STPS5H100-Y Automotive high voltage power Schottky rectifier Features ■ Negligible switching losses ■ High junction temperature capability ■ Low leakage current ■ Good trade off between leakage current and forward voltage drop ■ Avalanche specification ■ AEC-Q101 qualified K A NC DPAK STPS5H100BY Description This high voltage Schottky barrier rectifier is packaged in DPAK, and designed for high frequency miniature switched mode power supplies such as adaptators and on board DC to DC converters for automotive applications. November 2011 Table 1. Doc ID 17744 Rev 1 Device summary Symbol Value IF(AV) 5A VRRM 100 V Tj (max) 175 °C VF(max) 0.61 V 1/7 www.st.com 7 Characteristics 1 STPS5H100-Y Characteristics Table 2. Absolute ratings (limiting values) Symbol VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Unit 100 V 10 A Average forward current Tc = 165 °C, δ = 0.5 5 A IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A IRRM Repetitive peak reverse current tp = 2 µs, F = 1 KHz 1 A IRSM Non repetitive peak reverse current tp = 100 µs square PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C Tj dV/dt Storage temperature range Operating junction temperature(1) 2 A 7200 W -65 to + 175 °C -40 to +175 °C 10000 V/µs Value Unit 2.5 °C/W Critical rate of rise of reverse voltage 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Symbol IR(1) Parameter Junction to case Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM Typ. 1.3 Max. Unit 3.5 µA 4.5 mA 0.73 IF = 5 A 0.57 0.61 V 0.85 IF = 10 A 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.51 x IF(AV) + 0.02IF2(RMS) 2/7 Value IF(AV) Tstg 1. Parameter Doc ID 17744 Rev 1 0.66 0.71 STPS5H100-Y Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current IF(av)(A) PF(av)(W) 4.0 δ = 0.1 3.5 6 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-c) 5 δ = 0.05 3.0 2.5 4 δ=1 Rth(j-a)=80°C/W 3 2.0 1.5 2 T T 1.0 0.5 δ=tp/T IF(av) (A) 1 tp 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Figure 3. 1 Average forward current versus ambient temperature (δ = 0.5) Normalized avalanche power derating versus pulse duration 0 δ=tp/T tp 20 40 0 Figure 4. PARM(tp) PARM(1µs) 1.2 Tamb(°C) 60 80 100 120 140 160 180 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 0.1 0.8 0.6 0.01 0.4 0.2 tp(µs) 0.001 0.01 0.1 Figure 5. IM(A) 120 110 100 90 80 70 60 50 40 30 IM 20 10 0 1E-3 1 10 1000 100 Non repetitive surge peak forward current versus overload duration (maximum values) 0 25 Figure 6. Tj(°C) 50 75 100 15 125 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.8 Tc=50°C 0.6 Tc=75°C 0.4 δ = 0.5 δ = 0.2 δ = 0.1 Tc=125°C t 0.2 T Single pulse t(s) δ=0.5 1E-2 tp(s) 1E-1 1E+0 0.0 1E-3 Doc ID 17744 Rev 1 1E-2 δ=tp/T 1E-1 tp 1E+0 3/7 Characteristics Figure 7. STPS5H100-Y Reverse leakage current versus reverse voltage applied Figure 8. IR(µA) Junction capacitance versus reverse voltage applied (typical values) C(pF) 5E+3 1000 1E+3 F=1MHz Tj=25°C Tj=125°C 1E+2 1E+1 100 1E+0 Tj=25°C 1E-1 1E-2 VR(V) VR(V) 0 10 Figure 9. 20 30 40 50 60 70 80 10 90 100 Forward voltage drop versus forward current (maximum values) 10 100 Figure 10. Thermal resistance junction to ambient versus copper surface under tab IFM(A) 100 50.0 1 Rth(j-a) (°C/W) Epoxy printed circuit board, copper thickness: 35 µm 90 80 Tj=125°C 10.0 70 60 Tj=25°C 50 40 1.0 30 20 10 0.1 0.0 4/7 VFM(V) 0.2 0.4 0.6 0.8 S(Cu) (cm²) 0 1.0 1.2 1.4 1.6 0 Doc ID 17744 Rev 1 2 4 6 8 10 12 14 16 18 20 STPS5H100-Y 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. DPAK dimensions Dimensions Ref E A B2 C2 L2 D R H L4 A1 B R G Millimeters Inches Min. Max. Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 C A2 0.60 MIN. L2 0.80 typ. 0.031 typ. V2 L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° Figure 12. Footprint dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 Doc ID 17744 Rev 1 5/7 Ordering information 3 Ordering information Table 5. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS5H100BY-TR S5H100Y DPAK 0.30 g 2500 Tape and reel Revision history Table 6. 6/7 STPS5H100-Y Document revision history Date Revision 07-Nov-2011 1 Changes Initial release. Doc ID 17744 Rev 1 STPS5H100-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. 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