release Information TELEFUNKEN TFDU4100/TFDS4500/TFDT4500 Semiconductor Functional Block Diagram VCC1/SD VCC2 Driver Amplifier Rxd Comparator RS IRED Anode AGC Logic SC Txd IRED Cathode Open Collector Driver GND Pin Assignment and Description Pin Number “ U ”, “ T ” Option “S” Option Function 1 8 IRED Anode 2 1 IRED Cathode 3 7 Txd 4 2 5 Description I/O Active Transmit Data Input I HIGH Rxd Received Data Output, push–pull CMOS driver output capable of driving a standard CMOS or TTL load. No external pull–up or pull–down resistor is required (20 kΩ resistor internal to device). Pin is inactive during transmission. O LOW 6 NC Do not connect 6 3 VCC1/ SD 7 5 SC I HIGH 8 4 GND IRED anode, should be externally connected to VCC2 through a current control resistor IRED cathode, internally connected to driver transistor Supply Voltage/Shutdown (see “Shutdown” on page 6) Sensitivity control Ground 8 IRED 7 6 5 Detector IRED Detector 1 2 3 4 5 6 7 8 1 IRED ”U” Option BabyFace (Universal) 2 3 4 Detector ”S” Option Side View 2 1 2 3 4 5 6 7 8 ”T” Option Top View Pending—Rev. A, 03-Apr-98 Pre-Release Information TELEFUNKEN Semiconductor TFDU4100/TFDS4500/TFDT4500 Ordering Information Part Number Qty/ Reel Description TFDU4100–TR3 1000 pcs Oriented in carrier tape for side view surface mounting TFDU4100–TT3 1000 pcs Oriented in carrier tape for top view surface mounting TFDS4500–TR3 750 pcs TFDT4500–TR3 750 pcs Absolute Maximum Ratings Parameter Symbol Supply Voltage Range VCC1 Voltage Range of IRED Drive Output VCC2 Test Conditionsa IRED anode pin, Txd LOW Minb Typc Maxb – 0.5 6 – 0.5 6 Input Currentsd 10 Output Sink Current 25 Power Dissipatione Junction Temperature PD 200 TJ Tamb –25 85 Storage Temperature Range Tstg –25 85 t = 20 s Average IRED Current IIRED (DC) Repetitive Pulsed IRED Current IIRED (RP) IRED Anode Voltage at Current Output 215 100 t < 90µs, ton<20% mW °C mA 500 – 0.5 6 Transmitter Data Input Voltage VTxd – 0.5 Vcc + 0.5 Receiver Data Output Voltage VRxd – 0.5 d 2.5 Maximum Intensity for Class 1 Operation of IEC 825 or EN60825g mA 240 VIREDA Virtual Source Sizef V 125 Ambient Temperature Range (Operating) Soldering Temperature Unit EN60825, 1997 V Vcc + 0.5 2.8 mm 400 mW/sr Notes a. Reference point GND pin unless otherwise noted. b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum. c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. d. All pins except IRED cathode pin and IRED anode pin. e. See Derating Curve f. Method: (1-1/e) encircled energy. g. Worst case IrDA SIR pulse pattern. Pending—Rev. A, 03-Apr-98 3 Pre-Release Information TELEFUNKEN TFDU4100/TFDS4500/TFDT4500 Semiconductor Electrical Characteristics Parameter Symbol Test Conditionsa Minb Typc Maxb Unit Transceiver Supply Voltage VCC1 Receive Mode 2.7 5.5 Supply Voltage VCC1 Transmit Mode, R2 = 51 Ω 2.0 5.5 Supply pp y Current,, VCC1 Pin (Receive Mode) Supply pp y Current,, VCC1 Pin ((avg) g) (Transmit Mode) d VCC1= 5.5V 1.3 2.5 VCC1= 2.7V 1.0 1.5 VCC1= 5.5V 5.0 5.5 VCC1= 2.7V 3.5 4.5 VCC1= OFF, Txd = LOW, VCC2 = 6V, T = 25°– 85° C 0.005 0.5 IS IS Leakage Current of IR Emitter, IRED Anode Pin IS Transceiver Power On Settling Time IS V mA µA µs 50 Optoelectronic Characteristics Parameter Symbol Test Conditionsa Eemin α = ±15_, SIR Mode, SC = LOW Minb Typc Maxb 20 35 Unit Receiver Min Detection Threshold Irradiancee Min Detection Threshold Irradianced Max Detection Threshold Irradianced Logic Low Receiver Input Irradiance α = ±15_, SIR Mode, SC = LOW, VCC1 = 2.7V 35 Eemin α = ±15_, SIR Mode, SC = HIGH 6 Eemax α = ± 90_, SIR Mode, VCC1 = 5V 3.3 5 α = ± 90_, SIR Mode, VCC1 = 3V 8 15 10 15 kW/m2 4 mW/m2 0.8 V Eemax (low) SC = HIGH or LOW VOL Active, C = 15 pF, R = 2.2 kΩ VOH Non–active, C = 15 pF, R = 2.2 kΩ Rise Time tr C = 15 pF, R = 2.2 kΩ 20 1400 Fall Time tf C = 15 pF, R = 2.2 kΩ 20 200 Rxd Pulse Width of Output Signal 1.41 8 Rxd Output Voltage Output Current 0.5 VCC–0.5 VOL < 0.8V Pw 115.2 kbit/s mode Jitterf tj Over a period of 10 bit, 115.2 kbit/s Latency tL mW/m2 4 mA 2 100 500 ns µs µs Notes a. Tamb = 25_C, VCC = 2.7 – 5.5 V unless otherwise noted. b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum. c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. d. IIRED (peak) = 210 mA (At IRED Anode pin) e. BER = 10–8 (IrDA specification). f. Leading edge of output signal. 