STPS1L40-Y Automotive low drop power Schottky rectifier Features ■ Very small conduction losses ■ Negligible switching losses ■ Low forward voltage drop ■ Surface mount miniature packages ■ Avalanche capability specified ■ AEC-Q101 qualified ■ ECOPACK®2 compliant components K K SMA (JEDEC DO-214AC) STPS1L40AY Table 1. Description Single chip Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. Packaged in SMA and SMB this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection in automotive applications. October 2011 A A Doc ID 18247 Rev 1 SMB (JEDEC DO-214AA) STPS1L40UY Device summary Symbol Value IF(AV) 1A VRRM 40 V Tj (max) 150 °C VF(max) 0.42 V 1/9 www.st.com 9 Characteristics 1 STPS1L40-Y Characteristics Table 2. Absolute ratings (limiting values) Symbol Unit Repetitive peak reverse voltage 40 V IF(RMS) Forward rms current 8 A IF(AV) Average forward current TL = 130 °C δ = 0.5 1 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 60 A IRRM Repetitive peak reverse current tp = 2 µs F = 1 kHz square 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 1 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 900 W - 65 to + 150 °C -40 to + 150 °C 10000 V/µs Value Unit Tj dV/dt Storage temperature range Operating junction temperature range(1) Critical rate of rise of reverse voltage 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-l) Table 4. Parameter 30 SMB 25 °C/W Static electrical characteristics Symbol Parameter IR (1) Reverse leakage current VF (1) SMA Junction to lead Tests conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 1 A Min. Typ. Max. Unit - - 35 µA - 6 10 mA - - 0.5 - 0.37 0.42 - - 0.63 - 0.5 0.61 V IF = 2 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.23 x IF(AV) + 0.19 IF2(RMS) 2/9 Value VRRM Tstg 1. Parameter Doc ID 18247 Rev 1 STPS1L40-Y Figure 1. 0.8 Characteristics Average forward power dissipation Figure 2. versus average forward current PF(AV)(W) 1.2 0.7 δ = 0.1 δ = 0.05 0.6 δ = 0.2 δ = 0.5 IF(AV)(A) SMA Rth(j-a) = Rth(j-l) 1.0 δ=1 0.8 0.5 0.6 0.4 0.3 Rth(j-a) = 120 °C/W 0.4 0.2 T T 0.2 0.1 0.0 0.0 δ = tp / T IF(AV)(A) 0.2 Figure 3. 1.2 Average forward current versus ambient temperature (SMA, δ = 0.5) 0.4 0.6 0.8 1.0 1.2 δ = tp / T tp 1.4 0 1.6 25 Average forward current versus Figure 4. ambient temperature (SMB, δ = 0.5) IF(AV)(A) Tamb(°C) 50 75 100 125 150 Normalized avalanche power derating versus pulse duration PARM(tp) PARM(1 µs) SMB 1 Rth(j-a) = Rth(j-l) 1.0 tp 0.0 0.8 0.1 Rth(j-a) = 100 °C/W 0.6 0.4 0.01 T 0.2 δ = tp / T tp Tamb(°C) 0 Figure 5. 25 50 75 100 tp(µs) 0.001 0.0 125 150 Normalized avalanche power derating versus junction temperature 0.01 Figure 6. PARM(Tj) PARM(25 °C) 0.1 1 10 100 1000 Non repetitive surge peak forward current versus overload duration (maximum values, SMA) I (A) 7 M SMA 1.2 6 1 5 0.8 Ta = 25 °C 4 0.6 Ta = 75 °C 3 0.4 Ta = 125 °C 2 0.2 1 IM Tj(°C) 0 25 50 75 100 125 150 0 1.E-04 Doc ID 18247 Rev 1 t δ = 0.5 1.E-03 t(s) 1.E-02 1.E-01 1.E+00 3/9 Characteristics Figure 7. STPS1L40-Y Non repetitive surge peak forward current versus overload duration (maximum values, SMB) I (A) 7 M Figure 8. 1.0 SMB Zth(j-a)/Rth(j-a) SMA 0.9 6 Epoxy printed circuit board, copper thickness = 35 µm, recommended pad layout 0.8 5 0.7 Ta = 25 °C 0.6 4 Ta = 75 °C 0.5 3 0.4 Ta = 125 °C 2 0.3 0.2 IM 1 t δ = 0.5 0 1.E-04 1.E-03 Figure 9. 1.0 Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) 0.1 1.E-02 1.E-01 1.E+00 Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Single pulse tp(s) 0.0 1.E-02 1.E-01 1.E+00 Tj = 150 °C Epoxy printed circuit board, copper thickness = 35 µm, recommended pad layout 0.7 1.E+03 I (mA) 1.E+02 R SMB 0.8 1.E+02 Figure 10. Reverse leakage current versus reverse voltage applied (typical values) Zth(j-a)/Rth(j-a) 0.9 1.E+01 1.E+01 Tj = 125 °C Tj = 100 °C 1.E+00 0.6 0.5 Tj = 75 °C 1.E-01 0.4 Tj = 50 °C 0.3 0.2 1.E-02 Single pulse Tj = 25 °C 0.1 0.0 1.E-02 tp(s) 1.E-01 1.E+00 1.E+01 1.E+02 Figure 11. Junction capacitance versus reverse voltage applied (typical values) 1000 VR(V) 1.E-03 1.E+03 0 5 10 15 20 25 30 35 40 Figure 12. Forward voltage drop versus forward current (typical values, high level) I (A) 10.00 FM C(pF) F = 1 MHz Vosc = 30 mVRMS Tj = 25 °C Tj = 125 °C 1.00 100 Tj = 25 °C 0.10 VR(V) 10 1 4/9 10 100 0.01 0.0 Doc ID 18247 Rev 1 VFM(V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 STPS1L40-Y Characteristics Figure 13. Forward voltage drop versus forward current (typical values, low level) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (SMA) I (A) 3.0 FM 140 2.5 Rth(j-a)(°C/W) SMA Epoxy printed circuit board, FR4 copper thickness = 35 µm 120 100 2.0 Tj = 125 °C 80 1.5 Tj = 25 °C 60 1.0 40 0.5 0.0 0.0 20 VFM(V) 0.1 0.2 0.3 0.4 0.5 0.6 Scu(cm²) 0 0.0 0.7 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMB) 120 Rth(j-a)(°C/W) SMB Epoxy printed circuit board, FR4 copper thickness = 35 µm 100 80 60 40 20 0 0.0 Scu(cm²) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Doc ID 18247 Rev 1 4.0 4.5 5.0 5/9 Package information 2 STPS1L40-Y Package information ● Epoxy meets UL94, V0 ● Cathode band (SMA, SMB) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMA dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 16. Footprint, dimensions in mm (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) 6/9 Doc ID 18247 Rev 1 STPS1L40-Y Package information Table 6. SMB dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 17. Footprint, dimensions in mm (inches) 1.62 2.60 (0.064) (0.102) 1.62 (0.064) 2.18 (0.086) 5.84 (0.300) Doc ID 18247 Rev 1 7/9 Ordering information 3 Ordering information Table 7. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS1L40AY GB4Y SMA 0.068 g 5000 Tape and reel STPS1L40UY GC4Y SMB 0.107 g 2500 Tape and reel Revision history Table 8. 8/9 STPS1L40-Y Document revision history Date Revision 21-Oct-2011 1 Changes First issue. Doc ID 18247 Rev 1 STPS1L40-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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