STPS20SM100S Power Schottky rectifier Features A(1) ■ High current capability A(3) ■ Avalanche rated ■ Low forward voltage drop current ■ High frequency operation ■ K(2) K A A Insulated package (TO-220FPAB): – Insulation voltage 2000 V rms – Package capacitance = 12 pF A A I2PAK STPS20SM100SR TO-220AB STPS20SM100ST Description K K K This single Schottky rectifier is suited for high frequency switch mode power supply. A A D2PAK Packaged in TO-220AB, TO-220FPAB, and I2PAK, this device is intended to be used in notebook, game station and desktop adaptors, providing in these applications a good efficiency at both low and high load. Table 1. Device summary A K A D2PAK STPS20SM100SG TO-220FPAB STPS20SM100SFP Electrical characteristics (a) Figure 1. IF(AV) 20 A VRRM 100 V V Tj (max) 150 °C I VF(typ) 0.480 V I "Forward" 2 x IO X IF VRRM VR VAR IO X V IR VTo VF(Io) VF VF(2xIo) "Reverse" IAR a. VARM and IARM must respect the reverse safe operating area defined in Figure 14. VAR and IAR are pulse measurements (tp < 1 µs). VR, IR, VRRM and VF, are static characteristics April 2010 Doc ID 15524 Rev 2 1/11 www.st.com 11 Characteristics STPS20SM100S 1 Characteristics Table 2. Absolute ratings (limiting values with terminals 1 and 3 short circuited) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current 2 Average forward current δ = 0.5 IFSM Surge non repetitive forward current Maximum repetitive peak avalanche VARM (2) voltage Maximum single pulse peak avalanche voltage Tstg Storage temperature range V 30 A 20 A 350 A 2 tp = 10 ms sinusoidal, terminals 1 and 3 short circuited tp = 1 µs Tj = 25 °C 15000 W tp < 1 µs Tj < 150 °C IAR < 37.5 A 120 V tp < 1 µs Tj < 150 °C IAR < 37.5 A 120 V -65 to + 150 °C 150 °C Maximum operating junction temperature Tj 100 TO-220FPAB Tc = 85 °C Repetitive peak avalanche power VASM (2) Unit TO-220AB, D PAK, I PAK Tc = 125 °C IF(AV) PARM(1) Value (3) 1. For temperature or pulse time duration deratings, refer to Figure 4. and Figure 5.. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the application notes AN1768 and AN2025. 2. Refer to Figure 14. dPtot --------------dTj 3. 1 - condition to avoid thermal runaway for a diode on its own heatsink < ------------------------Rth ( j – a ) Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Symbol Parameter Junction to case TO-220AB, D2PAK, I2PAK Parameter Test conditions Reverse leakage current Tj = 125 °C Tj = 25 °C Tj = 25 °C Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM VR = 70 V IF = 5 A IF = 10 A IF = 20 A 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.6 x IF(AV) + 0.005 x IF2(RMS) 2/11 °C/W 4 Static electrical characteristics (terminals 1 and 3 short circuited) Tj = 125 °C VF(2) Unit 1.3 TO-220FPAB Tj = 25 °C IR(1) Value Doc ID 15524 Rev 2 Min. Typ. Max. Unit 10 30 µA 10 30 mA 5 µA 5 mA 565 480 685 560 620 800 900 630 700 mV STPS20SM100S Figure 2. Characteristics Average forward power dissipation Figure 3. versus average forward current PF (av)(W) 22 IF(av)(A) 22 Rth(j-a)=Rth(j-c) δ=1 20 18 16 16 14 12 δ = 0.1 10 TO-220FPAB 14 δ = 0.2 12 TO-220AB/I²PAK 20 δ = 0.5 18 Average forward current versus ambient temperature (δ = 0.5) 10 δ = 0.05 8 Rth(j-a)=15°C/W 8 6 6 T 4 T 4 2 δ=tp/T IF(av)(A) δ=tp/T 2 tp 0 tp Tamb(°C) 0 0 2 4 6 Figure 4. 8 10 12 14 16 18 20 22 24 26 28 Normalized avalanche power derating versus pulse duration 0 25 Figure 5. P ARM (t p ) P ARM (1µs) 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 0.01 0.1 Figure 6. 320 Tj(°C) t p (µs) 0.001 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration, maximum values IM(A) 50 Figure 7. 