4 Pending—Rev. A, 03-Apr-98 Pre-Release Information TELEFUNKEN Semiconductor TFDU4100/TFDS4500/TFDT4500 Optoelectronic Characteristics (Cont’d) Parameter Test Conditionsa Symbol Minb Typc Maxb Unit 0.3 0.4 A Transmitter IRED Operating Currentd ID Current limiting resistor is series to IRED: R1 = 8.2 Ω, VCC2 = 5V Logic Low Transmitter Input Voltage VIL (Txd) 0 0.8 Logic High Transmitter Input Voltage VIH (Txd) 2.4 VCC1+0.5 Output Radiant Intensitye IeH Current limiting resistor in series to IRED: R1 = 8.2Ω @ VCC2 = 5V, α = ±15_ Output Radiant Intensity IeL Logic Low Level Angle of Half Intensity α Peak Wavelength of Emission λP 45 140 200 mW/sr 0.04 mW/sr ±24 _ 880 900 Halfwidth of Emission Spectrum Optical Rise Time, Fall Time nm 60 tR, tF 115.2 kHz square wave signal, duty cycle 1:1 200 Optical Overshoot Rising Edge Peak–to–Peak Jitter V tj Over a period of 10 bits, independent of information content 600 ns 25 % 0.2 µs Notes a. Tamb = 25_C, VCC = 2.7 – 5.5 V unless otherwise noted. b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum. c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. d. IRED Operating Current can be adjusted by variation of R1 e. In agreement with IEC 825 eye safety limit Recommended Circuit Diagram The only required components for designing an IrDA 1.2 compatible design using TEMIC SIR transceivers are a current limiting resistor to the IRED. However, depending on the entire system design and board layout, additional components may be required (see Figure 1). It is recommended that the capacitors C1 and C2 are positioned as near as possible to the transceiver power supply pins, as in the proposed layout in Figure 1. A tantalum capacitor should be used for C1, while a ceramic capacitor should be used for C2 to suppress RF noise. Also, when connecting the described circuit to the power supply, low impedance wiring should be used. R1 is used for controlling the current through the IR emitter. For increasing the output power of the IRED, the value of the resistor should be reduced. Similarly, to reduce the output power of the IRED, the value of the resistor should be increased. For typical values of R1 see Fig 2. For IrDA compliant operation, a current control resistor of 8–12 Ω is recommended. The upper drive current limitation is dependent on the duty cycle and is given by the absolute maximum ratings on the data sheet and the eye safety limitations given by IEC825–1. VCC2 VCC1/SD TFDx4x00 IRED IRED Cathode Anode R2 Rxd Txd Rxd C1 R1 C2 Txd VCC1/SD SC GND NC GND SC Note: Outlined components are optional depending on quality of power supply. Figure 1. Recommended Application Circuit R2, C1 and C2 are optional and dependent on the quality of the supply voltage VCC1 and injected noise. An Pending—Rev. A, 03-Apr-98 5 Pre-Release Information TFDU4100/TFDS4500/TFDT4500 unstable power supply with dropping voltage during transmission may reduce sensitivity (and transmission range) of the transceiver. Table 1. Recommended Application Circuit Components Component Recommended Value C1 100 nF, Ceramic (use 470 nF for less stable power supplies) C2 1 µF, Tantalum R1 8.2 Ω, 0.25 W (recommend using two 0.125 W resistors in parallel) R2 22 – 47 Ω, 0.125 W The sensitivity control (SC) pin allows the minimum detection irradiance threshold of the transceiver to be lowered when set to a logic HIGH. Lowering the irradiance threshold increases the sensitivity to infrared signals and increases transmission range up to 3 meters. However, setting the SC pin to logic HIGH also makes the transceiver more susceptible to transmission errors due to an increased sensitivity to fluorescent light distrubances. It is recommended to set the SC pin to logic LOW or left open if the increased range is not required or if the system will be operating in bright ambient light. The guide pins on the side-view and top-view packages are internally connected to ground but should not be connected to the system ground to avoid ground loops. They should be used for mechanical purposes only and should be left floating. 300 Intensity Ie (mW/sr) 250 200 5.25 V, Min. Efficiency, Min. VF, Min. RDSon 150 4.75 V, Min. Efficiency, Min. VF, Max. RDSon 100 TELEFUNKEN Semiconductor Shutdown The internal switch for the IRED in TEMIC SIR transceivers is designed to be operated like an open collector driver. Thus, the VCC2 source can be an unregulated power supply while only a well regulated power source with a supply current of 1.3 mA connected to VCC1/SD is needed to provide power to the remainder of the transceiver circuitry in receive mode. In transmit mode, this current is slightly higher (approxiamately 4 mA average at 3V supply current) and the voltage is not required to be kept as stable as in receive mode. A voltage drop of VCC1 is acceptable down to about 2.2V when buffering the voltage directly from the VCC1 pin to GND by a 470 nF ceramic capacitor (C1) and a 51 Ω serial resistor (R2) is used (see figure 1). This configuration minimizes the influence of high current surges from the IRED on the internal analog control circuitry of the transceiver and the application circuit. Also, board space and cost savings can be achieved by eliminating the additional linear regulator normally needed for the IRED’s high current requirements. The transceiver can be very efficiently shutdown by keeping the IRED connected to the power supply VCC2 but switching off VCC1/SD. The power source to VCC1/SD can be provided directly from a microcontroller (see Figure 3). In shutdown, current loss is realized only as leakage current through the current limiting resistor to the IRED (typically, 5 nA). The settling time after switching VCC1/SD on again is approxiamately 50 µs. TEMIC’s TOIM3232 interface circuit is designed for this shutdown feature. The Vcc_SD, S0 or S1 outputs on the TOIM3232 can be used to power the transceiver with the necessary supply current. 50 IrDA Field of View: Cone of 15_ 0 4.0 6.0 8.0 10.0 12.0 14.0 Current Control Resistor, Rl () Figure 2. Ie vs Rl 16.0 If the microcontroller or the microprocessor is unable to drive the 1.3-mA supply current required by the transceiver, a low-cost SOT-23 pnp transistor can be used to switch voltage on and off from the regulated power supply (see figure 4). The additional component cost is minimal and saves the system designer additional power supply costs. 6 Pending—Rev. A, 03-Apr-98 Pre-Release Information TELEFUNKEN Semiconductor TFDU4100/TFDS4500/TFDT4500 Shutdown (Cont’d) IIRED Power Supply + _ Regulated Power Supply 50 mA RILIM IRED Anode Microcontroller or Microprocessor 20 mA TFDU4100 (Note: Typical Values Listed) Receive Mode @5 V: IIRED = 300 mA, IS = 1.3 mA @2.7 V: IIRED = 300 mA, IS = 1.0 mA Transmit Mode @5 V: IIRED = 300 mA, IS = 5 mA (Avg.) @2.7 V: IIRED = 300 mA, IS = 3.5 mA (Avg.) IS VCC1/SD Figure 3. IIRED Power Supply + _ Regulated Power Supply 50 mA R1 IRED Anode TFDU4100 (Note: Typical Values Listed) Receive Mode @5 V: IIRED = 300 mA, IS = 1.3 mA @2.7 V: IIRED = 300 mA, IS = 1.0 mA Transmit Mode @5 V: IIRED = 300 mA, IS = 5 mA (Avg.) @2.7 V: IIRED = 300 mA, IS = 3.5 mA (Avg.) IS Microcontroller or Microprocessor 20 mA VCC1/SD Figure 4. Pending—Rev. A, 03-Apr-98 7 Pre-Release Information TFDU4100/TFDS4500/TFDT4500 TELEFUNKEN Semiconductor TFDU4100 – BabyFace (Universal) Package Mechanical Dimensions 8 Pending—Rev. A, 03-Apr-98 Pre-Release Information TFDU4100/TFDS4500/TFDT4500 TELEFUNKEN Semiconductor TFDS4500 – Side View Package Mechanical Dimensions Pending—Rev. A, 03-Apr-98 9 Pre-Release Information TFDU4100/TFDS4500/TFDT4500 TELEFUNKEN Semiconductor TFDT4500 – Top View Package Mechanical Dimensions 10 Pending—Rev. A, 03-Apr-98 Pre-Release Information TFDU4100/TFDS4500/TFDT4500 TELEFUNKEN Semiconductor Recommended SMD Pad Layouta TFDU4100 Ć BabyFace (Universal) Package TFDT4500 Ć Top View Package TFDS4500 Ć Side View Package a. (note: leads of the device should be at least 0.3 mm within the ends of the pads. Pad 1 is longer to designate pin 1 connection to transciver) The leads of the device should be soldered in the center position. Pending—Rev. A, 03-Apr-98 11 Pre-Release Information TELEFUNKEN TFDU4100/TFDS4500/TFDT4500 Semiconductor Recommended Solder Profile 260 10 s Max. @ 230 _C 240 220 2 – 4 _C/Seconds C) 200 Temperature ( _ 180 160 140 120 – 180 Seconds 90 s Max. 120 100 80 2 – 4 _C/Seconds 60 40 20 0 0 50 100 150 200 250 300 350 Time (Seconds) Current Derating Curve 600 Peak Operating Current (mA) 500 400 300 Current derating as a function of the maximum forward current of IRED. Maximum duty cycle: 20% 200 100 0 –40 –20 0 20 40 60 80 100 120 140 Temperature (_C) 12 Pending—Rev. A, 03-Apr-98 Pre-Release Information