180 75 100 125 150 Non repetitive surge peak forward current versus overload duration, maximum values (TO-220FPAB) IM(A) TO-220FPAB TO-220AB/I²PAK 160 280 140 240 120 200 100 160 TC=25°C TC=25°C 80 120 TC=75°C 80 TC=125°C IM 40 t δ =0.5 40 TC=125°C IM 20 t(s) t δ =0.5 t(s) 0 0 1.E-03 TC=75°C 60 1.E-02 1.E-01 1.E+00 1.E-03 Doc ID 15524 Rev 2 1.E-02 1.E-01 1.E+00 3/11 Characteristics Figure 8. 1.0 STPS20SM100S Relative variation of thermal impedance junction to case versus pulse duration Figure 9. Zth(j-c)/Rth(j-c) 1.0 TO-220AB/I²PAK 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 Zth(j-c)/Rth(j-c) TO-220FPAB 0.4 0.4 0.3 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Single pulse 0.3 T T 0.2 0.2 tp(s) 0.1 δ=tp/T tp(s) 0.1 tp 0.0 1.E-03 Single pulse δ=tp/T 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 Figure 10. Reverse leakage current versus reverse voltage applied (typical values) 1.E+02 IR(mA) Tj=150°C 1.E+01 Tj=125°C Tj=100°C 1.E+00 Tj=75°C 1.E-01 Tj=50°C 1.E-02 Tj=25°C VR(V) 1.E-03 0 4/11 tp 0.0 10 20 30 40 50 60 Doc ID 15524 Rev 2 70 80 90 100 1.E+01 STPS20SM100S Characteristics Figure 11. Junction capacitance versus reverse voltage applied (typical values) 10000 Figure 12. Forward voltage drop versus forward current (terminals 1 and 3 short circuited) IFM(A) C(pF) 40 F=1MHz VOSC=30mVRMS Tj=25°C Tj=125°C (Maximum values) 30 Tj=125°C (Typical values) 20 1000 Tj=25°C (Maximum values) 10 VFM(V) VR(V) 0 100 1 10 100 Figure 13. Thermal resistance junction to ambient versus copper surface under tab for D2PAK 0.0 Rth(j-a)(°C/W) 0.6 0.8 1.0 1.2 Iarm (A) 46 44 42 40 38 36 34 32 30 28 Epoxy printed board FR4, copper thickness = 35 µm) 70 60 50 40 30 20 10 S(cm²) 10 15 20 Forbidden area Operating area Varm (V) 100 0 5 0.4 Figure 14. Reverse safe operating area (tp < 1 µs and Tj < 150 °C) 80 0 0.2 25 30 35 110 120 130 140 150 40 Doc ID 15524 Rev 2 5/11 Package information 2 STPS20SM100S Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. TO-220AB dimensions Dimensions Ref. Dia Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 C L5 L7 L6 L2 F2 D L9 L4 L2 F M G1 Inches A H2 F1 Millimeters 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 E G M Diam. 6/11 Doc ID 15524 Rev 2 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 STPS20SM100S Package information Table 6. TO-220FPAB dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 A B H Dia L6 L2 L7 L3 L5 F1 L4 D F2 F L2 E 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 G1 G Doc ID 15524 Rev 2 7/11 Package information STPS20SM100S Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount device, IS NOT PERMITTED. A standard through-hole mounting is mandatory. I2PAK dimensions Table 7. Dimensions Ref. c2 L2 D L1 A1 b1 L b c e e1 8/11 Doc ID 15524 Rev 2 Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 A E Millimeters STPS20SM100S Package information Table 8. D2PAK dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R 0.40 typ. V2 0° 0.016 typ. 8° 0° 8° Figure 15. D2PAK footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 Doc ID 15524 Rev 2 3.70 9/11 Ordering information 3 Ordering information Table 9. 4 Ordering information Order code Marking Package Weight STPS20SM100ST PS20SM100ST TO-220AB 2.2 g 50 Tube STPS20SM100SFP PS20SM100SFP TO-220FPAB 1.70 g 50 Tube 2 Base qty Delivery mode STPS20SM100SR PS20SM100SR I PAK 1.49 g 50 Tube STPS20SM100SG-TR PS20SM100SG D2PAK 1.48 g 1000 Tape and reel Revision history Table 10. 10/11 STPS20SM100S Document revision history Date Revision Changes 25-Mar-2009 1 First issue. 16-Apr-2010 2 Updated package graphic for TO-220AB on front page and in Table 5. Doc ID 15524 Rev 2 STPS20SM100S Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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